CN103642173A - Preparation method for hollow glass microsphere composite material - Google Patents
Preparation method for hollow glass microsphere composite material Download PDFInfo
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- CN103642173A CN103642173A CN201310655554.0A CN201310655554A CN103642173A CN 103642173 A CN103642173 A CN 103642173A CN 201310655554 A CN201310655554 A CN 201310655554A CN 103642173 A CN103642173 A CN 103642173A
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- hollow glass
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Abstract
The invention discloses a preparation method for a hollow glass microsphere composite material. The method comprises the following steps of 1, preparing a 10 percent anhydrous ethanol solution, adding a silane coupling agent, pouring the mixed solution into a flask with glass microspheres after uniform stirring mixing, performing ultrasonic oscillation for 30 minutes at 50 to 70 DEG C, performing baking for 3 hours at 120 DEG C, cooling the mixed solution to room temperature, and sieving and bottling the mixed solution for later use; 2, uniformly mixing epoxy resin, an active diluent and an antifoaming agent, adding the glass microspheres, a curing agent and a curing accelerator, performing uniform mixing and vacuum defoaming until bubbles are substantially eliminated, and pouring the mixed solution to a mold coated with a releasing agent for curing. According to the method, lightweight and strong-strength epoxy resin is obtained, and the hollow glass microspheres are used as a modifier capable of lowering the system density and improving the toughness, are subjected to surface treatment, and are filled into the epoxy resin to prepare a hollow microsphere-filled epoxy composite material; the toughness of the material is improved, and meanwhile, the mechanical strength of the material can be maintained.
Description
Technical field
The present invention relates to Material Field, specifically a kind of preparation method of hollow glass micropearl matrix material.
Background technology
Epoxy resin have good dielectric properties, chemical stability, can bonding and processibility, these features make it in fields such as tackiness agent, coating, electronics, electrical equipment and aerospace, be widely used, but the large drawbacks limit of its fragility the further expansion of its range of application.Therefore, the Research on Toughening of epoxy resin is become to one of focus of epoxy resin modification.Meanwhile, as most widely used caking agent and joint sealant in space flight and weapons, the density that further reduces epoxy resin is new demands that this field proposes epoxy resin at present to alleviate the quality of parts.Therefore, develop the new direction that a kind of new epoxy resin high-strength, light weight just becomes epoxy resin modification.
Summary of the invention
The preparation method who the object of this invention is to provide a kind of hollow glass micropearl matrix material.
Technical scheme of the present invention is achieved in that the preparation method of hollow glass micropearl matrix material, 1. configure 10% ethanol solution, then add silane coupling agent, after being uniformly mixed, pour in the flask that has been added with glass microballon, 50-70 ℃ of ultrasonic concussion 30 minutes, again in 120 ℃ baking 3h, be cooled to room temperature sieve bottling standby;
2. first epoxy resin, reactive thinner and defoamer are mixed, then add glass microballon, solidifying agent and curing catalyst, stir, and vacuum defoamation, to substantially without till bubble, is then poured into the mold cured that scribbles releasing agent.
Hollow glass micropearl is dried to 2.5-3h at 100-120 ℃.
The mass ratio of described epoxy resin, reactive thinner and defoamer is 110:30:2.5.
Described condition of cure: solidify 5h, 85 ℃ of curing 2h under room temperature.
Beneficial effect of the present invention is: the present invention has obtained a kind of lightweight, high-strength epoxy resin, select hollow glass micropearl as the properties-correcting agent that reduces system density, raising toughness, by to glass microballon surface treatment, and fill it in epoxy resin, prepared cenosphere ring type filling O compoiste material, when improving toughness of material, can keep the mechanical strength of material.
Embodiment
Below in conjunction with specific embodiment, the present invention is further explained to explanation.
The preparation method of embodiment 1 hollow glass micropearl matrix material, step is as follows:
1. configure 10% ethanol solution, then add silane coupling agent, pour in the flask that is added with glass microballon after being uniformly mixed, 50-70 ℃ of ultrasonic concussion 30 minutes, then in 120 ℃ of baking 3h, is cooled to the room temperature bottling of sieving standby;
2. first epoxy resin, reactive thinner and defoamer are mixed, then add glass microballon, solidifying agent and curing catalyst, stir, and vacuum defoamation, to substantially without till bubble, is then poured into the mold cured that scribbles releasing agent.Hollow glass micropearl is dried to 2.5-3h at 100-120 ℃.The mass ratio of described epoxy resin, reactive thinner and defoamer is 110:30:2.5.Described condition of cure: solidify 5h, 85 ℃ of curing 2h under room temperature.
