CN103622692B - Palm impedance frequency spectrum measurement instrument based on resonant frequency - Google Patents
Palm impedance frequency spectrum measurement instrument based on resonant frequency Download PDFInfo
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- CN103622692B CN103622692B CN201310567949.5A CN201310567949A CN103622692B CN 103622692 B CN103622692 B CN 103622692B CN 201310567949 A CN201310567949 A CN 201310567949A CN 103622692 B CN103622692 B CN 103622692B
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Abstract
The invention discloses a palm impedance frequency spectrum measurement instrument based on resonant frequency. The input end of a frequency sweeping sinusoidal signal generator module is connected with a single chip microcomputer core module, the output end of the frequency sweeping sinusoidal signal generator module is connected with the input end of a V/I conversion module, the output end of the V/I conversion module is connected with the input end of an inductance matching module and one input end of a peak-to-peak value detection module, and the output end of the inductance matching module is connected with a relay control measuring electrode switching module connected with the input end of palm tissue. The other input end of the peak-to-peak value detection module is connected to the output end of the palm tissue, and the output end of the peak-to-peak value detection module is connected with the single chip microcomputer core module. The single chip microcomputer core module is connected with the input end of a PC through an I/O port to finish data transmission. The measurement instrument is simple, low in cost, harmless to a human body, free of special work environment requirements and convenient to check.
Description
Technical field
The technology of the present invention belongs to biometrics identification technology and medical electronics field, relates to a kind of palm impedance spectrum measuring instrument based on resonant frequency.
Background technology
Living things feature recognition (Biometrics) is a kind of technology of carrying out personal identification based on the intrinsic physiological characteristic of human body or behavioural characteristic.Because many physiological characteristics of people are inherent, unique, and usually with lifelong, there is very high antifalsification and stability, therefore it is believed that living things feature recognition will be one more reliably, identification means easily and efficiently.
Physiological characteristic for bio-identification has face, iris, fingerprint, palmmprint, vein etc., and behavioural characteristic has person's handwriting, sound etc.Based on these physiological characteristics of human body, people have studied the polymorphic biological characteristic integration technologies such as recognition of face, fingerprint recognition, iris recognition, hand vein recognition, voice recognition, person's handwriting identification and fingerprint/vocal print, face/iris, face/fingerprint/hand shape.
But mostly the biometrics identification technology that Most current is known is based on two dimension or three-dimensional image acquisition and process.Such as, most of biological characteristic is all form picture signal by optical pickocff as fingerprint, face, vein etc., needs illumination condition; Fingerprint easily weares and teares and copies, and iris recognition needs expensive focusing camera, and retina identification laser perspective used can be detrimental to eye health, and person's handwriting identification, voice recognition error rate are high.These unfavorable factors constrain the further application of current biological feature identification technique.
Research shows, the electrical conductivity of biological tissue and capacitivity can change along with change of frequency, and different tissues has different frequency characteristics, and different individualities equally also has different frequency characteristics.The essential structure unit of tissue is cell.Cell dipping bath is among extracellular fluid, and cell is then made up of cell membrane and intracellular fluid.Extracellular fluid, intracellular fluid contain different kinds of ions, have electric conductivity, and its electrical properties, close to resistance, has impedance; And cell membrane main component is lipid bilayer and protein, without D.C. electrical conductivity, but by alternating current, can electric capacity be equivalent to, there is capacitive reactance.The concept of biological tissue three element equivalent model is finally proposed by more early stage scientist's theories.Equivalent model figure is shown in Fig. 1.
Bio-electrical impedance spectrum scanning technique (Bioelectrical Impedance Spectroscopy BIS) refers to the change of frequency of complex impedance with applied driving current of biological tissue, can there is respective change in its real, imaginary part, and have larger difference for the different this change forms of expression of organizing.This species diversity may be used for distinguishing normal structure and pathological tissues, and therefore bio-electrical impedance spectral technology has consequence at biomedical engineering field.But, can be found by the R-C tri-element equivalent-circuit model of impedance spectrum characteristic, not only there is resistance characteristic in biological tissue, also there is capacitance characteristic, from circuit resonance principle, biological tissue is connected with perceptual device, amplitude is applied to it identical, during the sinusoidal alternating current that frequency increases progressively within the specific limits, a bit will resonate at certain, the difference according to resonance point curve can distinguish different bions.Therefore, the electrical impedance of biological tissue contains by the biological characteristic can distinguishing individual difference in composing.
Human body palm can be equivalent to a complicated impedance network, and the personal characteristics such as palm structure, size, vascular distribution of Different Individual varies, and therefore, the electrical impedance spectral property of each organism palm is also unique.
Based on analysis above, inventive technique provides for a set of hand identification device based on resonant frequency impedance spectrum.This principle of device is, biological tissue is connected with perceptual device, frequency sweep AC signal is applied to the palm of human body, series of voltage data are gathered by data acquisition unit, find corresponding resonance point, by setting up a palm impedance spectrum database, and realize palm living things feature recognition by feature extraction and characteristic matching.
Summary of the invention
Order of the present invention is to provide a set of palm impedance spectrum measuring instrument based on resonant frequency method, measures palm impedance spectrum data and carry out analyzing the identity identifying organism by resonance method.
The present invention includes single-chip core core module, power module, sweep sine generator module, voltage/current modular converter, peak-to-peak value detection module, inductance matching circuit module, Control measurement electrode commutation circuit module and PC.The input of sweep sine generator module and monolithic microcomputer kernel model calling, the output of sweep sine generator module is connected with V/I modular converter input, the output of V/I modular converter is connected with an input of inductance matching module input, peak-to-peak value detection module, inductance matching module output is connected with Control measurement electrode handover module, and Control measurement electrode handover module connects the input of palm tissue.Another input of peak-to-peak value detection module is connected to the output of palm tissue, and the output of peak-to-peak value detection module is connected to single-chip core core module.Single chip microcomputer core module has been connected data by I/O mouth with PC input and has transmitted.
The invention has the beneficial effects as follows, this is a kind of portable checkout gear, this resonance frequency test method is harmless, without particular job environmental requirement, it is convenient to check, and device is simple, with low cost, the method can as one identification easily and efficiently, also can as the important supplement being enough other living things feature recognition.
