CN103727499A - Efficient heat-dissipation device of LED light source carrier - Google Patents

Efficient heat-dissipation device of LED light source carrier Download PDF

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Publication number
CN103727499A
CN103727499A CN201310683264.7A CN201310683264A CN103727499A CN 103727499 A CN103727499 A CN 103727499A CN 201310683264 A CN201310683264 A CN 201310683264A CN 103727499 A CN103727499 A CN 103727499A
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CN
China
Prior art keywords
led
light source
foam
led light
foam metal
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Pending
Application number
CN201310683264.7A
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Chinese (zh)
Inventor
不公告发明人
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QINGDAO WEILI ELECTRONIC TECHNOLOGY Co Ltd
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QINGDAO WEILI ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by QINGDAO WEILI ELECTRONIC TECHNOLOGY Co Ltd filed Critical QINGDAO WEILI ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201310683264.7A priority Critical patent/CN103727499A/en
Publication of CN103727499A publication Critical patent/CN103727499A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials

Abstract

The invention discloses an efficient heat-dissipation device of an LED light source carrier. The LED light source carrier comprises a plurality of LEDs, an LED supporting body and a circuit board, wherein the LEDs are arranged on the LED supporting body. The LED light source carrier is characterized in that the LED supporting body is made of foam metal of a through hole structure; a cooling fan is arranged on the surface of part of the foam metal or in a containing space formed by the foam metal; the circuit board is made of heat-conducting material such as aluminum, and heat-conducting glue is arranged between the circuit board and the LED supporting body. According to the efficient heat-dissipation device of the LED light source carrier, by the adoption of the foam metal, a great deal of metal material can be saved, and meanwhile the weight of the whole LED light source carrier is reduced substantially; the efficient heat-dissipation device is economical, convenient to use, and very good in heat dissipation effect.

Description

The efficient radiating apparatus of LED light source supporting body
Technical field
The present invention relates to LED lighting technical field, or rather, relate to the efficient radiating apparatus of LED light source supporting body.
Background technology
Along with the development and maturation of LED technology, the performance indications of LED increase substantially day by day, the light efficiency of white light LEDs has has met or exceeded the light efficiency level of ordinary incandescent lamp at present, and luminous flux is also increasing considerably, and LED is widely used at lighting field.Compared with the energy-saving lighting lamp of LED and general photo-voltaic power supply adapted, there is long, the outstanding advantages low, not fragile, power consumption is little and more energy-conservation that generates heat of life-span, people it be described as 21 century replace fluorescent lamps and incandescent lamp the 4th generation lighting source.
At present, when using light emitting diode, conventionally many light emitting diodes mode is in accordance with regulations arranged on aluminium base and forms lumination of light emitting diode supporting body, by aluminium base, dispel the heat.In order to reach heat radiation requirement, often need to increase the thickness of aluminium base, increased so on the one hand the weight of whole lighting, be inconvenient to use, the opposing party also certainly will increase manufacturing cost, and for high-power LED lighting fixture, it is especially obvious that this defect seems.Such as, the high-power LED street lamp of 120 watts of left and right of dispelling the heat by aluminium base, its weight is probably 9 kilograms of left and right, wherein most increases the thickness of aluminium base in order to reach the needs of heat radiation and the height of fin produces, this has increased the weight of whole street lamp on the one hand greatly, make installing/dismounting all inconvenient, and increased material cost; For too high fin, in especially integrated situation, also higher to the requirement of mould on the other hand, and the yield rate of product can decrease, and this has also increased manufacturing cost to a certain extent; And even so, it is also difficult to arrive desirable radiating effect on the whole.
Summary of the invention
The technical problem that the present invention solves is to overcome the defect that prior art exists, and a kind of efficient radiating apparatus of LED light source supporting body is provided.
For addressing the above problem, the technical solution used in the present invention is:
The efficient radiating apparatus of LED light source supporting body, it comprises some LED, LED supporter and circuit board, described LED is installed on described LED supporter, it is characterized in that: described LED supporter is made with the foam metal with through-hole structure; In the receiving space forming at described foam metal part surface or at foam metal, configure a cooling fan; Described circuit board is made with Heat Conduction Material aluminium, and between described circuit board and described LED supporter, heat-conducting glue is set.
Preferably, described foam metal is the one in foam iron, foam copper, foamed aluminium, foam iron alloy, foam copper alloy, foam aluminium alloy;
Preferably, select the foam metal between being 10-50 of hole count on per inch;
Preferably, on described foam metal surface, form one at least partly for supporting the metal supporting layer of described LED light source, and described metal supporting layer and foam metal are combined as a whole by the mode of electroplating;
Preferably, the part except being formed with metallic support layer region in described cooling fan is configured in to described foam metal surface;
Preferably, in described foam metal surface, except being formed with the part of metal supporting layer, in remaining surface, there is part to be closed;
Preferably, described circuit board heat is conductively being fixed in described metal supporting layer;
Preferably, in the described metal supporting layer solid metal layer that the material identical with foam metal make of serving as reasons.
Compared with prior art, the present invention configures cooling fan when forming foam metal layer on supporter in foam metal layer receiving space surperficial or that form at foam metal layer, make the heat of LED light source supporting body generation when passing to foam metal layer rapidly, by the flowing velocity of air in the 3 D stereo network structure of cooling fan acceleration foam metal inside, when guaranteeing that the long-pending first mate of heat source-contacting surface increases, by hot gas is mobile fast, quickly the heat of LED light source supporting body generation is taken away, played extraordinary radiating effect.In addition, adopt foam metal can also save a large amount of metal materials, also significantly reduced the weight of whole luminous supporting body simultaneously, not only economy but also easy to use.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view according to a kind of LED light source supporting body of the present invention's design.
Fig. 2 is the schematic perspective view of another angle of Fig. 1.
Fig. 3 is the schematic perspective view according to the another kind of LED light source supporting body of the present invention's design.
Fig. 4 is the schematic perspective view according to another LED light source supporting body of the present invention's design.
Fig. 5 is the schematic perspective view according to another LED light source supporting body of the present invention's design.
The specific embodiment
The present invention discloses LED light source supporting body heat abstractor, wherein said LED light source supporting body comprises some LED and LED supporter, described LED is installed on described LED supporter, and major technique design is that (1) makes described LED supporter with the foam metal with through-hole structure; (2) in the receiving space forming at described foam metal part surface or at foam metal, configure a cooling fan.
As shown in Figure 1, this figure is a kind of new LED light source supporting body 8 according to design design of the present invention, it comprises LED light source part 1 and LED supporter 2, wherein said LED light source part 1 comprises some LED (not shown) and carries the circuit board 10 of being made by the good Heat Conduction Material of heat conductivility (as aluminium) of described LED, described LED is configured in and on circuit board 10, forms some LED light-emitting sections (not label), certainly in order to obtain, better going out light effect, can be also every LEDs configuration lens devices 11 according to actual needs, described LED supporter 2 comprises foam metal layer 21 and at least part of for supporting the metal supporting layer 20 of described LED, described foam metal layer 21 by the foam metal with through-hole structure (as foam iron, foam copper, foamed aluminium, foam iron alloy, foam copper alloy, foam aluminium alloy) form, on this foam metal per inch, hole count is 10-50, adopt in the present embodiment foam copper, described metal supporting layer 20 is formed at the part surface of foam metal layer 21, the solid metal layer that this metal supporting layer 20 is made by the metal material identical with foam metal, such as adopting in the present embodiment foam copper, 20 of metal supporting layer are solid metal copper layer, described metal supporting layer 20 engages and is integrated with foam metal layer 21, preferred mode is for to make metal supporting layer 20 engage and be integrated with foam metal layer 21 by plating.Described LED supporter 2 also disposes a cooling fan 23, this cooling fan 23 is configured in the part except being formed with metal supporting layer 20 regions in foam metal layer 21 surfaces, Fig. 1 with in Fig. 2, illustrated that cooling fan 23 is arranged on the foam metal layer one side set up relative to metal supporting layer 20.Described LED is fixed on described LED supporter 2 by circuit board 10, in the present embodiment, described LED is fixed in metal supporting layer 20 by circuit board 10, circuit board 10 is close to metal supporting layer 20 and is contacted as far as possible in large area with it, at circuit board 10, be close between metal supporting layer 20 Heat Conduction Material also can be set, such as heat-conducting glue etc.When LED light source supporting body is worked like this, the heat that LED produces passes to metal supporting layer 20 by heat-conduction circuit board 10, by metal supporting layer 20, heat is passed to rapidly to foam metal layer 21, by the 3 D stereo network structure of foam metal 21 inside, the long-pending first mate of air and heat source-contacting surface is increased, cooling fan 23 rotates 3 D stereo network structure and the through hole by foam metal 21 inside simultaneously, the flowing velocity of foam metal layer 21 inner airs will be accelerated, the heat fast LED being produced is taken away, and plays extraordinary radiating effect.In addition, adopt foam metal can also save a large amount of metal materials, also significantly reduced the weight of the luminous supporting body 8 of whole LED simultaneously, not only economy but also easy to use.
As shown in Figure 3, this figure is the new LED light source supporting body 8 ' of another kind according to design of the present invention design, and the difference of the scheme that itself and Fig. 1 and Fig. 2 disclose is, cooling fan 23 is configured in the side of foam metal layer 21.Its operation principle is identical with embodiment bis-, at this, is not repeating.
As shown in Figure 4, this figure is that the difference of the scheme that this scheme and Fig. 1 and Fig. 2 disclose is in the side of foam metal layer 21, have a side to be sealed by a heat-insulating shield 25 according to another new LED light source supporting body 8 of design design of the present invention.The side that this scheme can be closed for the particular location setting of thermal source and the position of cooling fan 23, to reach better radiating effect.The part being closed is specifically determined according to the position of thermal source, such as other sides in can closed side, the side that only leaves thermal source position keeps open, when cooling fan 23 is worked, air only flows through from the side of thermal source position, will effectively solve local heat source's concentration problem.
As shown in Figure 5, this figure is another the new LED light source supporting body 8 according to design of the present invention design, and the difference of the scheme that this scheme and Fig. 1 and Fig. 2 disclose is, cooling fan 23 is configured in the receiving space of foam metal layer formation.
The above, be only preferred embodiment of the present invention, is not the restriction of the present invention being made to other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not depart from, any simple modification, equivalent variations and the remodeling above embodiment done according to technical spirit of the present invention, still belong to the protection domain of technical solution of the present invention.

Claims (3)

  1. The efficient radiating apparatus of 1.LED light source supporting body, it comprises some LED, LED supporter and circuit board, described LED is installed on described LED supporter, it is characterized in that: described LED supporter is made with the foam metal with through-hole structure; In the receiving space forming at described foam metal part surface or at foam metal, configure a cooling fan; Described circuit board is made with Heat Conduction Material aluminium, and between described circuit board and described LED supporter, heat-conducting glue is set.
  2. 2. the method for improving LED light source supporting body radiating effect as claimed in claim 1, is characterized in that: described foam metal is the one in foam iron, foam copper, foamed aluminium, foam iron alloy, foam copper alloy, foam aluminium alloy.
  3. 3. the method for improving LED light source supporting body radiating effect as claimed in claim 1 or 2, is characterized in that: select the foam metal between being 10-50 of hole count on per inch.
CN201310683264.7A 2013-12-13 2013-12-13 Efficient heat-dissipation device of LED light source carrier Pending CN103727499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310683264.7A CN103727499A (en) 2013-12-13 2013-12-13 Efficient heat-dissipation device of LED light source carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310683264.7A CN103727499A (en) 2013-12-13 2013-12-13 Efficient heat-dissipation device of LED light source carrier

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CN103727499A true CN103727499A (en) 2014-04-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108123025A (en) * 2018-01-23 2018-06-05 福建工程学院 A kind of high heat flux density cooling unit of high-power LED array module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201170510Y (en) * 2008-01-31 2008-12-24 宁波安迪光电科技有限公司 LED illumination device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201170510Y (en) * 2008-01-31 2008-12-24 宁波安迪光电科技有限公司 LED illumination device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108123025A (en) * 2018-01-23 2018-06-05 福建工程学院 A kind of high heat flux density cooling unit of high-power LED array module

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Application publication date: 20140416