CN103681491A - 加工方法 - Google Patents

加工方法 Download PDF

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Publication number
CN103681491A
CN103681491A CN201310399686.1A CN201310399686A CN103681491A CN 103681491 A CN103681491 A CN 103681491A CN 201310399686 A CN201310399686 A CN 201310399686A CN 103681491 A CN103681491 A CN 103681491A
Authority
CN
China
Prior art keywords
mentioned
wafer
processing method
plate object
boundary belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310399686.1A
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English (en)
Chinese (zh)
Inventor
关家一马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN103681491A publication Critical patent/CN103681491A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
CN201310399686.1A 2012-09-20 2013-09-05 加工方法 Pending CN103681491A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012206915A JP2014063813A (ja) 2012-09-20 2012-09-20 加工方法
JP2012-206915 2012-09-20

Publications (1)

Publication Number Publication Date
CN103681491A true CN103681491A (zh) 2014-03-26

Family

ID=50318629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310399686.1A Pending CN103681491A (zh) 2012-09-20 2013-09-05 加工方法

Country Status (3)

Country Link
JP (1) JP2014063813A (ko)
KR (1) KR20140038303A (ko)
CN (1) CN103681491A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106816412A (zh) * 2017-01-19 2017-06-09 吉林麦吉柯半导体有限公司 晶圆的切割工艺及晶圆的生产方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015233066A (ja) * 2014-06-09 2015-12-24 株式会社ディスコ 板状物の分割方法
JP6537414B2 (ja) * 2015-09-03 2019-07-03 株式会社ディスコ ウエーハの加工方法
JP6611130B2 (ja) * 2016-04-19 2019-11-27 株式会社ディスコ エキスパンドシート
JP6706979B2 (ja) * 2016-06-27 2020-06-10 株式会社ディスコ 拡張装置及び拡張方法
JP6706980B2 (ja) * 2016-06-29 2020-06-10 株式会社ディスコ 拡張装置及び拡張方法
JP6991475B2 (ja) 2017-05-24 2022-01-12 協立化学産業株式会社 加工対象物切断方法
JP7486327B2 (ja) 2020-03-05 2024-05-17 株式会社ディスコ チップの製造方法
JP7486345B2 (ja) 2020-05-01 2024-05-17 株式会社ディスコ エキスパンド方法及びエキスパンド装置
JP7499605B2 (ja) 2020-05-01 2024-06-14 株式会社ディスコ エキスパンド装置
CN117020397A (zh) * 2023-09-20 2023-11-10 北京理工大学 一种基于时空同步聚焦激光的碳化硅晶锭剥片方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030013380A1 (en) * 2001-06-28 2003-01-16 Kazuhisa Arai Semiconductor wafer dividing method
CN1713353A (zh) * 2004-06-22 2005-12-28 株式会社迪斯科 晶片加工方法
JP2006229021A (ja) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
CN101297394A (zh) * 2005-11-10 2008-10-29 株式会社瑞萨科技 半导体器件的制造方法以及半导体器件
US20090280622A1 (en) * 2008-05-07 2009-11-12 Disco Corporation Fabrication method for device having die attach film on the back side thereof
CN102152413A (zh) * 2010-01-19 2011-08-17 株式会社迪思科 晶片的加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155940A (ja) * 1984-08-27 1986-03-20 Nec Corp 半導体ウエハ−のペレツタイズ装置
JP4509719B2 (ja) * 2002-03-12 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法
JP5133660B2 (ja) * 2007-11-27 2013-01-30 株式会社ディスコ ウエーハの裏面に装着された接着フィルムの破断方法
JP5207455B2 (ja) * 2008-05-09 2013-06-12 株式会社ディスコ フィルム状接着剤の破断装置及び破断方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030013380A1 (en) * 2001-06-28 2003-01-16 Kazuhisa Arai Semiconductor wafer dividing method
CN1713353A (zh) * 2004-06-22 2005-12-28 株式会社迪斯科 晶片加工方法
JP2006229021A (ja) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
CN101297394A (zh) * 2005-11-10 2008-10-29 株式会社瑞萨科技 半导体器件的制造方法以及半导体器件
US20090280622A1 (en) * 2008-05-07 2009-11-12 Disco Corporation Fabrication method for device having die attach film on the back side thereof
CN102152413A (zh) * 2010-01-19 2011-08-17 株式会社迪思科 晶片的加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106816412A (zh) * 2017-01-19 2017-06-09 吉林麦吉柯半导体有限公司 晶圆的切割工艺及晶圆的生产方法

Also Published As

Publication number Publication date
KR20140038303A (ko) 2014-03-28
JP2014063813A (ja) 2014-04-10

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Application publication date: 20140326