CN103706525B - The sol evenning machine pallet preventing glue from sucking - Google Patents
The sol evenning machine pallet preventing glue from sucking Download PDFInfo
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- CN103706525B CN103706525B CN201310685767.8A CN201310685767A CN103706525B CN 103706525 B CN103706525 B CN 103706525B CN 201310685767 A CN201310685767 A CN 201310685767A CN 103706525 B CN103706525 B CN 103706525B
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- vacuum
- silicon chip
- sheet mouth
- inhaled
- sol evenning
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Abstract
The invention discloses a kind of sol evenning machine pallet preventing glue from sucking, comprising: silicon chip wafer-supporting platform, vacuum are inhaled chip architecture and be positioned at the suction inlet operator guards in vacuum suction chip architecture; The upper end of described silicon chip wafer-supporting platform is provided with silicon chip load plane, centre offers a recessed storage glue groove, is provided with a boss in the centre of described storage glue groove; Described vacuum is inhaled chip architecture and is comprised: upper end and vacuum inhale sheet mouth, and described upper end is positioned at described boss, and described vacuum inhales the top that sheet mouth is positioned at described upper end; Described suction inlet operator guards is positioned at the top of described boss.By the way, the present invention can stop that photoresist is inhaled into vacuum and inhales in sheet mouth in whipping process effectively, again be inhaled into vacuum after preventing the photoresist flowed in storage glue groove from reaching a certain height to inhale in sheet mouth simultaneously, avoid vacuum and inhale the not enough or blocking of suction that sheet mouth causes because sucking photoresist.
Description
Technical field
The present invention relates to sol evenning machine apparatus field, particularly relate to a kind of sol evenning machine pallet preventing glue from sucking.
background technology
The mode that existing photoresist glue evenning table adopts vacuum to inhale sheet holds silicon chip, but existing silicon chip wafer-supporting platform effectively cannot stop that photoresist infiltrates vacuum and inhales in sheet mouth in whipping process, prior art as shown in Figure 1, silicon chip and vacuum are inhaled sheet mouth and are directly contacted, sol evenning machine is in high-speed rotation, photoresist is by rotary centrifugal force and capillary synergy, be launched into thin film, the glue be wherein thrown out of in whipping process to silicon chip edge drips, because silicon chip edge and wafer-supporting platform inhale the pressure differential of sheet mouth and the capillary effect of colloid, the glue of part silicon chip edge drips and can be inhaled in vacuum suction sheet mouth along the back side of silicon chip, thus blocking vacuum inhales sheet mouth, vacuum is caused to inhale sheet mouth suction not enough, thus cause the uniformity of photoresist film to be deteriorated, damage can be caused to glue evenning table simultaneously.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of sol evenning machine pallet preventing glue from sucking, effectively can stop that photoresist is inhaled into vacuum and inhales in sheet mouth in whipping process, again be inhaled into vacuum after preventing the photoresist flowed in storage glue groove from reaching a certain height to inhale in sheet mouth simultaneously, avoid vacuum and inhale the not enough or blocking of suction that sheet mouth causes because sucking photoresist.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of sol evenning machine pallet preventing glue from sucking, comprising: silicon chip wafer-supporting platform, vacuum are inhaled chip architecture and be positioned at the suction inlet operator guards in vacuum suction chip architecture; The upper end of described silicon chip wafer-supporting platform is provided with silicon chip load plane, centre offers a recessed storage glue groove, is provided with a boss in the centre of described storage glue groove; Described vacuum is inhaled chip architecture and is comprised: upper end and vacuum inhale sheet mouth, and described upper end is positioned at described boss, and described vacuum inhales the top that sheet mouth is positioned at described upper end, and the vertical range that described vacuum is inhaled between sheet mouth and described silicon chip load plane is greater than 3mm; Described suction inlet operator guards is positioned at the top of described boss, is also provided with " T " shape bleed-off passage in described suction inlet operator guards, and the lower port of described bleed-off passage and described vacuum are inhaled sheet mouth and be communicated with.
In a preferred embodiment of the present invention, described storage glue groove is circular platform type, comprising: notch and bottom land, and the area of described notch is greater than the area of described bottom land.
