CN103627271A - Heat conductive coating - Google Patents
Heat conductive coating Download PDFInfo
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- CN103627271A CN103627271A CN201210309122.XA CN201210309122A CN103627271A CN 103627271 A CN103627271 A CN 103627271A CN 201210309122 A CN201210309122 A CN 201210309122A CN 103627271 A CN103627271 A CN 103627271A
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Abstract
The invention provides a heat conductive coating. The heat conductive coating contains a main resin, a spherical filler and a solvent and may also comprises an assistant; and the spherical filler contains a first grade filler, a second grade filler and a third grade filler, wherein the average particle size D1 of the first grade filler is 8-12mum, the average particle size D2 of the second grade filler is not lower than 0.9*0.414D1 and is not greater than 0.414D1, and the average particle size D3 of the third grade filler is not lower than 0.8*0.225D1 and is not greater than 0.225D1. In the heat conductive coating, fillers having different particle sizes are adopted as a heat conductive medium in a coating, and the particle sizes of the fillers are optimized according to the Hosifeld hexagonal filling theory, that is, a compact and effective heat conductive pathway having a consistent direction to a hot fluid is formed in a paint film through a powder grading method by selecting fillers having specific particle sizes, so the heat conduction efficiency of the coating is substantially improved, and the consumption of the fillers are effectively reduced, thereby the production cost is reduced.
Description
Technical field
The invention belongs to technical field of coatings, relate in particular to a kind of heat-conductive coating.
Background technology
Nowadays in various electrical equipment, electronics or mechanical means, comprise a lot of heat generating components, such as lighting transistor, CPU, battery and motor etc., and along with the progress of technology, the volume of these assemblies constantly reducing power also in continuous increase.Yet in increased power, its hear rate also significantly increases corresponding.If a large amount of hear rates can not distribute in time, the reliability of equipment will greatly be affected.According to statistics, in the factor that causes electronics to lose efficacy, temperature accounts for 55% (all the other factors are dust 6%, and humidity 19%, vibrates 20%), separately there is testing data to show: along with the increase of temperature, the failure rate of electronic devices and components is exponential growth, for some electron device, and 10 ℃ of the every risings of envrionment temperature, failure rate even can increase be twice above, and then in the reliability that has reduced in varying degrees equipment.So heat dissipation problem has become the hot topic that industry is manufactured, actively finds and study forward position and focus that advanced heat dissipation technology is current this field.
High thermal conductivity coating be a kind of not high for thermal conductivity own, but need radiating and cooling or need to strengthen the Novel heat-conducting material of the body surface of heat exchange, its be by filler and resin as basic material, additionally with suitable solvent and auxiliary agent, be in harmonious proportion formulated.But the actual thermal conductivity of the heat-conductive coating adopting in currently available technology is not high especially, its preparation method is also the adding proportion of selecting high thermal conductivity filler or improving heat conductive filler in coating mostly, causes the inevitable significantly rising of production cost.
A kind of high heat conduction organosilicon dip varnish is disclosed in CN101381583B, this impregnating varnish is mixed and made into mixed nitride aluminium powder stuffing by three kinds of average particle size particle size differences, the aluminium nitride powder simultaneously again with high thermal conductivity and high insulation characterisitic, then this mixed nitride aluminium powder stuffing is added in organosilicon performed polymer, add catalyzer and solidifying agent, ball milling mixes can obtain this heat conduction organosilicon dip varnish again.In this heat conduction organosilicon dip varnish, by selecting the heat conductive filler of different-grain diameter and ratio to mix, add, to expect to promote thermal conductivity, but because its given packing material size scope is too wide in range, make actual heat-conducting effect often not obvious even not good.
Summary of the invention
The poor technical problem of heat-conducting effect that the invention solves the heat-conductive coating existence existing in prior art, provides a kind of novel high thermal conductivity coating.