Accompanying drawing explanation
Three element equivalent-circuit models of Tu1Shi biological tissue;
Fig. 2 is the structural representation of instrument of the present invention;
Fig. 3 is the monolithic microcomputer kernel module principle figure of instrument of the present invention;
Fig. 4 is the power module circuitry schematic diagram of instrument of the present invention;
Fig. 5 is the sweep sine circuit for generating schematic diagram of instrument of the present invention;
Fig. 6 is the V/I change-over circuit schematic diagram of instrument of the present invention;
Fig. 7 is the inductance match circuit figure of instrument of the present invention;
Fig. 8 is the peak-to-peak value testing circuit schematic diagram of instrument of the present invention;
Fig. 9 is the Control measurement electrode commutation circuit schematic diagram of instrument of the present invention;
Figure 10 is the system control process figure of instrument of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the technology of the present invention is described in detail.
As Fig. 2, it is the structural representation of instrument of the present invention.The palm impedance spectrum measuring instrument that the present invention is based on resonant frequency method comprises: single-chip microcomputer single core module 1.; Sweep sine generator module 2.; V/I modular converter 3.; Inductance matching module 4.; Control measurement electrode handover module 5.; Peak-to-peak value detection module 6.; PC 7.; Inductance matching module is pointed by Control measurement electrode commutation circuit be connected with the center of palm, five of finger.
As Fig. 3, for the monolithic microcomputer kernel module principle figure of instrument of the present invention, one-chip computer module is the master control system that acp chip is formed by STM32, and single-chip core core module comprises singlechip chip IC0, the tenth chip IC 10, second crystal oscillator X2, the 3rd crystal oscillator X3, the tenth inductance L the 10, the 22 resistance R22, the 32 electric capacity C32, the 33 electric capacity C33, the 34 electric capacity C34, the 35 electric capacity C35, the 36 electric capacity C36, the 37 electric capacity C37, the 38 electric capacity C38, the 39 electric capacity C39.Singlechip chip IC0 is totally 64 pins, and 1 pin of singlechip chip IC0 is connected with+5V power supply.3 pins of singlechip chip IC0 are connected with one end of one end of the 32 electric capacity C32, the second crystal oscillator X2.The other end ground connection of the 32 electric capacity C32, the other end of the second crystal oscillator X2 is connected with one end of 4 pins of singlechip chip IC0, the 33 electric capacity C33.The other end ground connection of the 33 electric capacity C33.5 pins of singlechip chip IC0 are connected with one end of the 22 resistance R22, one end of the 3rd crystal oscillator X3, one end of the 34 electric capacity.6 pins of singlechip chip IC0 are connected with the other end of the 22 resistance R22, the other end of the 3rd crystal oscillator X3, one end of the 35 electric capacity C35.The other end ground connection of the 34 electric capacity C34.The other end ground connection of the 35 electric capacity C35.The 11st pin ground connection of singlechip chip IC0.13 pins of singlechip chip IC0 are connected with one end of the 37 electric capacity C37, the anode of the 36 electric capacity C36, one end of the tenth inductance L 10.The negativing ending grounding of the 36 electric capacity C36, the other end ground connection of the 37 electric capacity C37, the other end of the tenth inductance L 10 is connected with 3 pins of the tenth chip IC 10, the anode of the 39 electric capacity C39.The negativing ending grounding of the 39 electric capacity C39.1 pin of the tenth chip IC 10 is connected with the anode of+5V power supply, the 38 electric capacity C38.The negativing ending grounding of the 38 electric capacity, 2 pin ground connection of the tenth chip IC 10.20 pins of singlechip chip IC0,36 pins, 26 pins, 42 pins, 27 pins are connected with 5 outputs W1, W2, W3, W4, W5 of Control measurement electrode handover module respectively.52 pins of singlechip chip IC0,5 pins, 53 pins, 6 pins, 60 pins, 13 pins, 19 pins, 35 pins are connected with 4 pins of sweep sine generator module the 4th chip IC4,3 pins, 2 pins, 1 pin, 28 pins, 27 pins, 26 pins, 25 pins respectively.43 pins of singlechip chip IC0 are connected with 14 pins with 1 pin of peak-to-peak value detection module the 7th chip IC 7, the 8th chip IC 8.16 pins of singlechip chip IC0,24 pins, 32 pins, 49 pins, 50 pins, 51 pins, 54 pins, 57 pin ground connection.The model that described singlechip chip IC0 selects is the low power processor STM32F103RBT6 that ST Microelectronics produces, and the model that 3.3V power supply voltage stabilizing chip IC 10 is selected is AME1117.
As Fig. 4, for the power module circuitry schematic diagram of instrument of the present invention, power module comprises the first chip IC 1, second chip IC 2, the 3rd chip IC 3, first variable resistor R1, the first inductance L 1, first Schottky diode D1, the first electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3, the 4th electric capacity C4, the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8, the 9th electric capacity C9, the tenth electric capacity C10, the 11 electric capacity C11, the 12 electric capacity C12, the 13 electric capacity C13.1 pin of the first chip IC 1 is connected with the positive pole of one end of the first electric capacity C1, the 3rd electric capacity C3, the other end ground connection of the first electric capacity C1, the minus earth of the 3rd electric capacity C3.2 pins of the first chip IC 1 are connected with 1 pin of the second chip IC 2.3 pins of the first chip IC 1 are connected with one end of the positive pole of the 5th electric capacity, the 7th electric capacity, the minus earth of the 5th electric capacity C5, the other end ground connection of the 7th electric capacity C7.2 pins of the second chip IC 2 are connected with the negative pole of one end of the second electric capacity C2, the 4th electric capacity C4, the other end ground connection of the second electric capacity C2, the plus earth of the 4th electric capacity.3 pins of the second chip IC 2 are connected with one end of the negative pole of the 6th electric capacity C6, the 8th electric capacity C8, the plus earth of the 6th electric capacity C6, the other end ground connection of the 8th electric capacity.1 pin of the 3rd chip IC 3 is connected with one end of the 11 electric capacity C11, the other end of the 11 electric capacity C11 and 8 pins of the 3rd chip IC 3, the negative electrode of the first diode D1, one end of first inductance L 1 is connected, the plus earth of the first diode D1, the other end of the first inductance L 1 and one end of the 12 electric capacity C12, the positive pole of the 13 electric capacity C13, first variable-resistance one end is connected, the other end ground connection of the 12 electric capacity C12, the minus earth of the 13 electric capacity C13, the other end of the first variable resistor R1 is connected with 4 pins of the 3rd chip IC 3, the adjustable resistance end ground connection of the first variable resistor R1.7 pins of the 3rd chip IC 3 are connected with one end of one end of the 9th electric capacity C9, the tenth electric capacity C10, the other end ground connection of the 9th electric capacity C9, the other end ground connection of the tenth electric capacity C10.6 pin ground connection of the 3rd chip IC 3,2 pins, 3 pins, 5 pins are all unsettled.The model of the first described chip IC 1 is LM7812, and the model of the second chip IC 2 is LM7912, and the model of the 3rd chip IC 3 is TPS5450.
