CN103707193B - 修整器 - Google Patents

修整器 Download PDF

Info

Publication number
CN103707193B
CN103707193B CN201310461262.3A CN201310461262A CN103707193B CN 103707193 B CN103707193 B CN 103707193B CN 201310461262 A CN201310461262 A CN 201310461262A CN 103707193 B CN103707193 B CN 103707193B
Authority
CN
China
Prior art keywords
magnet
trimmer
auxiliary equipment
group
finishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310461262.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103707193A (zh
Inventor
筱崎弘行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN103707193A publication Critical patent/CN103707193A/zh
Application granted granted Critical
Publication of CN103707193B publication Critical patent/CN103707193B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201310461262.3A 2012-10-01 2013-09-30 修整器 Active CN103707193B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-219304 2012-10-01
JP2012219304A JP5919157B2 (ja) 2012-10-01 2012-10-01 ドレッサー

Publications (2)

Publication Number Publication Date
CN103707193A CN103707193A (zh) 2014-04-09
CN103707193B true CN103707193B (zh) 2017-09-15

Family

ID=50400732

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310461262.3A Active CN103707193B (zh) 2012-10-01 2013-09-30 修整器

Country Status (5)

Country Link
US (1) US20140179204A1 (ja)
JP (1) JP5919157B2 (ja)
KR (1) KR20140043284A (ja)
CN (1) CN103707193B (ja)
TW (1) TWI602227B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6254383B2 (ja) * 2013-08-29 2017-12-27 株式会社荏原製作所 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク
JP6592355B2 (ja) 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
USD793459S1 (en) * 2015-11-30 2017-08-01 Nawoo Precision & Industry Co., Ltd. Chip cover for tip dresser
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
CN106181603B (zh) * 2016-08-30 2018-05-01 拓卡奔马机电科技有限公司 裁床用磨刀砂轮装置
CN107671725B (zh) * 2017-10-20 2019-08-06 德淮半导体有限公司 修整盘***、化学机械研磨装置及研磨方法
US20200130139A1 (en) * 2018-10-31 2020-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Device for conditioning chemical mechanical polishing
JP7317440B2 (ja) * 2019-04-15 2023-07-31 株式会社ディスコ ドレッシング工具
WO2022132310A1 (en) * 2020-12-18 2022-06-23 Applied Materials, Inc. Pad carrier for horizontal pre-clean module
US11766758B2 (en) * 2021-01-27 2023-09-26 Taiwan Semiconductor Manufacturing Company Limited Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk
CN114571365A (zh) * 2022-01-20 2022-06-03 上海汉虹精密机械有限公司 一种抛光盘表面修整装置
CN116372801A (zh) * 2023-04-12 2023-07-04 华海清科股份有限公司 一种承载组件和化学机械抛光***

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3162876A (en) * 1962-12-14 1964-12-29 Ronson Corp Coupling arrangement for polishing machine
US4222204A (en) * 1979-06-18 1980-09-16 Benner Robert L Holder for an abrasive plate
US4664572A (en) * 1985-04-03 1987-05-12 Mitsubishi Jukogyo Kabushiki Kaisha Chip disposer
JPS63253855A (ja) * 1987-04-06 1988-10-20 Daido Steel Co Ltd 磁気カツプリング
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5667433A (en) * 1995-06-07 1997-09-16 Lsi Logic Corporation Keyed end effector for CMP pad conditioner
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6042457A (en) * 1998-07-10 2000-03-28 Aplex, Inc. Conditioner assembly for a chemical mechanical polishing apparatus
US6033290A (en) * 1998-09-29 2000-03-07 Applied Materials, Inc. Chemical mechanical polishing conditioner
JP3772946B2 (ja) * 1999-03-11 2006-05-10 株式会社荏原製作所 ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
JP2001121402A (ja) * 1999-10-29 2001-05-08 Applied Materials Inc コンディショニングディスク
JP2002307308A (ja) * 2001-04-12 2002-10-23 Fujimori Gijutsu Kenkyusho:Kk ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
KR100468111B1 (ko) * 2002-07-09 2005-01-26 삼성전자주식회사 연마 패드 컨디셔너 및 이를 갖는 화학적 기계적 연마 장치
KR100562498B1 (ko) * 2003-02-12 2006-03-21 삼성전자주식회사 씨엠피 설비의 패드 컨디셔너
US6945857B1 (en) * 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US7161451B2 (en) * 2005-04-14 2007-01-09 Gm Global Technology Operations, Inc. Modular permanent magnet chuck
CN101356597B (zh) * 2005-09-26 2013-02-06 磁转换技术全球控股有限公司 磁体阵列
DE602008002445D1 (de) * 2007-01-30 2010-10-28 Ebara Corp Poliervorrichtung
US7843295B2 (en) * 2008-04-04 2010-11-30 Cedar Ridge Research Llc Magnetically attachable and detachable panel system
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
US8350663B1 (en) * 2011-12-07 2013-01-08 Creative Engineering Solutions, Inc. Rotary switchable multi-core element permanent magnet-based apparatus

Also Published As

Publication number Publication date
US20140179204A1 (en) 2014-06-26
JP2014069299A (ja) 2014-04-21
JP5919157B2 (ja) 2016-05-18
TWI602227B (zh) 2017-10-11
KR20140043284A (ko) 2014-04-09
CN103707193A (zh) 2014-04-09
TW201426835A (zh) 2014-07-01

Similar Documents

Publication Publication Date Title
CN103707193B (zh) 修整器
US7134948B2 (en) Magnetically secured retaining ring
US6217433B1 (en) Grinding device and method
US8366518B2 (en) Orbital smoothing device
CN101422875B (zh) 磨轮
CN113305650A (zh) 一种超光滑平坦化抛光方法及装置
CN212553359U (zh) 一种硅片研磨设备固结磨盘用油石自动修正装置
CN215700222U (zh) 一种可冲退磁的磁盘
CN210209950U (zh) 化学机械研磨设备
JP3141853U (ja) 研磨具及びこの研磨具を用いた研磨装置
KR20110080576A (ko) 페놀수지로써 성형된 디스크형연마패드 및 그 제조방법
KR101001668B1 (ko) 탄성플레이트를 구비한 연마용 플랩 디스크
CN210452284U (zh) 一种用于双面研磨机的载体
CN108890445A (zh) 一种工业自动化磨边机
JP2004050355A (ja) 積層型回転研磨具及びその使用方法
CN212351557U (zh) 一种硬脆性材料的v型槽和切边的边缘抛光装置
JP3222997U (ja) ディスク型研磨機のワンタッチディスク着脱の構造
CN217071971U (zh) 一种双端面研磨机的上磨盘浮动机构
TWI325602B (en) Polishing device and automatic polishing method thereof
JP3072378U (ja) 砥石チップ保持体，砥石及び研磨機
KR20030038047A (ko) 백그라인딩 공정용 반도체 제조장치
JP5307679B2 (ja) 回転砥石及びその製造法
JP3099151U (ja) 研磨ディスクの改良
CN112536711A (zh) 一种研磨结构和研磨装置
TWI333235B (en) Edge bead removal by an electro polishing process

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant