CN103643269A - Process of ultrasonic wave electroplating of copper foil - Google Patents
Process of ultrasonic wave electroplating of copper foil Download PDFInfo
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- CN103643269A CN103643269A CN201310555466.3A CN201310555466A CN103643269A CN 103643269 A CN103643269 A CN 103643269A CN 201310555466 A CN201310555466 A CN 201310555466A CN 103643269 A CN103643269 A CN 103643269A
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- copper foil
- electroplating
- electroplate liquid
- ultrasonic wave
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Abstract
The invention discloses a process of ultrasonic wave electroplating of copper foil. An electroplating solution is prepared, and cerous oxalate is added into the electroplating solution; ultrasonic cleaning with deionized water is carried out before electroplating; during electroplating, the cathode current density is 2.5A/dm3; the electroplating solution is oscillated and stirred by ultrasonic wave of 700-1200 w and 20-35 KHz. The process of the invention adopts ultrasonic wave stirring, which increases the current density, reduces concentration polarization, improves brightness, enables easy escape of hydrogen at the cathode surface, reduces burrs and pin holes, and obtains an electroplating layer with finer and uniform crystal particles.
Description
Technical field
The present invention relates to a kind of electroplating technology, relate in particular to a kind of technique of electroplating in ultrasonic field Copper Foil.
Background technology
Zinc-plated have good weldability, solidity to corrosion and an oxidation-resistance, in electronic devices and components, uses extensively.Zinc-plated Copper Foil conducts electricity because of height, and shield effectiveness spy is good, non-oxidation, and the hold-time is long, easily welding, weld does not have oxidative phenomena and is widely used in high-end linkage lines, HDTV (High-Definition Television), panel computer etc.In adopting the common tin plating electrolyte process zinc-plated to Copper Foil, general electro-plating method, the hydrogen of cathode surface is difficult to discharge, and surface easily produces burr and pin hole, and tin coating porosity is large, very easily variable color in air, affects the corrosion resisting property of overall product coating.
Summary of the invention
The object of the present invention is to provide a kind of technique of electroplating in ultrasonic field Copper Foil, it improves coating luminance brightness, reduces pin hole and burr.
The present invention is achieved like this.A kind of technique of electroplating in ultrasonic field Copper Foil, its step is as follows: one, preparation electroplate liquid, press 65g/L tin protochloride, 100ml/L sulfuric acid, 5g/L vinyl sulfonic acid sodium, 3g/L butynediol, 2g xitix, 5g/L cerous carbonate, the formulated electroplate liquid that surplus is distilled water, and regulate PH to 3-4 with ammoniacal liquor.Two, plating pre-treatment, Copper Foil motion, with the speed process rinse bath of 10-20m/h, is used washed with de-ionized water, and add 20-40KHz ultrasonic wave when being cleaned in rinse bath, and grease and the impurity of copper foil surface is removed in deionized water ultrasonic cleaning.Three, plating pre-treatment is complete, and Copper Foil moves forward with the speed of 10-20m/h, enters in the pot that fills electroplate liquid by pulley, and Copper Foil connects the negative electrode of direct supply, and tin anode connects the anode of direct supply, and during plating, cathode current density is 2.5A/dm
3, adopting 700-1200w, the ultra-sonic oscillation of 20-35KHz are stirred electroplate liquid.
The invention has the beneficial effects as follows: the present invention adopts ultrasonic stirring, can increase current density, make near the concentration of metal ions of negative electrode balanced, do not cause near the metal ion of negative electrode to lack, reduce concentration polarization; Improve luminance brightness, and make the hydrogen of cathode surface be easy to overflow, reduce burr and pin hole, obtain more tiny, the uniform coating of crystalline particle.Use the porosity that can reduce coating containing the tin plating electrolyte of rare earth, improve anti-tarnishing ability and the solidity to corrosion of coating, particularly the raising of the overall resistance to corrosion of coating is had to fairly obvious effect.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention
Rinse bath 2, pot 3, tin anode 4, Copper Foil 5, pulley in the drawings 1.
Embodiment
For convenience of explanation, below in conjunction with embodiment, illustrate in detail the present invention.
A technique for electroplating in ultrasonic field Copper Foil, its step is as follows: one, preparation electroplate liquid, by 65g/L tin protochloride, 100ml/L sulfuric acid, 5g/L vinyl sulfonic acid sodium, 3g/L butynediol, 2g xitix, 5g/L cerous carbonate, the formulated electroplate liquid that surplus is distilled water, and regulate PH to 3 with ammoniacal liquor.Two, plating pre-treatment, Copper Foil 4 motions, with the speed process rinse bath 1 of 10m/h, are used washed with de-ionized water, and add 20KHz ultrasonic wave when being cleaned in rinse bath 1, and grease and the impurity on Copper Foil 4 surfaces is removed in deionized water ultrasonic cleaning.Three, plating pre-treatment is complete, and Copper Foil 4 moves forward with the speed of 10m/h, enters in the pot 2 that fills electroplate liquid by pulley 5, Copper Foil 4 connects the negative electrode of direct supply, tin anode 3 connects the anode of direct supply, and during plating, cathode current density is 2.5A/dm
3, adopting 700w, the ultra-sonic oscillation of 20KHz are stirred electroplate liquid.
A technique for electroplating in ultrasonic field Copper Foil, its step is as follows: one, preparation electroplate liquid, by 65g/L tin protochloride, 100ml/L sulfuric acid, 5g/L vinyl sulfonic acid sodium, 3g/L butynediol, 2g xitix, 5g/L cerous carbonate, the formulated electroplate liquid that surplus is distilled water, and regulate PH to 4 with ammoniacal liquor.Two, plating pre-treatment, Copper Foil 4 motions, with the speed process rinse bath 1 of 20m/h, are used washed with de-ionized water, and add 40KHz ultrasonic wave when being cleaned in rinse bath 1, and grease and the impurity on Copper Foil 4 surfaces is removed in deionized water ultrasonic cleaning.Three, plating pre-treatment is complete, and Copper Foil 4 moves forward with the speed of 20m/h, enters in the pot 2 that fills electroplate liquid by pulley 5, Copper Foil 4 connects the negative electrode of direct supply, tin anode 3 connects the anode of direct supply, and during plating, cathode current density is 2.5A/dm
3, adopting 1200w, the ultra-sonic oscillation of 35KHz are stirred electroplate liquid.
A technique for electroplating in ultrasonic field Copper Foil, its step is as follows: one, preparation electroplate liquid, by 65g/L tin protochloride, 100ml/L sulfuric acid, 5g/L vinyl sulfonic acid sodium, 3g/L butynediol, 2g xitix, 5g/L cerous carbonate, the formulated electroplate liquid that surplus is distilled water, and regulate PH to 3 with ammoniacal liquor.Two, plating pre-treatment, Copper Foil 4 motions, with the speed process rinse bath 1 of 15m/h, are used washed with de-ionized water, and add 30KHz ultrasonic wave when being cleaned in rinse bath 1, and grease and the impurity on Copper Foil 4 surfaces is removed in deionized water ultrasonic cleaning.Three, plating pre-treatment is complete, and Copper Foil 4 moves forward with the speed of 15m/h, enters in the pot 2 that fills electroplate liquid by pulley 5, Copper Foil 4 connects the negative electrode of direct supply, tin anode 3 connects the anode of direct supply, and during plating, cathode current density is 2.5A/dm
3, adopting 900w, the ultra-sonic oscillation of 30KHz are stirred electroplate liquid.
Below embodiments of the present invention are explained in detail, but the present invention is not limited to above-mentioned embodiment in conjunction with the embodiments, in the ken possessing those skilled in the art, can also under the prerequisite that does not depart from aim of the present invention, makes various variations.