Step-down chip IC 1 of the present invention and IC2 are used for external power supply
+15V is reduced to
+it is+5V voltage that 12V, power conversion chip U3 are used for+12V voltage transitions.
+15V power supply is that peak-to-peak value detection module is powered,
+12V power supply is that V/I change-over circuit is powered, and+5V power supply is that slave computer and swept signal generator circuit are powered.Wherein, in power module circuitry, step-down chip IC 1 and IC2 select LM7812 and LM7912, respectively
+15V power supply is reduced to
+12V power supply; Power conversion chip IC3 selects TPS5450, can be+5V power supply by+12V Power convert.
As Fig. 5, for sweep sine generator circuit schematic diagram, its voltage sinusoidal signal acting as output different frequency, sweep sine generator module comprises the 4th chip IC4, the first crystal oscillator X1, the second adjustable resistance R2, the 3rd resistance R3, the 4th resistance R4, the 5th resistance R5, the second inductance L 2, the 3rd inductance L 3, the 4th inductance L the 4, the 14 electric capacity C14, the 15 electric capacity C15, the 16 electric capacity C16, the 17 electric capacity C17, the 18 electric capacity C18, the 19 electric capacity C19, the 20 electric capacity C20, the 21 electric capacity C21.1 pin of the 4th chip IC4,2 pins, 3 pins, 4 pins, 25 pins, 26 pins, 27 pins, 28 pins successively with 8 I/O mouths of single-chip microcomputer: C1, C2, C3, C4, C5, C6, C7, C8 are connected.5th pin ground connection, the 6th pin connects+5V power supply, and the 7th pin connects the W_CLK pin of single-chip microcomputer, and the 8th pin connects the FQ_UD pin of single-chip microcomputer.9th pin connects 3 pins of the first crystal oscillator X1, and 1 pin of the first crystal oscillator X1 is unsettled, the 2 pin ground connection of the first crystal oscillator X1, and 4 pins of the first crystal oscillator connect+5V power supply.The 10 pin ground connection of the 4th chip IC4,11 pins meet+5V, and 12 pins connect one end of the 3rd resistance R3, the other end ground connection of the 3rd resistance R3.13 pins, 14 pins of the 4th chip IC4 are unsettled, 15th pin connects one end of the 14 electric capacity C14, the adjustable resistance end of the second adjustable resistance R2, the other end ground connection of the 14th electric capacity C14, one end ground connection of the second adjustable resistance R2, another termination+5V power supply of the second adjustable resistance.The 24 pin ground connection of the 4th chip IC4,23 pins connect+5V power supply, 22 pins connect the RESET pin of single-chip microcomputer, one end of 21 pins connection the 4th resistance R4, one end of the second inductance L 2, one end of the 15 electric capacity C15, one end of the 16 electric capacity C16, the other end of the 4th resistance R4, the other end ground connection of the 15 electric capacity.The other end of the 16 electric capacity C16, the other end of the second inductance L 2 are connected with one end of the 17 electric capacity C17, the 18 electric capacity C18, the 3rd inductance L 3, the other end ground connection of the 17 electric capacity C17.One end of the other end of the 3rd inductance L 3, the other end of the 18 electric capacity C18 and the 19 electric capacity C19, one end of the 20 electric capacity C20, one end of the 4th inductance L 4 are connected, the other end ground connection of the 19 electric capacity C19.One end of the other end of the 4th inductance L 4, the other end of the 20 electric capacity C20 and the 21 electric capacity C21, one end of the 5th resistance R5, the 16th pin, SIA are connected, the other end ground connection of the 21 electric capacity C21, the other end ground connection of the 5th resistance R5.17th pin, 20 pins are unsettled, the 19th pin ground connection, and the 18th pin connects+5V power supply.The model of the 4th described chip IC4 is that AD company produces DDS chip AD9850.
As Fig. 6, for V/I change-over circuit schematic diagram, the input of this circuit connects the output of sweep sine circuit for generating, be that constant current exports by the photovoltaic conversion that sweep sine circuit for generating exports, V/I modular converter comprises the 5th chip IC 5, the 6th chip IC 6, the 6th resistance R6, the 7th resistance R7, the 8th resistance R8, the 9th resistance R9, the 22 electric capacity C22, the 23 electric capacity C23, the 24 electric capacity C24, the 25 electric capacity C25.1 pin of the 5th chip IC 5 is connected with one end of the 22 electric capacity C22, the output SIA of sweep sine generator module.One end of 6 pins of the other end of the 22 electric capacity C22 and 4 pins of the 5th chip IC 5, the 6th chip IC 6,7 pins, the 8th resistance R8 is connected.The other end of the 8th resistance R8 is connected with 3 pins of the 6th chip IC 6, one end of the 24 electric capacity C24, the other end ground connection of the 24 electric capacity C24.2 pins of the 5th chip IC 5 connect-12V power supply, and 3 pins are unsettled.5 pins of the 5th chip IC 5 are connected with one end of 6 pins, the 9th resistance R9, and the other end of the 9th resistance R9 is connected with 5 pins of the 6th chip IC 6, one end of the 25 electric capacity C25, the other end of the 25 electric capacity and exports Iout.7 pins of the 5th chip IC 5 are connected with+12V power supply.8 pins of the 5th chip IC 5 are connected with 1 pin of the 6th chip IC 6, one end of the 6th resistance R6, one end of the 23 electric capacity C23, the other end of the 6th resistance R6, the other end of the 23 electric capacity C23 are connected with 2 pins of the 6th chip IC 6, one end of the 7th resistance R7, the other end ground connection of the 7th resistance R7.4 pins of the 6th chip IC 6 are connected with-12V power supply, and the 8th pin is connected with+12V power supply.The model of the 5th described chip IC 5 is the high speed gauges amplifier chip AD8130 that AD company produces, and the model of the 6th chip IC 6 is that AD company produces Fast FET amplifier AD8066.
