CN103658903A - System for continuously disassembling and recovering electronic component and solder based on waste circuit board - Google Patents
System for continuously disassembling and recovering electronic component and solder based on waste circuit board Download PDFInfo
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- CN103658903A CN103658903A CN201310432814.8A CN201310432814A CN103658903A CN 103658903 A CN103658903 A CN 103658903A CN 201310432814 A CN201310432814 A CN 201310432814A CN 103658903 A CN103658903 A CN 103658903A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/053—Heating appliances electric using resistance wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A system for continuously disassembling and recovering an electronic component and solder based on a waste circuit board comprises an electric heating wire heating tube, a blast device, a temperature controller, a limit plate, a brush, a short chain transmission disassembling device, a long chain transmission auxiliary disassembling device, a circuit board substrate, an electronic component recovery box, an inclined type vibration screen, a solder recovering box and a harmful gas processing device. The waste circuit board is driven by the long chain transmission auxiliary disassembling device to pass through a material conveying port to enter the system, the waste circuit board is conveyed to the position below the heating tube, the solder at the position of a circuit pin is fast heated and fused, and part of the element and solder are disassembled through the blast wind force and under the action of gravity of an inclined angle. When the waste circuit board is continued to be conveyed to the short chain transmission disassembling device, the remaining element and solder are disassembled through a steel wire and a cutting board arranged on the short chain transmission disassembling device, and the falling element and the solder fall onto a vibration screen to be separated and recovered. The efficient system is simple and free of pollution and can continuously conduct batch processing on the circuit board without damaging the substrate.
Description
Technical field:
The present invention relates to a kind of system that can't harm continuously break electronic devices and components and solder alloy for waste and old circuit board.The present invention can realize to waste and old circuit board and electronic devices and components and solder alloy harmless, efficient, in batches continuous separate from, and the circuit board substrate after processing is not damaged, and is convenient to carry out subsequent recovery processing, belongs to resource circulation utilization field.
Background technology:
Circuit board is the important component part of electronic device.Along with development of information speed is accelerated day by day, the circuit board that electronic devices and components are installed has been widely used in the various aspects of our social production and life.The reasons such as the damage of various Electron Equipment Circuit Boards, renewal, have produced a large amount of waste and old circuit boards, and owing to not adopting suitable recycling technology, waste and old circuit board has caused huge pressure to society and environment.Still there is very hang-up in the recycling for waste and old circuit board at present, abandons the harm environment such as landfill, washing, burning and healthy processing method, adopts the equipment of environmental protection, using waste and old circuit board as secondary resource, recycles and seem particularly important.
In waste and old printed circuit board, contain high-grade noble metal and there is the recyclable materials that reclaims meaning, there is very high resource value.And electronic devices and components major part or function on it are intact, waste and old circuit board is recycled, first need to remove the superincumbent electronic devices and components of connection and solder alloy, both at home and abroad the method and apparatus of the recovery of electronic devices and components on waste and old circuit board and solder alloy is had much at present, but majority is to process single waste and old circuit board, efficiency is very low, can not realize the dismounting electronic devices and components of working continuously.
Chinese invention patent CN101259555, open day 2008.9.10 have proposed a kind of equipment of dissembling waste and old circuit board.This equipment adopts Hot-blast Heating, uses cylinder to rotate to realize the separated of circuit board substrate and components and parts, and a bucket wall has screen net structure to carry out filtering electronic devices and components.This equipment removes to components and parts the destruction that rate is low and easily cause substrate in rotation, can not solder alloy rationally be reclaimed.Chinese invention patent CN101417358A, an open day 2009.4.29 have proposed a kind of circuit board element dismounting device.This equipment adopts gap nozzle that high temperature and high pressure gas is injected on circuit board, makes scolder separated with circuit board, pulls down electronic devices and components.These equipment gases at high pressure can make solder fusing, but hyperbar also makes scolder disperse breaking circuit plate, can not collect solder alloy; And at high temperature circuit board substrate is softening, high-pressure injection makes substrate deformed damaged, is unfavorable for circuit board subsequent treatment.The open day 2009.5.27 of China publication CN201244516Y has proposed a kind of centrifugation detinning equipment of component, and this equipment is fixed on waste and old circuit board in preheating casing and adopts high speed rotating, by centrifugal action separate electronic components and parts and scolding tin.But this equipment cannot batch process and sealing poor, easily cause toxic gas leak, the handling difficulty of circuit board, separative efficiency is low, big for environment pollution.The open day 2010.04.21 of China publication CN101695705A has proposed a kind of equipment of waste and old circuit board components and parts overall pulling down, this equipment adopts a turning arm connection microscope carrier that waste and old circuit board is moved in heated hot body medium and vibration box, but this technique is the process shifting from two operation intervals, temperature reduces, the soldering meeting not coming off is solidified again, thereby causes treatment effect undesirable.Adopt pneumatic hammer to pat and also can make to be subject to the circuit substrate plate of thermal softening to damage, affect the utilization of circuit board post-processed.