Claims (1)
1. the technique of an electroplating in ultrasonic field Copper Foil, it is characterized in that step is as follows: 1) preparation electroplate liquid, press 65g/L tin protochloride, 100ml/L sulfuric acid, 5g/L vinyl sulfonic acid sodium, 3g/L butynediol, 2g xitix, 5g/L cerous carbonate, the formulated electroplate liquid that surplus is distilled water, and regulate PH to 3-4 with ammoniacal liquor; 2) plating pre-treatment, Copper Foil motion, with the speed process rinse bath of 10-20m/h, is used washed with de-ionized water, and add 20-40KHz ultrasonic wave when being cleaned in rinse bath, and grease and the impurity of copper foil surface is removed in deionized water ultrasonic cleaning; 3) plating pre-treatment is complete, and Copper Foil moves forward with the speed of 10-20m/h, enters in the pot that fills electroplate liquid by pulley, and Copper Foil connects the negative electrode of direct supply, and tin anode connects the anode of direct supply, and during plating, cathode current density is 2.5A/dm
3, adopting 700-1200w, the ultra-sonic oscillation of 20-35KHz are stirred electroplate liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310555466.3A CN103643269A (en) | 2013-11-11 | 2013-11-11 | Process of ultrasonic wave electroplating of copper foil |
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| CN201310555466.3A CN103643269A (en) | 2013-11-11 | 2013-11-11 | Process of ultrasonic wave electroplating of copper foil |
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| CN103643269A true CN103643269A (en) | 2014-03-19 |
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| CN201310555466.3A Pending CN103643269A (en) | 2013-11-11 | 2013-11-11 | Process of ultrasonic wave electroplating of copper foil |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119912A (en) * | 2016-08-30 | 2016-11-16 | 乐凯特科技铜陵有限公司 | A kind of high accuracy wiring board method of electric tinning |
| CN111101179A (en) * | 2019-12-30 | 2020-05-05 | 禹象铜箔(浙江)有限公司 | Electrodeposition treatment method of copper foil and composite copper foil material |
| CN111304709A (en) * | 2020-04-22 | 2020-06-19 | 山东金宝电子股份有限公司 | Surface treating agent for improving corrosion resistance of electrolytic copper foil |
| CN114481220A (en) * | 2021-12-24 | 2022-05-13 | 兰州理工大学白银新材料研究院 | Method for refining electrodeposited copper grains by using cerium trichloride |
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| EP0567042A1 (en) * | 1992-04-21 | 1993-10-27 | Nkk Corporation | Method for continuously tin-electroplating metal strip |
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| EP0567042A1 (en) * | 1992-04-21 | 1993-10-27 | Nkk Corporation | Method for continuously tin-electroplating metal strip |
| US6068755A (en) * | 1996-12-06 | 2000-05-30 | Canon Kabushiki Kaisha | Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film |
| JP2002256479A (en) * | 2001-03-05 | 2002-09-11 | Alps Electric Co Ltd | Method and equipment for plating |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119912A (en) * | 2016-08-30 | 2016-11-16 | 乐凯特科技铜陵有限公司 | A kind of high accuracy wiring board method of electric tinning |
| CN111101179A (en) * | 2019-12-30 | 2020-05-05 | 禹象铜箔(浙江)有限公司 | Electrodeposition treatment method of copper foil and composite copper foil material |
| CN111101179B (en) * | 2019-12-30 | 2022-03-15 | 禹象铜箔(浙江)有限公司 | Electrodeposition treatment method of copper foil and composite copper foil material |
| CN111304709A (en) * | 2020-04-22 | 2020-06-19 | 山东金宝电子股份有限公司 | Surface treating agent for improving corrosion resistance of electrolytic copper foil |
| CN114481220A (en) * | 2021-12-24 | 2022-05-13 | 兰州理工大学白银新材料研究院 | Method for refining electrodeposited copper grains by using cerium trichloride |
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