CN103786232A - Method for producing artificial board through latent curing agent - Google Patents
Method for producing artificial board through latent curing agent Download PDFInfo
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- CN103786232A CN103786232A CN201410025985.3A CN201410025985A CN103786232A CN 103786232 A CN103786232 A CN 103786232A CN 201410025985 A CN201410025985 A CN 201410025985A CN 103786232 A CN103786232 A CN 103786232A
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Abstract
The invention relates to a method for producing an artificial board through a latent curing agent. The method comprises the step of carrying out gluing on raw materials, the latent curing agent is added during the gluing process. The latent curing technology is applied in the method, the problems that resin is cured in advance and is out of operation is solved, wasting of the resin are reduced, the quality of the artificial board is improved, the formaldehyde emission can be reduced to the value below 5 mg/100 g, the method plays a significant role on the enterprises and the society, the economic benefits of the enterprises are improved, the quality of the artificial board is improved, economic and environmental protection significances are facilitated, wasting of chemical raw materials is reduced, and the method has energy saving and emission reducing social significances under the political and economic environment that global resources are constantly exhausted, and low carbon emission, environment protection and energy conservation and emission reduction are advocated.
Description
Technical field
The present invention relates to the application of latent curing agent in Wood-based Panel Production.
Background technology
At present, the curing agent that China's industry of artificial boards uses is mainly the strong acid weak base salt such as ammonium chloride and ammonium sulfate, after it mixes with urea-formaldehyde resin adhesive, and fast response very at normal temperatures, make wood shavings or fiber after applying glue occur solidifying in advance phenomenon, cause a part of resin because solidifying and lost efficacy in advance.
There is a kind of latent curing agent (Germany produces, specifications and models: 131B2), after it mixes with urea-formaldehyde resin adhesive, under low temperature condition, do not react or react slower, and under the high temperature of 180-200 ℃, reaction is violent, solidifies rapidly.
Summary of the invention
In view of above-mentioned, the object of the invention is to be for the deficiencies in the prior art, propose a kind of latent curing agent to be applied in to the scheme in Wood-based Panel Production technique.
For completing object of the present invention, the technical scheme that the present invention takes is:
Use latent curing agent to produce a method for wood-based plate, comprise raw material applying glue, it is characterized in that:
In Process of Applying Glue, add latent curing agent.
Use latent curing agent to produce the method for particieboard, first it to raw material applying glue, then mat formation, hot pressing, then jagsaw limit, sanding and form particieboard, wherein:
Top layer wood shavings applying glue formula in raw material is: glue: 54kg/m3; Latent curing agent: 0.27kg/m3; Paraffin: 2.5kg/m3:
Sandwich layer wood shavings applying glue formula in raw material is: glue: 36kg/m3; Latent curing agent: 0.432kg/m3; Paraffin: 2.0kg/m3.
In described raw material, top layer wood shavings accounting 50--60%, sandwich layer wood shavings accounting 50-40%.
The parameter of described hot pressing is: temperature: 198-200 ℃; Pressure: 260-280bar; Time: more than 2.6 points.
Described glue is urea-formaldehyde resin adhesive, and this urea-formaldehyde resin adhesive is divided into dehydration and does not dewater, and while dehydration, solids content is at 47--53%, and when dehydration, solids content is controlled at 60--66%, and the composition beyond solids content is mainly water.
The model of described latent curing agent is 131B2.
Use latent curing agent to produce the method for medium density fibre board (MDF), first it carry out applying glue to raw material, and be then dried, mat formation, hot pressing, then through saw limit and form medium density fibre board (MDF), wherein:
The formula of applying glue is: glue: 140-180kg/m3; Latent curing agent: 1.2% of glue; Paraffin: 4kg/m3.
Described glue is non-dehydrated urea-formaldehyde resin adhesive, and its solids content is at 47--53%, and remainder main component is water.
The model of described latent curing agent is 131B2.
The parameter of described hot pressing is: temperature: 180-200 ℃; Pressure: 260-280bar; Continuous press speed: 1.3m/s.
The present invention has the following advantages:
Due to the application of the curing technology of hiding, having solved resin solidifies and the problem of inefficacy in advance, both reduced the waste of resin, also promoted the quality of product, be that burst size of methanal can be reduced to below 5mg/100g, to enterprise, society has been produced to significance, not only improve Business Economic Benefit, promoted product quality, there is economy, environment protection significance, and reduce the waste of industrial chemicals, advocate under the overall situation of low-carbon (LC), environmental protection, energy-saving and emission-reduction in the continuous exhaustion of global resources, there is the social effect of energy-saving and emission-reduction.
The specific embodiment:
The present invention relates to use latent curing agent to produce the method for wood-based plate, it is characterized in that adding latent curing agent in Process of Applying Glue.
Latent curing agent performance: after it mixes with Lauxite, under low temperature condition, do not react or react slower, and under the high temperature of 180-200 ℃, reaction is violent, solidifies rapidly, thereby it is hot-forming to can be used for realizing wood-based plate.