Above-mentioned prior art has respectively following problem:
1. in the process of removing electronic devices and components, substrate is damaged, it is affected in circuit board post-processed.
2. the dismounting efficiency of pair electronic devices and components is low, and single can only carry out separating of electronic devices and components to single waste and old circuit board, removes not thoroughly, and loads and unloads loaded down with trivial detailsly, can not realize continuous batch and process.
3. the pernicious gas heater circuit plate not being produced carries out special disposal, can pollute the infringement of environment and health of human body.
Summary of the invention
The object of the invention is to avoid the problems referred to above, provide a kind of and can can't harm electronic devices and components and solder alloy on efficient partition recovery waste and old circuit board, and the environment friendly system that the pernicious gas producing is carried out to harmless treatment.
Based on the waste and old circuit board system that reclaims electronic devices and components and scolder that breaks continuously, comprise the device housings with conveying oralia 101, electric-heating-wire-heating pipe 102, airflow regulating switch 103, air-blast device 104, temperature controller 105, limiting plate and hairbrush 106, short chain transmission divides dismantling device 107, the auxiliary dismantling device 108 of long-chain transmission, circuit board substrate reclaims baffle plate 109, circuit board substrate collection box 112, scolder collection box 113, tilting vibrating screen 114, electronic devices and components baffle plate 115, side shutter door 116, small size components and parts collection box 201 and large scale components and parts collection box 202,
Described system ontology is comprised of shell, conveying oralia 101 and the side shutter door 116 that is positioned at shell side, forms an obturator; Air-blast device 104, temperature controller 105 and the electric-heating-wire-heating pipe 102 of described system equipment conveying oralia one side roof part are connected, and have formed the heater of system to circuit board, and install heating tube symmetrical expression both sides; Below heater, be symmetrical arranged and respectively have to become with horizontal plane the auxiliary dismantling device 108 of the adjustable long-chain transmission in 30-45 degree inclination angle and short chain transmission to divide dismantling device 107 each two, article two, short chain transmission divides 107 one-tenth V-shapes arrangements of dismantling device and middle gapped, article two, 108 one-tenth V-shapes of the auxiliary dismantling device of long-chain transmission are settled and are middle gapped, article two, short chain transmission divides dismantling device 107 and two auxiliary dismantling devices 108 of long-chain transmission to be arranged symmetrically with respectively, and short chain transmission divides dismantling device 107 be arranged on the top of the auxiliary dismantling device 108 of long-chain transmission and be positioned at the one end away from conveying oralia; In short chain transmission, divide nearly heating tube one side of dismantling device 107 that limiting plate and hairbrush 106 are set; At the auxiliary dismantling device 108 of long-chain transmission, away from the end of conveying oralia, be provided with tilted-putted circuit board and reclaim baffle plate 109, for by the waste and old circuit board from removing electronic devices and components every substrate from circuit board substrate collection box 112; Long-chain transmit auxiliary dismantling device 108 under be provided with the tilting vibrating screen 114 at 20-30 degree inclination angle, by vibrating motor 501, produce vibration, by mesh screen sizes and sieve aperture specification, be set to upper and lower mesh screen, 114 one-tenth herringbone designs of described tilting vibrating screen, upper mesh is large, lower mesh is little, the electronic devices and components that come off with separation and solder alloy, electronic devices and components sieve by size in small size components and parts collection box 201 and large scale components and parts collection box 202, and solder alloy sieves in the scolder collection box 113 of dropping into bottom; On device housings, be also provided with pernicious gas exhaust tube, by asepwirator pump, access harmful gas treatment case.
