CN103619124B - A kind of production method of wiring board thin plate - Google Patents
A kind of production method of wiring board thin plate Download PDFInfo
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- CN103619124B CN103619124B CN201310608409.7A CN201310608409A CN103619124B CN 103619124 B CN103619124 B CN 103619124B CN 201310608409 A CN201310608409 A CN 201310608409A CN 103619124 B CN103619124 B CN 103619124B
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Abstract
The invention discloses the production method of a kind of wiring board thin plate, its technical scheme is characterized by and includes following steps: heavy copper；Outer-layer circuit Graphic transitions；Graphic plating and etching；Adopt cord, through hole, location and the beading of wiring board thin plate, each wiring board thin plate separates turmeric respectively；Wiring board thin plate level excessively is driven to draw the liquid medicine washing away wiring board thin sheet surface the wiring board thin plate slab after turmeric；Electrical testing；Gong plate；Adopt plastics package dish that the finished unit plate after gong plate is packed.Described outer-layer circuit Graphic transitions adopts pig cage device indent to carry out the transhipment of each inter process after wiring board thin plate is compressed to gong plate operation.The invention solves by little with wiring board sheet size and thin cause easy haftplatte, bent plate, clamp and disconnected plate problem, it is provided that a kind of technique is simple, the wiring board thin plate production method of product with stable quality.
Description
[technical field]
The present invention relates to the production method of a kind of wiring board thin plate.
[background technology]
Along with science and technology fast development, wiring board thin plate receives more and more attention, and consumer is for the requirement of electronic product Ultrathin portable, and the development for wiring board thin plate provides opportunity.While people enjoy the work facility brought by new and high technology and quality of life improves, industry of printed circuit boards is also faced with due to electronic product lightweight, the microminiaturized challenge in fields such as design, manufacture and assemblings brought.The manufacture quality of printed substrate, not only directly affects the reliability of electronic product, also can influential system product whole competitiveness.
The thickness of slab of wiring board thin plate is typically smaller than 0.28mm, if adopting the production method of conventional slab, it may appear that a lot of problems, causes product batch to scrap.As: easily there is clamp, disconnected plate when carrying thin plate in printed substrate horizontal production line；When Graphic transitions or welding resistance oil operation expose, because not having suitable transhipment bay, thin plate causes that the defects such as flower are wiped in plate face in transportation；During graphic plating, the too thin easy folder of thin plate loosely causes falling cylinder, and thin plate is easily bent in plating and causes that plate does not enter scaffold, causes electro-coppering thickness exception and scaffold to wipe flower dry film or stannum face；At electrical testing, gong room and packaging process because board size is too little, client is higher to packing instructions, and existing Making programme and instrument cannot meet the problems such as production.
[summary of the invention]
The present invention seeks to overcome the deficiencies in the prior art, it is provided that a kind of technique is simple, the wiring board thin plate production method of product with stable quality.
The present invention is achieved by the following technical solutions:
The production method of a kind of wiring board thin plate, it is characterised in that include following operation:
A) heavy copper: amass out one layer of conducting layers of copper between layers by the method for heavy copper at the inner hole deposition of laminated circuit plate of holing, make described hole become via；
B) outer-layer circuit Graphic transitions；
C) graphic plating and etching；
D) turmeric: adopt cord 14, through hole, location 29 and the beading 15 of wiring board thin plate 16, each wiring board thin plate 16 separates turmeric respectively；
E) washing: drive wiring board thin plate 16 level excessively to draw 17 liquid medicine washing away wiring board thin plate 16 surface the slab 18 of the wiring board thin plate 16 after turmeric；
F) electrical testing: the electric property of the detection each layer of wiring board thin plate 16；
G) gong plate: wiring board thin plate 16 qualified for electrical testing is gone out finished unit plate by customer requirement gong；
H) packaging: adopt wiring board thin plate packaging tray 19 that the finished unit plate after gong plate is packed；
Adopt pig cage device from outer-layer circuit Graphic transitions, after wiring board thin plate 16 being compressed with indent, carry out the transhipment of each inter process.