The application principle of latent curing agent: latent curing agent has latency because of it, therefore can prevent that this part resin from solidifying in advance, reduces the object of resin added thereby reach, and 30% resin generally can cut the waste.
Using latent curing agent to produce in the technique of particieboard, first to raw material applying glue, then mat formation, hot pressing, then jagsaw limit, sanding and form particieboard.Wherein: the top layer wood shavings applying glue formula in raw material is: glue: 54kg/m3; Latent curing agent: 0.27kg/m3; Paraffin: 2.5kg/m3; Sandwich layer wood shavings applying glue formula in raw material is: glue: 36kg/m3; Latent curing agent: 0.432kg/m3; Paraffin: 2.0kg/m3.
In described raw material, top layer wood shavings accounting 50--60%, sandwich layer wood shavings accounting 50-40%.
The parameter of described hot pressing is: temperature: 198-200 ℃; Pressure: 260-280bar; Time: more than 2.6 points.
Described glue is urea-formaldehyde resin adhesive, and this urea-formaldehyde resin adhesive is divided into dehydration and does not dewater, and while dehydration, solids content is at 47--53%, and when dehydration, solids content is controlled at 60--66%, and the composition beyond solids content is mainly water.
The model of described latent curing agent is 131B2.
Using latent curing agent to produce the technique of medium density fibre board (MDF), first it carry out applying glue to raw material, and be then dried, mat formation, hot pressing, then through saw limit and form medium density fibre board (MDF).Wherein: the formula of applying glue is: glue: 140-180kg/m3; Latent curing agent: 1.2% of glue; Paraffin: 4kg/m3.
Described glue is non-dehydrated urea-formaldehyde resin adhesive, and its solids content is at 47--53%, and remainder main component is water.
The model of described latent curing agent is 131B2.
The parameter of described hot pressing is: temperature: 180-200 ℃; Pressure: 260-280bar; Continuous press speed: 1.3m/s.
Introduce specific embodiment below
Embodiment 1
Produce particieboard with latent curing agent, its technical process is as follows:
Particieboard raw material through chipping, flaking, dry after, form dry wood shavings, wood shavings moisture content, at 1.5-2.0%, after sorting, is divided into top layer wood shavings and sandwich layer wood shavings, carries out respectively applying glue, then mats formation, hot pressing, then forms product through saw limit, sanding.Wherein:
Top layer applying glue formula is:
Glue: 54kg/m3
Latent curing agent: 0.27kg/m3
Paraffin: 2.5kg/m3 (amount of solid)
Sandwich layer applying glue formula:
Glue: 36kg/m3
Latent curing agent: 0.432kg/m3
Paraffin: 2.0kg/m3 (amount of solid)
Top layer wood shavings 50--60%, sandwich layer wood shavings 50--40%
Wood shavings moisture content: 5-7% after applying glue
Hot compression parameters:
Temperature: 198-200 ℃
Time: 2.6 points above (take 18 slabs as example)
Pressure: 260-280bar.
In above technical process: the glue adopting is urea-formaldehyde resin adhesive.Conventionally this resin can be divided into dehydration and not dewater two kinds, and while dehydration, solids content is at 47--53%, and when dehydration, solids content can be controlled, and in general, is controlled at 60--66%, and the composition beyond solids content is mainly water.Described latent curing agent adopts Germany to produce the product that model is 131B2.
The production technology of the present embodiment is substantially same as the prior art, and difference has adopted latent curing agent exactly.
Embodiment 2
Use latent curing agent to produce medium density fibre board (MDF), its technical process is:
Medium density fiber board raw material through chipping, washing, defibrator process, then through applying glue, be dried, mat formation, hot pressing, saw limit, and form medium density fiber panel products.
Applying glue formula:
Glue: 140-180kg/m3 (according to the difference of production line, glue amount is different)
Latent curing agent: 1.2% (accounting for the percentage of glue)
Paraffin: 4kg/m3 (solid)
Fiber moisture: 7-8%
Hot compression parameters:
Temperature: 180-200 ℃
Pressure: 260-280bar
Continuous press speed: 1.3m/s (thickness 3mm is example)
In above technical process: the glue adopting is non-dehydrated urea-formaldehyde resin adhesive, solids content is at 47--53%, and remainder main component is water.Described latent curing agent adopts Germany to produce the product that model is 131B2.
The production technology of the present embodiment is same as the prior art, and difference has adopted latent curing agent exactly.
Through national wood-based plate authoritative institution's country's wood-based plate and the check of Bamboo and wood product Quality Supervision and Inspection Center, the particieboard that adopts the technology of the present invention to produce, institute's inspection project all reaches standard gauge provisioning request, and particularly burst size of methanal index reaches the requirement of E0 level.Its result is as follows: density: 0.68g/cm3; MOR: 13.7MPa; Internal bond strength: 0.37MPa; Thickness swelling rate: 3.5%; Nail-holding ability: plate face 1250N, edges of boards 950N; Burst size of methanal: 5.0mg/100g.