The auxiliary dismantling device 108 forward transmissions of long-chain transmission of described system, comprise stainless steel steel wire grid 402 and are embedded in the protruding pin 404 on grid; Short chain transmission divides dismantling device 107 forward transmissions, and transmission speed is greater than the biography speed of the auxiliary dismantling device of long-chain transmission; Draw-in groove 308, component disassembling steel wire 303, components and parts and scolder are installed on it and remove knife plate 304 and spring net 307, wherein steel wire 303 and knife plate 304 are with parallel interval setting, and perpendicular to short chain transmission, divide dismantling device 107 transmission direction, knife plate 304 tops arrange spring net 307.
Utilize and described based on the waste and old circuit board system that reclaims electronic devices and components and scolder that breaks continuously, to carry out separated method, it is characterized in that:
The step adopting is as follows:
A, unlatching heating power supply, to electric-heating-wire-heating, adjust the temperature to 200 ℃-220 ℃, open air-blast device, and unlatching vibrating motor 501 and long-chain transmit 108, two fractionation lines of auxiliary dismantling device and together move; Then open asepwirator pump 110; Waste and old circuit board is placed on long-chain and enters conveying mouth, open short chain transmission and divide dismantling device 107;
B, the waste and old circuit board transmission by long-chain is below heating tube in moving process, melts soldering tin, under wind-force and self gravitation effect, scolder and the portions of electronics components and parts of fusing come off, the separated recovery of tilting vibrating screen through below, size components and parts fall into collection box from both sides, and scolder falls into scolder collection box by mesh screen mesh; When circuit board continues to move to short chain transmission and divides dismantling device 107, by friction and the drawing of steel wire and knife plate of two chains, to scrape, remaining electronic devices and components and scolder breaking circuit plate are able to thoroughly split and reclaim;
The circuit board substrate of c, dismounting electronic devices and components and scolder enters substrate recovery zone under the effect of circuit board substrate recovery baffle plate 109, while sticking to electronic devices and components on conveyer chain and scolder through baffle plate 115 and hairbrush 106, scraped, thereby do not affected follow-up work;
D, waste and old circuit board processing is in batches finished after, first disconnecting electric-heating-wire-heating device, mesh screen vibrating motor 501, short chain transmission divides dismantling device 107, long-chain to transmit the power supply of auxiliary dismantling device 108, cut off again afterwards air blast and asepwirator pump 110 power supplys, after internal system cooling, open side shutter door 116, the waste and old circuit board substrate being disposed, big or small electronic devices and components, solder alloy are taken out.
Advantage of the present invention is mainly reflected in:
1, the present invention processes continuously to circuit board batch, has solved the drawback that can only singlely process, and in closed system, has completed completely, has the features such as separative efficiency is high, processing speed fast, separation is thorough, environmentally safe.
2, the steel wire of system of the present invention by gearing friction and transmission analyzing system and knife plate combine to make electronic devices and components in the situation that of solder fusing, make scolder and electronic devices and components separated with circuit board substrate, and by electronic devices and components initial gross separation by size, the circuit board effect of power and vibrations that is not hit in this process, this has just guaranteed that circuit board substrate can not cause breakage, thereby does not affect the later stage recycling to circuit board substrate.
Accompanying drawing explanation
Fig. 1 is the main TV structure schematic diagram of the present invention.
Fig. 2 is agent structure left view of the present invention.
Fig. 3 a, Fig. 3 b are front view, the left view that short chain of the present invention divides dismantling device.
Fig. 4 is the front view of the auxiliary dismantling device of long-chain of the present invention.
Fig. 5 a, Fig. 5 b are front view and the left view of tilting vibrating screen of the present invention.
