CN103708708A - Moulding die, manufacturing method thereof, and method for manufacturing optical glass element - Google Patents
Moulding die, manufacturing method thereof, and method for manufacturing optical glass element Download PDFInfo
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- CN103708708A CN103708708A CN201310445292.5A CN201310445292A CN103708708A CN 103708708 A CN103708708 A CN 103708708A CN 201310445292 A CN201310445292 A CN 201310445292A CN 103708708 A CN103708708 A CN 103708708A
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Abstract
The invention provides a moulding die, a manufacturing method thereof, and a method for manufacturing optical glass elements. The manufacturing method of the moulding die is capable of moulding lens with fewer defects, and the moulding die comprises a separating-type film of a carbon film formed by a film forming device. The method is used for manufacturing moulding die with the separating-type film having a carbon film which is formed through steps of generating carbon plasma on a carbon cathode through vacuum arc, taking out ionized carbon from the carbon plasma, and irradiating ionized carbon onto a film surface to forming a film. The manufacturing method comprises steps of applying a first bias voltage V1(V)on the film surface while forming a first carbon film with thickness of d1(nm); and applying a second bias voltage V2(V)on the film surface while forming a first carbon film with outmost layer thickness of d2(nm), wherein the first and second bias voltage V1 and V2 and the thickness d1 and d2 satisfy V1>V2 and d1>d2.
Description
Technical field
The present invention relates to manufacture method and this compression molding die of compression molding die that use, that there is release film when manufacturing the optical elements such as lens by pressure forming.At length, manufacture method and this compression molding die of relating to compression molding die as described below, this compression molding die can mold the lens that macroscopic irregularity is few, and there is the release film that comprises carbon film, this carbon film is film forming in the following way: by vacuum arc discharge Formed plasma body on carbon cathode, from carbon plasma, only take out the carbon after ionization, to irradiated i.e. this carbon plasma of carbon after ionization by film forming face, carry out thus film forming.
Background technology
The precision pressure method of forming is also referred to as the optical mode method of forming, such method: by the molding surface of pressure forming die is critically transferred on glass, thus, by pressure forming, form optical function face, for example take lens as example, form the aspheric surface of non-spherical lens or the lens faces such as sphere of spherical lens.That is,, owing to need to not grinding and cut or the mechanical workout such as grinding in order to make optical function face, therefore, can manufacture optical element with high productivity, especially non-spherical lens.
In the prior art, following scheme has been proposed: as the moulding stock of the forming mould using in this method, used and take the metals such as SiC, superhard alloy, stainless steel and pottery and be the various materials of representative, in order to improve the release of forming mould and glass, on forming mould, be provided with containing release films such as carbon film, noble metal alloy films.The forming mould that is provided with the release film of carbon films such as also including diamond shaped carbon film, hydrogenated amorphous state carbon film (a-C:H film), hard carbon film, tetrahedron amorphous carbon film (taC film) in inside has advantages of that release is good, is difficult to fuse with glass.
Yet, repeatedly carrying out in the process of compression molding operation, such carbon film weares and teares, and cannot obtain enough processabilities, existing problems aspect weather resistance.Therefore,, in order to improve the weather resistance of release film, proposed to use hardness to be difficult for the film declining when moulding.
For example, at patent documentation 1(TOHKEMY 2012-12286 communique) in disclose at optical element forming with on the type mother metal of mould, by filtered cathodic vacuum arc method (Filtered Cathodic Vacuum Arc method, hereinafter referred to as FCVA method) film forming, go out the content of taC film.FCVA method is from the arc-over of carbon dioxide process carbon electrode, only to take out the charge particle of energy coincidence, forms the mode of homogeneous and highdensity film on substrate.According to the method, can obtain the taC film forming by engaging not hydrogeneous high-intensity sp3.
In addition, patent documentation 2(TOHKEMY 2009-199637 communique), disclose by filtering cathode arc process (Filtered Cathodic Arc method, hereinafter referred to as FCA method), on magnetic recording media, formed the content of taC film.In FCA method, on negative electrode, use pure graphite target, by arc-over, on target, produce electric arc, Formed plasma body, introduces the ion in plasma body by negative bias etc. to matrix, forms carbon film.In the carbon film of film forming by this method, due to respect to sp2 composition, the ratio of sp3 composition uprises, and therefore, can obtain hard and firm carbon film.
