CN103761008A - Panel device and manufacturing method thereof - Google Patents
Panel device and manufacturing method thereof Download PDFInfo
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- CN103761008A CN103761008A CN201410024017.0A CN201410024017A CN103761008A CN 103761008 A CN103761008 A CN 103761008A CN 201410024017 A CN201410024017 A CN 201410024017A CN 103761008 A CN103761008 A CN 103761008A
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Abstract
The invention relates to the technical field of panel display, in particular to a panel device and a manufacturing method thereof. The panel device at least comprises a substrate, a conducting wire layer and a shielding layer. The substrate comprises a first surface and a second surface which are opposite. The conducting wire layer is formed on the second surface. The shielding layer is formed on the first surface. The projection, on the first surface, of the shielding layer covers the projection, on the first surface, of the conducting wire layer. The invention further provides a panel device manufacturing method.
Description
Technical field
The present invention relates to technical field of flat panel display, relate in particular to a kind of face equipment and preparation method thereof.
Background technology
In consumption electronic products market now, collecting touch controllable function has become the trend of portable electric product mainstream development in display.Contact panel has been applied to multiple electronic product, for example smart mobile phone (Smart Phone), panel computer (Tablet PC), notebook computer (Notebook), navigating instrument (Navigator), POS system, self-aided terminal (Self-service Terminals) and Medical Devices (Medical Equipment).Because user can directly see through the icon showing on screen, operate and assign instruction, so contact panel provides the operation interface of the hommization between user and electronic product.
Integrated capacitor formula touch screen (one glass solution, OGS) be a kind of common contact panel, with respect to bilayer film formula (glass-film-film, GFF), double-layer and double-side formula (double ITO, DITO) etc., it is that touch-control electrode is integrated on cover-plate glass, therefore reduce a substrate, be conducive to lightening development trend.
Yet in OGS pattern, generally the first induction electrode tandem and the second induction electrode tandem to be all arranged to the surperficial centre position of the same side of cover-plate glass, and ink barrier bed is arranged to the surrounding position on same described surface, during due to OCA and contact panel laminating, the inner surface of contact panel is not smooth, be between described ink barrier bed and cover-plate glass, to exist section poor, when OCA being depressed into ink barrier bed place with roller, there will be buffer status, cause OCA and exist between the poor ink barrier bed of section completely closely attaching, therefore when applying OCA, contact panel inner surface has bubble, even if passed through deaeration technique, or can cause deaeration incomplete, binding yield and the display effect of touch control display apparatus have been affected.
On the other hand, the metal lead wire that connects first, second induction electrode tandem is generally located at ink layer away from the one side of cover-plate glass.For example, the patent No. is 201310181800.3, name is called in the disclosed capacitive touch screen of patent application document of " OGS capacitive touch screen and preparation method thereof ", it is that dielectric ink is first set on frame, reserved conductive hole, then use electrically conductive ink filled conductive hole, finally on dielectric ink, make metal lead wire, in this method for making, due to the poor existence of section between dielectric ink and cover-plate glass, make the electrically conductive ink must be by being arranged at the conductive hole and first on frame, the second induction electrode tandem connects, therefore can increase that metal lead wire opens circuit or the probability of short circuit, yields is extremely low.
Summary of the invention
In view of this, the invention provides a kind of face equipment that does not affect display effect and improve yields.
In addition, be also necessary to provide a kind of method for making of above-mentioned face equipment.
Described face equipment provided by the invention, it at least comprises a substrate, a conductive lead wire layer and a barrier bed, described substrate comprises opposing first surface and second surface, described conductive lead wire layer is formed at described second surface, described barrier bed is formed at described first surface, and described barrier bed covers described conductive lead wire layer in the projection of first surface in the projection of first surface.
In described face equipment provided by the invention, described face equipment also comprises a functional layer that is formed at described second surface, described second surface comprises first area and second area, described functional layer at least covers described first area in the projection of second surface, and described conductive lead wire layer covers described second area in the projection of second surface.
In described face equipment provided by the invention, described first area is positioned at the central authorities of described second surface, described second area in abutting connection with and around described first area, described first surface and second surface be arranged in parallel, described first surface comprises the 3rd region and the 4th region, described the 4th region in abutting connection with and around described the 3rd region, described the 4th region and second area are opposing, described the 3rd region and first area are opposing.
