CN103779288A - Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies - Google Patents
Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies Download PDFInfo
- Publication number
- CN103779288A CN103779288A CN201410025314.7A CN201410025314A CN103779288A CN 103779288 A CN103779288 A CN 103779288A CN 201410025314 A CN201410025314 A CN 201410025314A CN 103779288 A CN103779288 A CN 103779288A
- Authority
- CN
- China
- Prior art keywords
- parallel
- connection
- series
- galvanic couple
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies is formed by overlapping of two-stage refrigeration couples, wherein each stage of each refrigeration couple is composed of a pair of square p-type and n-type couple arms, and the two stages of each refrigeration couple are connected through a metal connecting piece. The connection circuit of each two-stage refrigeration couple is a serial-parallel mixed circuit and is supplied with power by two direct-current power supplies. Two-stage refrigeration couples belonging to the same set are connected in the mode that serial connection is adopted for the circuit and parallel connection is adopted for heat transmission, heat conducting ceramic plates are arranged at the cold ends of the two-stage refrigeration couples and at the hot ends of the two-stage refrigeration couples, and then the serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies is formed. According to the serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies, the contradiction between high refrigerating capacity and efficiency of an existing conventional advanced semiconductor can be effectively solved, and requirements for wide temperature difference application range are met.
Description
Technical field
The invention belongs to semiconductor refrigerating technology field, be specifically related to a kind of for coupling formula semiconductor refrigerating module in the connection in series-parallel based on duplicate supply of semiconductor cooler.
Background technology
Semiconductor refrigerating claims again thermoelectric cooling or thermoelectric cooling, and it is a kind of refrigeration modes that remarkable Peltier heat electrical effect that the refrigeration galvanic couple that utilizes extraordinary semiconductor p-type and N-shaped material to form has in the time applying direct current is realized refrigeration.That semiconductor refrigerating has is simple in structure, compact, it is rapid, simple to operate to freeze, easily realize the advantages such as high-precision temperature control, has a wide range of applications in fields such as industry, electronics, medical treatment, military affairs and Aero-Space.But the major defect of semiconductor refrigerating is that its refrigerating efficiency is low, this is mainly because the figure of merit of the semi-conducting material using at present itself is little caused, and has limited to a great extent the promotion and application of semiconductor refrigerating.Therefore, lacking at present in better semi-conducting material situation, improving semiconductor refrigerating performance by the structural design of improvement semiconductor refrigerating module and also just become one of developing direction important in this technical field.
At present, widely used in semiconductor cooler is single-stage semiconductor refrigerating module, and it is to be generally in series by circuit by many single-stage refrigeration galvanic couples, and configures single DC power supply work.The single-stage semiconductor refrigerating module of this connected mode, in the time applying electric current change, exists respectively maximum cooling capacity operating mode and optimum efficiency operating mode.For obtaining large refrigerating capacity, often will sacrifice efficiency, this is existing conventional single-stage semiconductor refrigerating module technological difficulties in actual applications always.For this problem, the technology of the present invention aims to provide a kind of feasible solution, it is coupling formula semiconductor refrigerating module in a kind of connection in series-parallel, by adopting dual power supply mode, and one group of refrigeration galvanic couple is divided into two-stage in inside by galvanic couple arm, and on circuit, take series connection to be connected with parallel coupled mode, on conducting heat, connection in series-parallel connects, and forms a kind of new interior coupling formula semiconductor refrigerating module.This semiconductor refrigerating module can solve the existing contradictory problems that can not simultaneously obtain larger refrigerating capacity and efficiency of existing conventional single-stage semiconductor refrigerating module effectively.Meanwhile, it had both gone for the requirement (being the range of application of existing conventional single-stage semiconductor refrigerating module) of the less refrigeration temperature difference, also can meet the requirement of the larger refrigeration temperature difference.Therefore, this technical scheme will promote semiconductor refrigerating will obtain well development and application widely in future, and can bring better economic benefit and social benefit.
Summary of the invention
For solving the defect and the deficiency that exist in above-mentioned prior art, the object of the present invention is to provide coupling formula semiconductor refrigerating module in a kind of connection in series-parallel based on duplicate supply, effectively solve the existing contradictory problems that can not simultaneously obtain larger refrigerating capacity and efficiency of existing conventional single-stage semiconductor refrigerating module; Meanwhile, it had both gone for the requirement of the less refrigeration temperature difference, also can meet the requirement of the larger refrigeration temperature difference.
For achieving the above object, concrete technical scheme of the present invention is:
Coupling formula semiconductor refrigerating module in a kind of connection in series-parallel based on duplicate supply, by coupling formula refrigeration galvanic couple cell formation in one group of same connection in series-parallel, in first connection in series-parallel, coupling formula is freezed in galvanic couple unit: first order p-type electricity arm side brace 105, first order p-type electricity arm 106, second level p-type electricity arm side brace 107, second level p-type electricity arm 108, hot junction brace 109, the electric arm 110 of second level N-shaped, second level N-shaped electricity arm side brace 111, first order N-shaped electricity arm 112 and first order N-shaped electricity arm side brace 113 connect successively; Two-stage p-type in second connection in series-parallel in coupling formula refrigeration galvanic couple unit and N-shaped galvanic couple arm formation and connected mode are identical with first, and it is connected with coupling formula refrigeration galvanic couple unit in first connection in series-parallel with first order N-shaped electricity arm side brace 113 by second level N-shaped electricity arm side brace 111 again; Each follow-up refrigeration galvanic couple unit connects in the same way successively; Cold junction ceramic wafer 103 is connected with the first order electricity arm side brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel; Hot junction ceramic wafer 104 is connected with the hot junction brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel; The second level p-type electricity arm side brace 107 of the positive pole of second level power supply 101 and coupling formula refrigeration galvanic couple unit in first connection in series-parallel is connected, and the second level N-shaped electricity arm side brace of the negative pole of second level power supply 101 and coupling formula refrigeration galvanic couple unit in last connection in series-parallel is connected; The positive pole of first order power supply 102 is connected with the first order p-type electricity arm side brace 105 of coupling formula refrigeration galvanic couple unit in first connection in series-parallel, and the negative pole of first order power supply 102 is connected with the first order N-shaped electricity arm side brace of coupling formula refrigeration galvanic couple unit in last connection in series-parallel.By above connected mode, form coupling formula semiconductor refrigerating module in the connection in series-parallel based on duplicate supply proposing.
In refrigeration module of the present invention, in each refrigeration galvanic couple unit, be divided into two-stage, every one-level is made up of a square shaped p-type and N-shaped galvanic couple arm; Between two-stage, realize heat transmission by metal connecting sheet; The connecting circuit of each refrigeration galvanic couple is connection in series-parallel hybrid circuit, and by two DC power supply; Again by one group of same two-stage refrigeration galvanic couple unit, by taking series system on circuit, taking parallel way that they are coupled together on conducting heat, and configure respectively thermal conductive ceramic plate at its cold junction and hot junction, thereby form coupling formula semiconductor refrigerating module in a kind of connection in series-parallel based on duplicate supply.By adopting dual power supply mode, this semiconductor refrigerating module can solve the existing contradictory problems that can not simultaneously obtain larger refrigerating capacity and efficiency of existing conventional single-stage semiconductor refrigerating module effectively.Meanwhile, it had both gone for the requirement (being the range of application of existing conventional single-stage semiconductor refrigerating module) of the less refrigeration temperature difference, also can meet the requirement of the larger refrigeration temperature difference.Therefore, this technical scheme will promote semiconductor refrigerating will obtain well development and application widely in future, and can bring better economic benefit and social benefit.
Accompanying drawing explanation
Accompanying drawing is the structural representation of refrigeration module of the present invention.
