CN103777364A - Manufacturing method of reticle - Google Patents
Manufacturing method of reticle Download PDFInfo
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- CN103777364A CN103777364A CN201310684808.1A CN201310684808A CN103777364A CN 103777364 A CN103777364 A CN 103777364A CN 201310684808 A CN201310684808 A CN 201310684808A CN 103777364 A CN103777364 A CN 103777364A
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- optical element
- graticule
- manufacture method
- photoresist
- motherboard
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Abstract
The invention discloses a manufacturing method of a reticle. The method comprises the following steps: uniformly coating a photoresist on an optical element, and baking to form a film; making a hollow counterpoint mark on the photoresist of the optical element by use of a plotter; attaching a motherboard with a solid counterpoint mark pattern to the hollow counterpoint mark on the optical element through a microscope aligning system in a counterpoint mode, and performing exposure processing on the optical element after attachment; placing the optical element after exposure in a developing solvent for photoresist development; and cleaning the optical element after the development, and preparing the reticle. According to the invention, the optical element is coated by a black glue or a dark-color photoresist, and the hollow counterpoint mark is made on the photoresist by use of the laser plotter so that accurate positioning attachment between the motherboard and the optical element can be realized, the qualified rate of the reticle is improved, and the manufacturing process is simple.
Description
Technical field
The present invention relates to graticule technical field, particularly a kind of manufacture method of graticule.
Background technology
Graticule is generally arranged on telescopical right eyepiece focal plane, as shown in Figure 4, it is the thin glass that graduation mil line is carved with on the surface of a utmost point book, because the thin glass of this piece has also participated in imaging theoretically, extend the focal length of object lens, can have impact more or less to the length of right eyepiece.Graticule requires high to cleanliness factor, any small dust all can produce very large stain in the time of observation; Meanwhile, the installation site accuracy requirement of graticule high (the optical glass center of circle and pattern center deviation ± 0.03mm), therefore, the dismounting of trying not, if dismounting must in statu quo be restored.
In Chinese patent literature CN102466891A, disclose a kind of manufacture method of graticule, it comprises motherboard manufacture craft and photocopying technique, and motherboard manufacture craft comprises the following steps: according to the file of client's Element Design drawing draw calculation machine drawing; Prepare motherboard substrate; Motherboard substrate is put into microscope alignment system; Open laser drawing instrument; The intensity of light source is set.Photocopying technique comprises the following steps: with the clean motherboard of detersive and optical element; Preparation ammonium liquid; Make photoresists; Optical element is placed on precise clamp and puts into hydro-extractor; Baking glass part; Vacuum suction template and optical element be bonding and employing dynamic exposure processing graticule optical element evenly; Optical element and motherboard precision are compound, then expose; Optical element is put into developer solution after stain, clean up.In this patent documentation, optical element and motherboard adopt the pattern of vacuum suction, and the two does not have positioning datum accurately, and therefore, the precision and the qualification rate that create product are not still very high, and equipment investment expense is relatively high.
Chinese patent literature CN101852985 discloses a kind of method for making of substrate alignment mark, and it is formed with a depression on the surface of a substrate, in concave interior, photoresist layer is set; Exposure, development, so that part photoresistance is retained in this photoresist layer; Around this part photoresistance, metal level is set; Remove this part photoresistance, leave this metal level, with form metal level around alignment mark.Above-mentioned patent documentation needs multiple operations, complex process make depression alignment mark on substrate time.
Summary of the invention
In order to solve the problem of prior art, simplify process costs, improve Product Precision and qualification rate, the invention provides a kind of manufacture method of graticule.
Described technical scheme is as follows:
A manufacture method for graticule, described method comprises the steps:
Step 4, is placed in developer solution by the optical element after exposure and carries out photoresist developing;
Step 5, cleans the optical element after developing, and makes graticule.
Photoresist in described step 1 is opaque photoetching glue.
The described photoresist thickness of smoking after film forming is 1 micron～10 microns.
Plotting apparatus in described step 2 is laser-beam plotter.
Hollow out contraposition in described step 2 is designated as cruciform, circle or star, and the solid register guide on described motherboard is consistent with the hollow out register guide shape on described optical element.
In described step 2, on optical element, make multiple hollow out register guides, on motherboard in described step 3, make corresponding multiple solid register guides, by microscope alignment system, the multiple hollow out register guides on the motherboard with multiple solid register guide patterns and optical element are carried out to the laminating of contraposition one by one.
On described optical element and described motherboard, all make three register guides, after three register guide lines of centres, form equilateral triangle structure.
On described optical element and described motherboard, all make four register guides, four register guide centers form square or rectangular structure after line in turn.
Described developer solution is akaline liquid KOH or Tetramethylammonium hydroxide (TMAH).