As Fig. 7, for the inductance match circuit figure of instrument of the present invention, be used for mating with the capacitive reactances of palm tissue equivalence, thus resonance can be there is under CF, voltage obtains minimum of a value, Lin is the output that input connects voltage/circuit conversion circuit, and Lout connects palm tissue just can measure resonance data.Inductance matching module comprises Lin interface, Lout interface, the 5th inductance L 5, the 6th inductance L 6, the 7th inductance L 7, the 8th inductance L 8, the 9th inductance L 9.1,2,3,4,5 pins of Lin interface connect the 9th inductance L 9 one end, one end of the 8th inductance L 8, one end of the 7th inductance L 7, the 6th inductance L 6 one end, the 5th inductance L 5 one end respectively, and the other end of the other end of the other end of the 5th inductance L 5, the other end of the 6th inductance L 6, the 7th inductance L 7, the other end of the 8th inductance L 8, the 9th inductance L 9 is connected with 1,2,3,4,5 pins of Lout interface respectively
As Fig. 8, be the peak-to-peak value testing circuit schematic diagram of instrument of the present invention, input connects the output of inductance match circuit, is used for detecting the output voltage peak-to-peak value that inductance match circuit is connected with palm tissue.Peak-to-peak value detection module comprises the 7th chip IC 7, the 8th chip IC 8, the 9th chip IC 9, the tenth resistance R10, the 11 resistance R11, the 12 resistance R12, the 13 resistance R13, the 14 resistance R14, the 15 resistance R15, the 26 electric capacity C26, the 27 electric capacity C27, the 28 electric capacity C28, the 29 electric capacity C29, the 30 electric capacity C30, the 31 electric capacity C31.1 pin of the 7th chip IC 7 is connected with 1 pin of 14 pins, the 8th chip IC 8,14 pins of the 8th chip IC 8.2 pins of the 7th chip IC 7 are connected with+15V power supply, 2 pins of the 8th chip, one end of the 26 electric capacity C26, the other end ground connection of the 26 electric capacity C26.3 pins of the 7th chip IC 7 are connected with one end of 5 pins, 9 pins, the 13 resistance R13, the other end of the 13 resistance R13 is connected with 3 pins of the 9th chip IC 9, one end of the 14 resistance R14, the other end of the 14 resistance R14 is connected with one end of 3 pins of the 8th chip IC 8,9 pins, the tenth resistance R10, the other end of the tenth resistance R10 is connected with 5 pins of the 8th chip IC 8, one end of the 11 resistance R11, and the other end of the 11 resistance R11 is connected with 6 pins of the 7th chip IC 7.4 pins of the 7th chip IC 7 are connected with one end of the 27 electric capacity C27, the other end ground connection of the 27 electric capacity C27.7 pins of the 7th chip IC 7 are connected with-15V power supply, 7 pins of the 8th chip IC 8, one end of the 29 electric capacity C29, the other end ground connection of the 29 electric capacity C29.8 pins and 13 pins of the 7th chip IC 7 connect in analog, the 10th, 11,12 pins are unsettled.4 pins of the 8th chip IC 8 are connected with one end of the 28 electric capacity C28, the other end ground connection of the 28 electric capacity C28.6 pins of the 8th chip IC 8 are connected with one end of the 12 resistance R12, the other end ground connection of the 12 resistance R12.8 pins of the 8th chip IC 8,13 pin ground connection, the 10th, 11,12 pins are unsettled.1,5,8 pins of the 9th chip IC 9 are unsettled, 2 pins are connected with one end of the 15 resistance R15, one end of the 16 resistance R16, the other end ground connection of the 15 resistance R15, the other end of the 16 resistance R16 is connected with 6 pins of OUT socket, the 9th chip.4 pins of the 9th chip are connected with one end of-15V power supply, the 30 electric capacity C30, the other end ground connection of the 30 electric capacity C30.7 pins of the 9th chip IC 9 are connected with one end of+15V power supply, the 31 electric capacity C31, the other end ground connection of the 31 electric capacity.The 7th described chip IC 7 and the model of the 8th chip IC 8 are the monolithic peak detector PKD01 that AD company produces, and the model of the 9th chip IC 9 is the precision operational-amplifier OP27 that AD company produces.