Number in the figure: 101 conveying oralias, 102 electric-heating-wire-heating pipes, 103 airflow regulating switch, 104 air-blast devices, 105 temperature controllers, 106 limiting plate hairbrush, 107 short chain transmissions divide dismantling device, the auxiliary dismantling device of 108 long-chain transmission, 109 circuit board substrate baffle plates, 110 asepwirator pumps, 111 pernicious gas treatment boxes, 112 circuit board substrate collection boxes, 113 solder alloy collection boxes, 114 tilting vibrations mesh screens, 115 electronic devices and components baffle plates, 116 side shutter door, 201 small size components and parts collection boxes, 202 large scale components and parts collection boxes, 301 first driven shafts, 302 transmission base band, 303 steel wires, 304 knife plates, 305 first driving shafts, 306 first motor, 307 spring nets, 308 draw-in grooves, 401 second driven shafts, 402 steel wire grids, 403 second driving shafts, 404 protruding pins, 405 second motor, 501 vibrating motors, mesh screen on 502, 503 times mesh screens.
The specific embodiment
According to accompanying drawing, the present invention will be described below.
Fig. 1 is the overall structure front view of whole system, the top of system casing is the air blowing heating device consisting of 102 electric-heating-wire-heating pipes, 103 airflow regulating switch, 104 air-blast devices, 105 temperature controllers, the wind blasting is heated to temperature required in electric-heating-wire-heating pipe 102, then blow on waste and old circuit board scolder is heated, temperature controller 105 regulates temperature by controlling current of electric heating wire size, and adjustable range is 150 ℃～350 ℃.The side of casing can be opened, and facilitates the assembling of equipment and the recovery that circuit board is processed rear each component.
By temperature, regulate, the hot blast temperature that makes to blow on circuit board reaches solder fusing point, and the scolder after fusing drips from substrate under gravity and wind power double action, through tilting vibrating screen 114, falls into solder alloy collection box 113.Meanwhile, the larger electronic devices and components of part are understood oneself to come off and are fallen on tilting vibrating screen 114 under gravity and wind-force effect, and then shake off in the electronic devices and components collection box of system sidewall.
Remaining electronic devices and components and the solder alloy not coming off through gravity and wind-force effect, after solder fusing with substrate to be connected power very little, when being transferred to short chain transmission and dividing dismantling device 107, under the effect of drawn steel wire 303, knife plate and sliding friction, depart from completely with substrate, thereby come off, reclaimed.
Waste and old circuit board through heating in processing procedure can discharge some toxic gases because being heated, as bioxin, and dibrom furan etc.Under the power of blowing of air-blast device gas and the suction of asepwirator pump, by asepwirator pump and pipeline, enter pernicious gas treatment box 111, treated rear discharge up to standard.
Fig. 2 is agent structure left view of the present invention, and two processing lines that can simultaneously carry out, inner symmetrical installation, are designed to V-type, realize circuit board is processed in batches continuously, raise the efficiency; Be symmetrical arranged and respectively have to become with horizontal plane the adjustable auxiliary dismantling device of long-chain transmission in 30-45 degree inclination angle and short chain transmission to divide each two of dismantling devices, article two, short chain transmission divides 107 one-tenth V-shapes arrangements of dismantling device and middle gapped, article two, 108 one-tenth V-shapes of the auxiliary dismantling device of long-chain transmission are settled and are middle gapped, article two, short chain transmission divides dismantling device 107 and two auxiliary dismantling devices 108 of long-chain transmission to be arranged symmetrically with respectively, and short chain transmission divides dismantling device 107 be arranged on the top of the auxiliary dismantling device 108 of long-chain transmission and be positioned at the one end away from conveying oralia; Each side all comprises short chain transmission and divides dismantling device, the auxiliary dismantling device of long-chain transmission, design 30-45 degree adjustable inclination angle, can make the heating tube mouth of pipe directly aim at scolder leg place, even if high-temperature hot-air acts directly on scolder leg place, reduce components and parts stopping high-temperature hot-air, improve melting rate, by wind-force, the scolder of fusing and part components and parts are blown off; Meanwhile, inclination angle is beneficial to components and parts and drops under self gravitation.
The tilting vibrating screen of below consists of upper screen cloth 502 and lower screen cloth 503 and vibrating motor 501, tilts and vibration object is in order to remove faster the electronic devices and components that drop when the operation, to prevent from piling up, being beneficial to scolder rear drippage separated with components and parts.Upper and lower two-layer is for the larger and less components and parts of initial gross separation, is convenient to follow-up recycling, and 201 and 202 are respectively reduced size electronic devices and components and large-size components and parts collection box, and 113 is solder alloy collection box.