Analyze again economic benefit of the present invention (take Jilin Forest branch company as example, calculating with every m3 unit) below
Resin added was originally 125kg/m3, after employing the present invention, was reduced to 90kg/m3.Hardener dose accounts for 0.78% of glue, and unit price is 20,000 yuan/ton.If glue valency calculates by 2.3 yuan/kg:
Glue cost savings (125-90)=35kg × 2.3 yuan/kg=80.5 unit;
Curing agent cost: 90 × 0.78% × 20 yuan/kg=14.04 unit;
Amount to every m3 cost 80.5-14.04=66.46 unit.
Calculate with these branch company's 200,000 m3 annual capacities, the Spring Festival holidays are propped up ten thousand yuan/year of 200000x66.46=1329.2.
From performance and the use principle of latent curing agent, it is applicable to adopt Lauxite to produce wood-based plate, is not only applicable to particieboard, medium density fibre board (MDF), is equally applicable to the wood-based plate that other use Lauxite to produce, as the production of urea-formaldehyde glue plywood.
The use of latent curing technology, has made sizable contribution by the technological progress for China's industry of artificial boards, and reason is:
1. make China's industry of artificial boards technical merit compare favourably with European level;
2. provide technical support for reducing glue consumption, thereby can create considerable economic benefit for enterprise;
3. the reduction of glue consumption, has reduced consumption and the waste of industrial chemicals resource, constantly exhausted and advocate under the overall situation of low-carbon (LC), environmental protection, energy-saving and emission-reduction in global resources, is country and even the world, aspect energy-saving and cost-reducing, energy-saving and emission-reduction, makes huge contribution;
4. can reduce artifical plate product's burst size of methanal, comply with country and national environmental requirement, its social benefit is immeasurable.
What need statement is; above-described embodiment is only for the present invention will be described but not limit the invention; therefore; for a person skilled in the art; in the situation that not deviating from spirit and scope of the invention, it is carried out to various apparent changes, all should be within protection scope of the present invention.
Claims (10)
1. use latent curing agent to produce a method for wood-based plate, comprise raw material applying glue, it is characterized in that:
In Process of Applying Glue, add latent curing agent.
2. use latent curing agent as claimed in claim 1 is produced the method for wood-based plate, and first it to raw material applying glue, then mat formation, hot pressing, then jagsaw limit, sanding and form particieboard, it is characterized in that:
To the top layer wood shavings applying glue formula in raw material be:
Glue: 54kg/m3;
Latent curing agent: 0.27kg/m3;
Paraffin: 2.5kg/m3;
To the sandwich layer wood shavings applying glue formula in raw material be:
Glue: 36kg/m3;
Latent curing agent: 0.432kg/m3;
Paraffin: 2.0kg/m3.
3. use latent curing agent as claimed in claim 2 is produced the method for wood-based plate, it is characterized in that:
In described raw material, top layer wood shavings accounting 50--60%, sandwich layer wood shavings accounting 50-40%.
4. use latent curing agent as claimed in claim 3 is produced the method for wood-based plate, it is characterized in that:
The parameter of described hot pressing is:
Temperature: 198-200 ℃;
Pressure: 260-280bar;
Time: more than 2.6 points.
5. use latent curing agent as claimed in claim 2 is produced the method for wood-based plate, it is characterized in that:
Described glue is urea-formaldehyde resin adhesive, and this urea-formaldehyde resin adhesive is divided into dehydration and does not dewater, and while dehydration, solids content is at 47--53%, and when dehydration, solids content is controlled at 60--66%, and the composition beyond solids content is mainly water.
6. use latent curing agent as claimed in claim 2 is produced the method for wood-based plate, it is characterized in that:
The model of described latent curing agent is 131B2.
7. use latent curing agent as claimed in claim 1 is produced the method for wood-based plate, and first it carry out applying glue to raw material, is then dried, mats formation, hot pressing, then through saw limit and form medium density fibre board (MDF), it is characterized in that:
The formula of described applying glue is:
Glue: 140-180kg/m3;
Latent curing agent: 1.2% of glue;
Paraffin: 4kg/m3.
8. use latent curing agent as claimed in claim 7 is produced the method for wood-based plate, it is characterized in that:
Described glue is non-dehydrated urea-formaldehyde resin adhesive, and its solids content is at 47--53%, and remainder main component is water.
9. use latent curing agent as claimed in claim 7 is produced the method for wood-based plate, it is characterized in that:
The model of described latent curing agent is 131B2.
10. use latent curing agent as claimed in claim 7 is produced the method for wood-based plate, it is characterized in that: the parameter of described hot pressing is:
Temperature: 180-200 ℃;
Pressure: 260-280bar;
Continuous press speed: 1.3m/s.
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| CN201410025985.3A CN103786232A (en) | 2014-01-21 | 2014-01-21 | Method for producing artificial board through latent curing agent |
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| CN201410025985.3A CN103786232A (en) | 2014-01-21 | 2014-01-21 | Method for producing artificial board through latent curing agent |
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| CN101244580A (en) * | 2008-02-26 | 2008-08-20 | 南京林业大学 | Method for producing antennaria dioica flakeboard |
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Application publication date: 20140514 |