Described pig cage device includes bracing frame 1, described bracing frame 1 is provided with front clamp 3 and rear clamp 4, multiple spaced apart dividing plate 13 it is equipped with between each described clamp, vertical slot is formed between described dividing plate 13, institute's clamp is equipped with the motion bar 7 running through dividing plate 13, the positioner that the motion bar 7 after by movement positions it is provided with between described clamp and motion bar 7, described motion bar 7 be provided with multiple can with motion bar 7 move and extend in vertical slot tabletting 8, vertical slot is separated into the left indent 9 and right indent 10 that can insert wiring board thin plate by described tabletting 8, the left indent 9 of described front clamp 3 is relative with the left indent 9 of rear clamp 4 and right indent 10 respectively with right indent 10.
The production method of wiring board thin plate as above, it is characterized in that: described bracing frame 1 both sides are provided with horizontal sliding bar 2, described rear clamp 4 is provided with the sliding sleeve 5 that can slide along described horizontal sliding bar 2, described sliding sleeve 5 is provided with screwed hole, is provided with the bolt 6 that top is pressed onto on horizontal sliding bar 2 in described screwed hole；Described front clamp 3 is fixed on described horizontal sliding bar 2.
The production method of wiring board thin plate as above, it is characterised in that: described positioner includes the one end being located at motion bar 7 adjusting nut 11 being stuck on clamp, and described motion bar 7 is screw rod.
The production method of wiring board thin plate as above, it is characterised in that: in described gong plate operation, wiring board thin plate 16 surface adds the cover plate that layer prevents wiring board thin plate 16 from being picked up.
The production method of wiring board thin plate as above, it is characterised in that: described gong plate operation must first be washed and electrical testing before starting.
The production method of wiring board thin plate as above, it is characterized in that: described wiring board thin plate packaging tray 19 includes substrate 20, it is provided with holding tank 21 in described substrate 20, described holding tank 21 includes the main groove that can put into finished unit plate 22, groove 24 centered by described main groove centre, described central channel 24 rear and front end is communicated with front end slot 25 and rear end slot 26, described central channel about 24 two ends are communicated with the left grabbing groove 27 and right grabbing groove 28 that can capture finished unit plate 22, the locating dowel 23 that the hole 29, location of described finished unit plate 22 is inserted it is provided with mean in described front end slot 25 and rear end slot 26.
The production method of wiring board thin plate as above, it is characterised in that: described central channel 24 degree of depth and described left grabbing groove 27, right grabbing groove 28 degree of depth are consistent.
The production method of wiring board thin plate as above, it is characterised in that: described central channel 24 degree of depth is more than the degree of depth of described front end slot 25, rear end slot 26.
The production method of wiring board thin plate as above, it is characterised in that: described wiring board thin plate packaging tray 19 is plastics package dish.
Compared with prior art, the present invention has the following advantages:
1, the present invention have employed Novel pig cage when transportation route plate thin plate, this pig cage simple in construction, easy to operate, can closely compress wiring board thin plate, it is to avoid in transport process because of vibration fall apart cause thin plate wipe flower and lamination bad wait affect quality phenomenon generation.
2, pig cage of the present invention can regulate the position of clamp according to the size of wiring board thin plate, is suitable for the transhipment of wiring board thin plate of all sizes.
3, pig cage of the present invention is provided with indent mark, it is to avoid the wrong plug groove position in fast quick-mounting plate process.
4, the present invention is in turmeric operation, wiring board thin plate is vertically being placed on the basis of turmeric special frame, it is tightly fastened sheet panel top face in the both sides of thin plate with beading, make between plate and plate, to keep a fixed range, prevent thin plate from the flexural deformation of plate face occurring because vertically placing, and cause that plate face Thickness on Immersion Gold is uneven.