Fig. 3 a and Fig. 3 (b) are structural front view and the left view that short chain transmission of the present invention divides dismantling device 107, drawn steel wire 303 and knife plate 304 are fixed in transmission base band 302 at certain intervals by draw-in groove 308, article three, one, steel wire interval knife plate, steel wire and steel wire and steel wire and knife plate spacing distance are 2cm.During work, when moving to short chain transmission, circuit board divides dismantling device place, effect by drawn steel wire 303 makes components and parts breaking circuit plate, being close to components and parts and the solder alloy of substrate pulls down by the effect of knife plate 304, wherein knife plate inner side arranges spring net 307, can make knife plate have certain activity displacement, unlikely damage circuit board substrate.
Fig. 4 is the front view of the auxiliary dismantling device 108 of long-chain transmission of the present invention, mainly by steel wire grid 402 and embedding protruding pin 404 thereon, formed, during system operation, circuit board is placed on steel wire grid, projection and driving-chain mesh by means of the electronic original part reverse side on circuit board can block circuit board fixing under rubbing action; It is that anti-skidding, is beneficial to the dismounting of components and parts and scolder for better fixing pending circuit board that protruding pin 404 is set.
Fig. 5 a and Fig. 5 (b) are tilting vibrating screen main body view of the present invention and left view, mesh screen is designed to oscillatory type, and become angle of inclination, be convenient to the disengaging of components and parts and scolder, can fast components and parts be removed simultaneously, prevent from piling up the drippage of components and parts and scolder after so just can not stopping; Upper mesh screen wants large in lower mesh screen overall dimensions, and upper mesh screen 502 mesh are greater than the mesh of lower mesh screen 503, is beneficial to big or small electronic devices and components initial gross separation, is collected in respectively near in the collection box 202 and 201 of system casing.
The course of work:
1, open heating power supply to electric-heating-wire-heating, adjust the temperature to 200 ℃-220 ℃, open air-blast device, unlatching vibrating motor 501 and long-chain transmit 108, two fractionation lines of auxiliary dismantling device and together move; Then open asepwirator pump 110; Waste and old circuit board is placed on long-chain and enters conveying mouth, open short chain transmission and divide dismantling device 107;
2, the transmission of waste and old circuit board by long-chain is below heating tube in moving process, melts soldering tin, under wind-force and self gravitation effect, scolder and the portions of electronics components and parts of fusing come off, the separated recovery of tilting vibrating screen through below, size components and parts fall into collection box from both sides, and scolder falls into scolder collection box by mesh screen mesh; When circuit board continues slowly to move to short chain transmission and divides dismantling device 107, by friction and the scraping of steel wire and knife plate of two chains, draw, remaining electronic devices and components and scolder breaking circuit plate are able to thoroughly split and reclaim;
3, the circuit board substrate of dismounting electronic devices and components and scolder enters substrate recovery zone under the effect of circuit board substrate recovery baffle plate 109, while sticking to electronic devices and components on conveyer chain and scolder through baffle plate 115 and hairbrush 106, scraped, thereby do not affected follow-up work;
4, after waste and old circuit board processing is in batches finished, first disconnecting electric-heating-wire-heating device, mesh screen vibrating motor 501, short chain transmission divides dismantling device 107, long-chain to transmit the power supply of auxiliary dismantling device 108, cut off again afterwards air blast and asepwirator pump 110 power supplys, after internal system cooling, open side shutter door 116, the waste and old circuit board substrate being disposed, big or small electronic devices and components, solder alloy are taken out;
5, after the waste and old circuit board substrate processed is cooling, can carry out post-processed operation.
