CN103631361A - Method and equipment for improving system reliability - Google Patents
Method and equipment for improving system reliability Download PDFInfo
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- CN103631361A CN103631361A CN201310595079.2A CN201310595079A CN103631361A CN 103631361 A CN103631361 A CN 103631361A CN 201310595079 A CN201310595079 A CN 201310595079A CN 103631361 A CN103631361 A CN 103631361A
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Abstract
The invention discloses a method and equipment for improving system reliability. The method includes the steps of obtaining junction temperature of a chip to be monitored, judging whether the junction temperature of the chip to be monitored is higher than the upper limit of a warning threshold or lower than the lower limit of the warning threshold; lowering performance or/and the capacity verification of the chip to be monitored when the junction temperature of the chip to be monitored is higher than the upper limit of the warning threshold; improving the performance or/and the capacity verification of the chip to be monitored when the junction temperature of the chip to be monitored is lower than the lower limit of the warning threshold. On the premise that the equipment can work normally, heat dissipation cost and refrigerating cost are reduced.
Description
Technical field
The present invention relates to communication technical field, relate in particular to a kind of method and apparatus that improves system reliability.
Background technology
Junction temperature (Junction Temperature) is the temperature of semi-conductor chip in electronic equipment (wafer, nude film), and it is usually above skin temperature and environment temperature.Maximum junction temperature can provide conventionally in the tables of data of semi-conductor chip handbook; if chip operation junction temperature surpasses maximum junction temperature; transistor in chip just may be destroyed; chip is random failure also, so should adopt various measures, reduces junction temperature or allows the heat of chip generation be distributed in environment as early as possible.
In order to improve the reliability of electronic equipment, semiconductor chip makers and network device manufacturers have been done a lot of work in this respect.For semiconductor maker, improve on the one hand the maximum junction temperature of semi-conductor chip as far as possible, even if environment temperature is very high like this, or the power consumption of chip is very large, also can guarantee chip reliably working; Reduce on the one hand in addition the thermal resistance of components and parts itself as far as possible and control maximum rated output power.For network device manufacturers, good secondary heat radiation is provided, as the material (aluminium, copper and heat pipe etc.) by change heating radiator improves radiating efficiency, increasing radiator heat-dissipation area improves radiating efficiency, reduces the thermal resistance (pressure of increase two articles surface of contact between components and parts and heating radiator installation interface, make the outshot distortion of object interface, thereby reduce gap, increase surface of contact; At two articles interface place, coat the gluey object-thermal grease conduction of the higher capacity of heat transmission), wind-cooling heat dissipating replaces automatic heat radiation, increases the ancillary methods such as wind deflector, wind-guiding grate and flow-disturbing part, and strengthen inlet and outlet in structural design, improves radiating efficiency.
Be accompanied by the development of mobile Internet, Global Internet number of users and the sharp increase of web-site quantity, and the sharply expansion of voice and video multimedia application, the demand of bandwidth also increases sharply at random, and the performance of the router of basic network equipment, switch is proposed to higher requirement.For tackling this situation, chip manufacturer provides most up-to-date techniques, the chip of epistasis energy and higher power consumption more.For certain specific chip, in maximum power dissipation, maximum junction temperature and chip crust thermal resistance fixedly in the situation that, the way that industry member is traditional is, use the heating radiator of high-quality more, continue to increase radiator heat-dissipation area, by high-intensity fan, freeze.Yet, further lifting along with chip power-consumption, the way that industry member is traditional causes the cost of heat radiation more and more higher, as PCB(Printed circuit board, printed circuit board (PCB)) layout is nervous, cabinet size becomes large, total noise of centrifuge exceeds standard, cost sharply rises etc.In fact, there is the serious design of crossing in industry member traditional method, and reason is as follows:
All kinds of building environment temperature requirement of telecommunications standard: category-A machine room normal temperature range 10-25 degree, can accept temperature range 10-26 degree; Category-B machine room normal temperature 10-28 degree, can accept temperature range 5-30 degree; C class machine room normal temperature 10-30 degree, can accept temperature range 5-30 degree; D class machine room normal temperature range 5-33 degree; D class machine room normal temperature range 5-33 degree, can accept temperature range 0-35 degree.Acceptable temperature refers in the short time (in continuous 4 hours), the temperature range that permission equipment is worked under the condition below or above normal temperature range.Data center machine room environment temperature requires standard: communication facilities is at long-time running duration of work, and computer room temperature is controlled at 18 degree to 25 degree.A level computer room temperature scope 23 ± 2 degree, B level computer room temperature scope 20 ± 2 degree.As can be seen here, for router and switching, in most application, environment temperature is still very good.
For meeting the application of the poor machine room of some environment, the high-end router of most basic network equipment manufacturer or switch externally declare that the highest long-term work temperature is 45 degree (some is even declared up to 55 degree or 65 degree); In addition,, in order to tackle some extreme environment, the high ambient temperature that the network equipment is actual to be supported may be higher.Hence one can see that, although most environment temperatures is lower, in order to tackle the poor scene of some environment, avoids semiconductor chip failure, causes the heat radiation of the network equipment and refrigeration cost higher.
Take router as example, and the most important index of router is exactly its forwarding performance and handling capacity, and the index of weighing forwarding performance is how many packets of processing per second, and the index of weighing handling capacity is how many Bit datas of processing per second.Router is the in the situation that of high forwarding performance and handling capacity, and its power consumption is maximum, but in fact this equipment is not that reason is as follows with the work of maximum power dissipation mode in most cases:
The maximum throughput ability of supposing router veneer is 20Gbps, and Ethernet message length is 64～1518 bytes, and Ethernet message overhead length is 20 bytes; For 64 byte messages, Packet Forwarding Rate=20Gbps/(84Byte/packet*8bit/Byte during this router surface speed forwarding) ≈ 30Mpps; For iMIX mixing length (256 byte) message, Packet Forwarding Rate=20Gbps/(276Byte/packet*8bit/Byte during this router surface speed forwarding) ≈ 9Mpps; For 1518 byte messages, Packet Forwarding Rate=20Gbps/(1538Byte/packet*8bit/Byte during this router surface speed forwarding) ≈ 1.6Mpps.In most network applications, be not to transmit 64 minimum byte messages always, neither transmit the long message of 1518 bytes always, the length of mixing message according to statistics is about 256 bytes.
As can be seen here, for conventional router veneer, for meeting the handling capacity demand of 20Gbps, most in the situation that, forwarding performance reaches 9Mpps and can satisfy the demands, but in order to tackle some special screnes, requires the package processing capability of this router veneer to reach 30Mpps.Along with the lifting of package processing capability, must cause the maximum work output consumption of forwarding engine to increase, for avoiding the too high semiconductor chip failure that causes of junction temperature, the heat radiation of the network equipment and refrigeration cost also can sharply increase, and cost performance is lower.
