CN103743783A - Dew point detection device based on micro-electromechanical system (MEMS) chip - Google Patents
Dew point detection device based on micro-electromechanical system (MEMS) chip Download PDFInfo
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- CN103743783A CN103743783A CN201410007381.6A CN201410007381A CN103743783A CN 103743783 A CN103743783 A CN 103743783A CN 201410007381 A CN201410007381 A CN 201410007381A CN 103743783 A CN103743783 A CN 103743783A
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- dew
- transparent panel
- mirror surface
- device based
- dew point
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
- G01N25/66—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point
- G01N25/68—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point by varying the temperature of a condensing surface
Abstract
The invention discloses a dew point detection device based on a micro-electromechanical system (MEMS) chip, and belongs to the technical field of atmosphere detection. The dew point detection device comprises a cooling fin, a refrigerator, a mirror surface and an upholder, wherein the refrigerator is fixed on the cooling fin; the mirror surface is attached to the upper surface of the refrigerator; a transparent plate array is machined above the mirror surface by a micro mechanical technology; the upholder is arranged between the transparent plate array and the mirror surface, and the transparent plate array and the upholder are made of high thermal conductivity materials, so that the temperature of each transparent plate is consistent with that of the mirror surface. Thus, the transparent plates form dew when the mirror surface forms dew; more attenuation of reflected light on a light path can be realized by dew formation of the transparent plates, an increase of variation amplitude of a reflected light signal is facilitated, and the sensitivity and the response speed of a dew point detector are increased.
Description
Technical field
The invention discloses the dew-point detecting device based on MEMS chip, belong to the technical field that atmosphere detects.
Background technology
Humidity is very important ingredient in aeromerric moasurenont.As everyone knows, relative humidity means under uniform temperature, pressure, whether the water vapor containing in air approaches a saturated physical quantity, relative humidity is larger, illustrate that airborne water vapor approaches saturated, when airborne water vapor condenses into water once the state of reaching capacity, be just referred to as dewfall, temperature at this moment is just called dewpoint temperature.In theory, for the air of giving fixed temperature, pressure, its relative humidity is corresponding with dewpoint temperature, therefore, as long as find dewpoint temperature in the situation that keeping pressure constant, by converting, just can determine relative humidity, Here it is surveys the principle of relative humidity with dew point method.
The principle that optics chilled-mirror type dew point instrument is measured dew point is: a branch of light source is irradiated on the minute surface of controllable temperature, by photodetector, receives reflected light.When minute surface is dry, its reflected light is the strongest.On minute surface during condensate water, light can produce certain decay during through moisture film, thereby at the interface of empty G&W, also may exist scattering that intensity of reflected light is weakened with the time.The telemetry circuit of dew point hygrometer can regulate the power of refrigerator in real time, makes the dew on minute surface keep certain thickness, the dewpoint temperature that now temperature of minute surface is tested gas.
The shortcomings such as at present, the method that optics dew point hygrometer is measured dew point is to change to judge with single mirror-reflection light intensity the amount of revealing on minute surface substantially, although this structure is simple, exists reaction slow, and sensitivity is low.
Summary of the invention
Technical matters to be solved by this invention is the deficiency for above-mentioned background technology, and the dew-point detecting device based on MEMS chip is provided.
The present invention adopts following technical scheme for achieving the above object:
Dew-point detecting device based on MEMS chip, comprise heat radiator, be fixed on the refrigeration machine on heat radiator, be fitted in the minute surface of refrigeration machine upper surface, the described dew-point detecting device based on MEMS chip also comprises: transparent panel array and back up pad, described back up pad is prepared on minute surface by miromaching, and described transparent panel array is prepared in back up pad by miromaching.
Dew-point detecting device based on MEMS chip, comprise heat radiator, be fixed on the refrigeration machine on heat radiator, be fitted in the minute surface of refrigeration machine upper surface, the described dew-point detecting device based on MEMS chip also comprises the transparent panel array by " π " type transparent panel integrated molding, and described " π " type transparent panel is prepared on minute surface by miromaching.
Further, transparent panel array is made by silit or aluminium nitride.
Further, back up pad is made by highly heat-conductive material.
The present invention adopts technique scheme, has following beneficial effect: the sensitivity and the response speed that have improved dew point detector.
Accompanying drawing explanation
Fig. 1 is the structural representation of the dew-point detecting device based on MEMS chip.
Fig. 2 is " π " type transparent panel structural representation.
Fig. 3 is " π " type transparent panel array dew-point detecting device structural representation.
Fig. 4 is back up pad, transparent panel array microstructure MEMS technique preparation process figure.
Fig. 5 is " π " type transparent panel array microstructure MEMS technique preparation process figure.
Number in the figure explanation: 1 is transparent panel array, and 2 is back up pad, and 3 is minute surface, and 4 is refrigeration machine, and 5 is heat radiator, 6 is incident light, and 7 is reflected light, and 8 is " π " type transparent panel, and 9 is silicon dioxide, 10,13,14,16 is mask pattern, and 11 is silit, and 12 is aluminium nitride, and 15 is silit.
Embodiment
Below in conjunction with accompanying drawing, the technical scheme of invention is elaborated.
Specific embodiment one:
The dew-point detecting device based on MEMS chip as shown in Figure 1, comprise heat radiator 5, be fixed on the refrigeration machine 4 on heat radiator 5, be fitted in the minute surface 3 of refrigeration machine 4 upper surfaces, transparent panel array 1, back up pad 2, back up pad 2 is prepared on minute surface 3 by miromaching, and transparent panel array 1 is by preparing in back up pad 2 for mechanical processing technique.The material of transparent panel array 1 is silit, and back up pad 2 can be metal, silit or aluminium nitride material.
Specific embodiment two:
The dew-point detecting device with regard to MEMS chip as shown in Figure 3, consider the factors such as technology difficulty and cost of manufacture, by some " π " type transparent panel 8 integrated moldings as shown in Figure 2, be transparent panel array 1, each " π " type transparent panel 8 is prepared on minute surface 3 by miromaching.
Transparent panel array 1 can be by being machined into shape and the thickness needing, and transparent panel is very little on the impact of light path, and is more conducive to gas flow, thereby is conducive to the diffusion of hydrone.
In when work, the temperature of transparent panel array 1 and minute surface 3 can think consistent approx, thereby when minute surface 3 dewfall, the upper and lower surface of transparent panel array 1 is dewfall likely also.Incident light 6 is when irradiating transparent panel array 1 and minute surface 3, due to transparent panel array 1 surface sweating, this makes reflected light 7 on light-path, have more decay, and the amplitude of variation of reflected light 7 signals increases, and can make the sensitivity of dew point transducer and response speed be improved.Utilize photodetector to receive reflected light 7, telemetry circuit detects the electric signal power of photodetector output, control refrigerator watt level so that on minute surface dew keep certain thickness, read the temperature data that temperature sensor records this moment and be tested gas dew point temperature.
For reaching above effect, the preparation of MEMS transparent panel array is adopted to embodiment as shown in Figure 4:
The first step, is deposited on silicon dioxide 9 to take the surface that minute surface 3 is substrate;
Second step, makes and covers silicon dioxide 9 surfaces for the mask pattern 10 of follow-up formation back up pad 2 parts, and carry out photoetching corrosion, removes mask pattern 10 part in addition;
The 3rd step, erosion removal mask graph 10, adopts pecvd process to prepare one deck silit 11 on silicon dioxide 9 surfaces;
The 4th step, polished surface, makes silicon dioxide 9 exposing surfaces;
The 5th step, adopts pecvd process to prepare one deck aluminium nitride 12 at silicon dioxide 9 and silit 11 surfaces;
The 6th step, makes and covers aluminium nitride 12 surfaces for the mask pattern 13 of follow-up formation transparent panel array, and carry out photoetching corrosion, removes mask pattern part in addition;
The 7th step, erosion removal mask pattern 13 and silicon dioxide 9, just formed satisfactory transparent panel array 1.
A preferred embodiment of the present invention is between minute surface and each transparent panel, to adopt four pin columnar supports to connect, but consider the factors such as technology difficulty and cost of manufacture, another kind of preferred version of the present invention is that transparent panel is directly prepared " π " type shown in Fig. 2, concrete steps as shown in Figure 5:
The first step, is deposited on silicon dioxide 9 to take the surface that minute surface 3 is substrate;
Second step, makes and covers silicon dioxide 9 surfaces for the mask pattern 14 of follow-up generation " π " type transparent panel array blank, and carry out photoetching corrosion, removes mask pattern 14 part in addition;
The 3rd step, erosion removal mask graph 14, adopts pecvd process to prepare one deck silit 15 on silicon dioxide 9 surfaces;
The 4th step, makes and covers silit 15 surfaces for the mask pattern 16 of follow-up formation " π " transparent panel 8;
The 5th step, the part beyond mask pattern 16 is removed in corrosion;
The 6th step, erodes mask pattern 16 and silicon dioxide 9, has just formed satisfactory transparent panel array 1.
To sum up: the back up pad that Heat Conduction Material is made and transparent panel array, make transparent panel consistent with mirror temperature, transparent panel also dewfall in minute surface dewfall; Transparent panel dewfall makes reflected light on light-path, have more decay, and the amplitude of variation that is conducive to reflected light signal increases, and has improved sensitivity and the response speed of dew point detector.
Claims (4)
1. the dew-point detecting device based on MEMS chip, comprise heat radiator, be fixed on the refrigeration machine on heat radiator, be fitted in the minute surface of refrigeration machine upper surface, it is characterized in that: the described dew-point detecting device based on MEMS chip also comprises: transparent panel array and back up pad, described back up pad is prepared on minute surface by miromaching, and described transparent panel array is prepared in back up pad by miromaching.
2. the dew-point detecting device based on MEMS chip, comprise heat radiator, be fixed on the refrigeration machine on heat radiator, be fitted in the minute surface of refrigeration machine upper surface, it is characterized in that: the described dew-point detecting device based on MEMS chip also comprises the transparent panel array by " π " type transparent panel integrated molding, described " π " type transparent panel is prepared on minute surface by miromaching.
3. dew-point detecting device according to claim 1 and 2, is characterized in that: transparent panel array is made by silit or aluminium nitride.
4. dew-point detecting device according to claim 1, is characterized in that: described back up pad is made by highly heat-conductive material.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109073578A (en) * | 2016-02-25 | 2018-12-21 | ams有限公司 | Cmos compatible dew point transducer device and the method for determining dew point |
CN110249216A (en) * | 2017-02-09 | 2019-09-17 | 松下知识产权经营株式会社 | Condensation sensor, condensation check system and freezer |
CN112723298A (en) * | 2020-12-30 | 2021-04-30 | 清华大学 | Heat dissipation compensation microstructure for MEMS sensor etching |
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US4946288A (en) * | 1988-11-02 | 1990-08-07 | Nova Husky Research Corporation | Dew point analyzer |
EP0409546A2 (en) * | 1989-07-17 | 1991-01-23 | Osaka Sanso Kogyo KK | Apparatus for measuring the water content of a gas |
US20040240515A1 (en) * | 2001-08-03 | 2004-12-02 | David Egan | Optical end-point detector for a hygrometer |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109073578A (en) * | 2016-02-25 | 2018-12-21 | ams有限公司 | Cmos compatible dew point transducer device and the method for determining dew point |
US11002696B2 (en) | 2016-02-25 | 2021-05-11 | Sciosense B.V. | CMOS-compatible dew point sensor device and method of determining a dew point |
US11525793B2 (en) | 2016-02-25 | 2022-12-13 | Sciosense B.V. | CMOS compatible dew point sensor device and method of determining a dew point |
CN110249216A (en) * | 2017-02-09 | 2019-09-17 | 松下知识产权经营株式会社 | Condensation sensor, condensation check system and freezer |
CN110249216B (en) * | 2017-02-09 | 2022-04-12 | 松下知识产权经营株式会社 | Dew condensation sensor, dew condensation detection system, and refrigerator |
CN112723298A (en) * | 2020-12-30 | 2021-04-30 | 清华大学 | Heat dissipation compensation microstructure for MEMS sensor etching |
CN112723298B (en) * | 2020-12-30 | 2023-02-17 | 清华大学 | Heat dissipation compensation microstructure for MEMS sensor etching |
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Application publication date: 20140423 |