5, after turmeric operation of the present invention when level draws washing excessively, cross together with the encapsulated drive thin plate of slab edge strip before thin plate and draw, and the adjacent lines rumble spacing pulled on of level arranges less, it is prevented that thin plate clamp when level is drawn excessively and disconnected plate.
6, the present invention is directed to wiring board sheet size too little and thin, when electrical testing, individually can not test with individual unit, need imposite multiple-unit jigsaw to test simultaneously, therefore process flow is washed electrical testing by original gong plate afterwards, changing washing electrical testing gong plate into, the program can meet thin plate production requirement can improve again electrical testing efficiency.Cover plate is added, it is prevented that thin plate is picked up during gong plate.
7, the present invention is directed to the little and very thin feature of the size of wiring board thin plate to be specifically designed and made the wiring board thin plate packaging tray being provided with locating dowel, packaging is convenient, firmly, picks and places facility, meets client's requirement to wiring board thin-plate element shipment.
8, wiring board thin plate packaging tray of the present invention adopt plastic shaping make, easy to process, cost is low and in transportation will not fall bits, without scratch plate face.
9, the degree of depth of wiring board thin plate packaging tray grabbing groove of the present invention is more than the degree of depth of front end slot, rear end slot, it is simple to the finger of people loads and takes out wiring board thin plate.
10, wiring board thin plate packaging tray locating dowel of the present invention is open tubular column, saves material and makes packaging tray lighter, at locating dowel top rounding, it is simple to loads and takes out wiring board thin plate.
[accompanying drawing explanation]
Fig. 1 is the schematic perspective view of pig cage of the present invention；
Fig. 2 is the sectional view of pig cage clamp of the present invention；
Fig. 3 is the enlarged drawing at I place in Fig. 1 of the present invention；
Fig. 4 is the schematic diagram that wiring board thin plate beading of the present invention produce；
Fig. 5 is the schematic diagram that slab of the present invention drives that wiring board thin plate level excessively is drawn；
Fig. 6 is the axonometric chart of wiring board thin plate packaging tray of the present invention；
Fig. 7 is the enlarged drawing of wiring board one unit of thin plate packaging tray of the present invention；
Fig. 8 is the top view of wiring board thin plate packaging tray holding tank of the present invention；
Fig. 9 is the sectional view of Fig. 8 of the present invention；
Figure 10 is the axonometric chart of holding tank of the present invention；
Figure 11 is holding tank of the present invention and wiring board sheet metal assembly schematic diagram.
[detailed description of the invention]
Below in conjunction with accompanying drawing, the invention will be further described, and the operation making wiring board thin plate is as follows:
A) sawing sheet: the raw material plate through passed examination is made up of copper-clad plate and resin film and cuts, surface clean and drying；
B) inner line figure transfer and the inspection of line: paste last layer sensitive material on above-mentioned surface of circuit board Copper Foil, then pass through the black film and carry out para-position exposure, line pattern is formed after development, in hole, edges of boards drilling pipe position, and adopt whether automatic optical detecting instrument detection surface of circuit board breakage of circuit, poor short circuit occurs；
C) brown and pressing plate: alligatoring is as each copper face of internal layer and line face；Being arranged by designing requirement by above-mentioned raw materials plate, pressing, obtain laminated circuit plate, described laminated circuit plate is wiring board thin plate；
D) boring: above-mentioned laminated circuit plate adopts high rigidity bit formulating region brill through hole；Production process needs to handle with care；
E) heavy copper and electric plating of whole board: amass out one layer of conducting layers of copper between layers by the method for heavy copper at the inner hole deposition of laminated circuit plate of holing, make described through hole become via；And adopt the method for electric plating of whole board that above-mentioned laminated circuit plate is electroplated, and make the via on laminated circuit plate and plate face all obtain certain thickness conductive copper, sheet size is too little, and the edge strip that need to hang width and thickness produces；
F) outer-layer circuit Graphic transitions: the copper foil surface at above-mentioned wiring board pastes last layer sensitive material, then passes through the yellow film and carries out para-position exposure, form line pattern after development；
To check before production transmission row rumble, by row rumble spacing adjust tight defense stop clamp, pre-treatment Plate grinder is respectively washed, liquid medicine tank pressure adjust 0.8kg/cm2 produce；Adjust pad pasting pressure to 2.5kg/cm2；Pad pasting temperature: 90-105 DEG C；Adjust developer pressure: 15-20psi, wash pressure: 10-15psi, to control to wear the film.