In addition, router interface is of a great variety, interface rate is diversified; Kind of interface comprises E1/CE1, T1/CT1, E3/CT3, T3/CT3, POS/CPOS, ATM, RPR, Ethernet interface etc.; Atm interface comprises 155M, 622M etc.; POS/CPOS comprises again 155M, 622M, 2.5G, 10G, 40G etc.; Ethernet comprises gigabit, 10,000,000,000,40G, 100G Ethernet etc.; Ethernet also comprises electricity mouth, light mouth, photoelectricity Combo(associating) interface etc.; Each interface subcard also provides 1 port, 2 ports, 4 ports, 8 ports, 10 ports, 20 ports etc. different specification.Therefore, a lot of routers adopt the implementation of flexible interface subcard, and forwarding engine is separated with link layer chip with Physical layer.The benefit of doing is like this that interface subcard can be applied on different router or cable card board on the one hand, protection customer investment; Router or cable card board also can be supported different types of interface, reduce user's purchase cost; Be convenient to fault isolation, improve system reliability; On the other hand, research and development and the inventory cost of equipment manufacturers have been reduced.
Referring to Fig. 1, the router veneer that the maximum throughput ability of take is 20Gbps describes as example.Suppose 2 hot swappable subcards of this router veneer support, the maximum bandwidth of each subcard is 10Gbps, and each subcard can be supported n*E1/CE1, n*T1/CT1, n*E3/CT3, n*T3/CT3, n*155M/622M POS/CPOS, n*155M/622M ATM, 1～10 * GE, 1 * 10GE.When router sticks with 1 * 10GE subcard (or 10 * GE subcard), router veneer need to meet the handling capacity of 20Gbps, the high forwarding performance of 64 bytes is about 30Mpps, now on veneer, the power consumption of forwarding engine is the highest, and other all configuration modes are in addition all without so high message processing capability is provided.
As can be seen here, for this router veneer, for meeting the surface speed forwarding demand of completely inserting 1 * 10GE subcard (or 10 * GE subcard), require the package processing capability of this router veneer to reach 30Mpps, but in most application, to the message processing capability of router veneer, require lower actually.In current industrial design, the heat radiator of router veneer and refrigeration are all to design according to maximum power dissipation, will cause the Material Cost of router higher, and cost performance is lower.
Summary of the invention
The invention provides a kind of method and apparatus that improves system reliability, to realize under the prerequisite that assurance equipment can work, reduce heat radiation and refrigeration cost.
In order to reach above object, the invention provides a kind of method that improves system reliability, comprising:
Obtain the junction temperature of chip to be monitored;
When the junction temperature of described chip to be monitored higher than alarming threshold in limited time, reduce the performance of described chip to be monitored or/and capacity specifications;
When the junction temperature of described chip to be monitored lower than alarming threshold under in limited time, improve the performance of described chip to be monitored or/and capacity specifications.
Wherein, described in obtain the junction temperature of chip to be monitored before, also comprise:
Determine described chip to be monitored at different performance or/and the junction temperature working under capacity specifications point;
The alarming threshold upper limit and the alarming threshold lower limit of corresponding described junction temperature point are set.
Wherein, described in obtain the junction temperature of chip to be monitored after, also comprise:
Determine that the current performance of described chip to be monitored is or/and capacity specifications;
The junction temperature of more described chip to be monitored with described chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put the corresponding alarming threshold upper limit and alarming threshold lower limit.
Wherein, the performance of the described chip to be monitored of described reduction is or/and before capacity specifications, also comprise:
Judge whether rotation speed of the fan is maximal value, if rotation speed of the fan is maximal value, determine that the performance of carrying out the described chip to be monitored of reduction is or/and the operation of capacity specifications; If rotation speed of the fan is not maximal value, improve rotation speed of the fan;
Or/and,
The performance of the described chip to be monitored of described raising is or/and before capacity specifications, also comprise:
Judge whether rotation speed of the fan is minimum value, if rotation speed of the fan is minimum value, determine that the performance of carrying out the described chip to be monitored of raising is or/and the operation of capacity specifications; If rotation speed of the fan is not minimum value, reduce rotation speed of the fan.
Wherein, the performance of the described chip to be monitored of described reduction is or/and before capacity specifications, also comprise:
Judge the performance of described chip to be monitored or/and whether capacity specifications is minimum state, and when the performance of described chip to be monitored or/and capacity specifications while being not minimum state, determine carry out reduce described chip to be monitored performance or/and the operation of capacity specifications;
Or/and,
The performance of the described chip to be monitored of described raising is or/and before capacity specifications, also comprise:
Judge the performance of described chip to be monitored or/and whether capacity specifications is high state, and when the performance of described chip to be monitored or/and capacity specifications while being not high state, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications.
Wherein, the method also comprises:
When the junction temperature of described chip to be monitored is higher than the alarming threshold upper limit, and the performance of described chip to be monitored is or/and capacity specifications while being minimum state, improves rotation speed of the fan;
When the junction temperature of described chip to be monitored is lower than alarming threshold lower limit, and the performance of described chip to be monitored is or/and capacity specifications during for high state, reduces rotation speed of the fan.
Wherein, when polycaryon processor that described chip to be monitored is described router, the performance of described chip to be monitored is or/and capacity specifications comprises following one or more:
The quantity of the operating voltage of the frequency of operation of the usage quantity of the core of described polycaryon processor, the core of described polycaryon processor, the core of described polycaryon processor, described polycaryon processor process IP message;
The performance of the described chip to be monitored of described reduction/improve or/and capacity specifications be specially:
Reduce/improve the usage quantity of the core of described polycaryon processor; Or/and,
Reduce/improve the frequency of operation of the core of described polycaryon processor; Or/and,
Reduce/improve the operating voltage of the core of described polycaryon processor; Or/and,
Reduce/improve the quantity of described polycaryon processor process IP message.
Wherein, when described chip to be monitored is three-state content addressing memory TCAM, the performance of described chip to be monitored or/and capacity specifications comprise:
The access times of described TCAM, or/and, the internal operating frequencies of described TCAM;
The performance of the described chip to be monitored of described reduction/improve or/and capacity specifications be specially:
Reduce/improve the access times of described TCAM; Or/and,
Improve/reduce the internal operating frequencies of described TCAM.
The present invention also provides a kind of equipment that improves system reliability, comprising:
Acquisition module, for obtaining the junction temperature of chip to be monitored;
Judge module, for the junction temperature that judges described chip to be monitored whether higher than the alarming threshold upper limit, or, whether lower than alarming threshold lower limit;
Processing module, higher than prescribing a time limit on alarming threshold, reduces the performance of described chip to be monitored or/and capacity specifications for the junction temperature when described chip to be monitored; When the junction temperature of described chip to be monitored lower than alarming threshold under in limited time, improve the performance of described chip to be monitored or/and capacity specifications.
Wherein, also comprise:
Module is set, for determining described chip to be monitored at different performance, or/and the junction temperature working under capacity specifications point, and the alarming threshold upper limit and the alarming threshold lower limit of corresponding described junction temperature point is set.
Wherein, described judge module also for, determine that the current performance of described chip to be monitored is or/and capacity specifications; The junction temperature of more described chip to be monitored with described chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put the corresponding alarming threshold upper limit and alarming threshold lower limit.