In addition, FCVA method and FCA method are the identical method for makings representing with different titles.Although as same title, there are vacuum arc method (Filtered Vacuum Arc method, hereinafter referred to as FVA method), the filtered arc deposition method (Filtered Arc Deposition method, hereinafter referred to as FAD method) etc. of filtering, but, these are all identical method for makings.By this method for making, carry out the carbon film of film forming, the ratio of sp3 composition uprises, and therefore, obtains the carbon film of high rigidity.
[prior art document]
[patent documentation]
[patent documentation 1] TOHKEMY 2012-12286 communique
[patent documentation 2] TOHKEMY 2009-199637 communique
Yet, in use, be formed with by the forming mould of the taC film of the film forming such as aforesaid FCVA method, to being carried out pressure forming by formed glass, thereby mold in the situation of optical element, there is such problem: on the optical element after moulding, produce the macroscopic irregularitys such as foaming, flaw, gonorrhoea, output capacity declines.
Summary of the invention
The present invention has that the peculiar the problems referred to above of forming mould of the carbon film by formation such as FCVA methods make just in order to solve, its object is, a kind of manufacture method that can mold the compression molding die of the lens that macroscopic irregularity is few is provided, and this compression molding die has the release film that comprises carbon film.
Discovery is in the film forming of the carbon film based on following manner, by going out at least the manufacture method by 2 layers of carbon film forming while applying specific bias voltage film forming, can obtain the release film of macroscopic irregularitys such as suppressing foaming and flaw, aforesaid way is: by vacuum arc discharge Formed plasma body on carbon cathode, from carbon plasma, only take out the carbon after ionization, the carbon after ionization is irradiated to by film forming face.
Be that body of the present invention provides a kind of manufacture method, it is the manufacture method with the compression molding die of release film, this release film comprises carbon film, this carbon film is by following manner film forming, that is: utilize vacuum arc discharge Formed plasma body on carbon cathode, from carbon plasma, only take out the carbon after ionization, the carbon after described ionization is irradiated to by film forming face and film forming, wherein, this manufacture method comprises: Yi Bian apply the 1st bias voltage V on by film forming face
1(V) on one side film forming to go out thickness be d
1(nm) operation of the 1st carbon film; And one side applies the 2nd bias voltage V on the 1st carbon film
2(V) on one side film forming to go out to form outermost thickness be d
2(nm) operation of the 2nd carbon film, the 1st and the 2nd bias voltage V
1, V
2and thickness d
1, d
2meet V
1>V
2and d
1>d
2.
According to the present invention, a kind of manufacture method with the compression molding die of release film can be provided, this release film comprises carbon film, and this compression molding die can mold the lens that macroscopic irregularity is few.
Accompanying drawing explanation
Fig. 1 is for the figure of the apparatus structure of the release membrane formation device 100 using in the film formation process based on FCVA method is described.
Fig. 2 is the figure of structure that the release film of embodiment 1 is shown.
Fig. 3 is the figure that the structure of the release film of inquiring into example 1 is shown.
Fig. 4 is the figure that the structure of the release film of inquiring into example 2 is shown.
Fig. 5 is the figure of structure that the release film of embodiment 7 is shown.
Specific embodiment mode
Below, with reference to accompanying drawing, the preferred embodiment of the present invention is described in detail.In addition, to identical in figure or corresponding section mark prosign, and no longer repeat its description.
In the present invention, by vacuum arc discharge Formed plasma body on carbon cathode, only take out the carbon after ionization from carbon plasma, the carbon after ionization is irradiated to by film forming face, thus, film forming goes out carbon film.
In the present invention, carbon cathode is preferably graphite-made, more preferably the negative electrode of pure graphite-made.
In the present invention, according to ordinary method, carry out vacuum arc discharge.
Further, in the present invention, from carbon plasma, only taking out in the method for the carbon ionization, comprising by magnetic filtering etc., but so long as can filter in the method produced simultaneously, the molten drop that makes membranous decline that produces carbon plasma just passablely, be not particularly limited.
As film as described above, can list filtered cathodic vacuum arc method (Filtered Cathodic Vacuum Arc method, hereinafter referred to as FCVA method), filtering cathode arc process (Filtered Cathodic Arc method, hereinafter referred to as FCA method), filter vacuum arc method (Filtered Vacuum Arc method, hereinafter referred to as FVA method) and filtered arc deposition method (Filtered Arc Deposition method, hereinafter referred to as FAD method) etc.
