CN103766016A - 电子元件安装装置及电子元件安装方法 - Google Patents
电子元件安装装置及电子元件安装方法 Download PDFInfo
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- CN103766016A CN103766016A CN201280041983.2A CN201280041983A CN103766016A CN 103766016 A CN103766016 A CN 103766016A CN 201280041983 A CN201280041983 A CN 201280041983A CN 103766016 A CN103766016 A CN 103766016A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/050848 WO2013108367A1 (ja) | 2012-01-17 | 2012-01-17 | 電子部品実装装置および電子部品実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103766016A true CN103766016A (zh) | 2014-04-30 |
CN103766016B CN103766016B (zh) | 2017-02-15 |
Family
ID=48798817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280041983.2A Active CN103766016B (zh) | 2012-01-17 | 2012-01-17 | 电子元件安装装置及电子元件安装方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5789680B2 (zh) |
CN (1) | CN103766016B (zh) |
WO (1) | WO2013108367A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108633244A (zh) * | 2017-03-23 | 2018-10-09 | 松下知识产权经营株式会社 | 构件准备方法以及构件准备装置 |
CN109519978A (zh) * | 2018-11-30 | 2019-03-26 | 王银仙 | 天然气灶具定位*** |
CN110622631A (zh) * | 2017-05-23 | 2019-12-27 | 株式会社富士 | 安装顺序决定装置、安装顺序检查装置、安装顺序决定方法及安装顺序检查方法 |
CN112470265A (zh) * | 2018-07-23 | 2021-03-09 | 三星电子株式会社 | 包括led传送装置的电子装置及其控制方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5975556B1 (ja) * | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | 移載装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007065414A (ja) * | 2005-08-31 | 2007-03-15 | Sharp Corp | バックライト製造方法 |
JP2011258821A (ja) * | 2010-06-10 | 2011-12-22 | Fuji Mach Mfg Co Ltd | 電子回路組立方法および電子回路組立システム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2537971B2 (ja) * | 1988-06-17 | 1996-09-25 | 松下電器産業株式会社 | 電子部品実装装置 |
JP2755195B2 (ja) * | 1994-12-08 | 1998-05-20 | 日本電気株式会社 | 半導体装置の製造方法及びその装置 |
JP2004047620A (ja) * | 2002-07-10 | 2004-02-12 | Toyoda Gosei Co Ltd | 発光ダイオード及び発光素子の配列方法及び配列装置 |
TWI240345B (en) * | 2004-06-28 | 2005-09-21 | Advanced Semiconductor Eng | A method for re-testing semiconductor device |
JP4870857B2 (ja) * | 2010-04-13 | 2012-02-08 | パイオニア株式会社 | 部品移送装置及び方法 |
JP2011238368A (ja) * | 2010-05-06 | 2011-11-24 | Funai Electric Co Ltd | 面発光装置及び面発光装置の製造方法 |
-
2012
- 2012-01-17 CN CN201280041983.2A patent/CN103766016B/zh active Active
- 2012-01-17 JP JP2013554118A patent/JP5789680B2/ja active Active
- 2012-01-17 WO PCT/JP2012/050848 patent/WO2013108367A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007065414A (ja) * | 2005-08-31 | 2007-03-15 | Sharp Corp | バックライト製造方法 |
JP2011258821A (ja) * | 2010-06-10 | 2011-12-22 | Fuji Mach Mfg Co Ltd | 電子回路組立方法および電子回路組立システム |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108633244A (zh) * | 2017-03-23 | 2018-10-09 | 松下知识产权经营株式会社 | 构件准备方法以及构件准备装置 |
CN108633244B (zh) * | 2017-03-23 | 2020-07-28 | 松下知识产权经营株式会社 | 构件准备方法以及构件准备装置 |
CN110622631A (zh) * | 2017-05-23 | 2019-12-27 | 株式会社富士 | 安装顺序决定装置、安装顺序检查装置、安装顺序决定方法及安装顺序检查方法 |
CN110622631B (zh) * | 2017-05-23 | 2022-02-22 | 株式会社富士 | 安装顺序决定装置、安装顺序检查装置、安装顺序决定方法及安装顺序检查方法 |
CN112470265A (zh) * | 2018-07-23 | 2021-03-09 | 三星电子株式会社 | 包括led传送装置的电子装置及其控制方法 |
CN112470265B (zh) * | 2018-07-23 | 2024-02-13 | 三星电子株式会社 | 包括led传送装置的电子装置及其控制方法 |
US12009452B2 (en) | 2018-07-23 | 2024-06-11 | Samsung Electronics Co., Ltd. | Electronic device including LED transmission device, and control method therefor |
CN109519978A (zh) * | 2018-11-30 | 2019-03-26 | 王银仙 | 天然气灶具定位*** |
Also Published As
Publication number | Publication date |
---|---|
CN103766016B (zh) | 2017-02-15 |
JP5789680B2 (ja) | 2015-10-07 |
WO2013108367A1 (ja) | 2013-07-25 |
JPWO2013108367A1 (ja) | 2015-05-11 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PIONEER FA Corp. Patentee after: PIONEER Corp. Address before: Kanagawa Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PFA Co. Patentee after: PIONEER Corp. Address before: Tokyo, Japan Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180903 Address after: Tokyo, Japan Co-patentee after: PFA Co. Patentee after: SHINKAWA Ltd. Address before: Tokyo, Japan Co-patentee before: PFA Co. Patentee before: PIONEER Corp. |