Wherein, described judge module also for, judge whether rotation speed of the fan is maximal value;
Described processing module also for, reducing the performance of described chip to be monitored or/and before capacity specifications, be maximal value if described judge module judges described rotation speed of the fan, determine carry out reduce described chip to be monitored performance or/and the operation of capacity specifications; If it is not maximal value that described judge module judges described rotation speed of the fan, improve rotation speed of the fan;
Or/and,
Described judge module also for, judge whether described rotation speed of the fan is minimum value;
Described processing module also for, reducing the performance of described chip to be monitored or/and before capacity specifications, be minimum value if described judge module judges described rotation speed of the fan, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications; If it is not minimum value that described judge module judges described rotation speed of the fan, reduce rotation speed of the fan.
Wherein, described judge module also for, judge the performance of described chip to be monitored or/and whether capacity specifications is minimum state;
Described processing module also for, in the performance that reduces described chip to be monitored or/and before capacity specifications, if the performance of the described chip to be monitored of described judge module judgement or/and capacity specifications is not minimum state, determines that the performance of carrying out the described chip to be monitored of reduction is or/and the operation of capacity specifications;
Or/and,
Described judge module also for, judge the performance of described chip to be monitored or/and whether capacity specifications is high state;
Described processing module also for, in the performance that improves described chip to be monitored or/and before capacity specifications, if state the performance of chip to be monitored described in the judgement of described judge module or/and capacity specifications is not high state, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications.
Wherein, described processing module also for, when the junction temperature of described chip to be monitored is higher than the alarming threshold upper limit, and the performance of described chip to be monitored is or/and capacity specifications while being minimum state, improves rotation speed of the fan; When the junction temperature of described chip to be monitored is lower than alarming threshold lower limit, and the performance of described chip to be monitored is or/and capacity specifications during for high state, reduces rotation speed of the fan.
Wherein, when polycaryon processor that described chip to be monitored is described router, the performance of described chip to be monitored is or/and capacity specifications comprises following one or more:
The quantity of the operating voltage of the frequency of operation of the usage quantity of the core of described polycaryon processor, the core of described polycaryon processor, the core of described polycaryon processor, described polycaryon processor process IP message;
Described processing module specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the usage quantity of the core of described polycaryon processor; Or/and,
Reduce/improve the frequency of operation of the core of described polycaryon processor; Or/and,
Reduce/improve the operating voltage of the core of described polycaryon processor; Or/and,
Reduce/improve the quantity of described polycaryon processor process IP message.
Wherein, when described chip to be monitored is three-state content addressing memory TCAM, the performance of described chip to be monitored or/and capacity specifications comprise:
The access times of described TCAM, or/and, the internal operating frequencies of described TCAM;
Described processing module specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the access times of described TCAM; Or/and,
Improve/reduce the internal operating frequencies of described TCAM.
In the above embodiment of the present invention, by Real-Time Monitoring, obtain the junction temperature of chip to be monitored, and whether the junction temperature that judges this chip to be monitored is higher than the alarming threshold upper limit, or lower than alarming threshold lower limit; When the junction temperature of chip to be monitored higher than thresholding in limited time, reduce the performance of this chip to be monitored or/and capacity specifications; When the junction temperature of chip to be monitored lower than alarming threshold under in limited time, improve the performance of this chip to be monitored or/and capacity specifications, in embodiments of the present invention, when monitoring the junction temperature abnormal (higher than the alarming threshold upper limit or lower than alarming threshold lower limit) of chip to be monitored, by adjust (reduce or improve) chip to be monitored performance or. and capacity specifications, make the junction temperature of chip to be monitored recover normal, and then electronic equipment can be worked, realized under the prerequisite that assurance equipment can work, reduced heat radiation and refrigeration cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the maximum throughput ability router veneer that is 20Gbps;
A kind of schematic flow sheet that improves the method for system reliability that Fig. 2 provides for the embodiment of the present invention;
Fig. 3 is the schematic flow sheet of a kind of fan refrigeration and performance raising system reliability method under the scene of using or/and capacity superposes of adjusting chip to be monitored;
Fig. 4 is the schematic flow sheet of a kind of fan refrigeration and performance raising system reliability method under use scenes or/and capacity superposes of adjusting chip to be monitored;
Fig. 5 is a kind of router cable fastener plate hardware structure schematic diagram based on polycaryon processor;
Fig. 6 be a kind of dynamic control nuclear volume, core voltage and and the schematic diagram of the method for frequency;
Fig. 7 dynamically controls the schematic flow sheet of polycaryon processor performance;
Fig. 8 dynamically controls the schematic flow sheet of nuclear volume, core frequency, core voltage and the rotation speed of the fan of polycaryon processor;
Fig. 9 dynamically controls the schematic flow sheet of TCAM access times;
A kind of structural representation that improves the equipment of system reliability that Figure 10 provides for the embodiment of the present invention.
Embodiment
In prior art, in order to guarantee system reliability, electronic equipment (comprises router, switches etc.) production firm is when producing electronic equipment, the heat radiator of veneer and fan refrigeration etc. are all can guarantee electronic equipment (environment temperature extreme difference under the highest power consumption state, electronic equipment (take router as example) transmits the message of 64 bytes always, to stick with flank speed subcard and subcard operate at full capacity) normal operation designs for prerequisite, but, due to electronic equipment in the vast majority of circumstances, can be in the highest power consumption state, therefore, such design has caused cost waste, cost performance is lower
For the problem occurring in above-mentioned prior art, the embodiment of the present invention provides a kind of technical scheme that improves system reliability.In this technical scheme, by Real-Time Monitoring, obtain the junction temperature of chip to be monitored, and whether the junction temperature that judges this chip to be monitored is higher than the alarming threshold upper limit, or lower than alarming threshold lower limit; When the junction temperature of chip to be monitored higher than thresholding in limited time, reduce the performance of this chip to be monitored or/and capacity specifications; When the junction temperature of chip to be monitored lower than alarming threshold under in limited time, improve the performance of this chip to be monitored or/and capacity specifications, in embodiments of the present invention, when monitoring the junction temperature abnormal (higher than the alarming threshold upper limit or lower than alarming threshold lower limit) of chip to be monitored, by adjust (reduce or improve) chip to be monitored performance or. and capacity specifications, make the junction temperature of chip to be monitored recover normal, and then electronic equipment can be worked, realized under the prerequisite that assurance equipment can work, reduced heat radiation and refrigeration cost.
Wherein, chip to be monitored can be the key chip of electronic equipment, during electronic device works power consumption large, to temperature more responsive (work efficiency temperature influence is larger), chip that maximum junction temperature is lower.For example, for router, this key chip can be processor/polycaryon processor, network processing unit, TCAM(Ternary Content Addressable Memory, three-state content addressing memory), FPGA(Field Programmable Gate Array, field programmable gate array), other ASIC(Application Specific Integrated Circuit such as Packet Forwarding Engine/traffic management device/switching network chip, special IC) chip.
Below in conjunction with the accompanying drawing in embodiments of the invention, the technical scheme in embodiments of the invention is carried out to clear, complete description, obviously, the embodiments described below are only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills are not paying the every other embodiment obtaining under creative work prerequisite, all belong to the scope of embodiments of the invention protection.