In a preferred embodiment of the present invention, described boss is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth.
In a preferred embodiment of the present invention, the cylindrical cap-like structure of described suction inlet operator guards, comprising: the cap wall concaved at the bottom of crown, cap and between being positioned at the bottom of described crown and cap.
In a preferred embodiment of the present invention, the through hole of bleeding of described bleed-off passage both sides is positioned on described cap wall, and is close to described crown.
In a preferred embodiment of the present invention, the center of circle in the center of circle and described silicon chip load plane that described vacuum inhales sheet mouth is on same vertical line.
The invention has the beneficial effects as follows: the sol evenning machine pallet that the present invention prevents glue from sucking, storage glue groove is offered in the centre of silicon chip wafer-supporting platform, first the photoresist glue be thrown out of in whipping process to silicon chip back side flow in storage glue groove under gravity, avoids vacuum and inhale sheet mouth and cause the not enough or blocking of suction because sucking photoresist; And the suction inlet operator guards of cap-like structure is installed on the top of boss; be provided with " T " shape bleed-off passage therein; protection vacuum inhales sheet mouth on the one hand; thoroughly prevent glue instillation; changing air-flow suction direction is on the other hand side direction; form certain draught head in the vacuum cavity that storage glue groove and silicon chip are formed, can prevent the photoresist flowed in storage glue groove after reaching a certain height, be again inhaled into vacuum at the bottom of the cap simultaneously on suction inlet operator guards and inhale in sheet mouth.
Accompanying drawing explanation
Fig. 1 is existing sol evenning machine support holder structure schematic diagram;
Fig. 2 is the structural representation of sol evenning machine pallet one preferred embodiment that the present invention prevents glue from sucking;
Fig. 3 is the structural representation of partial enlargement shown in Fig. 2;
Fig. 4 is structural representation in running order shown in Fig. 2;
In accompanying drawing, the mark of each parts is as follows: 1, silicon chip wafer-supporting platform, and 2, vacuum inhales chip architecture, 3, suction inlet operator guards; 4, silicon chip, 10, storage glue groove, 11, boss; 12, silicon chip load plane, 20, upper end, 21, vacuum inhales sheet mouth; 30, to bleed through hole, 31, cap wall, 32, crown; 33, at the bottom of cap; 100, notch, 101, bottom land, H, vacuum inhale the vertical range between sheet mouth and silicon chip load plane.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Refer to Fig. 2, Fig. 3 and Fig. 4, the embodiment of the present invention comprises:
The sol evenning machine pallet preventing glue from sucking, comprising: silicon chip wafer-supporting platform 1, vacuum are inhaled chip architecture 2 and be positioned at the suction inlet operator guards 3 in vacuum suction chip architecture 2, the upper end of described silicon chip wafer-supporting platform 1 is provided with silicon chip load plane 12, centre offers a recessed storage glue groove 10, is provided with a boss 11 in the centre of described storage glue groove 10, described vacuum is inhaled chip architecture 2 and is comprised: upper end 20 and vacuum inhale sheet mouth 21, described upper end 20 is positioned at described boss 11, described vacuum inhales the top that sheet mouth 21 is positioned at described upper end 20, and the vertical range that described vacuum is inhaled between sheet mouth 21 and described silicon chip load plane 12 is greater than 3mm, directly do not contact with silicon chip even if vacuum inhales sheet mouth 21, leave certain gap between the two, thus make the photoresist glue be thrown out of in whipping process to silicon chip 4 back side first flow in storage glue groove 10 under gravity, thus effectively can stop that photoresist is inhaled into vacuum and inhales in sheet mouth 21, described suction inlet operator guards 3 is positioned at the top of described boss 11, " T " shape bleed-off passage is also provided with in described suction inlet operator guards 3 inside, and the lower port of described bleed-off passage and described vacuum are inhaled sheet mouth 21 and are communicated with, making air by T " shape bleed-off passage is inhaled sheet mouth 21 place toward vacuum and is taken out, thus protection vacuum inhales sheet mouth 21 further.