For example, FCVA method is following method: using the negative electrode of graphite-made as target, by vacuum arc discharge, produce carbon plasma, spatial filter by electromagnetism is only taken out the carbon after ionization, by apply negative bias voltage on base material, carbon after ionization is incorporated on base material, forms carbon film.
Here, the spatial filter of electromagnetism is following strainer: cannot directly see that the position configuration of negative electrode has base material, negative electrode and base material not the position configuration on straight line have base material, make the plasma body producing from negative electrode occur that electromagnetism is crooked or curve, thus, can filter in the conveying of plasma body and to produce produced simultaneously, the molten drop that makes membranous reduction of carbon plasma.
The method according to this invention, tool has the following advantages: film forming at room temperature, the carbon film of acquisition does not comprise hydrogen, and hydrogen is the reason that the hardness of film when heating declines, and the carbon film of acquisition has controllable high rigidity, has level and smooth surface.
Below 1 mode of the film formation process of carbon film of the present invention is described.
Fig. 1 is for the figure of the apparatus structure of the release membrane formation device 100 that uses FCVA method is described.With reference to Fig. 1, this formation device 100 has back up pad 10 and as by the forming mould 20 of film forming matter in vacuum chamber 1.Here, back up pad 10 consists of conductive materials such as aluminium alloys.
For go out vacuum arc power supply 2, arc plasma generation chamber 3, plasma body transfer lime 4 and the strainer coil 5 of tetrahedron amorphous carbon film (taC film) by FCVA method film forming, be connected with vacuum chamber 1.
Arc plasma generates chamber 3 and comprises vacuum arc evaporation source, and this vacuum arc evaporation source makes cathode vaporation by vacuum arc discharge, generates the plasma body that comprises cathode substance.Plasma body transfer lime 4 is curved shape, connects and is arranged between arc plasma generation chamber 3 and vacuum chamber 1, is wound with the strainer coil 5 in formation magnetic field in the surrounding of transfer lime 4.
Then, to using this device that taC film film forming is carried out to following explanation in the film formation process of forming mould 20.
In vacuum chamber 1, forming mould 20 is configured to make by the normal direction of film forming face parallel with the direct of travel that produces the carbon 7 after the ionization after deflection by strainer coil 5.By vacuum pump (not shown), carry out exhaust, make the arrival vacuum tightness in vacuum chamber 1 reach 1 * 10
-4till Pa is following.Then, by vacuum arc power supply 2, at arc plasma, generate Formed plasma body in chamber 3, control, make to flow through desired electric current on strainer coil 5, only extract the carbon 7 after ionization.Further, control, make to flow through desired electric current on strainer coil 5, the carbon 7 after ionization is scanned, at the upper taC film equally that forms of the molding surface (by film forming face) that is configured in the forming mould 20 in back up pad 10.In addition,, by applying bias voltage to back up pad 10 and forming mould 20, the energy level that can make to form the ion particle of taC film changes.
By the bias voltage applying to back up pad 10 and forming mould 20, can adjust the hardness of the film forming by FCVA method, under the bias voltage of approximately-100V, demonstrate the highest hardness, when reducing bias voltage, hardness declines.
In the present invention, adopt following structure: be formed on the high rigidity film (the 1st carbon film) of film forming under the negative bias voltage that the absolute value of bias voltage is little as basal layer, form thereon than basal layer thin, under the large negative bias voltage of the absolute value of bias voltage the soft film (the 2nd carbon film) of film forming as outermost layer, by adopting this structure, glass changes to the followability of release film, the gas discharging from inside glass to outside is easy to, to the discharge of mould peripheral part, suppress the generation of the macroscopic irregularitys such as foaming.
Therefore, film formation process of the present invention comprises: on by film forming face, Yi Bian apply the 1st bias voltage V
1(V) on one side film forming to go out thickness be d
1(nm) operation of the 1st carbon film, and on the 1st carbon film, Yi Bian apply the 2nd bias voltage V
2(V) on one side film forming to go out to form outermost, thickness be d
2(nm) operation of the 2nd carbon film.By the voltage change that makes to apply, can form continuously the operation of the 1st carbon film and the operation of formation the 2nd carbon film.
In the present invention, the 2nd bias voltage V
2(V) than the 1st bias voltage V
1(V) low.
The 1st bias voltage V
1(V) be preferably-400≤V
1≤-10, more preferably-150≤V
1≤-10.
The 2nd bias voltage V
2(V) be preferably V
2≤-1100, V more preferably
2≤-1200.In addition the 2nd bias voltage V,
2(V) be preferably V
2≤-4000, V more preferably
2≤-3000, V more preferably
2≤-2500.
In above-mentioned preferred scope, suppressed the generation of the macroscopic irregularitys such as foaming, flaw, gonorrhoea.
In the present invention, the thickness d of the 1st carbon film
1(nm) than the thickness d of the 2nd carbon film
2(nm) thick.
The thickness d of the 1st carbon film
1(nm) be preferably d
1≤ 10, d more preferably
1≤ 20.In addition the thickness d of the 1st carbon film,
1(nm) be preferably d
1≤ 1000, d more preferably
1≤ 300.
The thickness d of the 2nd carbon film
2(nm) be preferably d
2≤ 7, d more preferably
2≤ 10.In addition the thickness d of the 2nd carbon film,
2(nm) be preferably d
2≤ 200, d more preferably
2≤ 100.
In above-mentioned preferred scope, suppressed the generation of the macroscopic irregularitys such as foaming, flaw, gonorrhoea.
In order to ensure the adhesion between forming mould 20 and release film, the peeling off of the release film while preventing from pressurizeing, the manufacture method of forming mould of the present invention can be included in the operation that also forms tack coat between the 1st carbon film and forming mould 20.Can according to and the material of forming mould 20 between relation suitably select tack coat, in the situation that forming mould 20 is SiC, can pass through FCVA method, from being formed by this two-layer tack coat forming of layers 1 and 2 by film forming face side, wherein, the 1st layer as follows: bias voltage is that-1500～-1000V, thickness are 5～15nm; The 2nd layer as follows: bias voltage is that-1000～-300V, thickness are 10～30nm.For example, form by this two-layer tack coat forming of layers 1 and 2, wherein, the 1st layer is as follows: and bias voltage is-and 1200V, thickness are 10nm; The 2nd layer is as follows: bias voltage for-900V, thickness be 20nm.
In addition, in the present invention, tack coat is not defined as 2 layers, can, for individual layer or more than 3 layers, by tack coat is set, improve the intensity of connecting airtight between forming mould 20 and the 1st carbon film yet.
In the present invention, compression molding die is preferred for glass optical component moulding.
Compression molding die of the present invention is more preferably used when manufacturing glass optical component by the optical mode method of forming.
The optical mode method of forming is such method: by the molding surface of pressure forming die is critically transferred on glass, thus, by pressure forming, form optical function face, for example, take lens as example, form the aspheric surface of non-spherical lens or the lens faces such as sphere of spherical lens.That is,, owing to need to not grinding and cut or the mechanical workout such as grinding in order to make optical function face, therefore, can manufacture optical element with high productivity, especially non-spherical lens.
In the present invention, as the kind of glass optical component, can exemplify the lens such as spherical lens, non-spherical lens, prism, diffraction grating etc.As the shape of lens, biconvex lens, plano-convex lens, biconcave lens, plano-concave lens can be shown, convex meniscus, each shapes such as matrix meniscus.In addition, about the size of lens, be not particularly limited, be suitable for the moulding of the lens of the Large diameter from small-bore lens to processing difficulties.
In the present invention, in compression molding die, the release film that comprises the carbon film by above-mentioned film formation process film forming is arranged in the molding surface of moulding stock.For example, in the situation that the compression molding die using while manufacturing glass optical component by the optical mode method of forming, release film is arranged in the molding surface with the upper die and lower die that joined by formed glass.In addition, according to the shape of optical element, except adopting upper die and lower die, also adopt the cylinder that is called sleeve to be used as the strut member of upper and lower mould, but, sleeve lining be also provided with release film with on face that contacted by formed glass.
Although as the moulding stock of compression molding die of the present invention, enumerated SiC(silicon carbide), but, be not limited to this, also can use and take WC(wolfram varbide) etc. be metal, the various potteries etc. such as the superhard alloy of main component, stainless steel.
The present invention comprises the compression molding die that use is manufactured as mentioned above, to being carried out pressure forming by formed glass, manufactures the manufacture method of the glass optical component of glass optical component.
In the situation that glass optical component is carried out to pressure forming, can adopt the known optical mode method of forming.For example, after the glass blank that is heated to specified temperature being supplied in the forming mould that comprises upper die and lower die, or, the glass blank of normal temperature is configured in forming mould, together with forming mould, glass blank is heated to after specified temperature, to forming mould applying load, start the pressure forming of glass blank.Soon, by upper die and lower die, glass blank is deformed into after desired shape, carries out the cooling of forming mould and glass blank.Then, after cooling to glass transition point or the temperature below glass transition point, in type glass optical component is taken out from forming mould, thus, can manufacture glass optical component.