As shown in Figure 2, a kind of schematic flow sheet that improves the method for system reliability for the embodiment of the present invention provides, can comprise the following steps:
Concrete, in embodiments of the present invention, two kinds of situations below at least needing to distinguish when obtaining the junction temperature of chip to be monitored:
The junction temperature of situation one, chip to be monitored can directly read
In this situation, can Real-Time Monitoring and read the junction temperature of chip to be monitored.
The junction temperature of situation two, chip to be monitored cannot directly read
In this situation, requirement is in chip development process to be monitored, by actual heat test, obtain the vs. temperature of junction temperature of chip and this chip exterior temperature inductor, in the time need to obtaining the junction temperature of such chip to be monitored, can be by reading the temperature of this chip exterior temperature inductor to be monitored, and according to the temperature of chip exterior temperature inductor to be monitored, determine the junction temperature of corresponding chip to be monitored.
Wherein, in embodiments of the present invention, before obtaining the junction temperature of chip to be monitored, can also comprise following processing operation:
Determine chip to be monitored at different performance or/and the junction temperature working under capacity specifications (junction temperature point);
Arrange the alarming threshold upper limit and alarming threshold lower limit that should junction temperature point.
Suppose the performance of chip to be monitored or/and capacity specifications can comprise S1, S2, S3 from high to low, determine respectively junction temperature point T1, T2, the T3 that this chip to be monitored works under S1, S2, S3; Take T1 as example, and the alarming threshold upper limit that T1 is corresponding can be T1+t1, and alarming threshold lower limit can be T1-t2; Or the alarming threshold upper limit that T1 is corresponding can be (1+a) T1, alarming threshold lower limit can be (1-b) T1; Wherein, t1, t2, a, b are positive number, and t1 can equal t2, also can be not equal to t2; A can equal b, also can be not equal to b.
In like manner, the alarming threshold upper limit that the alarming threshold upper limit that T2 is corresponding and the set-up mode of alarming threshold lower limit are corresponding with T1 is similar with the set-up mode of alarming threshold lower limit, does not repeat them here.
Concrete, due in most cases, not need to not working under the highest power consumption state of electronic equipment, therefore, the performance of the key chip of electronic equipment is not or/and capacity specifications needs to remain at high state, when the junction temperature of the key chip of electronic equipment is because the temperature of external environment condition etc. is former thereby when too high or too low, can be by reducing or improve the performance of key chip or/and capacity specifications makes the junction temperature of key chip recover normal.
In embodiments of the present invention, after getting the junction temperature of chip to be monitored, can determine performance that chip to be monitored is current or/and capacity specifications, and relatively the junction temperature of this chip to be monitored with this chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put corresponding alarming threshold and alarming threshold lower limit.
For example, the junction temperature of supposing the chip to be monitored that gets is t, the performance that this chip to be monitored is current or capacity specifications are to be limited to T1+t1 on the alarming threshold that T1(T1 is corresponding, under alarming threshold, be limited to T1-t2), can be by relatively t and T1+t1(or T1-t2) junction temperature of determining chip to be monitored is higher than the alarming threshold upper limit or lower than alarming threshold lower limit.
When the junction temperature of chip to be monitored higher than alarming threshold in limited time, in order to reduce the junction temperature of chip to be monitored, can reduce the performance of chip to be monitored or/and capacity specifications; When the junction temperature of chip to be monitored lower than alarming threshold under in limited time, in order to improve the junction temperature of chip to be monitored, can improve performance or the capacity specifications of chip to be monitored.
Preferably, in the performance that reduces chip to be monitored or/and before capacity specifications, can also first judge the performance of this chip to be monitored or/and whether capacity specifications is minimum state, and when the performance of chip to be monitored or/and capacity specifications while being not minimum state, determine carry out reduce chip to be monitored performance or/and capacity specifications.
In like manner, in the performance that improves chip to be monitored or/and before capacity specifications, also can first judge the performance of this chip to be monitored or/and whether capacity specifications is high state, and when the performance of chip to be monitored or/and capacity specifications while being not high state, determine carry out improve chip to be monitored performance or/and capacity specifications.
Further, if electronic equipment has been equipped with fan for refrigeration cool-down,, when access device determines that the junction temperature of chip to be monitored is abnormal, can also make by adjusting rotation speed of the fan the junction temperature of chip to be monitored recover normal.
Preferably, adjust rotation speed of the fan can with performance use or/and two kinds of modes of capacity superpose of adjusting chip to be monitored.For example, when the junction temperature of chip to be monitored higher than alarming threshold in limited time, can preferentially by adjusting rotation speed of the fan (raising rotation speed of the fan), reduce the junction temperature of chip to be monitored, if freeze by fan, can not satisfy the demands that (rotation speed of the fan adjusted is to maximal value, the junction temperature of chip to be monitored is still higher than the alarming threshold upper limit), further reduce the performance of chip to be monitored or/and capacity specifications; In like manner, also can be preferentially by reducing the performance of chip to be monitored or/and capacity specifications reduces the junction temperature of chip to be monitored, if by reducing the performance of chip to be monitored, or/and capacity specifications can not satisfy the demands, (performance of chip to be monitored is or/and capacity specifications has been adjusted to minimum state, the junction temperature of chip to be monitored is still higher than the alarming threshold upper limit), further improve the junction temperature that rotation speed of the fan reduces chip to be monitored.
In actual applications, can adjust flexibly strategy, the occasion as to noise-sensitive (need noise as far as possible low), can preferentially reduce performance or/and capacity specifications; And to the performance sensitive occasion of (needing performance height as far as possible), can preferentially improve rotation speed of the fan.
Take respectively below the junction temperature that needs to reduce the junction temperature of chip to be monitored under performance-sensitive occasion and improve chip to be monitored is described as the technical scheme that example provides the embodiment of the present invention.
As shown in Figure 3, for a kind of fan refrigeration and the performance of adjusting chip to be monitored are or/and the schematic flow sheet of the raising system reliability method under the scene that capacity stack is used, in this embodiment, take to needing to reduce the junction temperature of chip to be monitored under performance-sensitive occasion is example, and the method can comprise the following steps:
As shown in Figure 4, for a kind of fan refrigeration and the performance of adjusting chip to be monitored are or/and the schematic flow sheet of the raising system reliability method under capacity stack use scenes, in this embodiment, take to needing to improve the junction temperature of chip to be monitored under performance-sensitive occasion is example, and the method can comprise the following steps:
It should be noted that in embodiments of the present invention, can improve by the mode of stepping the performance of (or reduce) chip to be monitored or/and capacity specifications (or rotation speed of the fan), its specific implementation does not repeat them here.
The technical scheme providing in order to understand better the embodiment of the present invention, the technical scheme embodiment of the present invention being provided below in conjunction with concrete application scenarios is described below in greater detail.
The router cable fastener plate hardware structure based on polycaryon processor shown in Fig. 5 of take is example, wherein, usings polycaryon processor as chip to be monitored.
Correspondingly, the performance of chip to be monitored is or/and capacity specifications can comprise following one or more:
The quantity of the usage quantity of the core of polycaryon processor (core), the frequency of operation of core of polycaryon processor, the operating voltage of the core of polycaryon processor, polycaryon processor process IP message.