Wherein, described storage glue groove 10 is circular platform type, comprise: notch 100 and bottom land 101, and the area of described notch 100 is greater than the area of described bottom land 101, the area of notch 100 is larger can ensure that the photoresist throwing away silicon chip edge during sol evenning machine rotates all penetrates in storage glue groove 10.。
Described boss 11 is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth, and the top of described boss 11 also for installing fixing described suction inlet operator guards 3, and makes suction inlet operator guards 3 not protrude from outside described notch 100, avoids affecting laying of silicon chip 4.
The cylindrical cap-like structure of described suction inlet operator guards 3; comprise: at the bottom of crown 32, cap 33 and be positioned at the cap wall 31 concaved between 33 at the bottom of described crown 32 and cap; vacuum effectively can be avoided to inhale sheet mouth 21 and to suck photoresist; and at the bottom of cap, 33 can prevent the photoresist being positioned at storage glue groove 10 after reaching a certain height, and are again inhaled sheet mouth 21 by vacuum and suck.
The through hole 30 of bleeding of described bleed-off passage both sides is positioned on described cap wall 31, and be close to described crown 32, make the air in the back side of silicon chip 4 and storage glue groove 10 inhale sheet mouth 21 place by through hole 30 of bleeding toward vacuum to take away, thus make to be in negative pressure state in the back side of silicon chip 4 and storage glue groove 10, namely form a vacuum chamber.
The center of circle in the center of circle and described silicon chip load plane 12 that described vacuum inhales sheet mouth 21 is on same vertical line, i.e. center of circle alignment, to realize dropping in the even coating under rotary centrifugal force and capillary synergy of photoresist on silicon chip surface and the uniform film of generate one deck.
The course of work is as follows: as shown in Figure 4, first silicon chip 4 is placed on silicon chip load plane 12, and alignd in both centers of circle, then open vacuum and inhale chip architecture 2, air is inhaled sheet mouth 21 and is moved from " T " shape bleed-off passage toward vacuum, thus make the back side of silicon chip 4 and storage glue groove 11 form a vacuum cavity, namely the atmospheric pressure in silicon chip 4 front is greater than the atmospheric pressure at its back side, thus silicon chip 4 is firmly adsorbed on silicon chip load plane 12, then carry out while or low speed rotation static at silicon chip 4 dripping glue, drip glue amount to determine according to the size of the viscosity of photoresist and silicon chip 4, after dripping cementing bundle, sol evenning machine High Rotation Speed makes the thinning thickness reaching final requirement of photoresist layer.Wherein photoresist is thrown out of glue to silicon chip 4 back side when arriving the notch 100 of described storage glue groove 10 in whipping process, because the air pressure in storage glue groove 10 is lower than the air pressure at storage glue groove 10 edge, photoresist overcomes surface tension under dropping in draught head and Action of Gravity Field, therefore glue drip can under to drop in storage glue groove 10 and be stored in wherein, thus prevent glue to drip blocking vacuum suction sheet mouth 21, but due in glue evenning table high-speed rotation, glue in storage glue groove 10 drips the effect by centrifugal force, still can to surrounding whipping, at the bottom of cap on suction inlet operator guards 3,33 can keep away the photoresist being positioned at storage glue groove 10 and after reaching a certain height, inhaled sheet mouth 21 again by vacuum suck, there is protection vacuum further and inhale the effect of sheet mouth 21.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. prevent the sol evenning machine pallet that glue sucks, it is characterized in that, comprising: silicon chip wafer-supporting platform, vacuum are inhaled chip architecture and be positioned at the suction inlet operator guards in vacuum suction chip architecture; The upper end of described silicon chip wafer-supporting platform is provided with silicon chip load plane, centre offers a recessed storage glue groove, is provided with a boss in the centre of described storage glue groove; Described vacuum is inhaled chip architecture and is comprised: upper end and vacuum inhale sheet mouth, and described upper end is positioned at described boss, and described vacuum inhales the top that sheet mouth is positioned at described upper end, and the vertical range that described vacuum is inhaled between sheet mouth and described silicon chip load plane is greater than 3mm; Described suction inlet operator guards is positioned at the top of described boss, is also provided with " T " shape bleed-off passage in described suction inlet operator guards, and the lower port of described bleed-off passage and described vacuum are inhaled sheet mouth and be communicated with.
