CN103737472B - The burnishing device of curved surface polishing machine - Google Patents
The burnishing device of curved surface polishing machine Download PDFInfo
- Publication number
- CN103737472B CN103737472B CN201310734762.XA CN201310734762A CN103737472B CN 103737472 B CN103737472 B CN 103737472B CN 201310734762 A CN201310734762 A CN 201310734762A CN 103737472 B CN103737472 B CN 103737472B
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- Prior art keywords
- polishing disk
- workpiece
- polishing
- work platforms
- pressure
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- 238000005498 polishing Methods 0.000 title claims abstract description 127
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000004364 calculation method Methods 0.000 claims description 6
- 230000001174 ascending effect Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses the workpiece on a kind of work platforms by polishing disk to movement and apply to set the burnishing device of the curved surface polishing machine of pressure, it includes frame, frame is provided with rotatable polishing disk, it is characterized in that frame is provided with the dynamic pressurized device realizing polishing disk to the workpiece applying setting pressure on the work platforms of movement, described dynamic pressurized device keeps the pressure applying to set by the polishing disk being arranged on elevator platform to workpiece, present configuration is simple, polishing disk can be realized by PLC the pressure of workpiece applying setting is polished, overcome the defect that existing polishing exists, simultaneously, the movement of work platforms, substantially increase production efficiency and lay the foundation for realizing production line balance.
Description
Technical field
The present invention relates to a kind of curved surface polishing machine, a kind of ultra-thin, fragile workpiece curved surface polishing machine
Burnishing device, particularly relates to a kind of such as the throwing of the workpiece curved surface polishing machines such as glass, sapphire, piezoelectric quartz, monocrystalline silicon piece
Electro-optical device.
Background technology
In order to make the surface of the workpiece such as ultra-thin, fragile workpiece such as glass, sapphire, piezoelectric quartz, monocrystalline silicon piece become
Smooth, transparent, and there is gloss, generally its surface need to be polished.At present, the basic structure of existing used curved surface polishing machine
For upper dish (polishing disk), lower disc, polishing disk is rotated, and the work platforms i.e. lower wall being placed with workpiece can be relative
Polishing disk reversely rotates, and one is to increase grinding speed, and two is to make workpiece polishing uniformly.Meanwhile, in whole motor process, because throwing
CD and the contact area of work platforms keep constant, so when press polish works, cylinder can be by polishing disk to work
Make workpiece on platform and apply constant pressure, to ensure to keep between polishing disk and workpiece constant pressure.But, because of polishing
Dish, work platforms are all rotated, and polishing disk, the outer ring of work platforms there are differences, so in inner ring on-line velocity
The polishing uniformity causing workpiece on work platforms is poor, leaves blemishes on workpiece, such as polishing stricture of vagina etc., affects polishing effect and effect
Rate.To this end, can use while polishing disk is rotated, the work platforms being placed with workpiece moves horizontally.
But, when work platforms moves horizontally, polishing disk is being continually changing with the contact area of workpiece, thus polishing disk and workpiece
Between can not keep constant pressure, severely impact polishing effect, even defective work piece.
Summary of the invention
It is an object of the invention to provide the workpiece on a kind of work platforms by polishing disk to movement to apply to set pressure
The burnishing device of curved surface polishing machine.
The present invention adopts the following technical scheme that and realizes its goal of the invention, the burnishing device of a kind of curved surface polishing machine, it
Including frame, frame is provided with rotatable polishing disk, and frame is provided with and realizes polishing disk to the work on the work platforms of movement
Part applies to set the dynamic pressurized device of pressure, described dynamic pressurized device by the polishing disk that is arranged on elevator platform to work
Part keeps the pressure applying to set.
Work platforms of the present invention is square.
Dynamic pressurized device of the present invention includes being arranged in frame lift cylinder, the detection work controlled by PLC
The displacement transducer of platform displacement, the cylinder block of lift cylinder is arranged in frame, the piston rod of lift cylinder and elevator platform
Connect；The PLC displacement calculation polishing disk according to work platforms and the contact area of workpiece, passing ratio reversal valve determines liter
The ascending, descending of sending down the abnormal ascending QI cylinder controls, it is achieved polishing disk applies the pressure set to workpiece.