In this embodiment, the usage quantity of the core of router software dynamic management polycaryon processor, when the junction temperature of polycaryon processor higher than alarming threshold in limited time, system software is by closing the core of a polycaryon processor, to reduce output power; Otherwise, when the junction temperature of polycaryon processor lower than alarming threshold under in limited time, system software is by enabling the core of a polycaryon processor, to improve output power.The usage quantity of the core of polycaryon processor and the forwarding performance of router are closely related, are linear growth trend; The power consumption of the usage quantity of the core of polycaryon processor and polycaryon processor chip is also closely related, and the quantity of the core of closing is more, and the power consumption of polycaryon processor is less.
Router software is dynamically adjusted the frequency of operation of the core of polycaryon processor, when the junction temperature of polycaryon processor higher than alarming threshold in limited time, system software is by reducing the frequency of operation of the core of processor, to reduce output power; Otherwise, when the junction temperature of polycaryon processor lower than alarming threshold under in limited time, system software is by improving the frequency of operation of the core of processor, to improve output power.The frequency of operation of the core of polycaryon processor and the forwarding performance of router are closely related, are linear growth trend; The power consumption of the frequency of operation of the core of polycaryon processor and polycaryon processor chip is also closely related, and frequency of operation is lower, and the power consumption of polycaryon processor is less.
Router software is dynamically adjusted the operating voltage of the core of polycaryon processor, when the junction temperature of polycaryon processor higher than alarming threshold in limited time, system software is by reducing the operating voltage of the core of processor, to reduce output power; Otherwise, when the junction temperature of polycaryon processor, lower than the lower of alarming threshold, to prescribe a time limit, system software is by improving the operating voltage of the core of processor, to improve output power.The operating voltage of the core of polycaryon processor and the forwarding performance of router are closely related, are linear growth trend; The power consumption of the operating voltage of the core of polycaryon processor and polycaryon processor chip is also closely related, and operating voltage is lower, and the power consumption of polycaryon processor is less.
Router software is dynamically adjusted the quantity of polycaryon processor process IP message, when the junction temperature of polycaryon processor higher than alarming threshold in limited time, system software is by reducing the quantity of polycaryon processor process IP message, to reduce output power; Otherwise, when the junction temperature of polycaryon processor, lower than the lower of alarming threshold, to prescribe a time limit, system software is by improving the quantity of polycaryon processor process IP message, to improve output power.
Referring to Fig. 6, the usage quantity (hereinafter to be referred as nuclear volume) of core by reducing processor is, the frequency of operation (hereinafter to be referred as core frequency) of core and the operating voltage (hereinafter to be referred as core voltage) of core, to reduce the performance of router or/and capacity has been realized the reduction of polycaryon processor output power consumption.
Concrete, the processor of master control borad is by the junction temperature sensor of management bus access line clamp polycaryon processor, and then the junction temperature of definite polycaryon processor, and judges the relation of the upper and lower bound of itself and alarming threshold.Wherein, management bus can be used I2C bus conventionally.
The processor of master control borad is by order, the order of core frequency of the nuclear volume of adjusting polycaryon processor, the order of core voltage is delivered to the management Core of cable card board polycaryon processor by control bus, and control bus is generally industry ethernet.
The management Core read-write " enabling/manage control register " of cable card board polycaryon processor can be closed the Core of some forwardings and business processing, and it is quit work; The management Core read-write " frequency control register " of cable card board polycaryon processor can regulate chip internal phase-locked loop circuit, makes core (Core of forwarding and business processing) be operated in lower frequency; The management Core read-write " power supply control register " of cable card board polycaryon processor can regulate chip exterior Core voltage source module, makes core be operated in lower voltage.Foregoing step-by-step system reduces performance and the capacity of chip, being embodied in is exactly the quantity that step-by-step system is closed forwarding and business processing Core here, step-by-step system reduces the core frequency of polycaryon processor, step-by-step system reduces the core voltage of polycaryon processor, i.e. (higher environment temperature under exceedingly odious environment, router subcard is completely slotting, router inserts flank speed interface subcard, the data message that router forwards is all the message of minimum byte) performance that reduced polycaryon processor is or/and capacity specifications, also reduced the power consumption of polycaryon processor, thereby reduced the junction temperature of polycaryon processor, in relatively low cost mode, improve the reliability of system.
Referring to Fig. 7, the flow process of dynamically controlling polycaryon processor performance in this embodiment can comprise:
First, forwarding performance and the handling capacity of polycaryon processor under definition varying environment temperature conditions; Wherein, high forwarding performance and handling capacity that the performance of all kinds of machine room Normal Environmental Temperatures is polycaryon processor, under high temperature and thermal extremes environment, define lower forwarding performance and handling capacity;
Secondly, obtain forwarding performance and the handling capacity of polycaryon processor in different nuclear volumes, different core frequency and different core voltage situation;
The 3rd, by regulating heating radiator, obtain at varying environment temperature the junction temperature of polycaryon processor point;
The 4th, the corresponding relation of the junction temperature point of determining polycaryon processor and polycaryon processor nuclear volume, core frequency and core voltage, and each junction temperature is set puts the corresponding alarming threshold upper limit and alarming threshold lower limit;
The 5th, in the polycaryon processor course of work, according to the junction temperature of the polycaryon processor getting, adjust dynamically nuclear volume, core voltage and the core frequency of polycaryon processor.
Further, when router has been equipped with fan refrigeration cool-down, can be by adjusting nuclear volume, core frequency, the core voltage of polycaryon processor in this embodiment, and adjust rotation speed of the fan stack and use, guarantee better system reliability, wherein, the flow process of dynamically controlling nuclear volume, core frequency, core voltage and the rotation speed of the fan of polycaryon processor can be referring to Fig. 8, and its idiographic flow can comprise:
First, forwarding performance and the handling capacity of polycaryon processor under definition varying environment temperature conditions; Wherein, high forwarding performance and handling capacity that the performance of all kinds of machine room Normal Environmental Temperatures is polycaryon processor, under high temperature and thermal extremes environment, define lower forwarding performance and handling capacity;
Secondly, obtain forwarding performance and the handling capacity of polycaryon processor in different nuclear volumes, different core frequency and different core voltage situation;
The 3rd, by regulating heating radiator, rotation speed of the fan, obtain at varying environment temperature the junction temperature of polycaryon processor point;
The 4th, the corresponding relation of the junction temperature point of determining polycaryon processor and polycaryon processor nuclear volume, core frequency and core voltage, and each junction temperature is set puts the corresponding alarming threshold upper limit and alarming threshold lower limit;
The 5th, in the polycaryon processor course of work, according to the junction temperature of the polycaryon processor getting, adjust dynamically nuclear volume, core voltage, core frequency and the rotation speed of the fan of polycaryon processor.
It should be noted that, in the technical scheme providing in the embodiment of the present invention, chip to be monitored is not limited to polycaryon processor, can be also other chips.
Chip to be monitored take below as TCAM is example again, and the technical scheme that the embodiment of the present invention is provided is described.