Here, the hardness of carbon film of the present invention is described.
In the present invention, the hardness of measuring by Using Nanoindentation of the 2nd carbon film (following, to be called " nano-indentation hardness ") is for below 30GPa, and the nano-indentation hardness of the 1st carbon film is higher than the nano-indentation hardness of the 2nd carbon film.
In the present invention, used nano-indentation hardness device ENT-2100(エ リ オ ニ Network ス (ELIONIX) company to manufacture) measure nano-indentation hardness.Because the manner is the mode of hardness that pressure head is scaled the compression distance of test portion, therefore, in the situation that the thickness of test portion is thin, hardness becomes the value that affected by base material.Therefore, on SiC substrate, form with respect to compression distance enough the carbon unitary film of the thickness of thick 100nm as test portion.In mensuration, as pressure head, having used angle between end rib is the triangle plektron diamond superzapping head (Bai Keweiqi (Berkovich) pressure head) of 115 °.Make triangle plektron diamond superzapping head at right angles contact test portion surface, at load, for 10mgf, application time, be that 10 seconds, hold-time are 1 second, to remove duration of load application be applying load little by little under the condition of 10 seconds, reach after maximum load, load is returned to 0 gradually.Calculate value P/A that maximum load P is now obtained after the contact projection area A divided by pressure head contact part as nano-indentation hardness (H).
Detailed principle is documented in Te Evaluation value (the mechanical characteristics evaluation of the film based on Using Nanoindentation) the > > (R & D KOBE STEEL ENGINEERING REPORTS Vol.52 No.2) of < < Na ノ イ Application デ ン テ ー シ ョ Application method To I Ru Bu Mo Machine tool.
In the present invention, the kinetic friction coefficient of the 2nd carbon film is below 0.2, and the kinetic friction coefficient of the 1st carbon film is larger than the kinetic friction coefficient of the 2nd carbon film.
Adopt reciprocating kinetic friction coefficient tester to evaluate kinetic friction coefficient.Particularly, use glass as contact head, the load that makes to be applied to contact head is 5mgf, and the sliding velocity that makes sample is 0.15mm/ second, thereby measures.
[embodiment]
Before the ocular estimate of pressure forming body of inquiring into the forming mould that uses the release film with embodiment 1, first the operation that compression molding die is formed to release film is described.
(using the film formation process of FCVA mode)
After the forming mould consisting of SiC 20 is cleaned, be set to FCVA device (model MTCS-7B, Nano Film Technologies International PTE., LTD.(Singapore)) in, under following condition, carried out ion beam etching.
Then, the condition based on following, sets the bias voltage of stipulating, film forming goes out the carbon film of the thickness of regulation.; the upper film forming of molding surface (by molding surface) at forming mould 20 goes out tack coat 50; film 52 these two-layer carbon films that the film 51 that this tack coat 50 is 10nm by the thickness forming for-1200V in the situation that at bias voltage and the thickness forming for-900V in the situation that at bias voltage are 20nm form; then after changing bias voltage, film forming goes out the 1st carbon film 30 and the 2nd carbon film 40.
Fig. 2 is the figure of structure that the release film of embodiment 1 is shown.With reference to Fig. 2, embodiment 1 is the forming mould 20 with the SiC system of release film 6, and this release film 6 consists of tack coat 50, the 1st carbon film 30 and the 2nd carbon film 40, and wherein, the 1st carbon film 30 is as follows: bias voltage is-120V that thickness is 70nm; The 2nd carbon film 40 is as follows: bias voltage is-1200V that thickness is 20nm.
On the other hand, for embodiment 1 is easily understood, use and inquire into example 1,2 explanations further.Fig. 3 and Fig. 4 are the figure that the structure of the release film of inquiring into example 1,2 is shown.About inquiring into the film of example 1,2, under the identical condition of the film formation process with above-mentioned record, make can suitably changing by application time of bias voltage, form the release film of desired thickness.
With reference to Fig. 3,4, inquire into example the 1, the 2nd, do not have film forming to go out to be equivalent to the forming mould of the film of the 2nd carbon film 40 of the present invention.Particularly, inquiring into example 1 is the forming mould with the release film only consisting of the 1st carbon film 31, wherein, the 1st carbon film 31 is as follows: bias voltage is-1200V, thickness is 100nm, and inquiring into example 2 is the forming moulds with the release film consisting of tack coat 50 and the 1st carbon film 32, wherein, the 1st carbon film 32 is as follows: bias voltage is-120V that thickness is 70nm.
(ocular estimate method)
In aforesaid method, adopt respectively the external diameter that is provided with release film to be
compression molding die, use isothermal pressure forming device, at pressure and temp, be under 582 ℃, the compression load condition that is 300kgf, the moulding consisting of opticglass is carried out to precision pressure moulding with blank, produce biconvex lens.
Lens for obtaining carry out visual observation under spot light lamp, confirm: whether (1) central part has foaming and gonorrhoea; (2) whether periphery has radial flaw, and the lens that (1) (2) are not all had are defined as " well ", will occur that any one lens in (1) (2) are defined as " bad ".
The result obtaining is illustrated in table 1.In addition, the epimere that film forms hurdle is bias voltage, and hypomere is thickness.
[table 1]
[evaluation to the outermost thickness (variable) in the fixing situation of the thickness of basal layer]
Then, carry out the evaluation that the outward appearance in following situation is observed, above-mentioned situation is: form similarly to Example 1 tack coat 50 and basal layer (the 1st carbon film) 30, and make the Thickness Variation of outermost layer (the 2nd carbon film) 40.Particularly, in embodiment 2,3, comparative example 1, for the carbon film of basal layer, using bias voltage for-120V, thickness be 70nm as common ground, make outermost thickness with 5,10,20,30nm changes, and has carried out in this case the evaluation that outward appearance is observed.Table 2 shows the evaluation result that this outward appearance is observed.In addition, as a reference, in order to contribute to understand, in table 2, also listed the result of embodiment 1 simultaneously.
Here, about the film of embodiment 2,3 and comparative example 1, under the identical condition of the film formation process with above-mentioned record, make can suitably changing by application time of bias voltage, form the release film of desired thickness.
[table 2]
[evaluation to the outermost thickness (fixing) in the variable situation of the thickness of basal layer]
Then, in following situation, evaluate: form in the same manner as in Example 1 tack coat 50 and basal layer (the 1st carbon film) 30, make outermost layer become the 2nd carbon film 40, make the Thickness Variation of basal layer (the 1st carbon film), wherein, the 2nd carbon film 40 is as follows: bias voltage is-1200V that thickness is 30nm.Particularly, in embodiment 4,5 and comparative example 2, for outermost layer (the 2nd carbon film), using bias voltage for-1200V, thickness be that 30nm is as common ground, the thickness that makes basal layer with 20,40, the order of 70nm changes, and carried out in this case the evaluation that outward appearance is observed.Table 3 shows the evaluation result that this outward appearance is observed.
Here, about the film of embodiment 4,5 and comparative example 2, under the identical condition of the film formation process with above-mentioned record, make can suitably changing by application time of bias voltage, form the release film of desired thickness.
[table 3]
[evaluation to outermost bias voltage]
The result that outward appearance following in the situation that is observed has been shown in table 4: form similarly to Example 1 tack coat 20 and basal layer (the 1st carbon film) 30, the bias voltage of outermost layer (the 2nd carbon film) 40 is changed.
[table 4]
[evaluation of the physical property of carbon film]
For by using bias layer A(bias voltage that the film formation process of above-mentioned FCVA mode obtains for-120V), bias layer B(bias voltage is-1200V), bias layer C(bias voltage is-900V) and SiC substrate, used following method evaluation hardness and kinetic friction coefficient.
(measurement of hardness condition)
Using appts ENT-2100(エ リ オ ニ Network ス (ELIONIX) company manufactures), and use Bai Keweiqi (Berkovich) pressure head as pressure head, under the condition that the thickness of the carbon film that at load for 10mgf, application time be that 10 seconds, hold-time are 1 second, to remove duration of load application be 10 seconds, forms on test portion is 100nm, measured nano-indentation hardness.
(measuring friction coefficient condition)
Measured under the following conditions kinetic friction coefficient: use reciprocating frictionometer, and adopt glass as contact head, the load that makes to be applied to contact head is 5mgf, and the sliding velocity that makes sample is 0.15mm/ second.In this measurement result shown in table 5.