In described face equipment provided by the invention, the first surface at described the 4th place, region has a ledge structure, described ledge structure has three surface parallel with described first surface or second surface, between described the 3rd surface and described first surface, there is one first preset space length, described barrier bed is formed at the described first surface at the 4th place, region and covers described ledge structure, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface.
In described face equipment provided by the invention, described ledge structure also has four surface parallel with described the 3rd surface, described the 4th surface has one second preset space length with described the 3rd surface, described the second preset space length can equal or be not equal to described the first preset space length, and the spacing between described the 4th surface and first surface is the second preset space length and the first preset space length sum, described functional layer is touch control electrode layer, it comprises spaced many first electrode tandems and many second electrode tandems, described the first electrode tandem and the insulation of the second electrode tandem are intersected, described barrier bed at least consists of the opaque material with scratch resistance.
In described face equipment provided by the invention, described first surface is positioned at described the 4th region is positioned at the 3rd region adjoiner with it and has an inclined-plane, between described inclined-plane and described first surface, there is an angle, described barrier bed is formed at the described first surface at the 4th place, region and covers described inclined-plane, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface, and the scope of described angle is 20-45 degree.
A face equipment method for making, it at least comprises the following steps:
Provide one to there is opposing first surface and the substrate of second surface; First at described first surface, form a barrier bed, then at described second surface, form a conductive lead wire layer, or first at described second surface, form a conductive lead wire layer, then at described first surface, form a barrier bed; Described barrier bed covers described conductive lead wire layer in the projection of first surface in the projection of first surface.
In described face equipment provided by the invention and preparation method thereof, before described second surface forms a conductive lead wire layer, also on second surface, form a functional layer, described second surface comprises first area and second area, described functional layer at least covers described first area in the projection of second surface, and described conductive lead wire layer covers described second area in the projection of second surface.
In described face equipment provided by the invention and preparation method thereof, described first area is positioned at the central authorities of described second surface, described second area in abutting connection with and around described first area, described first surface and second surface be arranged in parallel, described first surface comprises the 3rd region and the 4th region, described the 4th region in abutting connection with and around described the 3rd region, described the 4th region and second area are opposing, described the 3rd region and first area are opposing, and described barrier bed at least consists of the opaque material with scratch resistance.
In described face equipment provided by the invention and preparation method thereof, before described first surface forms a barrier bed, also the first surface at described the 4th place, region forms a ledge structure, or at described first surface, be positioned at described the 4th region is positioned at the 3rd region adjoiner with it and there is an inclined-plane, described ledge structure at least has three surface parallel with described first surface or second surface, the scope of the angle that described inclined-plane and described first surface have is 20-45 degree, described barrier bed is formed at the described first surface at the 4th place, region and covers described ledge structure or inclined-plane, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface, described functional layer comprises spaced many first electrode tandems and many second electrode tandems, described the first electrode tandem and the insulation of the second electrode tandem are intersected.
In described face equipment provided by the invention and preparation method thereof, owing to barrier bed being arranged to the first surface of substrate, conductive lead wire is arranged to the second surface of substrate, than traditional same surface that barrier bed and conductive lead wire is arranged to substrate, it has avoided causing face equipment in follow-up bonding process, to produce the defect that bubble affects display effect due to the ledge structure of barrier bed on the one hand, on the other hand due to conductive lead wire and functional layer poor without section, therefore the probability that reduces conductive lead wire short circuit or open circuit, has improved the yields of face equipment.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of the face equipment 100 of a preferred embodiment provided by the invention;
Fig. 2 is the structural representation of the face equipment 200 of another better embodiment provided by the invention;
Fig. 3 is the structural representation of the another kind of better embodiment of face equipment shown in Fig. 2;
Fig. 4 is the structural representation of the another kind of better embodiment of face equipment shown in Fig. 2;
Fig. 5 is the schematic flow sheet of face equipment method for making described in Fig. 1;
Fig. 6 is the schematic flow sheet of face equipment method for making shown in Fig. 4.
Embodiment
For face equipment provided by the invention and preparation method thereof is described, below in conjunction with Figure of description and explanatory note, be described in detail.
Please refer to Fig. 1, is the schematic diagram of the face equipment 100 of a better embodiment provided by the invention.Described face equipment 100 at least comprises a substrate 101, a functional layer 102, a conductive lead wire layer 103 and a barrier bed 104.
Described substrate 101 at least has opposing first surface 101b and second surface 101a, in present embodiment, described first surface 101b and second surface 101a are the plane being parallel to each other, in other embodiments, first surface can be also parallel or uneven curved surface or irregular surface with second surface.The material of described substrate 101 is glass or resin etc.
Described conductive lead wire layer 103 and functional layer 102 are formed on described second surface 101a, described second surface 101a comprises first area and second area, described functional layer 102 at least covers described first area in the projection of second surface 101a, and described conductive lead wire layer 103 covers described second area in the projection of second surface 101a.In present embodiment, described first area is positioned at the central authorities of described second surface 101a, described second area in abutting connection with and around described first area.In other embodiments, second area also can be positioned at a side of first area.Described conductive lead wire layer 103 consists of conductive material such as metal, metal alloy or indium tin oxide target etc.
In present embodiment, described face equipment is contact panel, described functional layer 102 is touch control electrode layer, and it comprises spaced many first electrode tandems and many second electrode tandem (not shown)s, and described the first electrode tandem and the insulation of the second electrode tandem are intersected; In another embodiment, described face equipment is transistor (TFT) array substrate, and described functional layer comprises thin film transistor (TFT) and pixel electrode etc.
Described barrier bed 104 is formed at described first surface 101b, and described barrier bed 104 covers described conductive lead wire layer 103 in the projection of first surface 101b in the projection of first surface 101b.Shown in barrier bed 104 by the opaque material with scratch resistance, metal for example, pottery waits through applying or other techniques form.
As shown in Figure 5, it is the schematic flow sheet of face equipment method for making in present embodiment, shown in method for making at least comprise the following steps:
Step S01: provide one to there is opposing first surface and the substrate of second surface;
Step S02: form a barrier bed on described first surface;
Step S03: form a functional layer at described second surface, described second surface comprises first area and second area, described functional layer at least covers described first area in the projection of second surface;
Step S04: form a conductive lead wire layer at described second surface, described conductive lead wire layer covers described second area in the projection of described second surface, described barrier bed covers described conductive lead wire layer in the projection of first surface in the projection of first surface.
In other embodiments, after also step S02 can being positioned over to step S03, S04, that is: barrier bed is made after functional layer, conductive lead wire layer.
The face equipment of present embodiment is owing to barrier bed being arranged to the first surface of substrate, conductive lead wire is arranged to the second surface of substrate, than traditional same surface that barrier bed and conductive lead wire is arranged to substrate, it has avoided causing face equipment in follow-up bonding process, to produce the defect that bubble affects display effect due to the ledge structure of barrier bed on the one hand, on the other hand due to conductive lead wire and functional layer poor without section, therefore the probability that reduces conductive lead wire short circuit or open circuit, has improved the yields of face equipment.
As shown in Figure 2, it is the structural representation of the face equipment 200 of another better embodiment provided by the invention, the difference of itself and above-mentioned face equipment 100 is, described first surface 201b comprises the 3rd region and the 4th region, the first surface 201b at described the 4th place, region has a ledge structure, described ledge structure has the three surperficial 201c parallel with described first surface 201b or second surface 201a, between described the 3rd surperficial 201c and described first surface 201b, there is one first preset space length D1, described the 4th region in abutting connection with and around described the 3rd region, the second area of described the 4th region and second surface is opposing, the first area of described the 3rd region and second surface is opposing, barrier bed 204 is formed at the described first surface 201b at the 4th place, region and covers described ledge structure, in the direction perpendicular to described first surface 201b, described barrier bed 204 flushes with the plane at described first surface 201b place away from the one side of described first surface 201b.
The first surface 201b that the face equipment 200 of present embodiment is embedded in substrate 201 by barrier bed 204 is upper, can guarantee the planarization of the first surface 201b of substrate 201, has therefore further improved the appearance effect of face equipment 200.
As shown in Figure 3, it is the structural representation of the another kind of better embodiment of face equipment 200 in Fig. 2, the difference of the face equipment of itself and Fig. 2 is, ledge structure also has the four surperficial 201d parallel with described the 3rd surperficial 201c, described the 4th surperficial 201d and described the 3rd surperficial 201c have one second preset space length D2, described the second preset space length D2 can equal or be not equal to described the first preset space length D1, and the space D between described the 4th surperficial 201d and first surface 201a is the second preset space length D2 and the first preset space length sum D1, the ledge structure of this mode can reduce to produce the probability of bubble when applying barrier bed, therefore, can guarantee the homogeneity that barrier bed applies.