Technical scheme of the present invention is:
A heat-conductive coating, contains matrix resin, Ball-type packing, solvent, contains or does not contain auxiliary agent in described heat-conductive coating; In described Ball-type packing, contain one-level filler, three grades of fillers and three grades of fillers, wherein the median size D of one-level filler
1for 8-12 μ m, the median size D of secondary filler
2be 0.9 * 0.414D
1≤ D
2≤ 0.414D
1, the median size D of three grades of fillers
3be 0.8 * 0.225D
1≤ D
3≤ 0.225D
1.
In heat-conductive coating provided by the invention, by adopting the filler of multiple different-grain diameter as the heat-conducting medium in coating, and according to Hosfield six side's filling theories, the particle diameter of filler is further optimized, by powder grating method, select the filler of specified particle diameter to form closely knit effective, consistent with direction of heat flow thermal conducting path at paint film within, thereby can significantly promote the heat transfer efficiency of coating, can also effectively reduce the consumption of filler, thereby reduce production costs simultaneously.
Embodiment
The invention provides a kind of heat-conductive coating, in described heat-conductive coating, contain matrix resin, Ball-type packing, solvent, contain or do not contain auxiliary agent; In described Ball-type packing, contain one-level filler, three grades of fillers and three grades of fillers, wherein the median size D of one-level filler
1for 8-12 μ m, the median size D of secondary filler
2be 0.9 * 0.414D
1≤ D
2≤ 0.414D
1, the median size D of three grades of fillers
3be 0.8 * 0.225D
1≤ D
3≤ 0.225D
1.
The thermal conductivity of coating depends primarily on the acting in conjunction of resin and heat conductive filler; In currently available technology, conventional heat conductive filler has granular, sheet, the shape such as fibrous.The present inventor finds by lot of experiments, when heat conductive filler consumption hour, though filler can be uniformly dispersed in resin, can not form to each other contact and interact, so the thermal conductivity of material improves little; And when heat conductive filler consumption is increased to a certain threshold value, between filler, can be in contact with one another and interact, make to have formed in system the structural form of similar netted or chain, formed heat conduction network chain, now, when the orientation of heat conduction network chain is consistent with direction of heat flow, material thermal conductivity can be able to have a distinct increment; If but while not forming heat conduction network chain on direction of heat flow, filler can cause very large thermal resistance on the contrary on direction of heat flow, causes on the contrary material thermal conductivity energy variation.Therefore for obtaining highly thermally conductive polymeric matrix material, at the maximum heat conduction network chain of the inner formation of system, be the key that improves its thermal conductivity.
And under the situation of uncontrollable filler ordered state in paint film, spherical heat conductive filler is regarded as optimal stopping composition, so the filler adopting in the present invention is Ball-type packing.In theory, in the space producing toward homogeneous spheroidal particle, continuously fill the suitably bead of size, can obtain obturator very closely, but interstitital texture, with grain graininess is big or small, Interaction between particles is big or small and the variation of the condition of filling changes, is therefore difficult to obtain obturator completely closely in actual filling process.Obtain obturator closely, must suitably select the size of particle, thereby can guarantee fully contact by dense packing, to form good passage of heat.And in heat-conductive coating provided by the invention, just by adopting the filler of multiple different-grain diameter as the heat-conducting medium in coating, and according to Hosfield six side's filling theories, the particle diameter of filler is further optimized, by powder grating method, select the filler of specified particle diameter to form closely knit effective, consistent with direction of heat flow thermal conducting path at paint film within, thereby can significantly promote the heat transfer efficiency of coating.Particularly, in described Ball-type packing, contain one-level filler, secondary filler and three grades of fillers, wherein the median size D of one-level filler
1for 8-12 μ m, the median size D of secondary filler
2be 0.9 * 0.414D
1≤ D
2≤ 0.414D
1, the median size D of three grades of fillers
3be 0.8 * 0.225D
1≤ D
3≤ 0.225D
1.
In the present invention, because the particle diameter to filler is suitably selected, make filler can form good passage of heat in paint film, thereby there is good heat-conducting effect, therefore can significantly reduce the content of non-effective passage of heat region filler, thereby can reduce the consumption of described Ball-type packing, reduce coating cost.Under preferable case, the total mass of described heat-conductive coating of take is benchmark, and wherein the content of matrix resin is 30-40wt%, and the content of Ball-type packing is 15-30wt%, and the content of solvent is 40-55wt%.