Simple for calculating, the pressure that workpiece is applied to set by polishing disk of the present invention is that polishing disk is executed as P=F/ S, F
Adding to the pressure of workpiece, S is the work surface contact area with workpiece of polishing disk；The work surface of described polishing disk and workpiece
Contact area approximate calculation is:
In formula, S represents the near contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents work platforms
Relative shift, R >=H, cos α=(R-H)/R；Or
In formula, S represents the near contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents work platforms
Relative shift, H ＞ R, cos α=(H-R)/R.
For making polishing disk revolve round the sun while rotation, polishing disk of the present invention is arranged in mounting disc, polishing disk by
The polishing motor being arranged on elevator platform drives, and described mounting disc is driven by the revoluting motor being arranged on elevator platform.
Polishing disk of the present invention is 2～8, and the drive shaft of polishing disk is joined by the main shaft of gear train with polishing motor
Connect.
Owing to using technique scheme, the present invention preferably achieves goal of the invention, and its simple in construction can by PLC
Realize polishing disk the pressure of workpiece applying setting is polished, overcome the defect that existing polishing exists, meanwhile, work platforms
Movement, substantially increase production efficiency and lay the foundation for realizing production line balance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the electric control theory schematic diagram of the present invention；
Fig. 3 is work surface calculating schematic diagram (the work platforms shifting with the near contact area S of workpiece of polishing disk of the present invention
Dynamic distance H is less than or equal to the radius R of polishing disk)；
Fig. 4 is work surface calculating schematic diagram (the work platforms shifting with the near contact area S of workpiece of polishing disk of the present invention
Dynamic distance H is more than the radius R of polishing disk)；
Fig. 5 is the tonnage curve chart of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
As seen from Figure 1, Figure 2, the burnishing device of a kind of curved surface polishing machine, it includes that frame 1, frame 1 are provided with rotatable
Polishing disk 16, frame 1 is provided with and realizes polishing disk 16 and apply to set the dynamic of pressure to the workpiece 17 on the work platforms 8 of movement
State pressue device, workpiece 17 is kept applying to set by the polishing disk 16 being arranged on elevator platform 5 by described dynamic pressurized device
Fixed pressure.
Work platforms 8 of the present invention is square.
Dynamic pressurized device of the present invention includes being arranged in frame 1 lift cylinder 2, the detection work controlled by PLC
Making the displacement transducer of platform 8 displacement, the cylinder block of lift cylinder 2 is arranged in frame 1, the piston rod of lift cylinder 2 and liter
Fall frame 5 connects；The contact area of the PLC displacement calculation polishing disk 16 according to work platforms 8 and workpiece 17, passing ratio changes
Determine that the ascending, descending to lift cylinder 2 controls to valve, it is achieved polishing disk 16 applies the pressure set to workpiece 17.
Simple for calculating, the pressure that workpiece 17 is applied to set by polishing disk 16 of the present invention is polishing as P=F/ S, F
Dish 16 is applied to the pressure of workpiece 17, and S is the work surface contact area with workpiece 17 of polishing disk 16；The work of described polishing disk 16
The contact area approximate calculation making face and workpiece 17 is:
In formula, S represents the near contact area of polishing disk 16 and workpiece 17, and R represents the radius of polishing disk 16, and H represents work
The relative shift of platform 8, R >=H, cos α=(R-H)/R；Or
In formula, S represents the near contact area of polishing disk 16 and workpiece 17, and R represents the radius of polishing disk 16, and H represents work
The relative shift of platform 8, H ＞ R, cos α=(H-R)/R.
For making polishing disk 16 revolve round the sun while rotation, polishing disk 16 of the present invention is arranged in mounting disc 7, polishing
Dish 16 is driven by the polishing motor 3 being arranged on elevator platform 5, and described mounting disc 7 is by the revolution electricity being arranged on elevator platform 5
Machine 6 drives.Described polishing disk 16 is 2～8, and the polishing disk 16 of the present embodiment is 3, and the drive shaft of polishing disk 16 passes through gear
Group couples with the main shaft of polishing motor 3.
