CN103646839A

CN103646839A - Metal net for bearing and fixing TEM sample

Info

Publication number: CN103646839A
Application number: CN201310554617.3A
Authority: CN
Inventors: 史燕萍
Original assignee: Shanghai Huali Microelectronics Corp
Current assignee: Shanghai Huali Microelectronics Corp
Priority date: 2013-11-08
Filing date: 2013-11-08
Publication date: 2014-03-19

Abstract

The invention relates to a metal net for bearing and fixing a TEM sample. The bottom part of the metal net is an arc which is bent downwards. The top part of the metal net is provided with a plurality of grooves. The side wall of each groove is provided with a plurality of steps distributed in a ladder pattern and the steps extend along the side walls of the grooves towards the inner part of the grooves to the bottom parts of the grooves. In the metal net for bearing and fixing the TEM sample, part of the sample fixing and bearing metal net, which is used for fixing and bearing the sample, in a TEM sample preparation process is arranged into a ladder-pattern step structure so that a plurality of samples can be placed all at once for TEM observation; and the samples can be pasted on the upper surfaces of the steps and possibility of fall-off is reduced compared to that when the samples are pasted on the sides faces of the steps; moreover, the design of the ladder-pattern step structure enables sample loss probability to be reduced when the pasted samples fall.

Description

Carrying and the fixedly wire netting of TEM sample

Technical field

The present invention relates to the auxiliary implement in a kind of semiconductor preparing process, relate in particular to a kind of carrying and the fixing wire netting of TEM sample.

Background technology

Development along with semiconductor technology, the size of semiconductor device is proportional dwindling progressively, its critical size becomes more and more less, gradually from 90nm to 45nm again to 28nm, for the more and more less semiconductor device of critical size, conventionally adopt FIB(to focus on beam-plasma) and Omniprobe(nanomanipulators) prepare TEM(transmission electron microscope) sample, because coordinate FIB to carry out sample preparation with Omniprobe, can reach extraordinary effect, it is very thin to be that sample can be made, and substantially can meet the morphology analysis of TEM observation critical size.

In Chinese patent (CN 101644642A) and United States Patent (USP) (NO.6420722), all recorded the method for carrying out in-situ sampling in FIB, this in-situ sampling technology is that a series of FIB grind and sample moves step, for generation of the concrete sample relevant to position, for carrying out observation subsequently at TEM or other analytical instrument.In position in sampling process, the material sample that comprises area-of-interest (normally wedge shape) first by the ion beam process of lapping in FIB from piece sample as separated completely semiconductor wafer or mould.Then with inner nano-controller, be combined with ion beam assisted chemical vapor deposition technique and sample the removal of sample, this CVD technique can obtain with FIB instrument.The suitable effector system of receiving is Omniprobe Inc., manufacture.Then TEM specimen holder is positioned in the visual field of FIB, and makes to sample with nano-controller the edge that sample drops to specimen holder.Then with the CVD metal deposition in FIB vacuum chamber, sample is fixed on TEM specimen holder.Once sample is connected on this TEM specimen holder, probe tip just grinds and sample separation by ion.Then can use traditional FIB grinding steps to grind sample, to prepare out a thin region, for carrying out TEM check or other analyses.

Due to, sample is carried out to TEM observation and need to carry out corresponding support and fixing to sample, conventionally sample can be fixed on to Grid(copper mesh) on.Concrete method is to find position plating Pt(platinum the most outstanding on copper mesh 101 trenched side-walls), to adhere to sample 102, as shown in Figure 1.But the copper mesh using at present can, because the degree of roughness of its edge surface is undesirable, be bonded at sample on copper mesh so more difficult, thereby cause further preparing TEM sample conventionally.

In addition, may be inadequate due to the amount in platinum plating, after also there will be sample to be fixed on copper mesh, its adhesion time is not long, situation about dropping in technical process.Will cause the loss of sample like this, and then technique can not normally be completed, cause upper waste of time.