As Fig. 9, for the Control measurement electrode commutation circuit schematic diagram of instrument of the present invention, by the switching of Control measurement electrode, as long as palm is placed on the bioelectric impedance data 5 measurement electrode and 1 public electrode just can being measured palm tissue, Control measurement electrode handover module comprises the first relay S1, second relay S2, 3rd relay S3, 4th relay S4, 5th relay S5, first triode Q1, second triode Q2, 3rd triode Q3, 4th triode Q4, 5th triode Q5, second Schottky diode D2, 3rd Schottky diode D3, 4th Schottky diode D4, 5th Schottky diode D5, 6th Schottky diode D6, 17 resistance R17, 18 resistance R18, 19 resistance R19, 20 resistance R20, 21 resistance R21, Control interface, Signal Input interface, Signal Output interface.1 pin, 4 pins of the first relay S1 are unsettled.2 pins of the first relay are connected with one end of+5V power supply, the 32 electric capacity C32, one end of the 33 electric capacity C33, the negative electrode of the second Schottky diode D2, the other end ground connection of the 32 electric capacity C32, the other end ground connection of the 33 electric capacity C33, the anode of the second Schottky diode D2 is connected with 3 pins of 5 pins of the first relay S1, the first triode Q1,2 pins of the first triode are connected with 5 pins of Control interface, 1 pin ground connection of the first triode.The three-prong of the first relay S1 is connected with 1 pin of Signal Input interface, and 6 pins of the first relay S1 are connected with 1 pin of Signal Output interface.1 pin, 4 pins of the second relay S2 are unsettled.2 pins of the second relay S2 are connected with the negative electrode of+5V power supply, the 3rd Schottky diode D3, the anode of the 3rd Schottky diode D3 is connected with 3 pins of 5 pins of the second relay S2, the second triode Q2,2 pins of the second triode Q2 are connected with one end of the 18 resistance R18, the other end of the 18 resistance R18 is connected with 4 pins of Control interface, the 1 pin ground connection of the second triode Q2.3 pins of the second relay S2 are connected with 2 pins of Signal Input interface, and 6 pins of the second relay S2 are connected with 2 pins of Signal Output interface.1 pin, 4 pins of the 3rd relay S3 are unsettled.2 pins of the 3rd relay S3 are connected with the negative electrode of+5V power supply, the 4th Schottky diode D4, the anode of the 4th Schottky diode D4 is connected with 3 pins of 5 pins of the 3rd relay S3, the 3rd triode Q3,2 pins of the 3rd triode Q3 are connected with one end of the 19 resistance R19, the other end of the 19 resistance R19 is connected with 3 pins of Control interface, the 1 pin ground connection of the 3rd triode Q3.3 pins of the 3rd relay S3 are connected with 3 pins of Signal Input interface, and 6 pins of the 3rd relay S3 are connected with 3 pins of Signal Output interface.1 pin, 4 pins of the 4th relay S4 are unsettled.2 pins of the 4th relay S4 are connected with the negative electrode of+5V power supply, the 5th Schottky diode D5, the anode of the 5th Schottky diode D5 is connected with 3 pins of 5 pins of the 4th relay S4, the 4th triode Q4,2 pins of the 4th triode Q4 are connected with one end of the 20 resistance R20, the other end of the 20 resistance R20 is connected with 2 pins of Control interface, the 1 pin ground connection of the 4th triode Q4.3 pins of the 4th relay S4 are connected with 4 pins of Signal Input interface, and 6 pins of the 4th relay S4 are connected with 4 pins of Signal Output interface.1 pin, 4 pins of the 5th relay S5 are unsettled.2 pins of the 5th relay S5 are connected with the negative electrode of+5V power supply, the 6th Schottky diode D6, the anode of the 6th Schottky diode D6 is connected with 3 pins of 5 pins of the 5th relay S5, the 5th triode Q5,2 pins of the 5th triode Q5 are connected with one end of the 21 resistance R21, the other end of the 21 resistance R21 is connected with 1 pin of Control interface, the 1 pin ground connection of the 5th triode Q5.3 pins of the 5th relay S5 are connected with 5 pins of Signal Input interface, and 6 pins of the 5th relay S5 are connected with 5 pins of Signal Output interface.Signal Output interface is connected with 5 measurement electrode W1, W2, W3, W4, W5.The model of described relay S1, S2, S3, S4, S5 is HK4100f – DC5V-SHG.
As Figure 10, be the system control process figure of instrument of the present invention.After system starts, first initialize, then open serial ports, start image data, judge whether data receive for the first time according to timing, if do not completed, continue receive, if complete reception, start to carry out analog-to-digital conversion, complete first time scanning after by data stored in buffering area, according to relay switching channel continuous sweep 5 times, close serial ports, data acquisition after judging to receive 5 secondary data, the data gathered are sent to host computer by serial ports.
What the technology of the present invention was used is two electrode measurement methods, a public electrode and 5 measurement electrode are placed on palm central authorities and 5 fingers respectively, when pumping signal is by inductance matching module and palm tissue, known by resonance principle, because the change of frequency of pumping signal can resonate at a certain Frequency point, output signal is detected again through peak-to-peak value testing circuit, signal is converted to data signal and passes to PC, the voltage signal received by PC just can obtain the biological information of palm, thus carries out the identification of human body.
The present invention is based on the palm impedance spectrum measuring instrument of resonant frequency method, have employed this novel measuring metering method of resonant frequency, circuit theory knowledge and living things feature recognition are combined closely.Signal generating circuit have employed the DDS technology of Direct frequency synthesizer, and uses the bipolar current source of the band DC stabilization loop of high stability to change as V/I; Adopt peak-to-peak value testing circuit, instead of single peak detects, and makes measurement result more accurate; Adopt power transfer module that power supply is used convenient, adopt two electrode methods to measure, greatly simplify measurement complexity, reduce instrument volume, make instrument more miniaturized.This is a kind of portable checkout gear, and this resonance frequency test method is harmless, and without particular job environmental requirement, it is convenient to check, and device is simple, with low cost, and provides a kind of new thinking for the design of biological characteristic identification instrument.