As shown in Figure 4, it is the structural representation of the another kind of better embodiment of face equipment 200 shown in Fig. 2, the difference of the face equipment of itself and Fig. 2 is, described first surface is positioned at described the 4th region is positioned at the 3rd region adjoiner with it and has an inclined-plane 207, between described inclined-plane 207 and described first surface 201b, there is an angle theta, barrier bed 204 is formed at the described first surface 201b at the 4th place, region and covers described inclined-plane 207, in the direction perpendicular to described first surface 201b, described barrier bed 204 flushes with the plane at described first surface 201b place away from the one side of described first surface 201b, the scope of described angle is 20-45 degree, preferably, described angle is 30 degree.Described inclined-plane 207 can be plane or curved surface.The face equipment of this structure produces the probability of bubble in the time of can also reducing to apply barrier bed, can guarantee the homogeneity that barrier bed applies.
As shown in Figure 6, the schematic flow sheet of the method for making of face equipment shown in Fig. 4.Described method for making at least comprises the following steps:
S11: provide one to have opposing first surface and the substrate of second surface, described first surface comprises the 3rd region and the 4th region;
Step S12: be positioned at described first surface described the 4th region is positioned at the 3rd region adjoiner with it and form an inclined-plane;
Step S13 a: barrier bed is formed to the first surface at the 4th place, region, and covers described inclined-plane;
Step S14: form a functional layer on described second surface, described functional layer at least covers described first area;
Step S15: form a conductive lead wire layer on described second surface, it covers described second area.
It is more than the better embodiment of face equipment provided by the invention and preparation method thereof; can not be interpreted as the restriction to rights protection scope of the present invention; those skilled in the art should know; without departing from the inventive concept of the premise; also can do multiple improvement or replacement; these all improvement or replacement all should be in the scope of the present invention, and the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a face equipment, it at least comprises a substrate, a conductive lead wire layer and a barrier bed, described substrate comprises opposing first surface and second surface, described conductive lead wire layer is formed at described second surface, described barrier bed is formed at described first surface, and described barrier bed covers described conductive lead wire layer in the projection of first surface in the projection of first surface.
2. face equipment as claimed in claim 1, it is characterized in that: described face equipment also comprises a functional layer that is formed at described second surface, described second surface comprises first area and second area, described functional layer at least covers described first area in the projection of second surface, and described conductive lead wire layer covers described second area in the projection of second surface.
3. face equipment as claimed in claim 2, it is characterized in that: described first area is positioned at the central authorities of described second surface, described second area in abutting connection with and around described first area, described first surface and second surface be arranged in parallel, described first surface comprises the 3rd region and the 4th region, described the 4th region in abutting connection with and around described the 3rd region, described the 4th region and second area are opposing, described the 3rd region and first area are opposing.
4. face equipment as claimed in claim 3, it is characterized in that: the first surface at described the 4th place, region has a ledge structure, described ledge structure has three surface parallel with described first surface or second surface, between described the 3rd surface and described first surface, there is one first preset space length, described barrier bed is formed at the described first surface at the 4th place, region and covers described ledge structure, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface.
5. face equipment as claimed in claim 4, it is characterized in that: described ledge structure also has four surface parallel with described the 3rd surface, described the 4th surface has one second preset space length with described the 3rd surface, described the second preset space length can equal or be not equal to described the first preset space length, and the spacing between described the 4th surface and first surface is the second preset space length and the first preset space length sum, described functional layer is touch control electrode layer, it comprises spaced many first electrode tandems and many second electrode tandems, described the first electrode tandem and the insulation of the second electrode tandem are intersected, described barrier bed at least consists of the opaque material with scratch resistance.
6. face equipment as claimed in claim 3, it is characterized in that: described first surface is positioned at described the 4th region is positioned at the 3rd region adjoiner with it and has an inclined-plane, between described inclined-plane and described first surface, there is an angle, described barrier bed is formed at the described first surface at the 4th place, region and covers described inclined-plane, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface, and the scope of described angle is 20-45 degree.
7. a method for making for face equipment, it at least comprises the following steps:
Provide one to there is opposing first surface and the substrate of second surface;
First at described first surface, form a barrier bed, then at described second surface, form a conductive lead wire layer, or first at described second surface, form a conductive lead wire layer, then at described first surface, form a barrier bed;
Described barrier bed covers described conductive lead wire layer in the projection of first surface in the projection of first surface.
8. face equipment method for making as claimed in claim 7, it is characterized in that: before described second surface forms a conductive lead wire layer, also on second surface, form a functional layer, described second surface comprises first area and second area, described functional layer at least covers described first area in the projection of second surface, and described conductive lead wire layer covers described second area in the projection of second surface.
9. face equipment method for making as claimed in claim 8, it is characterized in that: described first area is positioned at the central authorities of described second surface, described second area in abutting connection with and around described first area, described first surface and second surface be arranged in parallel, described first surface comprises the 3rd region and the 4th region, described the 4th region in abutting connection with and around described the 3rd region, described the 4th region and second area are opposing, described the 3rd region and first area are opposing, and described barrier bed at least consists of the opaque material with scratch resistance.
10. face equipment method for making as claimed in claim 9, it is characterized in that: before described first surface forms a barrier bed, also the first surface at described the 4th place, region forms a ledge structure, or at described first surface, be positioned at described the 4th region is positioned at the 3rd region adjoiner with it and there is an inclined-plane, described ledge structure at least has three surface parallel with described first surface or second surface, the scope of the angle that described inclined-plane and described first surface have is 20-45 degree, described barrier bed is formed at the described first surface at the 4th place, region and covers described ledge structure or inclined-plane, in the direction perpendicular to described first surface, described barrier bed flushes with the plane at described first surface place away from the one side of described first surface, described functional layer comprises spaced many first electrode tandems and many second electrode tandems, described the first electrode tandem and the insulation of the second electrode tandem are intersected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410024017.0A CN103761008B (en) | 2014-01-18 | 2014-01-18 | A kind of face equipment and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410024017.0A CN103761008B (en) | 2014-01-18 | 2014-01-18 | A kind of face equipment and preparation method thereof |
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| CN103761008A true CN103761008A (en) | 2014-04-30 |
| CN103761008B CN103761008B (en) | 2017-06-20 |
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| CN201410024017.0A Active CN103761008B (en) | 2014-01-18 | 2014-01-18 | A kind of face equipment and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105302353A (en) * | 2014-08-01 | 2016-02-03 | 深圳莱宝高科技股份有限公司 | Panel structure manufacturing method |
| CN106527779A (en) * | 2015-09-09 | 2017-03-22 | 深圳莱宝高科技股份有限公司 | Panel structure and panel processing method and device |
| CN110262702A (en) * | 2019-07-30 | 2019-09-20 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN112041914A (en) * | 2018-04-24 | 2020-12-04 | 住友化学株式会社 | Optical laminate and method for producing same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101477421B (en) * | 2009-01-21 | 2011-08-17 | 友达光电股份有限公司 | Touch control panel structure |
| CN201440257U (en) * | 2009-05-13 | 2010-04-21 | 中国南玻集团股份有限公司 | Capacitive touch control screen |
| CN102314270A (en) * | 2010-07-01 | 2012-01-11 | 富创得科技股份有限公司 | Monolithic capacitor touch panel structure |
| CN103129073B (en) * | 2011-11-28 | 2015-04-15 | 宸鸿光电科技股份有限公司 | Device with multiple printing layers and printing method thereof |
| CN203720805U (en) * | 2014-01-18 | 2014-07-16 | 深圳莱宝高科技股份有限公司 | Panel device |
-
2014
- 2014-01-18 CN CN201410024017.0A patent/CN103761008B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105302353A (en) * | 2014-08-01 | 2016-02-03 | 深圳莱宝高科技股份有限公司 | Panel structure manufacturing method |
| CN106527779A (en) * | 2015-09-09 | 2017-03-22 | 深圳莱宝高科技股份有限公司 | Panel structure and panel processing method and device |
| CN112041914A (en) * | 2018-04-24 | 2020-12-04 | 住友化学株式会社 | Optical laminate and method for producing same |
| CN110262702A (en) * | 2019-07-30 | 2019-09-20 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN110262702B (en) * | 2019-07-30 | 2022-05-10 | 昆山国显光电有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103761008B (en) | 2017-06-20 |
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