In the present invention, the film-forming components that described matrix resin is paint film, it can adopt various resin systems conventional in prior art.Described matrix resin requires energy seasoning or low-temperature curing, has good weathering resistance, resistance to acids and bases and chemical resistance, the most important thing is to be conducive to the dispersion of Ball-type packing simultaneously, and is conducive to adhering between paint film and base material.Under preferable case, described matrix resin can be selected from one or more in acrylic resin, epoxy resin, Synolac, urethane resin, fluorocarbon resin, but is not limited to this.
In the present invention, only the particle diameter of filler is carried out to specific selection, and its kind is not had to particular requirement, described Ball-type packing can adopt various fillers conventional in prior art.According to aspect requirements such as actual thermal conductivity, coating application performance and cost control, under preferable case, in the present invention, one or more in the optional autoxidation zinc of described Ball-type packing, aluminum oxide, magnesium oxide, silicon carbide, boron nitride, aluminium nitride, but be not limited to this.The filler adopting is Ball-type packing.
In the present invention, the kind of described solvent can suitably be selected according to the difference of type of substrate and spraying environment.Common practise as those skilled in the art, described solvent must fully dissolve matrix resin, otherwise can have a strong impact on day dispersiveness in jail, secondly, the consumption of solvent is wanted to guarantee that coating has the viscosity of suitable spraying, in addition the evaporation rate of solvent is unsuitable too fast, otherwise can be unfavorable for the levelling of paint film.Generally, described solvent adopts one or more in ethyl acetate, butylacetate, propylene glycol monomethyl ether, butyl glycol ether, methyl iso-butyl ketone (MIBK), acetone, isophorone, dimethylbenzene, but is not limited to this.
In order to improve dispersiveness, elimination micro-bubble, the reduction coating surface tension force of filler in described heat-conductive coating, thereby improve thermal conductivity and the spraying adaptive of coating, as a kind of preferred implementation of the present invention, in described heat-conductive coating, also contain auxiliary agent.Described auxiliary agent is selected from one or more in dispersion agent, flow agent, defoamer.The content of described auxiliary agent is unsuitable too high, otherwise can reduce the relative content of matrix resin, filler, reduces its film forming and heat-conducting effect.Under preferable case, the total mass of described heat-conductive coating of take is benchmark, and the content of described auxiliary agent is 0.1-1wt%.Described auxiliary agent can directly adopt the various product that is purchased of the prior art, and the present invention is not particularly limited.
For guaranteeing the abundant closely knit filling of energy between each rank filler, meet again the actual complete processing of heat conductive filler supplier simultaneously, under preferable case, in described one-level filler, the particle diameter of 90% above particle is at its median size D
1in scope; In secondary filler, the particle diameter of 90% above particle is at its median size D
2in scope; In three grades of fillers, the particle diameter of 90% above particle is at its median size D
3in scope.
In the present invention, described secondary filler can be filled among the gap of one-level filler, and three grades of fillers can further be filled among the gap of one-level filler, secondary filler mixed system, further reduce the filler voidage in paint film, each rank filler can fully be contacted.According to Hosfield six side's filling theories, the mass ratio of one-level filler, secondary filler, three grades of fillers is preferably 1:(0.052-0.071): (0.012-0.023); Now can guarantee that each rank filler fully contacts, to form effective passage of heat.
As a kind of preferred implementation of the present invention, for further reducing the filler voidage in paint film, in described Ball-type packing, also contain level Four filler, the median size D of described level Four filler
4be 0.8 * 0.177D
1≤ D
4≤ 0.177D
1.It is also to calculate according to Hosfield six side's filling theories that the particle diameter of described level Four filler is selected.Further, according to Hosfield six side's filling theories, the mass ratio of one-level filler and level Four filler is 1:(0.023-0.044).In level Four filler, the particle diameter of 90% above particle is at its median size D
4in scope.