Claims (1)
1. based on the palm impedance spectrum measuring instrument of resonant frequency, comprise single-chip core core module, power module, sweep sine generator module, voltage/current modular converter, peak detection block, inductance matching circuit module, Control measurement electrode commutation circuit module and PC, the input of sweep sine generator module and monolithic microcomputer kernel model calling, the output of sweep sine generator module is connected with voltage/current modular converter input, the output of voltage/current modular converter and inductance matching module input, an input of peak detection block connects, inductance matching module output is connected with Control measurement electrode handover module, Control measurement electrode handover module connects the input of palm tissue, another input of peak detection block is connected to the output of palm tissue, and the output of peak detection block is connected to single-chip core core module, single chip microcomputer core module has been connected data by I/O mouth with PC input and has transmitted,
Described power module is sweep sine generator module, voltage/current modular converter, Control measurement electrode handover module, peak detection block and monolithic microcomputer kernel module for power supply, it is characterized in that:
Single-chip core core module comprises singlechip chip IC0, the tenth chip IC 10, second crystal oscillator X2, the 3rd crystal oscillator X3, the tenth inductance L the 10, the 22 resistance R22, the 32 electric capacity C32, the 33 electric capacity C33, the 34 electric capacity C34, the 35 electric capacity C35, the 36 electric capacity C36, the 37 electric capacity C37, the 38 electric capacity C38, the 39 electric capacity C39; Singlechip chip IC0 is totally 64 pins, and 1 pin of singlechip chip IC0 is connected with+5V power supply; 3 pins of singlechip chip IC0 are connected with one end of one end of the 32 electric capacity C32, the second crystal oscillator X2; The other end ground connection of the 32 electric capacity C32, the other end of the second crystal oscillator X2 is connected with one end of 4 pins of singlechip chip IC0, the 33 electric capacity C33; The other end ground connection of the 33 electric capacity C33; 5 pins of singlechip chip IC0 are connected with one end of the 22 resistance R22, one end of the 3rd crystal oscillator X3, one end of the 34 electric capacity; 6 pins of singlechip chip IC0 are connected with the other end of the 22 resistance R22, the other end of the 3rd crystal oscillator X3, one end of the 35 electric capacity C35; The other end ground connection of the 34 electric capacity C34; The other end ground connection of the 35 electric capacity C35; The 11st pin ground connection of singlechip chip IC0; 13 pins of singlechip chip IC0 are connected with one end of the 37 electric capacity C37, the anode of the 36 electric capacity C36, one end of the tenth inductance L 10; The negativing ending grounding of the 36 electric capacity C36, the other end ground connection of the 37 electric capacity C37, the other end of the tenth inductance L 10 is connected with 3 pins of the tenth chip IC 10, the anode of the 39 electric capacity C39; The negativing ending grounding of the 39 electric capacity C39; 1 pin of the tenth chip IC 10 is connected with the anode of+5V power supply, the 38 electric capacity C38; The negativing ending grounding of the 38 electric capacity, 2 pin ground connection of the tenth chip IC 10; 20 pins of singlechip chip IC0,36 pins, 26 pins, 42 pins, 27 pins are connected with 5 outputs W1, W2, W3, W4, W5 of Control measurement electrode handover module respectively; 52 pins of singlechip chip IC0,5 pins, 53 pins, 6 pins, 60 pins, 13 pins, 19 pins, 35 pins are connected with 4 pins of sweep sine generator module the 4th chip IC4,3 pins, 2 pins, 1 pin, 28 pins, 27 pins, 26 pins, 25 pins respectively; 43 pins of singlechip chip IC0 are connected with 14 pins with 1 pin of peak detection block the 7th chip IC 7, the 8th chip IC 8; 16 pins of singlechip chip IC0,24 pins, 32 pins, 49 pins, 50 pins, 51 pins, 54 pins, 57 pin ground connection; The model that described singlechip chip IC0 selects is the low power processor STM32F103RBT6 that ST Microelectronics produces, and the model that 3.3V power supply voltage stabilizing chip IC 10 is selected is AME1117;
Power module comprises the first chip IC 1, second chip IC 2, the 3rd chip IC 3, first variable resistor R1, the first inductance L 1, first Schottky diode D1, the first electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3, the 4th electric capacity C4, the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8, the 9th electric capacity C9, the tenth electric capacity C10, the 11 electric capacity C11, the 12 electric capacity C12, the 13 electric capacity C13, 1 pin of the first chip IC 1 is connected with the positive pole of one end of the first electric capacity C1, the 3rd electric capacity C3, the other end ground connection of the first electric capacity C1, the minus earth of the 3rd electric capacity C3, 2 pins of the first chip IC 1 are connected with 1 pin of the second chip IC 2, 3 pins of the first chip IC 1 are connected with one end of the positive pole of the 5th electric capacity, the 7th electric capacity, the minus earth of the 5th electric capacity C5, the other end ground connection of the 7th electric capacity C7, 2 pins of the second chip IC 2 are connected with the negative pole of one end of the second electric capacity C2, the 4th electric capacity C4, the other end ground connection of the second electric capacity C2, the plus earth of the 4th electric capacity, 3 pins of the second chip IC 2 are connected with one end of the negative pole of the 6th electric capacity C6, the 8th electric capacity C8, the plus earth of the 6th electric capacity C6, the other end ground connection of the 8th electric capacity, 1 pin of the 3rd chip IC 3 is connected with one end of the 11 electric capacity C11, the other end of the 11 electric capacity C11 and 8 pins of the 3rd chip IC 3, the negative electrode of the first diode D1, one end of first inductance L 1 is connected, the plus earth of the first diode D1, the other end of the first inductance L 1 and one end of the 12 electric capacity C12, the positive pole of the 13 electric capacity C13, first variable-resistance one end is connected, the other end ground connection of the 12 electric capacity C12, the minus earth of the 13 electric capacity C13, the other end of the first variable resistor R1 is connected with 4 pins of the 3rd chip IC 3, the adjustable resistance end ground connection of the first variable resistor R1, 7 pins of the 3rd chip IC 3 are connected with one end of one end of the 9th electric capacity C9, the tenth electric capacity C10, the other end ground connection of the 9th electric capacity C9, the other end ground connection of the tenth electric capacity C10, 6 pin ground connection of the 3rd chip IC 3,2 pins, 3 pins, 5 pins are all unsettled, the model of the first described chip IC 1 is LM7812, and the model of the second chip IC 2 is LM7912, and the model of the 3rd chip IC 3 is TPS5450,
