CN103646901B - 焊臂结构 - Google Patents

焊臂结构 Download PDF

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Publication number
CN103646901B
CN103646901B CN201310539655.1A CN201310539655A CN103646901B CN 103646901 B CN103646901 B CN 103646901B CN 201310539655 A CN201310539655 A CN 201310539655A CN 103646901 B CN103646901 B CN 103646901B
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arm
weldering
sliding block
wafer
lever arm
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CN103646901A (zh
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区大公
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CATHAY ROBOTICS Corp Ltd
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CATHAY ROBOTICS Corp Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明适用于半导体固晶技术领域。本发明公开一种焊臂结构，与焊臂连接座固定的焊臂支座，在该焊臂支座的端部设有滑块和使滑块上下滑动的气缸，该滑块设有杠杆臂和晶圆吸嘴，设有收纳空腔的托臂与焊臂支座连接，该收纳空腔内设有与控制模块连接的压力传感器，在该托臂与杠杆臂之间设有复位弹簧。工作时，由所述压力传感器适时将杠杆臂与托臂之间的压力反馈给控制模块，并控制气缸控制晶圆吸嘴的位置。由于该托臂与焊臂支架固定，杠杆臂与晶圆吸嘴都固定在滑块上同步移动，可以避免在压力较大时键合损坏晶圆，提高焊臂与晶圆夹持的稳定性和可靠性。

Description

焊臂结构
技术领域
本发明涉及半导体固晶技术领域，特别涉及一种固晶机用焊臂结构。
背景技术
半导体固晶装置在进行作时需要将固晶用的物料通过上料装置输送至相应位置后，由机械手将晶体，如LED晶圆移动到基板对应位置进行固定。
现有的半导体固晶装置焊臂将晶圆与基板之间键合时无法精确地控制键合压力，造成部分晶圆损坏，因而键合的稳定性和可靠性不高。
发明内容
本发明主要解决的技术问题是提供一种焊臂结构，该焊臂结构可以避免键合时压坏晶圆，提高晶圆键合的稳定性和可靠性。
为了解决上述问题，本发明提供一种焊臂结构，该焊臂结构包括与焊臂连接座固定的焊臂支座，在该焊臂支座的端部设有滑块和使滑块上下滑动的气缸，该滑块设有杠杆臂和晶圆吸嘴，设有收纳空腔的托臂与焊臂支座连接，该收纳空腔内设有与控制模块连接的压力传感器，在该托臂与杠杆臂之间设有复位弹簧。
进一步地说，所述杠杆臂上设有销钉，所述复位弹簧套设于该销钉之上。
进一步地说，所述杠杆臂上还设有接触螺钉，该接触螺钉一端与压力传感器配合。
本发明焊臂结构，包括与焊臂连接座固定的焊臂支座，在该焊臂支座的端部设有滑块和使滑块上下滑动的气缸，该滑块设有杠杆臂和晶圆吸嘴，设有收纳空腔的托臂与焊臂支座连接，该收纳空腔内设有与控制模块连接的压力传感器，在该托臂与杠杆臂之间设有复位弹簧。工作时，由所述压力传感器适时将杠杆臂与托臂之间的压力反馈给控制模块，并控制气缸控制晶圆吸嘴的位置。由于该托臂与焊臂支架固定，杠杆臂与晶圆吸嘴都固定在滑块上同步移动，可以避免在压力较大时键合损坏晶圆，提高焊臂与晶圆夹持的稳定性和可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，而描述中的附图是本发明的一些实施例，对于本领域普通技术人员来说，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图。
图1是本发明焊臂结构实施例结构示意图。
图2是本发明焊臂结构分解结构示意图。
下面结合实施例，并参照附图，对本发明目的的实现、功能特点及优点作进一步说明。
具体实施方式
为了使发明的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1和图2所示，本发明提供一种焊臂结构实施例。
该焊臂结构包括：与焊臂连接座固定的焊臂支座31，在该焊臂支座31的端部设有滑块30和使滑块30上下滑动的气缸33，该滑块30设有杠杆臂34和晶圆吸嘴32，设有收纳空腔371的托臂37与焊臂支座31连接，该收纳空腔371内设有与控制模块连接的压力传感器36，在该托臂37与杠杆臂34之间设有复位弹簧38。
具体地说，所述杠杆臂34上设有销钉，所述复位弹簧38套设于该销钉之上，便于对复位弹簧38固定和限位。所述杠杆臂34上还设有接触螺钉35，该接触螺钉35一端与压力传感器36配合，调节压力传感器36的输出的压力数据。
工作时，由所述压力传感器36适时将杠杆臂34与托臂37之间的压力反馈给控制模块，并通过气缸33控制晶圆吸嘴32的位置。由于该托臂37与焊臂支架31固定，杠杆臂34与晶圆吸嘴32都固定在滑块30上同步移动，可以避免在压力较大时键合损坏晶圆，提高焊臂与晶圆夹持的稳定性和可靠性。
以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，而这些修改或替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (1)

1.焊臂结构，包括与焊臂连接座固定的焊臂支座，其特征在于：
在该焊臂支座的端部设有滑块和使滑块上下滑动的气缸，该滑块设有杠杆臂和晶圆吸嘴，设有收纳空腔的托臂与焊臂支座连接，该收纳空腔内设有与控制模块连接的压力传感器，在该托臂与杠杆臂之间设有复位弹簧，所述杠杆臂上还设有接触螺钉，该接触螺钉一端与压力传感器配合，所述杠杆臂上设有销钉，所述复位弹簧套设于该销钉之上。
CN201310539655.1A 2013-10-25 2013-10-25 焊臂结构 Expired - Fee Related CN103646901B (zh)

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Publication number Priority date Publication date Assignee Title
CN110504206A (zh) * 2019-09-26 2019-11-26 先进光电器材（深圳）有限公司 一种led固晶机吸取装置
CN111312651B (zh) * 2020-02-28 2020-10-13 深圳新益昌科技股份有限公司 固晶摆臂***及固晶机
CN113753512B (zh) * 2021-09-13 2022-07-29 深圳市标谱半导体科技有限公司 补料装置及装带机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101664932A (zh) * 2009-09-23 2010-03-10 清华大学 一种机械臂
CN102173345A (zh) * 2011-02-25 2011-09-07 华中科技大学 一种气动直线驱动的芯片拾取与翻转装置
CN203536388U (zh) * 2013-10-25 2014-04-09 深圳市恒睿智达科技有限公司 新型焊臂结构

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US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101664932A (zh) * 2009-09-23 2010-03-10 清华大学 一种机械臂
CN102173345A (zh) * 2011-02-25 2011-09-07 华中科技大学 一种气动直线驱动的芯片拾取与翻转装置
CN203536388U (zh) * 2013-10-25 2014-04-09 深圳市恒睿智达科技有限公司 新型焊臂结构

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