CN103645003A - Pressure sensor chip bonding structure - Google Patents
Pressure sensor chip bonding structure Download PDFInfo
- Publication number
- CN103645003A CN103645003A CN201310617970.1A CN201310617970A CN103645003A CN 103645003 A CN103645003 A CN 103645003A CN 201310617970 A CN201310617970 A CN 201310617970A CN 103645003 A CN103645003 A CN 103645003A
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- nation
- pressure sensor
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a pressure sensor chip bonding structure comprising a substrate (1), a chip (2) and a bonding wire. The substrate (1) is provided with a groove. The chip (2) is installed in the groove of the substrate (1). One end of the bonding wire is connected with the chip (2), and the other end is connected with the substrate (1) so that height difference between upper surfaces of the chip (2) and the substrate (1) is reduced. When the bonding wire is connected with the chip (2) and the substrate (1), the bonding wire is short in stroke and small in bending degree so that reliability in connection of the bonding wire is enhanced and the service life of a sensor is increased.
Description
Technical field
The invention belongs to pressure sensor technique field, relate in particular to a kind of pressure sensor chip nation fixed structure.
Background technology
Conventional pressure sensor chip is directly connected on substrate by glue, and nation's alignment is connected to substrate from sensor upper surface again, and chip upper surface is higher than upper surface of base plate, nation's alignment stroke is long, flexibility is large, cause nation's alignment to connect unreliable, easily fracture, causes sensor life-time low.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of nation alignment and connects reliable, high pressure sensor chip nation fixed structure of life-span.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of pressure sensor chip nation fixed structure, comprise substrate, chip and nation's alignment, described substrate is provided with groove, described chip is arranged in the groove of substrate, described nation's alignment one end is connected with chip, and the other end is connected with substrate.
The upper surface of described substrate is concordant with the upper surface of chip.
The periphery of described chip is connected by glue with the sidewall of the groove of substrate.
The upper surface of described glue is concordant with the upper surface of substrate.
The aluminum steel that described nation alignment is 1.0～2.0mil.
Described groove is provided with pore.
The invention has the advantages that, by chip being arranged in the groove of substrate, thereby reduce the height of chip upper surface, the difference in height of chip and upper surface of base plate is reduced, when nation's alignment connects chip and substrate, the stroke of nation's alignment is short, flexibility is little, thereby improves nation's alignment connection reliability, increases sensor serviceable life.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of pressure sensor chip of the present invention nation fixed structure;
Fig. 2 is prior art structural representation;
Mark in above-mentioned figure is: 1, substrate, 2, chip, 3, glue.
Embodiment
Fig. 1 is the structural representation of a kind of pressure sensor chip of the present invention nation fixed structure, comprises substrate 1, chip 2 and nation's alignment, and substrate 1 is provided with groove, and chip 2 is arranged in the groove of substrate 1, and nation's alignment one end is connected with chip 2, and the other end is connected with substrate 1.
The upper surface of substrate 1 is concordant with the upper surface of chip 2.When nation's alignment connection substrate 1 and chip 2 upper surface, nation's alignment stroke is short, and flexibility is little.
The sidewall of the periphery of chip 2 and the groove of substrate 1 is connected by glue 3.Increased the contact area of chip 2 with substrate 1, thereby improved the load-bearing capacity of chip 2, made chip 2 more stable work reliable.
The upper surface of glue 3 is concordant with the upper surface of substrate 1, makes substrate 1 surface more smooth, and structure is more stable.
Nation's alignment is the aluminum steel of 1.0mil.Groove is provided with pore.
Adopt after above-mentioned structure, by chip 2 being arranged in the groove of substrate 1, thereby reduce the height of chip 2 upper surfaces, the difference in height of chip 2 and substrate 1 upper surface is reduced, when nation's alignment connects chip 2 and substrate 1, the stroke of nation's alignment is short, flexibility is little, thereby improves nation's alignment connection reliability, increases sensor serviceable life.
By reference to the accompanying drawings the present invention is exemplarily described above; obviously specific implementation of the present invention is not subject to the restrictions described above; as long as adopted the improvement of the various unsubstantialities that method of the present invention design and technical scheme carry out; or without improving, design of the present invention and technical scheme are directly applied to other occasion, all within protection scope of the present invention.
Claims (6)
1.Yi Zhong pressure sensor chip nation fixed structure, comprise substrate (1), chip (2) and nation's alignment, it is characterized in that, described substrate (1) is provided with groove, described chip (2) is arranged in the groove of substrate (1), described nation's alignment one end is connected with chip (2), and the other end is connected with substrate (1).
2. pressure sensor chip as claimed in claim 1 nation fixed structure, is characterized in that, the upper surface of described substrate (1) is concordant with the upper surface of chip (2).
3. pressure sensor chip as claimed in claim 1 or 2 nation fixed structure, is characterized in that, the sidewall of the periphery of described chip (2) and the groove of substrate (1) is connected by glue (3).
4. pressure sensor chip as claimed in claim 3 nation fixed structure, is characterized in that, the upper surface of described glue (3) is concordant with the upper surface of substrate (1).
5. pressure sensor chip as claimed in claim 4 nation fixed structure, is characterized in that the aluminum steel that described nation alignment is 1.0～2.0mil.
6. pressure sensor chip as claimed in claim 5 nation fixed structure, is characterized in that, described groove is provided with pore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617970.1A CN103645003A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617970.1A CN103645003A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103645003A true CN103645003A (en) | 2014-03-19 |
Family
ID=50250255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310617970.1A Pending CN103645003A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103645003A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106017773A (en) * | 2016-05-06 | 2016-10-12 | 博艳萍 | Iron core assembly machine pressure sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050087020A1 (en) * | 2003-08-29 | 2005-04-28 | Fuji Electric Device Technology Co., Ltd. | Pressure sensor device and cell thereof |
| CN101922987A (en) * | 2010-07-15 | 2010-12-22 | 芜湖通和汽车管路***有限公司 | Intake manifold pressure sensor and manufacturing method thereof |
| CN202631181U (en) * | 2011-12-20 | 2012-12-26 | 东风襄樊仪表***有限公司 | Chip packaging base assembly |
| CN103063357A (en) * | 2011-10-20 | 2013-04-24 | 刘胜 | Gas pressure transmitter based on ceramic packaging |
| CN203178006U (en) * | 2013-04-11 | 2013-09-04 | 东莞市高晶电子科技有限公司 | Pressure transducer packaging structure |
-
2013
- 2013-11-27 CN CN201310617970.1A patent/CN103645003A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050087020A1 (en) * | 2003-08-29 | 2005-04-28 | Fuji Electric Device Technology Co., Ltd. | Pressure sensor device and cell thereof |
| CN101922987A (en) * | 2010-07-15 | 2010-12-22 | 芜湖通和汽车管路***有限公司 | Intake manifold pressure sensor and manufacturing method thereof |
| CN103063357A (en) * | 2011-10-20 | 2013-04-24 | 刘胜 | Gas pressure transmitter based on ceramic packaging |
| CN202631181U (en) * | 2011-12-20 | 2012-12-26 | 东风襄樊仪表***有限公司 | Chip packaging base assembly |
| CN203178006U (en) * | 2013-04-11 | 2013-09-04 | 东莞市高晶电子科技有限公司 | Pressure transducer packaging structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106017773A (en) * | 2016-05-06 | 2016-10-12 | 博艳萍 | Iron core assembly machine pressure sensor |
| CN106017773B (en) * | 2016-05-06 | 2018-10-30 | 林国章 | A kind of iron core assembly machine pressure inductor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2219220A3 (en) | Connection structure, power module and method of manufacturing the same | |
| EP2180532A3 (en) | Semiconductor light emitting device | |
| EP2372790A3 (en) | Light emitting diode, light emitting diode package, and lighting system | |
| CN103645003A (en) | Pressure sensor chip bonding structure | |
| CN203102850U (en) | Piezoelectric type buzzer | |
| CN205212174U (en) | Semiconductor laser packaging structure | |
| CN103646926B (en) | A kind of pressure sensor chip installation structure | |
| CN201829532U (en) | Paster LED bracket | |
| CN103456450A (en) | Novel potentiometer | |
| CN202373628U (en) | LED (Light Emitting Diode) encapsulating structure | |
| CN202347928U (en) | Glass door handle | |
| CN207068657U (en) | A kind of capacitor arrangement | |
| CN210234213U (en) | Composite environment-friendly natural stone | |
| CN204966533U (en) | High light efficiency COB base plate | |
| CN201842902U (en) | Hydrophobic polyamide monofilament | |
| CN102931563B (en) | A kind of automotive connector press fit device | |
| CN202156863U (en) | Escalator pedal reinforced rib | |
| CN202883352U (en) | Horizontal one-way valve for pulp | |
| CN203048353U (en) | Novel elevator guiding shoe | |
| CN202124991U (en) | Clerestory supporting mechanism for steel structure | |
| CN204415992U (en) | Rubber part case | |
| CN201077286Y (en) | Combined triangle | |
| CN203574937U (en) | PCB (printed circuit board) structure used in LED nixie tube | |
| CN204787991U (en) | Novel groove aluminium | |
| CN104555023A (en) | Rubber parts box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHU ZHITONG AUTOMOBILE ELECTRONICS CO., LTD. Free format text: FORMER OWNER: WUHU TONGHE AUTO PIPELINE SYSTEM CO., LTD. Effective date: 20150611 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150611 Address after: 8 A building, block 35, car electronics Pioneer Park, Hengshan Road, Wuhu economic and Technological Development Zone, Anhui 241009, China Applicant after: Wuhu causes the Electronics Co., Ltd. that is open to the traffic Address before: 241009 Hengshan Road economic and Technological Development Zone, Anhui, No. 26, Applicant before: Wuhu Tonhe Automobile Fluid System Co., Ltd. |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140319 |