The router cable fastener plate hardware structure based on polycaryon processor shown in Fig. 5 of still take is example, and wherein, chip to be monitored is TCAM.
When polycaryon processor application TCAM carries out route querying fast, due to the access mode of TCAM and conventional random access memory (Random Access Memory, abbreviation RAM) by Input Address, return to this address and locate corresponding data message difference, only need the content of input key word, TCAM will carry out matching ratio by list items all in this key word and TCAM simultaneously, finally returns to coupling list item corresponding address in CAM.
The power consumption of TCAM is owing to carrying out the scounting line of search and determine that in search required charging current and the discharge current of matched line of coupling causes in TCAM.TCAM work is that what to adopt is parallel search, power consumption is generally all very large, the calculating of power consumption is more complicated also, with the clock frequency of interface, the length of search word, the search mask bit of word, the capacity of the speed of search, database has direct relation, the power difference of TCAM when work and under battery saving mode is larger, and power consumption fluctuation ratio is larger.
In embodiments of the present invention, can be by dynamically controlling TCAM access times, dynamically control maximum quantity that can process IP message, realize the control of TCAM power consumption, and then control the junction temperature of TACM.
Referring to Fig. 9, the flow process of dynamically controlling TCAM access times in this embodiment can comprise:
First, the list lookup performance of TCAM under definition varying environment temperature conditions; Wherein, the highest list lookup performance that the performance of all kinds of machine room Normal Environmental Temperatures is TCAM, under high temperature and thermal extremes environment, defines lower list lookup performance;
Secondly, obtain the list lookup performance of TCAM in different access number of times situation;
The 3rd, by regulating heating radiator, obtain at varying environment temperature the junction temperature of TCAM point;
The 4th, determine the corresponding relation of the access times of TCAM junction temperature point and TCAM, and each junction temperature is set puts the corresponding alarming threshold upper limit and alarming threshold lower limit;
The 5th, in the TCAM course of work, according to the junction temperature of the TCAM getting, dynamically adjust the access times of TCAM.
Wherein, in embodiments of the present invention, by controlling the quantity that maximum can process IP message, realize the control to TCAM access times.
In practical application, reduce TCAM access times, reduce maximum quantity that can process IP message, can reduce the output power consumption of polycaryon processor and TCAM chip, the junction temperature of polycaryon processor and TCAM also can decrease.In fact, the output power of the chip such as traffic management chip, switching network access chip and switching network all can reduce; In the situation that dispelling the heat and refrigeration modes is constant, the junction temperature of key chip can reduce.
Wherein, the mode of controlling maximum quantity that can process IP message has a variety of, as realized by the mode of agreement access rate, also can realize by reducing the mode of parallel processing resource, also the mode that can access external resource bandwidth by reduction realizes, also can realize by the mode of reduction system or bus frequency, do not repeat them here.
Known by above description, in the technical scheme providing in the embodiment of the present invention, by Real-Time Monitoring, obtain the junction temperature of chip to be monitored, and whether the junction temperature that judges this chip to be monitored is higher than the alarming threshold upper limit, or lower than alarming threshold lower limit; When the junction temperature of chip to be monitored higher than thresholding in limited time, reduce the performance of this chip to be monitored or/and capacity specifications; When the junction temperature of chip to be monitored lower than alarming threshold under in limited time, improve the performance of this chip to be monitored or/and capacity specifications, in embodiments of the present invention, when monitoring the junction temperature abnormal (higher than the alarming threshold upper limit or lower than alarming threshold lower limit) of chip to be monitored, by adjust (reduce or improve) chip to be monitored performance or. and capacity specifications, make the junction temperature of chip to be monitored recover normal, and then electronic equipment can be worked, realized under the prerequisite that assurance equipment can work, reduced heat radiation and refrigeration cost.
Technical conceive based on identical, the embodiment of the present invention also provides a kind of equipment that improves system reliability, can be applied to said method embodiment.
As shown in figure 10, a kind of structural representation that improves the equipment of system reliability for the embodiment of the present invention provides, can comprise:
Acquisition module 11, for obtaining the junction temperature of chip to be monitored;
The equipment of the raising system reliability that wherein, the embodiment of the present invention provides also can comprise:
Wherein, described judge module 12 also for, determine that the current performance of described chip to be monitored is or/and capacity specifications; The junction temperature of more described chip to be monitored with described chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put the corresponding alarming threshold upper limit and alarming threshold lower limit.
Wherein, described judge module 12 also for, judge whether rotation speed of the fan is maximal value;
Described processing module 13 also for, in the performance that reduces described chip to be monitored or/and before capacity specifications, if the described rotation speed of the fan of described judge module 12 judgement is maximal value, determine carry out reduce described chip to be monitored performance or/and the operation of capacity specifications; If the described rotation speed of the fan of described judge module 12 judgement is not maximal value, improve rotation speed of the fan;
Or/and,
Described judge module 12 also for, judge whether described rotation speed of the fan is minimum value;
Described processing module 13 also for, in the performance that reduces described chip to be monitored or/and before capacity specifications, if the described rotation speed of the fan of described judge module 12 judgement is minimum value, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications; If the described rotation speed of the fan of described judge module 12 judgement is not minimum value, reduce rotation speed of the fan.
Wherein, described judge module 12 also for, judge the performance of described chip to be monitored or/and whether capacity specifications is minimum state;
Described processing module 13 also for, in the performance that reduces described chip to be monitored or/and before capacity specifications, if the performance of the described chip to be monitored of described judge module 12 judgement, or/and capacity specifications is not minimum state, determines that the performance of carrying out the described chip to be monitored of reduction is or/and the operation of capacity specifications;
Or/and,
Described judge module 12 also for, judge the performance of described chip to be monitored or/and whether capacity specifications is high state;
Described processing module 13 also for, in the performance that improves described chip to be monitored or/and before capacity specifications, if state the performance of chip to be monitored described in 12 judgements of described judge module or/and capacity specifications is not high state, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications.
Wherein, described processing module 13 also for, when the junction temperature of described chip to be monitored is higher than the alarming threshold upper limit, and the performance of described chip to be monitored is or/and capacity specifications while being minimum state, improves rotation speed of the fan; When the junction temperature of described chip to be monitored is lower than alarming threshold lower limit, and the performance of described chip to be monitored is or/and capacity specifications during for high state, reduces rotation speed of the fan.
Wherein, when polycaryon processor that described chip to be monitored is described router, the performance of described chip to be monitored is or/and capacity specifications comprises following one or more:
The quantity of the operating voltage of the frequency of operation of the usage quantity of the core of described polycaryon processor, the core of described polycaryon processor, the core of described polycaryon processor, described polycaryon processor process IP message;
Described processing module 13 specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the usage quantity of the core of described polycaryon processor; Or/and,
Reduce/improve the frequency of operation of the core of described polycaryon processor; Or/and,
Reduce/improve the operating voltage of the core of described polycaryon processor; Or/and,
Reduce/improve the quantity of described polycaryon processor process IP message.