Summary of the invention

In view of the above problems, the invention provides a kind of carrying and the fixing wire netting of TEM sample.

The technical scheme that technical solution problem of the present invention adopts is:

Carrying and fixedly a wire netting for TEM sample, wherein, the bottom of described wire netting is reclinate arc, the top of described wire netting is provided with some grooves;

Described in each, the sidewall of groove is provided with the step of some stepped distributions, and described step extends until the bottom of described groove in along the sidewall of described groove to groove gradually.

Described carrying and the fixedly wire netting of TEM sample, wherein, described in each, the upper surface of step and side surface are plane.

Described carrying and the fixedly wire netting of TEM sample, wherein, the angle that described in each, the upper surface of step and side surface are is right angle.

Described carrying and the fixedly wire netting of TEM sample, wherein, described in each, the upper surface of step is for being horizontally disposed with, and described in each, the side surface of step is vertically to arrange.

Described carrying and the fixedly wire netting of TEM sample, wherein, described in each, the height of step is greater than length, width and the height of described TEM sample.

Described carrying and the fixedly wire netting of TEM sample, wherein, described in each, the length of step is greater than length, width and the height of described TEM sample.

Described carrying and the fixedly wire netting of TEM sample, wherein, the material of described wire netting is copper.

Described carrying and the fixedly wire netting of TEM sample, wherein, the middle part of described wire netting is provided with the hollow out of rectangle.

Technique scheme tool has the following advantages or beneficial effect:

The present invention is arranged to stair-stepping ledge structure by the part for the wire netting fixed sample of fixing and carrying sample in TEM sample preparation technique, makes to place once a plurality of samples to carry out TEM observation; Sample can glue that to be put in the upper surface (being horizontal plane) of step upper in addition, with respect to sticky be put on side surface for, reduced the possibility coming off; In addition, the design of stepped ledge structure of the present invention, can be so that when the sticky sample of putting drops, reduce the probability that sample is lost.

Accompanying drawing explanation

With reference to appended accompanying drawing, to describe more fully embodiments of the invention.Yet appended accompanying drawing only, for explanation and elaboration, does not form limitation of the scope of the invention.

Fig. 1 is the sticky structural representation of putting TEM sample on existing copper ring;

Fig. 2 is the structural representation of wire netting in the embodiment of the present invention;

Fig. 3 is the structure for amplifying schematic diagram of groove structure in wire netting in the embodiment of the present invention;

Fig. 4 glues setting-out product to carry out structural representation prepared by planar sample on wire netting in the embodiment of the present invention;

Fig. 5 is the structural representation that in the embodiment of the present invention, sticky setting-out product carry out section sample preparation on wire netting.

Embodiment

The invention provides a kind of carrying and the fixing wire netting of TEM sample, be applied in the preparation technology of TEM sample, be particularly useful for adopting Omniprobe to receive in the TEM sample preparation technique that control system carries out.Can be used for technology node is be more than or equal to 130nm, 90nm, 65/55nm, 45/40nm, 32nm/28nm or be less than or equal in the technique of 22nm etc.; Can be used in the technology platforms such as Logic, Memory, RF, HV, Analog/Power, MEMS, CIS, Flash, eFlash, Package.

Main thought of the present invention is by the structure of the copper mesh using in existing TEM sample preparation technique is improved, the surface texture of using it for adhesion sample becomes stepped, make sample can be adhered to stair-stepping ledge surface, thereby complete paired samples is fixing.

Below in conjunction with specific embodiments and the drawings to carrying of the present invention and fixedly the wire netting of TEM sample be elaborated.

Fig. 2 is carrying and the fixing structural representation of TEM sample wire netting in the embodiment of the present invention; As shown in Figure 2, the whole semicircular in shape of wire netting, wherein the bottom of wire netting is the arc in semicircle, on the top of wire netting, being provided with in some groove 201(figure is 2), the edge of these grooves is used for adhering to TEM sample, sample is carried out to follow-up further preparation.