The work platforms 8 of movement of the present invention it driven by driving means, described driving means includes being provided with guide rail
The frame 1 of 10, work platforms 8 is provided with the slide block 9 coordinated with guide rail 10, makes work platforms 8 can slide on guide rail 10；Work
Platform 8 is provided with chain mounting seat 21, and frame 1 is provided with and moves horizontally driving motor 12, driven sprocket 15, drives by moving horizontally
The drive sprocket 13 that galvanic electricity machine 12 drives, chain 14 is wound on drive sprocket 13 and driven sprocket 15, and two ends are pacified with chain respectively
Dress seat 21 connects.Simple for controlling, the movement of work platforms 8 of the present invention is horizontal linear uniform motion.For making workpiece 17
Having moderately good polishing effect, work platforms 8 of the present invention is provided with the cooler cooling down work platforms 8
Structure and the adsorbing mechanism of installation workpiece 17.
Cooling body of the present invention includes the serpentine waterways 19 being located in work platforms 8, connects with serpentine waterways 19
Water supply connector, water out adapter, water inlet pipe, outlet pipe are arranged on drag chain and are connected with water supply connector, water out adapter respectively, dragging
Chain one end is fixed in frame 1, and the other end is fixed on work platforms 8；Described adsorbing mechanism includes being located in work platforms 8
Vacuum air-channel 20, be arranged on work platforms 8 vacuum cup connected with vacuum air-channel 20.
Have tank and air drain on work platforms 8 of the present invention, and closed by shrouding 11, thus form Serpentis
Shape water channel 19 and vacuum air-channel 20；It is provided with substrate 18 with the corresponding position of vacuum air-channel 20, substrate 18 is provided with vacuum cup.
The present embodiment is provided with lift cylinder 2 in frame 1, and the piston rod of lift cylinder 2 is connected with elevator platform 5, this reality
The polishing disk 16 executing example is 6, is arranged on elevator platform 5 by mounting disc 7 respectively, and is driven by polishing motor 3, polishing disk
Centre bore on 16 is connected with polishing fluid part flow arrangement 4 respectively；Described mounting disc 7 is by the revolution electricity being arranged on elevator platform 5
Machine 6 drives.
When the present invention works, workpiece 17 is moved to vacuum cup by mechanical hand, and under the control of PLC, work platforms 8 is by level
Mobile driving motor 12 drive level at the uniform velocity moves, and according to the pressure set, PLC approximates meter according to the displacement of work platforms 8
Calculating contact area S of polishing disk 16 and workpiece 17, passing ratio reversal valve determines that the ascending, descending to lift cylinder 2 controls, polishing disk
16 are revolved round the sun by mounting disc 7 while rotation, are polished workpiece 17, and Fig. 5 show the tonnage curve of the present invention
Figure.
Due to polishing disk 16, with the speed high speed rotating of about 1000 revs/min, (existing polishing velocity is 300 revs/min
Left and right), produce substantial amounts of heat, therefore, emulsus polishing fluid polished liquid part flow arrangement 4 respectively enters the centre bore of polishing disk 16
And flow out workpiece 17 is cooled down, meanwhile, work platforms 8 is also cooled down by cooling water, during to keep polishing operation
Good working environment is between 25 ± 5 DEG C.Emulsus polishing fluid is recovered, and cooling is recycling after processing.
Polishing fluid part flow arrangement 4 of the present invention includes feed tube, shunting main chamber, shunting main chamber and the master of polishing motor 3
Axle couples, and shunting main chamber is coupled with the centre bore of polishing disk 16 by isocon；Feed tube and shunting main chamber, isocon and polishing
Sealed by sealing member between the centre bore of dish 16, to ensure that polishing disk 16 emulsus polishing fluid when rotation is with revolution does not spills.