Wherein, when described chip to be monitored is three-state content addressing memory TCAM, the performance of described chip to be monitored or/and capacity specifications comprise:
The access times of described TCAM, or/and, the internal operating frequencies of described TCAM;
Described processing module 13 specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the access times of described TCAM; Or/and,
Improve/reduce the internal operating frequencies of described TCAM.
Through the above description of the embodiments, those skilled in the art can be well understood to the mode that the present invention can add essential general hardware platform by software and realize, and can certainly pass through hardware, but in a lot of situation, the former is better embodiment.Understanding based on such, the part that technical scheme of the present invention contributes to prior art in essence in other words can embody with the form of software product, this computer software product is stored in a storage medium, comprise that some instructions are with so that a station terminal equipment (can be mobile phone, personal computer, server, or the network equipment etc.) carry out the method described in each embodiment of the present invention.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be looked protection scope of the present invention.
Claims (16)
1. a method that improves system reliability, is characterized in that, comprising:
Obtain the junction temperature of chip to be monitored;
When the junction temperature of described chip to be monitored higher than alarming threshold in limited time, reduce the performance of described chip to be monitored or/and capacity specifications;
When the junction temperature of described chip to be monitored lower than alarming threshold under in limited time, improve the performance of described chip to be monitored or/and capacity specifications.
2. the method for claim 1, is characterized in that, described in obtain the junction temperature of chip to be monitored before, also comprise:
Determine described chip to be monitored at different performance or/and the junction temperature working under capacity specifications point;
The alarming threshold upper limit and the alarming threshold lower limit of corresponding described junction temperature point are set.
3. method as claimed in claim 2, is characterized in that, described in obtain the junction temperature of chip to be monitored after, also comprise:
Determine that the current performance of described chip to be monitored is or/and capacity specifications;
The junction temperature of more described chip to be monitored with described chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put the corresponding alarming threshold upper limit and alarming threshold lower limit.
4. the method for claim 1, is characterized in that,
The performance of the described chip to be monitored of described reduction is or/and before capacity specifications, also comprise:
Judge whether rotation speed of the fan is maximal value, if rotation speed of the fan is maximal value, determine that the performance of carrying out the described chip to be monitored of reduction is or/and the operation of capacity specifications; If rotation speed of the fan is not maximal value, improve rotation speed of the fan;
Or/and,
The performance of the described chip to be monitored of described raising is or/and before capacity specifications, also comprise:
Judge whether rotation speed of the fan is minimum value, if rotation speed of the fan is minimum value, determine that the performance of carrying out the described chip to be monitored of raising is or/and the operation of capacity specifications; If rotation speed of the fan is not minimum value, reduce rotation speed of the fan.
5. the method for claim 1, is characterized in that,
The performance of the described chip to be monitored of described reduction is or/and before capacity specifications, also comprise:
Judge the performance of described chip to be monitored or/and whether capacity specifications is minimum state, and when the performance of described chip to be monitored or/and capacity specifications while being not minimum state, determine carry out reduce described chip to be monitored performance or/and the operation of capacity specifications;
Or/and,
The performance of the described chip to be monitored of described raising is or/and before capacity specifications, also comprise:
Judge the performance of described chip to be monitored or/and whether capacity specifications is high state, and when the performance of described chip to be monitored or/and capacity specifications while being not high state, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications.
6. method as claimed in claim 5, is characterized in that, the method also comprises:
When the junction temperature of described chip to be monitored is higher than the alarming threshold upper limit, and the performance of described chip to be monitored is or/and capacity specifications while being minimum state, improves rotation speed of the fan;
When the junction temperature of described chip to be monitored is lower than alarming threshold lower limit, and the performance of described chip to be monitored is or/and capacity specifications during for high state, reduces rotation speed of the fan.
7. the method for claim 1, is characterized in that, when polycaryon processor that described chip to be monitored is described router, the performance of described chip to be monitored is or/and capacity specifications comprises following one or more:
The quantity of the operating voltage of the frequency of operation of the usage quantity of the core of described polycaryon processor, the core of described polycaryon processor, the core of described polycaryon processor, described polycaryon processor process IP message;
The performance of the described chip to be monitored of described reduction/improve or/and capacity specifications be specially:
Reduce/improve the usage quantity of the core of described polycaryon processor; Or/and,
Reduce/improve the frequency of operation of the core of described polycaryon processor; Or/and,
Reduce/improve the operating voltage of the core of described polycaryon processor; Or/and,
Reduce/improve the quantity of described polycaryon processor process IP message.
8. the method for claim 1, is characterized in that, when described chip to be monitored is three-state content addressing memory TCAM, the performance of described chip to be monitored or/and capacity specifications comprise:
The access times of described TCAM, or/and, the internal operating frequencies of described TCAM;
The performance of the described chip to be monitored of described reduction/improve or/and capacity specifications be specially:
Reduce/improve the access times of described TCAM; Or/and,
Improve/reduce the internal operating frequencies of described TCAM.
9. an equipment that improves system reliability, is characterized in that, comprising:
Acquisition module, for obtaining the junction temperature of chip to be monitored;
Judge module, for the junction temperature that judges described chip to be monitored whether higher than the alarming threshold upper limit, or, whether lower than alarming threshold lower limit;
Processing module, higher than prescribing a time limit on alarming threshold, reduces the performance of described chip to be monitored or/and capacity specifications for the junction temperature when described chip to be monitored; When the junction temperature of described chip to be monitored lower than alarming threshold under in limited time, improve the performance of described chip to be monitored or/and capacity specifications.
10. equipment as claimed in claim 9, is characterized in that, also comprises:
Module is set, for determining described chip to be monitored at different performance, or/and the junction temperature working under capacity specifications point, and the alarming threshold upper limit and the alarming threshold lower limit of corresponding described junction temperature point is set.
11. equipment as claimed in claim 10, is characterized in that,
Described judge module also for, determine that the current performance of described chip to be monitored is or/and capacity specifications; The junction temperature of more described chip to be monitored with described chip to be monitored in current performance or/and the junction temperature working under capacity specifications is put the corresponding alarming threshold upper limit and alarming threshold lower limit.
12. equipment as claimed in claim 9, is characterized in that,
Described judge module also for, judge whether rotation speed of the fan is maximal value;
Described processing module also for, reducing the performance of described chip to be monitored or/and before capacity specifications, be maximal value if described judge module judges described rotation speed of the fan, determine carry out reduce described chip to be monitored performance or/and the operation of capacity specifications; If it is not maximal value that described judge module judges described rotation speed of the fan, improve rotation speed of the fan;
Or/and,
Described judge module also for, judge whether described rotation speed of the fan is minimum value;
Described processing module also for, reducing the performance of described chip to be monitored or/and before capacity specifications, be minimum value if described judge module judges described rotation speed of the fan, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications; If it is not minimum value that described judge module judges described rotation speed of the fan, reduce rotation speed of the fan.