Sweep sine generator module comprises the 4th chip IC4, the first crystal oscillator X1, the second adjustable resistance R2, the 3rd resistance R3, the 4th resistance R4, the 5th resistance R5, the second inductance L 2, the 3rd inductance L 3, the 4th inductance L the 4, the 14 electric capacity C14, the 15 electric capacity C15, the 16 electric capacity C16, the 17 electric capacity C17, the 18 electric capacity C18, the 19 electric capacity C19, the 20 electric capacity C20, the 21 electric capacity C21; 1 pin of the 4th chip IC4,2 pins, 3 pins, 4 pins, 25 pins, 26 pins, 27 pins, 28 pins successively with 8 I/O mouths of single-chip microcomputer: C1, C2, C3, C4, C5, C6, C7, C8 are connected; 5th pin ground connection, the 6th pin connects+5V power supply, and the 7th pin connects the W_CLK pin of single-chip microcomputer, and the 8th pin connects the FQ_UD pin of single-chip microcomputer; 9th pin connects 3 pins of the first crystal oscillator X1, and 1 pin of the first crystal oscillator X1 is unsettled, the 2 pin ground connection of the first crystal oscillator X1, and 4 pins of the first crystal oscillator connect+5V power supply; The 10 pin ground connection of the 4th chip IC4,11 pins meet+5V, and 12 pins connect one end of the 3rd resistance R3, the other end ground connection of the 3rd resistance R3; 13 pins, 14 pins of the 4th chip IC4 are unsettled, 15th pin connects one end of the 14 electric capacity C14, the adjustable resistance end of the second adjustable resistance R2, the other end ground connection of the 14th electric capacity C14, one end ground connection of the second adjustable resistance R2, another termination+5V power supply of the second adjustable resistance; The 24 pin ground connection of the 4th chip IC4,23 pins connect+5V power supply, 22 pins connect the RESET pin of single-chip microcomputer, one end of 21 pins connection the 4th resistance R4, one end of the second inductance L 2, one end of the 15 electric capacity C15, one end of the 16 electric capacity C16, the other end of the 4th resistance R4, the other end ground connection of the 15 electric capacity; The other end of the 16 electric capacity C16, the other end of the second inductance L 2 are connected with one end of the 17 electric capacity C17, the 18 electric capacity C18, the 3rd inductance L 3, the other end ground connection of the 17 electric capacity C17; One end of the other end of the 3rd inductance L 3, the other end of the 18 electric capacity C18 and the 19 electric capacity C19, one end of the 20 electric capacity C20, one end of the 4th inductance L 4 are connected, the other end ground connection of the 19 electric capacity C19; One end of the other end of the 4th inductance L 4, the other end of the 20 electric capacity C20 and the 21 electric capacity C21, one end of the 5th resistance R5, the 16th pin, SIA are connected, the other end ground connection of the 21 electric capacity C21, the other end ground connection of the 5th resistance R5; 17th pin, 20 pins are unsettled, the 19th pin ground connection, and the 18th pin connects+5V power supply; The model of the 4th described chip IC4 is that AD company produces DDS chip AD9850;
Voltage/current modular converter comprises the 5th chip IC 5, the 6th chip IC 6, the 6th resistance R6, the 7th resistance R7, the 8th resistance R8, the 9th resistance R9, the 22 electric capacity C22, the 23 electric capacity C23, the 24 electric capacity C24, the 25 electric capacity C25; 1 pin of the 5th chip IC 5 is connected with one end of the 22 electric capacity C22, the output SIA of sweep sine generator module; One end of 6 pins of the other end of the 22 electric capacity C22 and 4 pins of the 5th chip IC 5, the 6th chip IC 6,7 pins, the 8th resistance R8 is connected; The other end of the 8th resistance R8 is connected with 3 pins of the 6th chip IC 6, one end of the 24 electric capacity C24, the other end ground connection of the 24 electric capacity C24; 2 pins of the 5th chip IC 5 connect-12V power supply, and 3 pins are unsettled; 5 pins of the 5th chip IC 5 are connected with one end of 6 pins, the 9th resistance R9, and the other end of the 9th resistance R9 is connected with 5 pins of the 6th chip IC 6, one end of the 25 electric capacity C25, the other end of the 25 electric capacity and exports Iout; 7 pins of the 5th chip IC 5 are connected with+12V power supply; 8 pins of the 5th chip IC 5 are connected with 1 pin of the 6th chip IC 6, one end of the 6th resistance R6, one end of the 23 electric capacity C23, the other end of the 6th resistance R6, the other end of the 23 electric capacity C23 are connected with 2 pins of the 6th chip IC 6, one end of the 7th resistance R7, the other end ground connection of the 7th resistance R7; 4 pins of the 6th chip IC 6 are connected with-12V power supply, and the 8th pin is connected with+12V power supply; The model of the 5th described chip IC 5 is the high speed gauges amplifier chip AD8130 that AD company produces, and the model of the 6th chip IC 6 is that AD company produces Fast FET amplifier AD8066;
Inductance matching module comprises Lin interface, Lout interface, the 5th inductance L 5, the 6th inductance L 6, the 7th inductance L 7, the 8th inductance L 8, the 9th inductance L 9; 1,2,3,4,5 pins of Lin interface connect the 9th inductance L 9 one end, one end of the 8th inductance L 8, one end of the 7th inductance L 7, the 6th inductance L 6 one end, the 5th inductance L 5 one end respectively, and the other end of the other end of the other end of the 5th inductance L 5, the other end of the 6th inductance L 6, the 7th inductance L 7, the other end of the 8th inductance L 8, the 9th inductance L 9 is connected with 1,2,3,4,5 pins of Lout interface respectively;