G) graphic plating and etching: present after completing dry film operation and thicken layers of copper with electro-plating method on the copper face of circuit, improve quality of coating, to reach the requirement of client；Plate the stannum protective layer as this circuit again；Then above-mentioned wiring board thin plate is put in etching solution, etching off logicalnot circuit layers of copper, expose circuit pack, obtain last forming wire pattern；
Because of thin plate (i.e. wiring board thin plate, down together) easily folder is insecure causes board falling, thin plate is easily bent in plating and causes that plate does not enter scaffold, electro-coppering thickness exception and scaffold is caused to wipe flower dry film or stannum face, therefore produce before be ready to than produce plate slightly long accompany plating lath, one flies each three each lastblocks in position in left, center, right of bar to support, and compensates electric current and adds the electric current of one block of plate；Turning down when electroplating into cylinder and inflate, thin plate is bended in conference of inflating；Supporting scaffold with broadside bar, manual operation guarantees that plank enters in scaffold.
H) outer graphics inspection: adopt scanner that the short circuit phenomenon of opening of circuit is checked；
I) photosensitive solder resist: print one layer of uniform photosensitive green oil film on thin plate, to reach purpose anti-welding, insulation；For avoiding silk-screen off normal, silk-screen operation adopts fixing edges of boards four limit of double faced adhesive tape；
J) turmeric: utilize chemical method to deposit the nickel dam of regulation required thickness in the independent copper wire of above-mentioned wiring board, and on nickel dam heavy one layer of gold；
As shown in Figure 4, in turmeric operation, wiring board thin plate 16 is vertically being placed on the basis of turmeric special frame, it is tightly fastened sheet panel top face in the both sides of thin plate with beading 15, make between plate with plate spaced apart, it is prevented that the flexural deformation of plate face occurs thin plate because vertically placing, and causes that plate face Thickness on Immersion Gold is uneven.Being each passed through the hole, location 29 of wiring board thin plate 16 and beading 15 with fixing beading 15 with cord 14, described beading 15 are made up of the plastics of corrosion resistance；
K) washing: draw the liquid medicine washing away wiring board thin plate 16 surface on 17 after turmeric in level；
Because sheet size is little and soft, as it is shown in figure 5, when level is drawn excessively, thin plate front end easily sticks into level and draws in 17, causes damage.The present invention draws 17 in encapsulated drive wiring board thin plate 16 level excessively of wiring board thin plate 16 front end slab 18, and level to draw adjacent lines rumble spacing on 17 to arrange less, it is prevented that clamp when thin plate level excessively draws 17 and disconnected plate.
L) electrical testing: the electric property of the detection each layer of thin plate.
M) gong plate: thin plate qualified for electrical testing is gone out finished unit plate by customer requirement gong；
Owing to sheet size is too little and thin, when electrical testing, individually can not test with individual unit, need imposite multiple-unit jigsaw to test simultaneously, therefore process flow is washed electrical testing by original gong plate afterwards, changing washing electrical testing gong plate into, the program can meet thin plate production requirement can improve again electrical testing efficiency.Cover plate is added, it is prevented that thin plate is picked up during gong plate.
N) inspection eventually: check the outward appearance of finished unit plate；
Adopt visual inspection machine to check wiring board outward appearance, increase the roasting anti-plate bent plate of pressure and stick up, to improve the qualification rate of thin plate.
O) packaging: by the finished unit plate of passed examination by customer requirement packaging.