Embodiment
As shown in drawings, coupling formula semiconductor refrigerating module in a kind of connection in series-parallel based on duplicate supply of the present invention, it is characterized in that: by coupling formula refrigeration galvanic couple cell formation in one group of same connection in series-parallel, in first connection in series-parallel, coupling formula is freezed in galvanic couple unit: first order p-type electricity arm side brace 105, first order p-type electricity arm 106, second level p-type electricity arm side brace 107, second level p-type electricity arm 108, hot junction brace 109, second level N-shaped electricity arm 110, second level N-shaped electricity arm side brace 111, first order N-shaped electricity arm 112 and first order N-shaped electricity arm side brace 113 connect successively.Two-stage p-type in second connection in series-parallel in coupling formula refrigeration galvanic couple unit and N-shaped galvanic couple arm formation and connected mode are identical with first, and it is connected with coupling formula refrigeration galvanic couple unit in first connection in series-parallel with first order N-shaped electricity arm side brace 113 by second level N-shaped electricity arm side brace 111 again; Each follow-up refrigeration galvanic couple unit connects in the same way successively.Cold junction ceramic wafer 103 is connected with the first order electricity arm side brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel; Hot junction ceramic wafer 104 is connected with the hot junction brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel.The second level p-type electricity arm side brace 107 of the positive pole of second level power supply 101 and coupling formula refrigeration galvanic couple unit in first connection in series-parallel is connected, and the second level N-shaped electricity arm side brace of the negative pole of second level power supply 101 and coupling formula refrigeration galvanic couple unit in last connection in series-parallel is connected; The positive pole of first order power supply 102 is connected with the first order p-type electricity arm side brace 105 of coupling formula refrigeration galvanic couple unit in first connection in series-parallel, and the negative pole of first order power supply 102 is connected with the first order N-shaped electricity arm side brace of coupling formula refrigeration galvanic couple unit in last connection in series-parallel.By above connected mode, form coupling formula semiconductor refrigerating module in the connection in series-parallel based on duplicate supply proposing.
Operation principle of the present invention is: in the connection in series-parallel of this duplicate supply in coupling formula semiconductor refrigerating module after power connection, by first order power supply 102 and second level power supply 101 respectively by first order p-type electricity arm side brace 105 and second level p-type electricity arm side brace 107 to refrigeration module joint supply electric current, in first order p-type and N-shaped electricity arm and second level p-type and N-shaped electricity arm, produce operating current, thus by the Peltier effect of all refrigeration galvanic couples, this refrigeration module absorbs heat at cold junction ceramic wafer 103 places, reach refrigeration, simultaneously, can emit heat at hot junction ceramic wafer 104 places.
Claims (1)
1. coupling formula semiconductor refrigerating module in the connection in series-parallel based on duplicate supply, it is characterized in that: by coupling formula refrigeration galvanic couple cell formation in one group of same connection in series-parallel, in first connection in series-parallel, coupling formula is freezed in galvanic couple unit: first order p-type electricity arm side brace (105), first order p-type electricity arm (106), second level p-type electricity arm side brace (107), second level p-type electricity arm (108), hot junction brace (109), second level N-shaped electricity arm (110), second level N-shaped electricity arm side brace (111), first order N-shaped electricity arm (112) and first order N-shaped electricity arm side brace (113) connect successively,
Two-stage p-type in second connection in series-parallel in coupling formula refrigeration galvanic couple unit and N-shaped galvanic couple arm formation and connected mode are identical with first, and it is connected with coupling formula refrigeration galvanic couple unit in first connection in series-parallel with first order N-shaped electricity arm side brace (113) by second level N-shaped electricity arm side brace (111) again; Each follow-up refrigeration galvanic couple unit connects in the same way successively;
Cold junction ceramic wafer 103 is connected with the first order electricity arm side brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel; Hot junction ceramic wafer 104 is connected with the hot junction brace in coupling formula refrigeration galvanic couple unit in all connection in series-parallel;