2. the sol evenning machine pallet preventing glue from sucking according to claim 1, is characterized in that, described storage glue groove is circular platform type, comprising: notch and bottom land, and the area of described notch is greater than the area of described bottom land.
3. the sol evenning machine pallet preventing glue from sucking according to claim 1, is characterized in that, described boss is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth.
4. the sol evenning machine pallet preventing glue from sucking according to claim 1, is characterized in that, the cylindrical cap-like structure of described suction inlet operator guards, comprising: the cap wall concaved at the bottom of crown, cap and between being positioned at the bottom of described crown and cap.
5. the sol evenning machine pallet preventing glue from sucking according to claim 4, is characterized in that, the through hole of bleeding of described bleed-off passage both sides is positioned on described cap wall, and is close to described crown.
6. the sol evenning machine pallet preventing glue from sucking according to claim 1, is characterized in that, the center of circle in the center of circle and described silicon chip load plane that described vacuum inhales sheet mouth is on same vertical line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310685767.8A CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310685767.8A CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
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| Publication Number | Publication Date |
|---|---|
| CN103706525A CN103706525A (en) | 2014-04-09 |
| CN103706525B true CN103706525B (en) | 2015-12-09 |
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| CN201310685767.8A Expired - Fee Related CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105954975B (en) * | 2016-06-29 | 2019-11-26 | 南通大学 | A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
| CN105921368B (en) * | 2016-06-29 | 2018-06-19 | 南通大学 | A kind of three layers of cavity type end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
| CN105964498B (en) * | 2016-06-29 | 2018-08-10 | 南通大学 | A kind of slip-type end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
| CN110052370B (en) * | 2019-05-15 | 2024-04-02 | 苏州美图半导体技术有限公司 | Vacuum glue homogenizing device of glue homogenizing machine |
| CN113522650B (en) * | 2021-07-14 | 2023-03-31 | 蘅东光通讯技术(深圳)股份有限公司 | Automatic glue injection and suction equipment and method for optical communication connector |
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| US4889069A (en) * | 1987-11-23 | 1989-12-26 | Tazmo Co., Ltd. | Substrate coating equipment |
| JPH10294261A (en) * | 1997-04-18 | 1998-11-04 | Sony Corp | Device for applying resist |
| US5952050A (en) * | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
| CN101498895A (en) * | 2008-01-28 | 2009-08-05 | 东京应化工业株式会社 | Photoresist supply recovering system and photoresist recovering method |
| CN102259083A (en) * | 2011-01-19 | 2011-11-30 | 沈阳芯源微电子设备有限公司 | Spin-coating method of thick film used in semiconductor packaging |
| US8091504B2 (en) * | 2006-09-19 | 2012-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for cleaning spin coater |
| CN203725340U (en) * | 2013-12-16 | 2014-07-23 | 南通大学 | Spin coater tray capable of preventing glue suction |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3598054B2 (en) * | 2000-11-06 | 2004-12-08 | 東京エレクトロン株式会社 | Coating film forming equipment |
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2013
- 2013-12-16 CN CN201310685767.8A patent/CN103706525B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4889069A (en) * | 1987-11-23 | 1989-12-26 | Tazmo Co., Ltd. | Substrate coating equipment |
| US5952050A (en) * | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
| JPH10294261A (en) * | 1997-04-18 | 1998-11-04 | Sony Corp | Device for applying resist |
| US8091504B2 (en) * | 2006-09-19 | 2012-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for cleaning spin coater |
| CN101498895A (en) * | 2008-01-28 | 2009-08-05 | 东京应化工业株式会社 | Photoresist supply recovering system and photoresist recovering method |
| CN102259083A (en) * | 2011-01-19 | 2011-11-30 | 沈阳芯源微电子设备有限公司 | Spin-coating method of thick film used in semiconductor packaging |
| CN203725340U (en) * | 2013-12-16 | 2014-07-23 | 南通大学 | Spin coater tray capable of preventing glue suction |
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| CN103706525A (en) | 2014-04-09 |
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Granted publication date: 20151209 Termination date: 20161216 |