The development temperature of the developer solution in described step 4 be 25 ℃ ?35 ℃, development time 3 minutes～10 minutes, by soak or backwashing manner carry out the development of graticule.The beneficial effect that technical scheme provided by the present invention is brought is:
A. the present invention, by apply photoresist layer on optical element, directly accurately makes hollow out register guide on photoresist layer by laser-beam plotter, and technique is simple.
B. by the hollow out register guide on the solid register guide on motherboard and optical element is fitted, can realize the exactitude position of the two, improve make efficiency, Product Precision and qualification rate, product percent of pass can reach more than 90%.
C. because the installation site accuracy requirement of graticule is higher, it is easier that on graticule, the drafting of hollow out register guide makes the installation of graticule, easily restores former state.
D. the present invention adopts multiple spot alignment mode, has significantly improved the aligning accuracy between motherboard and optical element.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is graticule manufacture method process flow diagram provided by the present invention;
Fig. 2 a is a kind of structural diagrams of hollow out register guide on photoresist;
Fig. 2 b is the another kind of structural diagrams of hollow out register guide on photoresist;
Fig. 3 a is a kind of structure contraposition diagram of the laminating of the hollow out register guide contraposition on solid register guide pattern and optical element on motherboard;
Fig. 3 b is the another kind of structure contraposition diagram of the laminating of the hollow out register guide contraposition on solid register guide pattern and optical element on motherboard;
Fig. 4 is the schematic diagram of graticule;
Fig. 5 is that on motherboard, the hollow out register guide on solid register guide pattern and optical element adopts 3 contrapositions laminatings;
Fig. 6 is that on motherboard, the hollow out register guide on solid register guide pattern and optical element adopts 4 contrapositions laminatings.
In figure: 1 ?hollow out register guide; 2 ?solid register guide; 3 ?graticule.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
As shown in Figure 1, the invention provides a kind of manufacture method of graticule, manufacture method wherein comprises the steps:
Step 4, is placed in developer solution by the optical element after exposure and carries out photoresist developing;
Step 5, cleans the optical element after developing, and makes graticule.
Photoresist used in the present invention is opaque photoetching glue, can be the dark photoresists such as commercially available opaque black photoresist, red photoresist, blue photoresist.
Wherein the hollow out contraposition in step 2 is designated as cruciform, circle, star etc., and the solid register guide on motherboard is consistent with the hollow out register guide shape on optical element.Solid register guide on hollow out register guide and motherboard wherein also can adopt other version, just repeats no more here.
The present invention preferably adopts multiple spot aligning structure mode, and hollow out register guide wherein can be made three or four, and the solid register guide production quantity on motherboard is identical with the quantity of hollow out register guide, and keeps the contraposition laminating one by one of multiple register guides.Wherein Figure 5 shows that 3 contraposition laminating types; Figure 6 shows that 4 contraposition laminating types.Also can adopt 5 even more contraposition laminating types of multiple spot, just repeat no longer one by one here.
In Fig. 2 a, illustrate that hollow out contraposition is designated as criss-cross structure, in Fig. 2 b, illustrated that hollow out contraposition is designated as circular configuration.
In Fig. 3 a and Fig. 3 b, show respectively the structural representation that the hollow out register guide on solid register guide and the optical element on motherboard fits.
Described developer solution is KOH or other alkaline solution, can be also Tetramethylammonium hydroxide (TMAH).
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a manufacture method for graticule, is characterized in that: described method comprises the steps:
Step 1 evenly applies photoresist, and smokes film forming on optical element;
Step 2, utilizes on the photoresist of plotting apparatus on optical element and makes hollow out register guide;
Step 3, carries out contraposition laminating by microscope alignment system by the hollow out register guide on the motherboard with solid register guide pattern and optical element, and the optical element after laminating is carried out to exposure-processed;
Step 4, is placed in developer solution by the optical element after exposure and carries out photoresist developing;
Step 5, cleans the optical element after developing, and makes graticule.
2. the manufacture method of graticule according to claim 1, is characterized in that:
Photoresist in described step 1 is opaque photoetching glue.
3. the manufacture method of graticule according to claim 2, is characterized in that:
The described photoresist thickness of smoking after film forming is 1 micron～10 microns.
4. the manufacture method of graticule according to claim 1, is characterized in that:
Plotting apparatus in described step 2 is laser-beam plotter.
5. the manufacture method of graticule according to claim 4, is characterized in that:
Hollow out contraposition in described step 2 is designated as cruciform, circle or star, and the solid register guide on described motherboard is consistent with the hollow out register guide shape on described optical element.