[table 5]
The evaluation of the situation that embodiment 7[is composite bed to outermost layer]
Fig. 5 is the figure of structure that the release film of embodiment 7 is shown.With reference to Fig. 5, by using the film formation process of above-mentioned FCVA mode, the release film 6 ' of the structure that the whole thickness of having made release film on forming mould 20 is 120nm, this release film 6 ' has tack coat 50, the 1st carbon film 30 and composite bed, wherein, the 1st carbon film 30 is as follows: bias voltage is-120V, thickness is 70nm, described composite bed is formed by layer 42 and layer 43 interaction cascading as the 2nd carbon film 41, thickness amounts to 20nm, wherein, layer 42 is as follows: bias voltage is-1200V, thickness is 1nm, layer 43 is as follows: bias voltage is-150V, thickness is that 1nm(is with reference to Fig. 5).Embodiment 7 is different from embodiment 1 aspect as follows: outermost the 2nd carbon film 40(bias voltage forming as embodiment 1 on composite bed is-1200V that thickness is 20nm).
Outward appearance at the lens that obtain using the compression molding die of the release film 6 ' with embodiment 7 has been carried out after evaluation in the same manner as in Example 1, and result is good.
Finally, use figure etc. carries out general description to embodiment 1.
About thering is the manufacture method of the compression molding die 20 of release film, this release film comprises by the carbon film of following manner film forming, aforesaid way is: the cathode arc electric discharge by embodiment 1 and on carbon target Formed plasma body, from carbon plasma, only take out the carbon after ionization, the carbon after ionization is irradiated to by film forming face.As shown in Figure 1 and Figure 2, this manufacture method comprises: while apply bias voltage-120V film forming on by film forming face, go out the operation that thickness is the carbon film 30 of 70nm; With on carbon film 30, while applying bias voltage-1200V film forming, go out to form the operation that outermost thickness is the carbon film 40 of 20nm, bias voltage-120V ,-1200V and thickness 70nm, 20nm meet following condition: the bias voltage-1200V of (bias voltage-120V of carbon film 30) >(carbon film 40) and the thickness 20nm of (the thickness 70nm of carbon film 30) >(carbon film 40).
Preferably, as shown in Figure 2, the bias voltage of carbon film 40 (1200V) is-below 1100V, and the thickness of carbon film 40 (20nm) is more than 7nm.
Preferably, as shown in Figure 2, the bias voltage of carbon film 30 (120V) is-10V is following ,-more than 400V.
Further preferably, above-mentioned manufacture method comprises as shown in Figure 2, also forms the operation of tack coat 50 between carbon film 30 and compression molding die 20.
Further preferably, the carbon film 30 and the carbon film 40 that by above-mentioned compression molding die 20 film forming, go out have following relation: as shown in table 5, the hardness of measuring by Using Nanoindentation of carbon film 40 is below 30GPa, and the hardness of measuring by Using Nanoindentation of the hardness ratio carbon film 40 of measuring by Using Nanoindentation of carbon film 30 is high.
Further preferably, carbon film 30 and carbon film 40 that on above-mentioned compression molding die 20, film forming goes out have following relation: as shown in table 5, the kinetic friction coefficient of carbon film 40 is below 0.2, and the kinetic friction coefficient of carbon film 30 is larger than the kinetic friction coefficient of carbon film 40.
By adopting such structure, glass changes to the followability of release film, and the gas discharging from inside glass to outside is easy to, to the discharge of mould peripheral part, suppress the generation of the macroscopic irregularitys such as foaming.
In addition can use if the above-mentioned compression molding die producing is to being carried out pressure forming and manufacture glass optical component by formed glass.According to the manufacture method of such glass optical component, can obtain the good glass optical component of macroscopic irregularitys such as thering is no foaming, gonorrhoea, flaw.
Will be understood that, in this disclosed embodiment, all points are illustration but not are construed as limiting.Scope of the present invention is not above-mentioned explanation but illustrates by claim, comprises the implication that is equal to claim and the whole change in scope.
[label declaration]
Claims (8)
1. a manufacture method with the compression molding die of release film, this release film comprises carbon film, this carbon film is by following manner film forming, that is: utilize vacuum arc discharge Formed plasma body on carbon cathode, from described carbon plasma, only take out the carbon after ionization, carbon after described ionization is irradiated to by film forming face and film forming, and wherein, this manufacture method comprises:
On by film forming face, apply the 1st bias voltage V on one side
1it is d that one side film forming goes out thickness
1the operation of the 1st carbon film; And
On described the 1st carbon film, apply the 2nd bias voltage V on one side
2it is d that one side film forming goes out to form outermost thickness
2the operation of the 2nd carbon film,
Described the 1st bias voltage V
1with described the 2nd bias voltage V
2and described thickness d
1, described thickness d
2meet V
1>V
2and d
1>d
2.