More preferably in situation, in described Ball-type packing, also contain Pyatyi filler, similarly, according to Hosfield six side's filling theories, the median size D of described Pyatyi filler
5be 0.8 * 0.116D
1≤ D
5≤ 0.116D
1.Further, according to Hosfield six side's filling theories, the mass ratio of one-level filler and Pyatyi filler is 1:(0.006-0.012).In Pyatyi filler, the particle diameter of 90% above particle is at its median size D
5in scope.
In the present invention, the preparation method of described heat-conductive coating is the conventional preparation method of art technology, comprises first auxiliary agent is scattered in solvent, then adds Ball-type packing, after mixing, finally adds resin, is stirred to system even, obtains described heat-conductive coating.
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Embodiment 1
Take according to the following ratio raw material:
Solvent: (25wt% dimethylbenzene, 15wt% butylacetate and 12.95wt% butyl glycol ether) 52.95wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 15wt%
Aluminum oxide (particle diameter 4 μ m) 1wt%
Aluminum oxide (particle diameter 2 μ m) 0.2wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating S1 of the present embodiment.
Embodiment 2
Take according to the following ratio raw material:
Solvent: (23wt% dimethylbenzene, 12wt% butylacetate and 10.35wt% butyl glycol ether) 45.35wt%
Auxiliary agent: dispersion agent: BYK 110 0.5wt%
Flow agent: TEGO Glide-410 0.25wt%
Defoamer: TEGO Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 22wt%
Aluminum oxide (particle diameter 4 μ m) 1.4wt%
Aluminum oxide (particle diameter 2 μ m) 0.4wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating S2 of the present embodiment.
Embodiment 3
Take according to the following ratio raw material:
Solvent: (25wt% dimethylbenzene, 15wt% butylacetate and 12.95wt% butyl glycol ether) 52.95wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminium nitride (particle diameter 10 μ m) 15wt%
Aluminium nitride (particle diameter 4 μ m) 1wt%
Aluminium nitride (particle diameter 2 μ m) 0.2wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating S3 of the present embodiment.
Comparative example 1
Take according to the following ratio raw material:
Solvent: (25wt% dimethylbenzene, 15wt% butylacetate and 12.95wt% butyl glycol ether) 52.95wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 16.2wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating DS1 of the present embodiment.
Comparative example 2
Take according to the following ratio raw material:
Solvent: 23wt% dimethylbenzene, 12wt% butylacetate and 10.35wt% butyl glycol ether) 45.35wt%
Auxiliary agent: dispersion agent: BYK 110 0.5wt%
Flow agent: TEGO Glide-410 0.25wt%
Defoamer: TEGO Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 23.8wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating DS2 of the present embodiment.
Comparative example 3
Take according to the following ratio raw material:
Solvent: (25wt% dimethylbenzene, 15wt% butylacetate and 12.95wt% butyl glycol ether) 52.95wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 15wt%
Aluminum oxide (particle diameter 5 μ m) 1wt%
Aluminum oxide (particle diameter 1 μ m) 0.2wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating DS3 of the present embodiment.
Embodiment 4
Take according to the following ratio raw material:
Solvent: (23wt% dimethylbenzene, 12wt% butylacetate and 9.65wt% butyl glycol ether) 44.65wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 22wt%
Aluminum oxide (particle diameter 4 μ m) 1.4wt%
Aluminum oxide (particle diameter 2 μ m) 0.4wt%
Aluminum oxide (particle diameter 1.6 μ m) 0.7wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating S4 of the present embodiment.