Claims (3)
1. based on waste and old circuit board, break continuously and reclaim the system of electronic devices and components and scolder, it is characterized in that: the device housings that comprises band conveying oralia (101), electric-heating-wire-heating pipe (102), airflow regulating switch (103), air-blast device (104), temperature controller (105), limiting plate and hairbrush (106), short chain transmission divides dismantling device (107), the auxiliary dismantling device of long-chain transmission (108), circuit board substrate reclaims baffle plate (109), circuit board substrate collection box (112), scolder collection box (113), tilting vibrating screen (114), electronic devices and components baffle plate (115), side shutter door (116), small size components and parts collection box (201) and large scale components and parts collection box (202),
System ontology is comprised of shell, conveying oralia (101) and the side shutter door (116) that is positioned at shell side, forms an obturator, the air-blast device (104) of described system equipment conveying oralia one side roof part, temperature controller (105) and electric-heating-wire-heating pipe (102) are connected, and have formed the heater of system to circuit board, and install heating tube symmetrical expression both sides, below heater, be symmetrical arranged and respectively have to become with horizontal plane the adjustable auxiliary dismantling device of long-chain transmission (108) in 30-45 degree inclination angle and short chain transmission to divide each two of dismantling devices (107), article two, short chain transmission divides dismantling device (107) to become V-shape arrangement and middle gapped, article two, the auxiliary dismantling device of long-chain transmission (108) becomes V-shape arrangement and middle gapped, article two, short chain transmission divides dismantling device (107) and two auxiliary dismantling devices of long-chain transmission (108) to be arranged symmetrically with respectively, short chain transmission divides dismantling device (107) be arranged on the top of the auxiliary dismantling device of long-chain transmission (108) and be positioned at the one end away from conveying oralia, in short chain transmission, divide nearly heating tube one side of dismantling device (107) that limiting plate and hairbrush (106) are set, at the auxiliary dismantling device of long-chain transmission (108), away from the end of conveying oralia, be provided with tilted-putted circuit board and reclaim baffle plate (109), for by the waste and old circuit board from removing electronic devices and components every substrate from circuit board substrate collection box (112), long-chain transmit auxiliary dismantling device (108) under be provided with 20-30 degree degree of tilt angle lapping inclined vibrating screen (114), by vibrating motor (501), produce vibration, by mesh screen sizes and sieve aperture specification, be set to upper and lower mesh screen, described tilting vibrating screen (114) becomes herringbone design, upper mesh is large, lower mesh is little, the electronic devices and components that come off with separation and solder alloy, electronic devices and components sieve by size in small size components and parts collection box (201) and large scale components and parts collection box (202), and solder alloy sieves in the scolder collection box (113) of dropping into bottom, on device housings, be also provided with pernicious gas exhaust tube, by asepwirator pump, access harmful gas treatment case.
2. according to claim 1ly based on waste and old circuit board, break continuously and reclaim the system of electronic devices and components and scolder; it is characterized in that: the auxiliary dismantling device of long-chain transmission (108) forward transmission, comprises stainless steel steel wire grid (402) and be embedded in the protruding pin (404) on grid; Short chain transmission divides dismantling device (107) forward transmission, and transmission speed is greater than the biography speed of the auxiliary dismantling device of long-chain transmission; Draw-in groove (308), component disassembling steel wire (303), components and parts and scolder are installed on it and remove knife plate (304) and spring net (307), wherein steel wire (303) and knife plate (304) parallel interval setting, and perpendicular to short chain transmission, divide dismantling device (107) transmission direction, knife plate (304) top arranges spring net (307).