The present invention is while polishing disk 16 is rotated, and being placed with the work platforms 8 of workpiece 17, to carry out level straight
Line moves, and meanwhile, polishing disk 16 is revolved round the sun by mounting disc 7 while rotation.So, one is due between being finished to of workpiece 17
The operation of having a rest property, cool time is longer, can effectively prevent excess calories from concentrating the workpiece 17 caused to crush, so polishing disk 16
Can rotate with a fair speed, thus realize high speed polishing operation；Two is owing to the horizontal linear of work platforms 8 moves
Dynamic, it is to avoid the linear velocity difference of the long-time grinding of workpiece 17, thus improve finished product rate；Three is due to the shape of workpiece 17
Shape is with square in the majority, and work platforms 8 can be set to square so that the space availability ratio of work platforms 8 is high, reduces pendulum
Requirement；Four is that the workpiece on work platforms 8 is the most only partially in polishing disk 16 times, when " stir-fry machine " phenomenon occurs, only
Workpiece 17 under polishing disk 16 can be destroyed, thus reduces the loss that " stir-fry machine " brings to processing；Meanwhile, the present invention is significantly
Improve production efficiency and lay the foundation for realizing production line balance, burnishing device rational and compact, Operation and Maintenance are simple
Convenience, failure rate is low, service life of equipment are long.
Claims (4)
1. a burnishing device for curved surface polishing machine, it includes that frame, frame are provided with rotatable polishing disk, it is characterized in that machine
Frame be provided with realize polishing disk on the work platforms of movement workpiece apply set pressure dynamic pressurized device, described dynamically
Pressue device keeps the pressure applying to set by the polishing disk being arranged on elevator platform to workpiece；Described dynamic pressurized dress
Put and include being arranged in frame lift cylinder, the displacement transducer of detection work platforms displacement controlled by PLC, lift cylinder
Cylinder block is arranged in frame, and the piston rod of lift cylinder is connected with elevator platform；PLC is according to the displacement calculation of work platforms
Polishing disk and the contact area of workpiece, passing ratio reversal valve determines that the ascending, descending to lift cylinder controls, it is achieved polishing disk is to work
Part applies the pressure set；The pressure that workpiece is applied to set by described polishing disk is that polishing disk is applied to workpiece as P=F/ S, F
Pressure, S is the contact area of work surface and the workpiece of polishing disk；The work surface of described polishing disk and the contact area of workpiece
Approximate calculation is:
In formula, S represents the near contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative of work platforms
Displacement, R >=H, cos α=(R-H)/R；Or
In formula, S represents the near contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative of work platforms
Displacement, H ＞ R, cos α=(H-R)/R.
The burnishing device of curved surface polishing machine the most according to claim 1, is characterized in that described work platforms is square.
The burnishing device of curved surface polishing machine the most according to claim 1 and 2, is characterized in that described polishing disk is arranged on peace
In sabot, polishing disk is driven by the polishing motor being arranged on elevator platform, and described mounting disc is by being arranged on elevator platform
Revoluting motor drives.
The burnishing device of curved surface polishing machine the most according to claim 3, is characterized in that described polishing disk is 2～8, polishing
The drive shaft of dish is coupled with the main shaft of polishing motor by gear train.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734762.XA CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734762.XA CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103737472A CN103737472A (en) | 2014-04-23 |
| CN103737472B true CN103737472B (en) | 2016-10-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310734762.XA Active CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
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| CN (1) | CN103737472B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106378670B (en) * | 2016-12-08 | 2019-04-26 | 宇晶机器（长沙）有限公司 | A kind of method of the concave surface 3D polishing |
| CN107953247A (en) * | 2017-12-13 | 2018-04-24 | 无锡上机数控股份有限公司 | Numerical control pneumatic lifts bistrique |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| JP3006568B2 (en) * | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | Wafer polishing apparatus and polishing method |
| JP2000005988A (en) * | 1998-04-24 | 2000-01-11 | Ebara Corp | Polishing device |
| CN101357447A (en) * | 2008-09-02 | 2009-02-04 | 河南安飞电子玻璃有限公司 | Plate glass surface grinding device and method |
| CN102229093B (en) * | 2011-07-01 | 2013-09-18 | 中国电子科技集团公司第四十五研究所 | Lifting and pressing mechanism applied to wafer polishing equipment |
| CN203680003U (en) * | 2013-12-27 | 2014-07-02 | 湖南宇晶机器股份有限公司 | Polishing device of curved polishing machine |
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Application publication date: 20140423 Assignee: Hunan Yiyuan New Material Technology Co.,Ltd. Assignor: HUNAN YUJING MACHINE INDUSTRIAL Co.,Ltd. Contract record no.: X2023980050763 Denomination of invention: Polishing device of curved surface polishing machine Granted publication date: 20161005 License type: Common License Record date: 20231213 |