Embodiment 5
Take according to the following ratio raw material:
Solvent: (23wt% dimethylbenzene, 12wt% butylacetate and 9.45wt% butyl glycol ether) 44.45wt%
Auxiliary agent: dispersion agent: BYK(Bi Ke) 110 0.5wt%
Flow agent: TEGO(enlightening is high) Glide-410 0.25wt%
Defoamer: TEGO(enlightening is high) Foamex N 0.1wt%
Ball-type packing: aluminum oxide (particle diameter 10 μ m) 22wt%
Aluminum oxide (particle diameter 4 μ m) 1.4wt%
Aluminum oxide (particle diameter 2 μ m) 0.4wt%
Aluminum oxide (particle diameter 1.6 μ m) 0.7wt%
Aluminum oxide (particle diameter 1 μ m) 0.2wt%
Matrix resin: monocomponent polyurethane resin 30wt%
According to said ratio, first auxiliary agent is scattered in solvent, stir 5min, then add Ball-type packing, stir 10min, finally add matrix resin, stir 30min, obtain the heat-conductive coating S5 of the present embodiment.
Performance test
Each heat-conductive coating S1-S5 and DS1-DS3 are sprayed respectively to the plastics disk surfaces with diameter 3cm, thickness 2mm, and after spraying, thickness is 30 μ m, solidifies 30min at 60 ℃, forms corresponding paint film S10-S50 and DS10-DS30.Then the thermal conductivity that adopts the FYDP-4 type thermal conductivity detector of Jilin Feng Yuan sophisticated electronics company to test each paint film sample.Test result is as shown in table 1.
Table 1
From the test result of S10-S50 and DS10-DS20, relatively can find out, in the present invention, adopt the mixed fillers system of different-grain diameter grating as the heat conductive filler in coating, it is compared to the single particle size heat conductive filler in DS10-DS20, and thermal conductivity promotes comparatively obvious.
From the test result of S10 and DS30, relatively can find out, when in filler, each diameter of particle is selected not according to rule of the present invention and arbitrarily adds, its lifting for paint film thermal conductivity is less.
From the test result of S20 and S10, relatively can find out, when in coating, the consumption of Ball-type packing increases, the paint film thermal conductivity obtaining can obviously promote.
From the test result of S30 and S10, relatively can find out, when adopting aluminium nitride that self thermal conductivity is higher as filler, paint film thermal conductivity is higher.
From the test result of S20 and S30, relatively can find out, for example, when adopting the filler (aluminum oxide) of common thermal conductivity, increase its consumption and also can reach the heat-conducting effect for example, with expensive high thermal conductivity filler (aluminium nitride) approaching, those skilled in the art can suitably select from cost aspect.
From the test result of S10 and DS20, relatively can find out, in heat-conductive coating provided by the invention, by the particle diameter to filler, suitably select, can under the prerequisite that reduces amount of filler, still reach approaching heat-conducting effect, can effectively reduce costs.
From the test result of S40, S50 and S20, relatively can find out, in little amplitude, increase under the prerequisite of amount of filler ratio, increase the progression of filler, can make to fill between filler more closely knit, thereby further increase the heat-conducting effect of heat-conductive coating provided by the invention.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a heat-conductive coating, is characterized in that, contains matrix resin, Ball-type packing, solvent, contains or do not contain auxiliary agent in described heat-conductive coating; In described Ball-type packing, contain one-level filler, three grades of fillers and three grades of fillers, wherein the median size D of one-level filler
1for 8-12 μ m, the median size D of secondary filler
2be 0.9 * 0.414D
1≤ D
2≤ 0.414D
1, the median size D of three grades of fillers
3be 0.8 * 0.225D
1≤ D
3≤ 0.225D
1.
2. heat-conductive coating according to claim 1, is characterized in that, the total mass of described heat-conductive coating of take is benchmark, and wherein the content of matrix resin is 30-40wt%, and the content of Ball-type packing is 15-30wt%, and the content of solvent is 40-55wt%.
3. heat-conductive coating according to claim 1 and 2, it is characterized in that, one or more in described matrix resin acrylic resin, epoxy resin, Synolac, urethane resin, fluorocarbon resin, described Ball-type packing is selected from one or more in zinc oxide, aluminum oxide, magnesium oxide, silicon carbide, boron nitride, aluminium nitride, and described solvent is selected from one or more in ethyl acetate, butylacetate, propylene glycol monomethyl ether, butyl glycol ether, methyl iso-butyl ketone (MIBK), acetone, isophorone, dimethylbenzene.