The above; it is only preferably embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; according to technical scheme of the present invention and inventive concept thereof, be equal to replacement or changed, within all should being encompassed in protection scope of the present invention.
Claims (4)
1. the preparation method of hollow glass micropearl matrix material, it is characterized in that, 1. configure 10% ethanol solution, then add silane coupling agent, after being uniformly mixed, pour in the flask that has been added with glass microballon, 50-70 ℃ of ultrasonic concussion 30 minutes, then in 120 ℃ of baking 3h, is cooled to the room temperature bottling of sieving standby;
2. first epoxy resin, reactive thinner and defoamer are mixed, then add glass microballon, solidifying agent and curing catalyst, stir, and vacuum defoamation, to substantially without till bubble, is then poured into the mold cured that scribbles releasing agent.
2. the preparation method of hollow glass micropearl matrix material according to claim 1, is characterized in that, hollow glass micropearl is dried to 2.5-3h at 100-120 ℃.
3. the preparation method of hollow glass micropearl matrix material according to claim 1, is characterized in that, the mass ratio of described epoxy resin, reactive thinner and defoamer is 110:30:2.5.
4. the preparation method of hollow glass micropearl matrix material according to claim 1, is characterized in that, condition of cure: under room temperature, solidify 5h, 85 ℃ of curing 2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310655554.0A CN103642173A (en) | 2013-11-30 | 2013-11-30 | Preparation method for hollow glass microsphere composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310655554.0A CN103642173A (en) | 2013-11-30 | 2013-11-30 | Preparation method for hollow glass microsphere composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103642173A true CN103642173A (en) | 2014-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201310655554.0A Pending CN103642173A (en) | 2013-11-30 | 2013-11-30 | Preparation method for hollow glass microsphere composite material |
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| CN (1) | CN103642173A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN105885353A (en) * | 2016-06-03 | 2016-08-24 | 南京工程学院 | Method for improving mechanical property of epoxy resin through surface treatment of hollow glass micro-beads |
| CN108929518A (en) * | 2017-05-26 | 2018-12-04 | 洛阳尖端技术研究院 | A kind of epoxide resin wave-absorbing composite material and preparation method |
| CN111267327A (en) * | 2020-03-16 | 2020-06-12 | 沈阳飞机工业（集团）有限公司 | Skin stretch forming die and manufacturing method thereof |
| CN113121881A (en) * | 2021-03-03 | 2021-07-16 | 宁波恩派新材料科技有限公司 | Density-reducing and hardness-increasing filler for latex foam products, preparation method and application thereof |
| CN115785748A (en) * | 2022-11-30 | 2023-03-14 | 南京星起源新材料科技有限公司 | Single-component aqueous heat-reflecting heat-insulating colorful coating and preparation method thereof |
-
2013
- 2013-11-30 CN CN201310655554.0A patent/CN103642173A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN105885353A (en) * | 2016-06-03 | 2016-08-24 | 南京工程学院 | Method for improving mechanical property of epoxy resin through surface treatment of hollow glass micro-beads |
| CN108929518A (en) * | 2017-05-26 | 2018-12-04 | 洛阳尖端技术研究院 | A kind of epoxide resin wave-absorbing composite material and preparation method |
| CN108929518B (en) * | 2017-05-26 | 2022-11-25 | 洛阳尖端技术研究院 | Epoxy resin wave-absorbing composite material and preparation method thereof |
| CN111267327A (en) * | 2020-03-16 | 2020-06-12 | 沈阳飞机工业（集团）有限公司 | Skin stretch forming die and manufacturing method thereof |
| CN113121881A (en) * | 2021-03-03 | 2021-07-16 | 宁波恩派新材料科技有限公司 | Density-reducing and hardness-increasing filler for latex foam products, preparation method and application thereof |
| CN115785748A (en) * | 2022-11-30 | 2023-03-14 | 南京星起源新材料科技有限公司 | Single-component aqueous heat-reflecting heat-insulating colorful coating and preparation method thereof |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140319 |