Peak detection block comprises the 7th chip IC 7, the 8th chip IC 8, the 9th chip IC 9, the tenth resistance R10, the 11 resistance R11, the 12 resistance R12, the 13 resistance R13, the 14 resistance R14, the 15 resistance R15, the 26 electric capacity C26, the 27 electric capacity C27, the 28 electric capacity C28, the 29 electric capacity C29, the 30 electric capacity C30, the 31 electric capacity C31; 1 pin of the 7th chip IC 7 is connected with 1 pin of 14 pins, the 8th chip IC 8,14 pins of the 8th chip IC 8; 2 pins of the 7th chip IC 7 are connected with+15V power supply, 2 pins of the 8th chip, one end of the 26 electric capacity C26, the other end ground connection of the 26 electric capacity C26; 3 pins of the 7th chip IC 7 are connected with one end of 5 pins, 9 pins, the 13 resistance R13, the other end of the 13 resistance R13 is connected with 3 pins of the 9th chip IC 9, one end of the 14 resistance R14, the other end of the 14 resistance R14 is connected with one end of 3 pins of the 8th chip IC 8,9 pins, the tenth resistance R10, the other end of the tenth resistance R10 is connected with 5 pins of the 8th chip IC 8, one end of the 11 resistance R11, and the other end of the 11 resistance R11 is connected with 6 pins of the 7th chip IC 7; 4 pins of the 7th chip IC 7 are connected with one end of the 27 electric capacity C27, the other end ground connection of the 27 electric capacity C27; 7 pins of the 7th chip IC 7 are connected with-15V power supply, 7 pins of the 8th chip IC 8, one end of the 29 electric capacity C29, the other end ground connection of the 29 electric capacity C29; 8 pins and 13 pins of the 7th chip IC 7 connect in analog, the 10th, 11,12 pins are unsettled; 4 pins of the 8th chip IC 8 are connected with one end of the 28 electric capacity C28, the other end ground connection of the 28 electric capacity C28; 6 pins of the 8th chip IC 8 are connected with one end of the 12 resistance R12, the other end ground connection of the 12 resistance R12; 8 pins of the 8th chip IC 8,13 pin ground connection, the 10th, 11,12 pins are unsettled; 1,5,8 pins of the 9th chip IC 9 are unsettled, 2 pins are connected with one end of the 15 resistance R15, one end of the 16 resistance R16, the other end ground connection of the 15 resistance R15, the other end of the 16 resistance R16 is connected with 6 pins of OUT socket, the 9th chip; 4 pins of the 9th chip are connected with one end of-15V power supply, the 30 electric capacity C30, the other end ground connection of the 30 electric capacity C30; 7 pins of the 9th chip IC 9 are connected with one end of+15V power supply, the 31 electric capacity C31, the other end ground connection of the 31 electric capacity; The 7th described chip IC 7 and the model of the 8th chip IC 8 are the monolithic peak detector PKD01 that AD company produces, and the model of the 9th chip IC 9 is the precision operational-amplifier OP27 that AD company produces;
Control measurement electrode handover module comprises the first relay S1, second relay S2, 3rd relay S3, 4th relay S4, 5th relay S5, first triode Q1, second triode Q2, 3rd triode Q3, 4th triode Q4, 5th triode Q5, second Schottky diode D2, 3rd Schottky diode D3, 4th Schottky diode D4, 5th Schottky diode D5, 6th Schottky diode D6, 17 resistance R17, 18 resistance R18, 19 resistance R19, 20 resistance R20, 21 resistance R21, Control interface, Signal Input interface, Signal Output interface, 1 pin, 4 pins of the first relay S1 are unsettled, 2 pins of the first relay are connected with one end of+5V power supply, the 32 electric capacity C32, one end of the 33 electric capacity C33, the negative electrode of the second Schottky diode D2, the other end ground connection of the 32 electric capacity C32, the other end ground connection of the 33 electric capacity C33, the anode of the second Schottky diode D2 is connected with 3 pins of 5 pins of the first relay S1, the first triode Q1,2 pins of the first triode are connected with 5 pins of Control interface, 1 pin ground connection of the first triode, the three-prong of the first relay S1 is connected with 1 pin of Signal Input interface, and 6 pins of the first relay S1 are connected with 1 pin of Signal Output interface, 1 pin, 4 pins of the second relay S2 are unsettled, 2 pins of the second relay S2 are connected with the negative electrode of+5V power supply, the 3rd Schottky diode D3, the anode of the 3rd Schottky diode D3 is connected with 3 pins of 5 pins of the second relay S2, the second triode Q2,2 pins of the second triode Q2 are connected with one end of the 18 resistance R18, the other end of the 18 resistance R18 is connected with 4 pins of Control interface, the 1 pin ground connection of the second triode Q2, 3 pins of the second relay S2 are connected with 2 pins of Signal Input interface, and 6 pins of the second relay S2 are connected with 2 pins of Signal Output interface, 1 pin, 4 pins of the 3rd relay S3 are unsettled, 2 pins of the 3rd relay S3 are connected with the negative electrode of+5V power supply, the 4th Schottky diode D4, the anode of the 4th Schottky diode D4 is connected with 3 pins of 5 pins of the 3rd relay S3, the 3rd triode Q3,2 pins of the 3rd triode Q3 are connected with one end of the 19 resistance R19, the other end of the 19 resistance R19 is connected with 3 pins of Control interface, the 1 pin ground connection of the 3rd triode Q3, 3 pins of the 3rd relay S3 are connected with 3 pins of Signal Input interface, and 6 pins of the 3rd relay S3 are connected with 3 pins of Signal Output interface, 1 pin, 4 pins of the 4th relay S4 are unsettled, 2 pins of the 4th relay S4 are connected with the negative electrode of+5V power supply, the 5th Schottky diode D5, the anode of the 5th Schottky diode D5 is connected with 3 pins of 5 pins of the 4th relay S4, the 4th triode Q4,2 pins of the 4th triode Q4 are connected with one end of the 20 resistance R20, the other end of the 20 resistance R20 is connected with 2 pins of Control interface, the 1 pin ground connection of the 4th triode Q4, 3 pins of the 4th relay S4 are connected with 4 pins of Signal Input interface, and 6 pins of the 4th relay S4 are connected with 4 pins of Signal Output interface, 1 pin, 4 pins of the 5th relay S5 are unsettled, 2 pins of the 5th relay S5 are connected with the negative electrode of+5V power supply, the 6th Schottky diode D6, the anode of the 6th Schottky diode D6 is connected with 3 pins of 5 pins of the 5th relay S5, the 5th triode Q5,2 pins of the 5th triode Q5 are connected with one end of the 21 resistance R21, the other end of the 21 resistance R21 is connected with 1 pin of Control interface, the 1 pin ground connection of the 5th triode Q5, 3 pins of the 5th relay S5 are connected with 5 pins of Signal Input interface, and 6 pins of the 5th relay S5 are connected with 5 pins of Signal Output interface, Signal Output interface is connected with 5 measurement electrode W1, W2, W3, W4, W5, the model of described relay S1, S2, S3, S4, S5 is HK4100f – DC5V-SHG.
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| CN105982671B (en) * | 2015-03-03 | 2020-07-07 | 思澜科技（成都）有限公司 | Optimized biological impedance test circuit |
| CN106137193B (en) * | 2016-07-29 | 2023-03-17 | 普罗朗生物技术（无锡）有限公司 | Human body biological conductance multiple value simulator |
| CN110932728B (en) * | 2019-12-23 | 2024-05-10 | 北京百联长通科技有限公司 | Analog-to-digital conversion device |
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