13. equipment as claimed in claim 9, is characterized in that,
Described judge module also for, judge the performance of described chip to be monitored or/and whether capacity specifications is minimum state;
Described processing module also for, in the performance that reduces described chip to be monitored or/and before capacity specifications, if the performance of the described chip to be monitored of described judge module judgement or/and capacity specifications is not minimum state, determines that the performance of carrying out the described chip to be monitored of reduction is or/and the operation of capacity specifications;
Or/and,
Described judge module also for, judge the performance of described chip to be monitored or/and whether capacity specifications is high state;
Described processing module also for, in the performance that improves described chip to be monitored or/and before capacity specifications, if state the performance of chip to be monitored described in the judgement of described judge module or/and capacity specifications is not high state, determine carry out improve described chip to be monitored performance or/and the operation of capacity specifications.
14. equipment as claimed in claim 13, is characterized in that,
Described processing module also for, when the junction temperature of described chip to be monitored is higher than the alarming threshold upper limit, and the performance of described chip to be monitored is or/and capacity specifications while being minimum state, improves rotation speed of the fan; When the junction temperature of described chip to be monitored is lower than alarming threshold lower limit, and the performance of described chip to be monitored is or/and capacity specifications during for high state, reduces rotation speed of the fan.
15. equipment as claimed in claim 9, is characterized in that, when polycaryon processor that described chip to be monitored is described router, the performance of described chip to be monitored is or/and capacity specifications comprises following one or more:
The quantity of the operating voltage of the frequency of operation of the usage quantity of the core of described polycaryon processor, the core of described polycaryon processor, the core of described polycaryon processor, described polycaryon processor process IP message;
Described processing module specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the usage quantity of the core of described polycaryon processor; Or/and,
Reduce/improve the frequency of operation of the core of described polycaryon processor; Or/and,
Reduce/improve the operating voltage of the core of described polycaryon processor; Or/and,
Reduce/improve the quantity of described polycaryon processor process IP message.
16. equipment as claimed in claim 9, is characterized in that, when described chip to be monitored is three-state content addressing memory TCAM, the performance of described chip to be monitored or/and capacity specifications comprise:
The access times of described TCAM, or/and, the internal operating frequencies of described TCAM;
Described processing module specifically for, realize in the following manner reduce/improve described chip to be monitored performance or/and capacity specifications:
Reduce/improve the access times of described TCAM; Or/and,
Improve/reduce the internal operating frequencies of described TCAM.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104536483A (en) * | 2014-12-11 | 2015-04-22 | 上海卓悠网络科技有限公司 | Communication terminal temperature control method and device |
| WO2016062069A1 (en) * | 2014-10-22 | 2016-04-28 | 中兴通讯股份有限公司 | Method and device for adjusting core voltage of chip |
| WO2016074383A1 (en) * | 2014-11-12 | 2016-05-19 | 中兴通讯股份有限公司 | Method and device for detecting fault in terminal |
| CN106713149A (en) * | 2015-11-12 | 2017-05-24 | 新华三技术有限公司 | Daughter card of router and wire clamp board |
| CN107562083A (en) * | 2017-08-25 | 2018-01-09 | 上海斐讯数据通信技术有限公司 | A kind of method and system for controlling router MCU temperature |
| CN112083752A (en) * | 2020-09-03 | 2020-12-15 | 索尔思光电（成都）有限公司 | Optical transceiving system, module and method based on self-adaptive voltage regulation |
| CN112859994A (en) * | 2021-01-11 | 2021-05-28 | 湖南国科微电子股份有限公司 | Voltage regulation method, device, equipment and medium of integrated chip |
| CN114448882A (en) * | 2020-11-04 | 2022-05-06 | 国家计算机网络与信息安全管理中心 | Design method for realizing high-performance and high-capacity routing equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359043A (en) * | 2000-12-18 | 2002-07-17 | 联想(北京)有限公司 | Method for reducing and controlling CPU-junction temp. |
| US20050071705A1 (en) * | 2003-09-29 | 2005-03-31 | Ati Technologies, Inc. | Adaptive temperature dependent feedback clock control system and method |
| US20080188994A1 (en) * | 2007-02-06 | 2008-08-07 | Singh Deepak K | Fan speed control from adaptive voltage supply |
| CN101673506A (en) * | 2008-09-11 | 2010-03-17 | 视频有限公司 | Maximization of performance of an electronic device by maintaining constant junction temperature independent of ambient temperature |
| CN101714824A (en) * | 2008-09-30 | 2010-05-26 | 洛克威尔自动控制技术股份有限公司 | Power electronic module igbt protection method and system |
| JP2013014096A (en) * | 2011-07-05 | 2013-01-24 | Ricoh Co Ltd | Ink jet printing device and overheating error detection method for the ink jet printing device |
-
2013
- 2013-11-21 CN CN201310595079.2A patent/CN103631361A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359043A (en) * | 2000-12-18 | 2002-07-17 | 联想(北京)有限公司 | Method for reducing and controlling CPU-junction temp. |
| US20050071705A1 (en) * | 2003-09-29 | 2005-03-31 | Ati Technologies, Inc. | Adaptive temperature dependent feedback clock control system and method |
| US20080188994A1 (en) * | 2007-02-06 | 2008-08-07 | Singh Deepak K | Fan speed control from adaptive voltage supply |
| CN101673506A (en) * | 2008-09-11 | 2010-03-17 | 视频有限公司 | Maximization of performance of an electronic device by maintaining constant junction temperature independent of ambient temperature |
| CN101714824A (en) * | 2008-09-30 | 2010-05-26 | 洛克威尔自动控制技术股份有限公司 | Power electronic module igbt protection method and system |
| JP2013014096A (en) * | 2011-07-05 | 2013-01-24 | Ricoh Co Ltd | Ink jet printing device and overheating error detection method for the ink jet printing device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016062069A1 (en) * | 2014-10-22 | 2016-04-28 | 中兴通讯股份有限公司 | Method and device for adjusting core voltage of chip |
| CN105589504A (en) * | 2014-10-22 | 2016-05-18 | 中兴通讯股份有限公司 | Method and device for adjusting chip core voltage |
| WO2016074383A1 (en) * | 2014-11-12 | 2016-05-19 | 中兴通讯股份有限公司 | Method and device for detecting fault in terminal |
| CN104536483A (en) * | 2014-12-11 | 2015-04-22 | 上海卓悠网络科技有限公司 | Communication terminal temperature control method and device |
| CN106713149A (en) * | 2015-11-12 | 2017-05-24 | 新华三技术有限公司 | Daughter card of router and wire clamp board |
| CN106713149B (en) * | 2015-11-12 | 2020-06-30 | 新华三技术有限公司 | Daughter card and wire clamping board of router |
| CN107562083A (en) * | 2017-08-25 | 2018-01-09 | 上海斐讯数据通信技术有限公司 | A kind of method and system for controlling router MCU temperature |
| CN112083752A (en) * | 2020-09-03 | 2020-12-15 | 索尔思光电（成都）有限公司 | Optical transceiving system, module and method based on self-adaptive voltage regulation |
| CN114448882A (en) * | 2020-11-04 | 2022-05-06 | 国家计算机网络与信息安全管理中心 | Design method for realizing high-performance and high-capacity routing equipment |
| CN112859994A (en) * | 2021-01-11 | 2021-05-28 | 湖南国科微电子股份有限公司 | Voltage regulation method, device, equipment and medium of integrated chip |
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