Fig. 3 is to structural representation after the amplification of the groove structure in Fig. 1; As shown in Figure 3, distribution for the ease of step-like surface, trenched side-wall is curved, surface at the trenched side-wall of these arcs is distributed with several stepped steps from top to bottom, wherein, the upper surface 301 of each step is horizontal plane, and side surface 302 is vertical surface, and the angle of this side surface 302 and upper surface 301 is 90 °.In these some steps, the height of every grade of step (distance of extending on the vertical direction of step) can be set as identically also can being set as difference, equally, the degree of depth of every grade of step (distance of extending in step horizontal direction) also can be set as identical or different.Although above-mentioned height and the degree of depth can be set to identical also can be set to different, but must guarantee when sample adheres to, a face that sample need to be able to be adhered to adheres to the surface (upper surface or side surface) of step completely, that is to say, sample while adhering to step surperficial, can not occur having in the surface being adhered to of sample subregion not with the situation of the surface adhesion of step, because may cause like this not exclusively fixing of sample, and the risk that increase sample comes off, so the size for sample is different, the degree of depth that slot wedge in wire netting of the present invention is topped bar and highly can suitably adjusting.

When sample is adhered on wire netting of the present invention, can need per sample the section difference being thinned to be divided into several modes of emplacements, in Fig. 4, illustrated the sticky position of putting of sample while preparing planar sample, two samples in figure are all wedge shape, for the ease of distinguishing, it is defined as respectively to the first sample 401 and the second sample 402, this first sample 401 and the second sample 402 all adhere to the upper surface of wire netting step of the present invention, the first sample 401 and the second sample 402 are carried out to such adhesion, so that the plane (411 to the first sample and the second sample, 421) be prepared.In Fig. 5, illustrated the sticky position of putting of sample while preparing section sample, sample in figure is all wedge shape, be respectively the 3rd sample 503 and the 4th sample 504, wherein the 3rd sample 503 adheres to the upper surface of wire netting step of the present invention, the 4th sample 504 adheres to the side surface of wire netting step of the present invention, so that the section of the 3rd sample 531 and the 4th sample 541 is prepared.

By Fig. 4 and Fig. 5, can find out, while adopting wire netting of the present invention to adhere to sample, because sample adhesion place is step-like structure, so even sample does not adhere to the surface of step completely when adhering to, after coming off, can drop on next stage or stage further step, can't cause sample landing after coming off to other places.In addition, by this stair-stepping ledge structure, can on different steps, place sample, thereby make to meet sticky sample and mutual impregnable requirement of putting different TEM observation requirements simultaneously simultaneously.

For above-mentioned wire netting of the present invention, can adopt by different metals and make, but preferably can adopt copper.

In sum, the wire netting of the present invention's carrying and fixedly TEM sample is by being arranged to trenched side-wall stair-stepping ledge structure, so that can place a plurality of samples when sticky setting-out product simultaneously, and when sample is sticky while putting insecure coming off, can take advantage of a situation and drop on subordinate's step, thereby reduce the possibility that sample is lost.For a person skilled in the art, read after above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Within the scope of claims, scope and the content of any and all equivalences, all should think and still belong to the intent and scope of the invention.

Claims

1. carrying and fixedly a wire netting for TEM sample, is characterized in that, the bottom of described wire netting is reclinate arc, and the top of described wire netting is provided with some grooves;

2. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, described in each, the upper surface of step and side surface are plane.

3. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, the angle that described in each, the upper surface of step and side surface are is right angle.

4. carrying as claimed in claim 3 and the fixedly wire netting of TEM sample, is characterized in that, described in each, the upper surface of step is for being horizontally disposed with, and described in each, the side surface of step is vertically to arrange.

5. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, described in each, the height of step is greater than length, width and the height of described TEM sample.

6. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, described in each, the length of step is greater than length, width and the height of described TEM sample.

7. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, the material of described wire netting is copper.

8. carrying as claimed in claim 1 and the fixedly wire netting of TEM sample, is characterized in that, the middle part of described wire netting is provided with the hollow out of rectangle.