CN103625029A

CN103625029A - Graphene heat-conducting device

Info

Publication number: CN103625029A
Application number: CN201310603456.2A
Authority: CN
Inventors: 许子寒
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-11-25
Filing date: 2013-11-25
Publication date: 2014-03-12

Abstract

The invention discloses a structure of a graphene heat-conducting device and a fabrication method of the graphene heat-conducting device. A protective film/grapheme/metal foil/grapheme adhesion layer or a protective film/grapheme/metal foil/grapheme/adhesion layer/grapheme/metal foil/grapheme adhesion layer is adopted to form a graphene heat conducting and homogenizing film. The heat conducting and homogenizing capacity of the metal foil can be effectively improved, the electronic device can be effectively improved, especially, heat management for consumer electronics is improved, therefore, the chip life and the consumption experience are improved.

Description

A kind of Graphene heat-transfer device

Technical field

The invention belongs to Heat Conduction Material and devices field.

Background technology

The device of various devices, especially electronic applications all can produce certain heat when work, and the temperature of device work is raise, and affects service efficiency and the life-span of device.

At present, Heat Conduction Material is all widely used in various industrial circles, but due to the restriction of thermal conductivity, heat conduction and heat radiation effect is unsatisfactory, has limited the design of device or system.Especially in electronic industry, design of electronic circuits integrated, trend toward miniaturization is more and more obvious, the requirement of high-performance heat conduction and heat radiation material is also more and more higher, demand is also increasing.But mostly traditional heat conduction and heat radiation material is take metal or graphite, as basic material, manufacture, can not meet electronic industry for the demand of heat conduction and heat radiation at present.

The transverse thermal conductivity of Graphene is up to 5300W*K ^-1* M ^-1, be about copper (400 W*K ^-1* M ^-1) 13 times, native graphite (500 W*K ^-1* M ^-1) 10 times, be the current known the highest material of thermal conductivity in the world, be very suitable for thermal conductivity to require harsh field.

Summary of the invention

Design and its implementation of the object of this invention is to provide a kind of Graphene heat-transfer device, be applied to heat conduction field but be not limited to heat conduction and heat radiation field.

A kind of Graphene heat-transfer device the present invention relates to, comprising:

Metal level, for catalytic growth graphene film;

Graphene layer, grows in the upper and lower surface of metal level, for hot cross conduction;

Adhesion layer, for adhering to the device surface of graphene layer and required attaching, and for adhering to graphene layer and graphene layer;

Diaphragm, is not destroyed for the protection of Graphene.

Further, the metallic substrates for growing graphene of using can be a kind of, the two kinds or more of alloys of copper, nickel, iron, cobalt, aluminium, zinc, silver, rhodium, ruthenium;

Further, the metallic substrates thickness of use need to be below 0.5 millimeter;

Further, the graphene layer using is to be directly grown on metal, and the number of plies is at 30 below atomic layer;

Further; can use " adhesion layer/Graphene/metal level/Graphene/diaphragm " structure; also can, using " adhesion layer/Graphene/metal level/Graphene " structure as elementary cell, by accumulating the mode of two or more unit, strengthen the equal thermal effect of this device.

accompanying drawing explanation:

Accompanying drawing 1: Graphene heat conducting film basic block diagram.

Accompanying drawing 2: composite graphite alkene heat conduction film structure figure.

the specific embodiment:

Below in conjunction with specific embodiments and the drawings, the present invention is further described in detail, but the present invention is not limited to following specific embodiment.

Embodiment 1:

As shown in Figure 1, use " plastic protective film for plastics 10/ Graphene 11/ metal forming 12/ Graphene 13/ adhesion layer 14 " structure, form heat conducting film, concrete manufacturing process is as follows:

Step 1, preparation metal foil, metal foil thickness is less than 100 microns, and the material of metal foil is a kind of, the two kinds or more of alloys in copper, nickel, iron, cobalt, aluminium, zinc, silver, rhodium, ruthenium;

Step 2, in metal foil upper and lower surface, carry out the growth of Graphene, can be by the method for chemical vapour deposition (CVD), the method that also can apply by solution is carried out the growth of Graphene, and the Graphene required thickness of growing is at 50 below carbon atom;

Step 3, in growth, there is the metal foil upper surface gluing of Graphene, form tack coat, preferentially select hot-setting adhesive, adhesive sticker and pressure sensitive adhesive;

Step 4, in growth, there is the metal foil lower surface of Graphene to cover ambroin diaphragm, preferably pet film;

Step 3 and step 4 can be exchanged.

Embodiment 2:

As shown in Figure 2, use " adhesion layer/Graphene/metal level/Graphene " elementary cell, form and contain double layer of metal paper tinsel, the heat conducting film of four layer graphenes.Concrete manufacturing process is as follows:

Step 1: prepare metal foil, metal foil thickness is less than 100 microns, and the material of metal foil is a kind of, the two kinds or more of alloys in copper, nickel, iron, cobalt, aluminium, zinc, silver, rhodium, ruthenium;

Step 2: in metal foil upper and lower surface, carry out the growth of Graphene, can be by the method for chemical vapour deposition (CVD), the method that also can apply by solution is carried out the growth of Graphene, and the Graphene required thickness of growing is at 50 below carbon atom;

Step 3: have the metal foil upper surface gluing of Graphene in growth, form tack coat;

Step 4: another sheet is not had to gluing, growth has the one side of metal foil of Graphene to adhere on the Graphene metal foil of gluing, forms Graphene 21/ metal foil 22/ Graphene 23/ tack coat 24/ Graphene 25/ metal foil 26/ Graphene 27 composite constructions;

Step 5, applies glue-line at the Graphene place of the composite construction lower surface forming, and forms tack coat 28;

Step 6: cover ambroin diaphragm 20 at the composite construction upper surface forming, preferably pet film.

Step 5 and step 6 can be exchanged.

Claims

1. a Graphene heat-transfer device, is characterized in that: by Graphene and metal foil, form conducting-heat elements, make diaphragm and gluing layer, respectively as insulating protective layer and adhesion layer in upper and lower surface.

2. according to the Graphene heat-transfer device described in right 1, it is characterized in that: heat-transfer device structure is diaphragm/Graphene/metal foil/Graphene/adhesion layer or diaphragm/Graphene/metal foil/Graphene/adhesion layer/Graphene/metal foil/Graphene adhesion layer.

3. according to the Graphene heat-transfer device described in right 1, it is characterized in that: the metal foil substrate for growing graphene of using can be a kind of, the two kinds or more of alloys of copper, nickel, iron, cobalt, aluminium, zinc, silver, rhodium, ruthenium, and foil thickness is below 0.5 millimeter.

4. according to the Graphene heat-transfer device described in right 1, it is characterized in that: the graphene layer using is to be directly grown in metal foil upper and lower surface, the number of plies is at 30 below atomic layer.