4. heat-conductive coating according to claim 1, is characterized in that, the total mass of described heat-conductive coating of take is benchmark, and wherein the content of auxiliary agent is 0.1-1wt%; Described auxiliary agent is selected from one or more in dispersion agent, flow agent, defoamer.
5. heat-conductive coating according to claim 1, is characterized in that, in described one-level filler, the particle diameter of 90% above particle is at its median size D
1in scope; In secondary filler, the particle diameter of 90% above particle is at its median size D
2in scope; In three grades of fillers, the particle diameter of 90% above particle is at its median size D
3in scope.
6. heat-conductive coating according to claim 1 or 5, is characterized in that, the mass ratio of one-level filler, secondary filler, three grades of fillers is 1:(0.052-0.071): (0.012-0.023).
7. heat-conductive coating according to claim 1, is characterized in that, also contains level Four filler, the median size D of described level Four filler in described Ball-type packing
4be 0.8 * 0.177D
1≤ D
4≤ 0.177D
1; The mass ratio of one-level filler and level Four filler is 1:(0.023-0.044).
8. heat-conductive coating according to claim 7, is characterized in that, in level Four filler, the particle diameter of 90% above particle is at its median size D
4in scope.
9. heat-conductive coating according to claim 7, is characterized in that, also contains Pyatyi filler, the median size D of described Pyatyi filler in described Ball-type packing
5be 0.8 * 0.116D
1≤ D
5≤ 0.116D
1; The mass ratio of one-level filler and Pyatyi filler is 1:(0.006-0.012).
10. heat-conductive coating according to claim 9, is characterized in that, in Pyatyi filler, the particle diameter of 90% above particle is at its median size D
5in scope.
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| CN104592831A (en) * | 2015-01-13 | 2015-05-06 | 苏州环明电子科技有限公司 | Heat-conducting coating and preparation method of heat-conducting film |
| CN104861821A (en) * | 2015-04-30 | 2015-08-26 | 佛山市禾才科技服务有限公司 | Anticorrosive heat dissipation coating and production method thereof |
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| CN104592831A (en) * | 2015-01-13 | 2015-05-06 | 苏州环明电子科技有限公司 | Heat-conducting coating and preparation method of heat-conducting film |
| CN104861821A (en) * | 2015-04-30 | 2015-08-26 | 佛山市禾才科技服务有限公司 | Anticorrosive heat dissipation coating and production method thereof |
| CN106433421A (en) * | 2016-10-26 | 2017-02-22 | 安徽飞达电气科技有限公司 | Oily heat dissipation coating for thin-film capacitor casing and preparation method of heat dissipation coating |
| CN106947375A (en) * | 2017-04-13 | 2017-07-14 | 江门市德佑金属材料实业有限公司 | A kind of heat-conductive coating and its preparation and the aluminum matrix composite with its overlay film |
| CN107189665A (en) * | 2017-07-07 | 2017-09-22 | 东莞市德聚胶接技术有限公司 | Heat-conductive coating, heat conduction film and preparation method thereof |
| CN110484063A (en) * | 2019-07-08 | 2019-11-22 | 马春江 | A kind of plate quick-frozen honeycomb coating and its smearing method |
| CN110484063B (en) * | 2019-07-08 | 2021-10-22 | 苏州市东挺河智能科技发展有限公司 | Quick-frozen honeycomb coating for plates and coating method thereof |
| CN115335487A (en) * | 2020-03-31 | 2022-11-11 | 3M创新有限公司 | Heat-conducting electromagnetic absorption material |
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| US11985805B2 (en) | 2021-03-23 | 2024-05-14 | 3M Innovative Properties Company | Thermally conductive electromagnetically absorptive material |
| CN115260899A (en) * | 2022-07-28 | 2022-11-01 | 广东美的白色家电技术创新中心有限公司 | Hydrophobic coating and preparation method and application thereof |
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