3. utilize and based on the waste and old circuit board system that reclaims electronic devices and components and scolder that breaks continuously, carry out separated method described in claim 1, it is characterized in that:
The step adopting is as follows:
A, unlatching heating power supply, to electric-heating-wire-heating, adjust the temperature to 200 ℃-220 ℃, open air-blast device, open vibrating motor (501) and long-chain and transmit auxiliary dismantling device (108), and two split lines and together move; Then open asepwirator pump (110); Waste and old circuit board is placed on long-chain and enters conveying mouth, open short chain transmission and divide dismantling device (107);
B, the waste and old circuit board transmission by long-chain is below heating tube in moving process, melts soldering tin, under wind-force and self gravitation effect, scolder and the portions of electronics components and parts of fusing come off, the separated recovery of tilting vibrating screen through below, size components and parts fall into collection box from both sides, and scolder falls into scolder collection box by mesh screen mesh; When circuit board continues to move to short chain transmission and divides dismantling device (107), by friction and the drawing of steel wire and knife plate of two chains, to scrape, remaining electronic devices and components and scolder breaking circuit plate are split recovery;
C, the circuit board substrate of removing electronic devices and components and scolder reclaim at circuit board substrate under the effect of baffle plate (109) and enter substrate recovery zone, while sticking to electronic devices and components on conveyer chain and scolder through baffle plate (115) and hairbrush (106), are scraped;
D, waste and old circuit board processing is in batches finished after, first disconnecting electric-heating-wire-heating device, mesh screen vibrating motor (501), short chain transmission divides dismantling device (107), long-chain to transmit the power supply of auxiliary dismantling device (108), cut off again afterwards air blast and asepwirator pump (110) power supply, after internal system cooling, open side shutter door (116), the waste and old circuit board substrate being disposed, big or small electronic devices and components and solder alloy are taken out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310432814.8A CN103658903B (en) | 2013-09-22 | 2013-09-22 | Break continuously based on waste and old circuit board and reclaim the system of electronic devices and components and solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310432814.8A CN103658903B (en) | 2013-09-22 | 2013-09-22 | Break continuously based on waste and old circuit board and reclaim the system of electronic devices and components and solder |
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| Publication Number | Publication Date |
|---|---|
| CN103658903A true CN103658903A (en) | 2014-03-26 |
| CN103658903B CN103658903B (en) | 2015-08-26 |
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| CN201310432814.8A Active CN103658903B (en) | 2013-09-22 | 2013-09-22 | Break continuously based on waste and old circuit board and reclaim the system of electronic devices and components and solder |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104307853A (en) * | 2014-10-30 | 2015-01-28 | 四会市丰裕塑胶有限公司 | Electronic waste recovery device |
| CN105772480A (en) * | 2014-12-22 | 2016-07-20 | Tcl奥博（天津）环保发展有限公司 | Environment-friendly circuit board disassembly treatment equipment |
| CN105813395A (en) * | 2014-12-29 | 2016-07-27 | 鸿富锦精密电子(郑州)有限公司 | Material removing equipment |
| CN106270887A (en) * | 2015-05-26 | 2017-01-04 | 富泰华工业（深圳）有限公司 | Electronic component disassembling apparatus |
| CN106672622A (en) * | 2016-12-25 | 2017-05-17 | 中山市恒辉自动化科技有限公司 | Moving type electronic product recovery and reaction equipment |
| CN107716514A (en) * | 2017-10-30 | 2018-02-23 | 仁新设备制造（四川）有限公司 | For circuit board component detin equipment |
| CN108746151A (en) * | 2018-05-20 | 2018-11-06 | 苏州沃森优金电子科技有限公司 | A kind of disassembling apparatus of electronic component |
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| CN106270887A (en) * | 2015-05-26 | 2017-01-04 | 富泰华工业（深圳）有限公司 | Electronic component disassembling apparatus |
| CN106672622A (en) * | 2016-12-25 | 2017-05-17 | 中山市恒辉自动化科技有限公司 | Moving type electronic product recovery and reaction equipment |
| CN106672622B (en) * | 2016-12-25 | 2018-10-26 | 中山市恒辉自动化科技有限公司 | A kind of flow-type electronic product recycling consersion unit |
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| CN107716514B (en) * | 2017-10-30 | 2024-03-08 | 仁新设备制造（四川）有限公司 | De-tin equipment for circuit board components |
| CN108746151A (en) * | 2018-05-20 | 2018-11-06 | 苏州沃森优金电子科技有限公司 | A kind of disassembling apparatus of electronic component |
| CN110328220A (en) * | 2019-08-09 | 2019-10-15 | 刘鸿生 | A kind of waste computer circuit board feature processing unit |
| CN111530888A (en) * | 2020-05-07 | 2020-08-14 | 中国矿业大学 | Device and method for recycling components of waste circuit board |
| CN111607768A (en) * | 2020-06-08 | 2020-09-01 | 福建阿石创新材料股份有限公司 | Planar target material unbinding device and method |
| CN113414563A (en) * | 2021-07-16 | 2021-09-21 | 重庆航天职业技术学院 | Computer CPU's dismantlement equipment |
| CN113414563B (en) * | 2021-07-16 | 2022-07-05 | 重庆航天职业技术学院 | Computer CPU's dismantlement equipment |
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