6. the manufacture method of graticule according to claim 5, is characterized in that:
In described step 2, on optical element, make multiple hollow out register guides, on motherboard in described step 3, make corresponding multiple solid register guides, by microscope alignment system, the multiple hollow out register guides on the motherboard with multiple solid register guide patterns and optical element are carried out to the laminating of contraposition one by one.
7. the manufacture method of graticule according to claim 6, is characterized in that:
On described optical element and described motherboard, all make three register guides, after three register guide lines of centres, form equilateral triangle structure.
8. the manufacture method of graticule according to claim 6, is characterized in that:
On described optical element and described motherboard, all make four register guides, four register guide centers form square or rectangular structure after line in turn.
9. the manufacture method of graticule according to claim 1, is characterized in that:
Described developer solution is akaline liquid KOH or Tetramethylammonium hydroxide (TMAH).
10. the manufacture method of graticule according to claim 9, is characterized in that:
The development temperature of the developer solution in described step 4 be 25 ℃ ?35 ℃, development time 3 minutes～10 minutes, by soak or backwashing manner carry out the development of graticule.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684808.1A CN103777364B (en) | 2013-12-13 | 2013-12-13 | A kind of manufacture method of graticle |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684808.1A CN103777364B (en) | 2013-12-13 | 2013-12-13 | A kind of manufacture method of graticle |
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| CN103777364A true CN103777364A (en) | 2014-05-07 |
| CN103777364B CN103777364B (en) | 2017-10-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932113A (en) * | 2015-07-23 | 2015-09-23 | 合肥扬帆通信元器件有限公司 | Reticle with digital display screen function and manufacturing method thereof |
| CN107247340A (en) * | 2017-07-31 | 2017-10-13 | 合肥赛度电子科技有限公司 | A kind of manufacture method of the graticle with digital display screen function |
| CN111128963A (en) * | 2018-10-30 | 2020-05-08 | 成都京东方光电科技有限公司 | Display substrate mother board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1006556A1 (en) * | 1998-12-02 | 2000-06-07 | LEO Elektronenmikroskopie GmbH | Particle-optical device and method for producing microstructures |
| US20020012853A1 (en) * | 2000-07-19 | 2002-01-31 | Nikon Corporation | Apparatus and methods for patterning a reticle blank by electron-beam inscription with reduced exposure of the reticle blank by backscattered electrons |
| CN102445836A (en) * | 2010-10-13 | 2012-05-09 | 无锡华润上华半导体有限公司 | Photomask and exposure method thereof |
| CN102466891A (en) * | 2010-11-16 | 2012-05-23 | 上海法雷光学科技有限公司 | Manufacturing method for reticule |
-
2013
- 2013-12-13 CN CN201310684808.1A patent/CN103777364B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1006556A1 (en) * | 1998-12-02 | 2000-06-07 | LEO Elektronenmikroskopie GmbH | Particle-optical device and method for producing microstructures |
| US20020012853A1 (en) * | 2000-07-19 | 2002-01-31 | Nikon Corporation | Apparatus and methods for patterning a reticle blank by electron-beam inscription with reduced exposure of the reticle blank by backscattered electrons |
| CN102445836A (en) * | 2010-10-13 | 2012-05-09 | 无锡华润上华半导体有限公司 | Photomask and exposure method thereof |
| CN102466891A (en) * | 2010-11-16 | 2012-05-23 | 上海法雷光学科技有限公司 | Manufacturing method for reticule |
Non-Patent Citations (1)
| Title |
|---|
| 徐冉冉: "投影光刻***套刻对准技术的研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932113A (en) * | 2015-07-23 | 2015-09-23 | 合肥扬帆通信元器件有限公司 | Reticle with digital display screen function and manufacturing method thereof |
| CN107247340A (en) * | 2017-07-31 | 2017-10-13 | 合肥赛度电子科技有限公司 | A kind of manufacture method of the graticle with digital display screen function |
| CN111128963A (en) * | 2018-10-30 | 2020-05-08 | 成都京东方光电科技有限公司 | Display substrate mother board and manufacturing method thereof |
| US11227839B2 (en) | 2018-10-30 | 2022-01-18 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate motherboard and method for manufacturing the same |
| CN111128963B (en) * | 2018-10-30 | 2022-04-26 | 成都京东方光电科技有限公司 | Display substrate mother board and manufacturing method thereof |
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| Publication number | Publication date |
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| CN103777364B (en) | 2017-10-13 |
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Effective date of registration: 20181212 Address after: 065700 Lanyuan S3 Building, Peacock City, Bazhou, Langfang City, Hebei Province Patentee after: Bazhou Yungu Electronic Technology Co. Ltd. Address before: 100085 First Floor of Huanyang Building, No. 1 Shangdi East Road, Haidian District, Beijing Patentee before: Weixinnuo Science and Technology Co., Ltd., Beijing |
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