The positive pole of second level power supply (101) is connected with the second level p-type electricity arm side brace (107) of coupling formula refrigeration galvanic couple unit in first connection in series-parallel, and the second level N-shaped electricity arm side brace of the negative pole of second level power supply (101) and coupling formula refrigeration galvanic couple unit in last connection in series-parallel is connected; The positive pole of first order power supply (102) is connected with the first order p-type electricity arm side brace (105) of coupling formula refrigeration galvanic couple unit in first connection in series-parallel, and the negative pole of first order power supply (102) is connected with the first order N-shaped electricity arm side brace of coupling formula refrigeration galvanic couple unit in last connection in series-parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410025314.7A CN103779288A (en) | 2014-01-18 | 2014-01-18 | Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410025314.7A CN103779288A (en) | 2014-01-18 | 2014-01-18 | Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103779288A true CN103779288A (en) | 2014-05-07 |
Family
ID=50571390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410025314.7A Pending CN103779288A (en) | 2014-01-18 | 2014-01-18 | Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103779288A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091399A (en) * | 2014-05-20 | 2015-11-25 | 中兴通讯股份有限公司 | Refrigeration circuit, terminal and terminal refrigeration method |
| CN111520947A (en) * | 2019-02-01 | 2020-08-11 | 艾默生环境优化技术有限公司 | Container for refrigerated food |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353098A (en) * | 2013-06-25 | 2013-10-16 | 陈志明 | High-power LED lamp cooling device and manufacturing method thereof |
-
2014
- 2014-01-18 CN CN201410025314.7A patent/CN103779288A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353098A (en) * | 2013-06-25 | 2013-10-16 | 陈志明 | High-power LED lamp cooling device and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李玉东: "半导体多级制冷性能组合优化设计", 《中国优秀硕士学位论文全文数据库 工程科技II辑》, no. 4, 15 April 2008 (2008-04-15), pages 028 - 15 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091399A (en) * | 2014-05-20 | 2015-11-25 | 中兴通讯股份有限公司 | Refrigeration circuit, terminal and terminal refrigeration method |
| CN111520947A (en) * | 2019-02-01 | 2020-08-11 | 艾默生环境优化技术有限公司 | Container for refrigerated food |
| US11549730B2 (en) | 2019-02-01 | 2023-01-10 | Emerson Climate Technologies, Inc. | Refrigerated food container |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017166956A1 (en) | Single-phase interleaved pfc circuit and on-board charger and electric automobile using same | |
| CN103227352B (en) | The temperature control equipment of electromobile/hybridvehicle vehicle battery cell and method | |
| CN204612090U (en) | A kind of air conditioner utilizing heat of compressor to carry out thermo-electric generation | |
| CN203721845U (en) | Alternating current charge-discharge low-temperature heating circuit for boost-type DC-DC (direct current-direct current) power battery | |
| CN203721849U (en) | Alternating current heating circuit for power battery charger | |
| CN104279678A (en) | Air conditioner with waste heat recovery function | |
| CN103918073A (en) | Semiconductor device | |
| CN103531864A (en) | Battery box heat management system and method for electric automobile | |
| CN103779288A (en) | Serial-parallel coupler-in-emulsion semiconductor refrigeration module based on double power supplies | |
| CN211084498U (en) | Intelligent constant temperature device | |
| CN206322817U (en) | A kind of power battery thermal management system based on semiconductor chilling plate | |
| CN202217708U (en) | Semiconductor temperature-difference power generation assembly | |
| CN202996592U (en) | Capacitor | |
| CN103326552A (en) | Current equalizing system of super-power IGBT induction heating equipment and full-bridge inverting unit | |
| CN203366215U (en) | Industrial personnel computer hard disk constant temperature protection system | |
| CN203421874U (en) | Semiconductor-type vehicle-mounted refrigerator with temperature capable of being regulated and displayed | |
| CN109525204A (en) | A kind of multistage linear power amplification power supply circuit of MOSFET control | |
| CN104075483A (en) | Semiconductor cooler with hot end and cold end at long distance with each other | |
| CN103219457A (en) | Semiconductor thermoelectric module | |
| CN201895631U (en) | Automobile energy conversion device | |
| CN203443215U (en) | Portable constant temperature device | |
| CN108447974B (en) | Inclined thermoelectric element and inclined thermoelectric assembly composed of same | |
| CN204244124U (en) | In order to reduce the motor drive circuit of switching loss | |
| CN203704214U (en) | Solar semiconductor air conditioning | |
| CN203704440U (en) | Control circuit for thermoelectric semiconductor refrigeration component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140507 |