CN103707193B - 修整器 - Google Patents
修整器 Download PDFInfo
- Publication number
- CN103707193B CN103707193B CN201310461262.3A CN201310461262A CN103707193B CN 103707193 B CN103707193 B CN 103707193B CN 201310461262 A CN201310461262 A CN 201310461262A CN 103707193 B CN103707193 B CN 103707193B
- Authority
- CN
- China
- Prior art keywords
- magnet
- trimmer
- auxiliary equipment
- group
- finishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000926 separation method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 7
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 6
- 230000008439 repair process Effects 0.000 description 5
- 238000009966 trimming Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004425 Makrolon Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical group C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-219304 | 2012-10-01 | ||
JP2012219304A JP5919157B2 (ja) | 2012-10-01 | 2012-10-01 | ドレッサー |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103707193A CN103707193A (zh) | 2014-04-09 |
CN103707193B true CN103707193B (zh) | 2017-09-15 |
Family
ID=50400732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310461262.3A Active CN103707193B (zh) | 2012-10-01 | 2013-09-30 | 修整器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140179204A1 (ja) |
JP (1) | JP5919157B2 (ja) |
KR (1) | KR20140043284A (ja) |
CN (1) | CN103707193B (ja) |
TW (1) | TWI602227B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6254383B2 (ja) * | 2013-08-29 | 2017-12-27 | 株式会社荏原製作所 | ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク |
JP6592355B2 (ja) | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | 連結機構および基板研磨装置 |
USD793459S1 (en) * | 2015-11-30 | 2017-08-01 | Nawoo Precision & Industry Co., Ltd. | Chip cover for tip dresser |
JP6842859B2 (ja) * | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法 |
CN106181603B (zh) * | 2016-08-30 | 2018-05-01 | 拓卡奔马机电科技有限公司 | 裁床用磨刀砂轮装置 |
CN107671725B (zh) * | 2017-10-20 | 2019-08-06 | 德淮半导体有限公司 | 修整盘***、化学机械研磨装置及研磨方法 |
US20200130139A1 (en) * | 2018-10-31 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Device for conditioning chemical mechanical polishing |
JP7317440B2 (ja) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | ドレッシング工具 |
WO2022132310A1 (en) * | 2020-12-18 | 2022-06-23 | Applied Materials, Inc. | Pad carrier for horizontal pre-clean module |
US11766758B2 (en) * | 2021-01-27 | 2023-09-26 | Taiwan Semiconductor Manufacturing Company Limited | Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk |
CN114571365A (zh) * | 2022-01-20 | 2022-06-03 | 上海汉虹精密机械有限公司 | 一种抛光盘表面修整装置 |
CN116372801A (zh) * | 2023-04-12 | 2023-07-04 | 华海清科股份有限公司 | 一种承载组件和化学机械抛光*** |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3162876A (en) * | 1962-12-14 | 1964-12-29 | Ronson Corp | Coupling arrangement for polishing machine |
US4222204A (en) * | 1979-06-18 | 1980-09-16 | Benner Robert L | Holder for an abrasive plate |
US4664572A (en) * | 1985-04-03 | 1987-05-12 | Mitsubishi Jukogyo Kabushiki Kaisha | Chip disposer |
JPS63253855A (ja) * | 1987-04-06 | 1988-10-20 | Daido Steel Co Ltd | 磁気カツプリング |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5667433A (en) * | 1995-06-07 | 1997-09-16 | Lsi Logic Corporation | Keyed end effector for CMP pad conditioner |
US6036583A (en) * | 1997-07-11 | 2000-03-14 | Applied Materials, Inc. | Conditioner head in a substrate polisher and method |
US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6042457A (en) * | 1998-07-10 | 2000-03-28 | Aplex, Inc. | Conditioner assembly for a chemical mechanical polishing apparatus |
US6033290A (en) * | 1998-09-29 | 2000-03-07 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
JP3772946B2 (ja) * | 1999-03-11 | 2006-05-10 | 株式会社荏原製作所 | ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置 |
US6386963B1 (en) * | 1999-10-29 | 2002-05-14 | Applied Materials, Inc. | Conditioning disk for conditioning a polishing pad |
JP2001121402A (ja) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | コンディショニングディスク |
JP2002307308A (ja) * | 2001-04-12 | 2002-10-23 | Fujimori Gijutsu Kenkyusho:Kk | ケミカルマシンポリッシャの研磨盤用研磨ドレッサ |
KR100468111B1 (ko) * | 2002-07-09 | 2005-01-26 | 삼성전자주식회사 | 연마 패드 컨디셔너 및 이를 갖는 화학적 기계적 연마 장치 |
KR100562498B1 (ko) * | 2003-02-12 | 2006-03-21 | 삼성전자주식회사 | 씨엠피 설비의 패드 컨디셔너 |
US6945857B1 (en) * | 2004-07-08 | 2005-09-20 | Applied Materials, Inc. | Polishing pad conditioner and methods of manufacture and recycling |
US7161451B2 (en) * | 2005-04-14 | 2007-01-09 | Gm Global Technology Operations, Inc. | Modular permanent magnet chuck |
CN101356597B (zh) * | 2005-09-26 | 2013-02-06 | 磁转换技术全球控股有限公司 | 磁体阵列 |
DE602008002445D1 (de) * | 2007-01-30 | 2010-10-28 | Ebara Corp | Poliervorrichtung |
US7843295B2 (en) * | 2008-04-04 | 2010-11-30 | Cedar Ridge Research Llc | Magnetically attachable and detachable panel system |
JP5236515B2 (ja) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | ドレッシング装置、化学的機械的研磨装置及び方法 |
US8350663B1 (en) * | 2011-12-07 | 2013-01-08 | Creative Engineering Solutions, Inc. | Rotary switchable multi-core element permanent magnet-based apparatus |
-
2012
- 2012-10-01 JP JP2012219304A patent/JP5919157B2/ja active Active
-
2013
- 2013-09-20 US US14/032,773 patent/US20140179204A1/en not_active Abandoned
- 2013-09-27 TW TW102135065A patent/TWI602227B/zh active
- 2013-09-27 KR KR1020130115094A patent/KR20140043284A/ko not_active Application Discontinuation
- 2013-09-30 CN CN201310461262.3A patent/CN103707193B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20140179204A1 (en) | 2014-06-26 |
JP2014069299A (ja) | 2014-04-21 |
JP5919157B2 (ja) | 2016-05-18 |
TWI602227B (zh) | 2017-10-11 |
KR20140043284A (ko) | 2014-04-09 |
CN103707193A (zh) | 2014-04-09 |
TW201426835A (zh) | 2014-07-01 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |