CN103702513A - Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof - Google Patents
Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof Download PDFInfo
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- CN103702513A CN103702513A CN201410021118.2A CN201410021118A CN103702513A CN 103702513 A CN103702513 A CN 103702513A CN 201410021118 A CN201410021118 A CN 201410021118A CN 103702513 A CN103702513 A CN 103702513A
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Abstract
The invention discloses a carrier film suitable for a single-sided flexible circuit board. The carrier film comprises a substrate layer placed in the middle position, two binder layers bound on the two surfaces of the substrate layer and two release films connected with the two binder layers. The invention provides the carrier film, only copper foils need to be compounded on the two surfaces of the carrier film, then processing can be performed, the carrier film and the copper foils can be fast and conveniently peeled off after processing, the efficiency is high, and the product quality is good. Only the copper foils need to be compounded on the two surfaces of the carrier film, then the processing is performed, and after the processing is completed, the carrier film can be separated from the copper foils, so that the production efficiency of the whole single-sided flexible circuit board can be doubled; and the output per unit area in unit time in equipment of all processes is doubled, the range of application is wide, the carrier film can be implemented by the existing equipment and the cost is low.
Description
Technical field
Single-sided flexible circuit board is manufactured field, is particularly applicable to carrier film of single-sided flexible circuit board and its preparation method and application.
Background technology
The production and processing process of single sided board generally, because the common diaphragm+tack coat+Copper Foil of structure of lamina is a kind of raw material, diaphragm+Copper Foil is another kind of raw material.First, Copper Foil will carry out the PROCESS FOR TREATMENT such as etching and obtain the circuit needing, and diaphragm will hole to expose corresponding pad.After cleaning, by rolling process, both are combined again.And then protect at the pad portion electrogilding exposing or tin etc.; In prior art, be all the processing through a plate of a plate of such flow process, efficiency is low, even be also to make an issue of on processing this part plate in order to increase efficiency, not only cost uprises, product also can step-down, the invention provides a kind of simple to operate, in whole processing procedure without making other extra operations or changing flow process, can not occur that chemicals carries cross pollution secretly, the problems such as the wrinkling bubbling distortion of product at process of manufacture yet.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of film of bearing, only Copper Foil need to be met on the two sides of carrier film and can process, after processing, can peel off quickly and easily and bear film and Copper Foil, efficiency is high, good product quality.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
Be applicable to the carrier film of single-sided flexible circuit board, carrier film forms to be had: be placed in the substrate layer in centre position, be bonded in two adhesive layers on substrate layer two sides, be connected in two release films of two adhesive layers.
The aforesaid preparation method who is applicable to the carrier film of single-sided flexible circuit board, comprises the steps: that (1) is by two-sided corona treatment of substrate layer surface cleaning while; (2) by adhesive-coated in the one side of substrate layer, and dry to form adhesive layer; (3) release film is composite and fixed on adhesive layer; (4) repeating step (1), (2), (3) are at the another side of substrate layer.
The aforesaid preparation method who is applicable to the carrier film of single-sided flexible circuit board, comprises the steps: that (1) is by two-sided corona treatment of substrate layer surface cleaning while; (2) by adhesive-coated in the one side of substrate layer, and dry to form adhesive layer; (3) release film is composite and fixed on adhesive layer; (4) clean release film surface corona treatment; (5) coating adhesive layer is surperficial at the release film of step (4), and dries; (6) adhesive layer in step (5) is composite and fixed to the another side of above-mentioned substrate layer.
The aforesaid preparation method who is applicable to the carrier film of single-sided flexible circuit board, compound fixing condition is temperature 20-100 ℃, pressure 0.1-10Kg/cm.
The aforesaid preparation method who is applicable to the carrier film of single-sided flexible circuit board, Binder Composition is comprised of polypropylene based polymers, organosilicon or ethyl acetate.
The aforesaid preparation method who is applicable to the carrier film of single-sided flexible circuit board, the dyne value of corona treatment is not less than 30mN/m.
The aforesaid application that is applicable to the carrier film of single-sided flexible circuit board, pressing Copper Foil in carrier film two sides forms double-faced flexible wiring board, to this double-faced flexible wiring board processing, then Copper Foil and carrier film is peeled off and is obtained two products.
Usefulness of the present invention is: the invention provides a kind of film of bearing, only Copper Foil need to be met on the two sides of carrier film and can process, after processing, can peel off quickly and easily and bear film and Copper Foil, efficiency is high, good product quality.Only Copper Foil need to be compound in to the two sides of carrier film, then start processing, after machining, carrier film and Copper Foil be separated, just can make one times of the improving productivity of whole single-sided flexible circuit board; Unit are quantum of output in the equipment of each processing procedure in the unit interval is doubled, and applied range, and existing equipment can be realized, and cost is low.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of application of the present invention;
Fig. 2 is the sectional view of an embodiment of the present invention;
Fig. 3 is the sectional view of the another kind of embodiment of the present invention;
The implication of Reference numeral in figure:
1 Copper Foil, 2 carrier films, 201 adhesive layers, 202 release film layers, 203 substrate layers.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is done to concrete introduction.
Method one:
The preparation method who is applicable to the carrier film 2 of single-sided flexible circuit board, comprises the steps:
(1) by two-sided corona treatment of 203 surface cleaning while of substrate layer; Obtain certain dyne value and be not less than 30mN/m.
(2) by adhesive-coated in the one side of substrate layer 203, and dry to form adhesive layer 201; Binder Composition is by polypropylene based polymers, organosilicon or ethyl acetate.Dry time control organic solvent residual rate processed below 0.5%.
(3) release film is composite and fixed on adhesive layer 201; Compound tense is used the temperature of 20-100 degree, and the pressure of 0.1-10Kg/cm.
(4) by two-sided corona treatment of 203 surface cleaning while of substrate layer; Obtain certain dyne value and be not less than 30mN/m.
(5) another side at substrate layer 203 is coated with adhesive layer 201, and dries, and controls organic solvent residual rate below 0.5%.
(6) release film is composite and fixed on the adhesive layer 201 of step (5); Compound tense is used the temperature of 20-100 degree, and the pressure of 0.1-10Kg/cm; Product completes.
Method two:
(1) by two-sided corona treatment of 203 surface cleaning while of substrate layer; Obtain certain dyne value and be not less than 30mN/m.
(2) by adhesive-coated in the one side of substrate layer 203, and dry to form adhesive layer 201; Binder Composition is by polypropylene based polymers, organosilicon or ethyl acetate.Dry time control organic solvent residual rate processed below 0.5%.
(3) release film is composite and fixed on adhesive layer 201; Compound tense is used the temperature of 20-100 degree, and the pressure of 0.1-10Kg/cm.
(4) get a release film clean surface corona treatment, obtain certain dyne value and be not less than 30mN/m.
(5) release film of coating adhesive layer 201 steps (4) surface, and dry, organic solvent residual rate controlled below 0.5%.
(6) adhesive layer 201 in step (5) is composite and fixed to the another side of above-mentioned substrate layer 203.
Be applicable to the application of the carrier film 2 of single-sided flexible circuit board, carrier film 2 two sides pressing Copper Foils 1 form double-faced flexible wiring board, to this double-faced flexible wiring board processing, then Copper Foil 1 and carrier film 2 are peeled off and are obtained two products.
The invention provides a kind of film of bearing, only Copper Foil 1 need to be met on the two sides of carrier film 2 and can process, after processing, can peel off quickly and easily and bear film and Copper Foil 1, efficiency is high, good product quality.Only Copper Foil 1 need to be compound in to the two sides of carrier film 2, then start processing, after machining, carrier film 2 and Copper Foil 1 be separated, just can make one times of the improving productivity of whole single-sided flexible circuit board; Unit are quantum of output in the equipment of each processing procedure in the unit interval is doubled, and applied range, and existing equipment can be realized, and cost is low.
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.
Claims (7)
1. the carrier film that is applicable to single-sided flexible circuit board, is characterized in that, above-mentioned carrier film forms to be had: be placed in the substrate layer in centre position, be bonded in two adhesive layers on above-mentioned substrate layer two sides, be connected in two release films of above-mentioned two adhesive layers.
2. the above-mentioned preparation method who is applicable to the carrier film of single-sided flexible circuit board according to claim 1, is characterized in that, comprises the steps: that (1) is by two-sided corona treatment of substrate layer surface cleaning while; (2) by adhesive-coated in the one side of above-mentioned substrate layer, and dry to form adhesive layer; (3) release film is composite and fixed on above-mentioned adhesive layer; (4) repeat above-mentioned steps (1), (2), (3) at the another side of above-mentioned substrate layer.
3. the preparation method who is applicable to the carrier film of single-sided flexible circuit board according to claim 1, is characterized in that, comprises the steps: that (1) is by two-sided corona treatment of substrate layer surface cleaning while; (2) by adhesive-coated in the one side of above-mentioned substrate layer, and dry to form adhesive layer; (3) release film is composite and fixed on above-mentioned adhesive layer; (4) clean release film surface corona treatment; (5) coating adhesive layer is surperficial at the release film of step (4), and dries; (6) adhesive layer in step (5) is composite and fixed to the another side of above-mentioned substrate layer.
4. according to the preparation method of the carrier film that is applicable to single-sided flexible circuit board described in claim 2 or 3, it is characterized in that, above-mentioned compound fixing condition is temperature 20-100 ℃, pressure 0.1-10Kg/cm.
5. according to the preparation method of the carrier film that is applicable to single-sided flexible circuit board described in claim 2 or 3, it is characterized in that, above-mentioned Binder Composition is comprised of polypropylene based polymers, organosilicon or ethyl acetate.
6. according to the preparation method of the carrier film that is applicable to single-sided flexible circuit board described in claim 2 or 3, it is characterized in that, the dyne value of above-mentioned corona treatment is not less than 30mN/m.
7. the application that is applicable to the carrier film of single-sided flexible circuit board according to claim 1, it is characterized in that, above-mentioned carrier film two sides pressing Copper Foil forms double-faced flexible wiring board, to this double-faced flexible wiring board processing, then Copper Foil and carrier film is peeled off and is obtained two products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410021118.2A CN103702513A (en) | 2014-01-17 | 2014-01-17 | Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410021118.2A CN103702513A (en) | 2014-01-17 | 2014-01-17 | Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof |
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| CN103702513A true CN103702513A (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410021118.2A Pending CN103702513A (en) | 2014-01-17 | 2014-01-17 | Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof |
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| CN (1) | CN103702513A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113845853A (en) * | 2021-08-09 | 2021-12-28 | 深圳市鑫达辉软性电路科技有限公司 | Bearing film and laminating method thereof |
| CN117858362A (en) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0948092A (en) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | Laminate with adhesive |
| CN101437358A (en) * | 2007-11-14 | 2009-05-20 | 亚洲电材股份有限公司 | Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| KR20090128791A (en) * | 2008-06-11 | 2009-12-16 | (주)인터플렉스 | Method and apparatus of one-sided flexible printed circuit board using double-sided carrier tape |
| CN101781529A (en) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board |
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| KR20120101937A (en) * | 2011-03-07 | 2012-09-17 | (주)인터플렉스 | Release film for cover-lay laminating in flexible printed circuit board |
| CN202826624U (en) * | 2012-08-27 | 2013-03-27 | 安徽格林开思茂光电科技股份有限公司 | High temperature resistant wet-weather-resistance polyethylene terephthalate (PET) film |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN203840630U (en) * | 2014-01-17 | 2014-09-17 | 杨秀英 | Carrier film suitable for single-side flexible circuit board |
-
2014
- 2014-01-17 CN CN201410021118.2A patent/CN103702513A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0948092A (en) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | Laminate with adhesive |
| CN101437358A (en) * | 2007-11-14 | 2009-05-20 | 亚洲电材股份有限公司 | Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| KR20090128791A (en) * | 2008-06-11 | 2009-12-16 | (주)인터플렉스 | Method and apparatus of one-sided flexible printed circuit board using double-sided carrier tape |
| CN101781529A (en) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board |
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| KR20120101937A (en) * | 2011-03-07 | 2012-09-17 | (주)인터플렉스 | Release film for cover-lay laminating in flexible printed circuit board |
| CN202826624U (en) * | 2012-08-27 | 2013-03-27 | 安徽格林开思茂光电科技股份有限公司 | High temperature resistant wet-weather-resistance polyethylene terephthalate (PET) film |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN203840630U (en) * | 2014-01-17 | 2014-09-17 | 杨秀英 | Carrier film suitable for single-side flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113845853A (en) * | 2021-08-09 | 2021-12-28 | 深圳市鑫达辉软性电路科技有限公司 | Bearing film and laminating method thereof |
| CN117858362A (en) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
| CN117858362B (en) * | 2024-03-07 | 2024-05-10 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
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Application publication date: 20140402 |
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