2. manufacture method according to claim 1, wherein, described the 2nd bias voltage V
2for-below 1100V, and described thickness d
2more than 7nm.
3. manufacture method according to claim 2, wherein, described the 1st bias voltage V
1for-below 10V ,-more than 400V.
4. according to the manufacture method described in any one in claims 1 to 3, wherein, this manufacture method comprises: the operation that also forms tack coat between described the 1st carbon film and described compression molding die.
5. a compression molding die, wherein, this compression molding die is to manufacture by the manufacture method described in any one in claim 1 to 4.
6. compression molding die according to claim 5, wherein, the hardness of measuring by Using Nanoindentation of the 2nd carbon film is below 30GPa, and the hardness of measuring by Using Nanoindentation of the hardness ratio of measuring by Using Nanoindentation the 2nd carbon film of the 1st carbon film is high.
7. according to the compression molding die described in claim 5 or 6, wherein, the kinetic friction coefficient of described the 2nd carbon film is below 0.2, and the kinetic friction coefficient of described the 1st carbon film is larger than the kinetic friction coefficient of described the 2nd carbon film.
8. a manufacture method for glass optical component, wherein, right to use requires the compression molding die described in any one in 5 to 7, to being carried out pressure forming and manufacture glass optical component by formed glass.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012216622A JP6073624B2 (en) | 2012-09-28 | 2012-09-28 | Method for producing mold press mold, mold press mold, and method for producing glass optical element using the same |
| JP2012-216622 | 2012-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103708708A true CN103708708A (en) | 2014-04-09 |
| CN103708708B CN103708708B (en) | 2017-03-29 |
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|---|---|---|---|
| CN201310445292.5A Active CN103708708B (en) | 2012-09-28 | 2013-09-26 | The manufacture method of compression molding die and its manufacture method and glass optical component |
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| Country | Link |
|---|---|
| JP (1) | JP6073624B2 (en) |
| CN (1) | CN103708708B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592534A (en) * | 2019-10-12 | 2019-12-20 | 九江职业技术学院 | Method and device for preparing ultra-nano diamond film |
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|---|---|---|---|---|
| JPS6442313A (en) * | 1987-08-10 | 1989-02-14 | Semiconductor Energy Lab | Production of carbon |
| CN1178263A (en) * | 1996-08-30 | 1998-04-08 | 三菱电机株式会社 | Apparatus and method for forming thin diamond-like films |
| CN1539513A (en) * | 2003-10-29 | 2004-10-27 | 中山大学 | Biologic coating material of carbon in use for medical inner embedded body and preparation method |
| US20100311209A1 (en) * | 2009-06-05 | 2010-12-09 | Jiangsu Lexvu Electronics Co., Ltd. | Method o encapsulating a wafer level microdevice |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5483384B2 (en) * | 2007-06-01 | 2014-05-07 | 国立大学法人豊橋技術科学大学 | DLC film and DLC coated mold |
| WO2012063735A1 (en) * | 2010-11-09 | 2012-05-18 | 株式会社ニコン | Carbon thin film, mold for molding optical element and method for producing optical element |
-
2012
- 2012-09-28 JP JP2012216622A patent/JP6073624B2/en active Active
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2013
- 2013-09-26 CN CN201310445292.5A patent/CN103708708B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442313A (en) * | 1987-08-10 | 1989-02-14 | Semiconductor Energy Lab | Production of carbon |
| CN1178263A (en) * | 1996-08-30 | 1998-04-08 | 三菱电机株式会社 | Apparatus and method for forming thin diamond-like films |
| CN1539513A (en) * | 2003-10-29 | 2004-10-27 | 中山大学 | Biologic coating material of carbon in use for medical inner embedded body and preparation method |
| US20100311209A1 (en) * | 2009-06-05 | 2010-12-09 | Jiangsu Lexvu Electronics Co., Ltd. | Method o encapsulating a wafer level microdevice |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592534A (en) * | 2019-10-12 | 2019-12-20 | 九江职业技术学院 | Method and device for preparing ultra-nano diamond film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014069984A (en) | 2014-04-21 |
| CN103708708B (en) | 2017-03-29 |
| JP6073624B2 (en) | 2017-02-01 |
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