After the inspection eventually of wiring board thin plate is qualified, adopt wiring board thin plate packaging tray 19 that thin plate is packed.As illustrated in figs. 6-11, including substrate 20, it is provided with holding tank 21 in described substrate 20, described holding tank 21 includes the main groove that can put into finished unit plate 22, groove 24 centered by described main groove centre, described central channel 24 rear and front end is communicated with front end slot 25 and rear end slot 26, described central channel about 24 two ends are communicated with the left grabbing groove 27 and right grabbing groove 28 that can capture finished unit plate 22, are provided with mean for the locating dowel 23 that the hole 10, location of described finished unit plate 22 is inserted in described front end slot 25 and rear end slot 26.
As shown in figure 11, described front end slot 25 is similar to described finished unit plate 22 profile with rear end slot 26 profile.Size 0.2mm bigger than finished unit plate 22.
Described substrate 20 is divided into nine identical cell boards of size, and each unit is equipped with the holding tank 21 loaded for finished unit plate 22, and the quantity of cell board can customize according to the demand of client.
Described locating dowel 23 is open tubular column, can save material and make wiring board thin plate packaging tray 19 lighter.It is provided with rounding on locating dowel 23 top, the external diameter of locating dowel 23 0.2mm less of hole, location 29, finished unit plate 22 two ends diameter, it is easy to loading and the taking-up of finished unit plate 22, and can guarantee that the finished unit plate after loading can fully be inserted in locating dowel 23 and not loosen, each unit can stack 20-25 block finished unit plate 22, because every piece of finished unit plate 22 copper face amasss little, and it is fixed in holding tank 21, the superposition of plurality of plates does not result in plate face and wipes flower, described wiring board thin plate packaging tray 19 is packed simple, firm, it is simple to long-distance transportation.
Described central channel 24 degree of depth and described left grabbing groove 27, right grabbing groove 28 degree of depth are consistent, and described central channel 24 degree of depth is more than the degree of depth of described front end slot 25, rear end slot 26.When loading finished unit plate 22, finger nips finished unit plate 22 both sides, stretches in described left grabbing groove 27 and right grabbing groove 28, is inserted in described locating dowel 23 by finished unit plate 22.
Wiring board thin plate packaging tray 19 of the present invention adopts plastic shaping to make, easy to process, cost is low and in transportation will not fall bits, plate face will not be abraded.
After described wiring board thin plate packaging tray 19 installs finished unit plate 22, entirety bubble chamber film adds moistureproof pearl, and evacuation is packed, and makes finished unit plate isolation air, it is to avoid oxidation by air.
The production method of a kind of wiring board thin plate as above, in the operation of outer-layer circuit Graphic transitions to gong plate, the transhipment of thin plate need to be carried out, owing to the size of thin plate is little and very thin, traditional wiring board transhipment bay cannot clamp thin plate, easily cause thin plate and wipe flower, the present invention is directed to the transport of thin plate and invent pig cage device, as shown in Figure 1 to Figure 3, a kind of thin plate pig cage, including by bracing frame 1, described bracing frame 1 is provided with front clamp 3 and rear clamp 4, multiple spaced apart dividing plate 13 it is provided with between each described clamp, described clamp includes front clamp 3 and rear clamp 4, vertical slot is formed between described dividing plate 13, described clamp is provided with through the motion bar 7 of dividing plate 13, the positioner that the motion bar 7 after by movement positions it is provided with between described clamp and motion bar 7, described motion bar 7 be provided with multiple can with motion bar 7 move and extend in vertical slot tabletting 8, vertical slot is separated into the left indent 9 and right indent 10 that can insert wiring board thin plate by described tabletting 8, the left indent 9 of described front clamp 3 is relative with the left indent 9 of rear clamp 4 and right indent 10 respectively with right indent 10.Support frame as described above 1 is made up of stainless iron, corrosion-resistant, hardness good, and intensity is high, durable in use.Described positioner includes adjusting nut 11, and described adjusting nut 11 is mounted at one end of motion bar 7 and is stuck on clamp, and described motion bar 7 is screw rod.At least threaded with one piece of dividing plate 13.The tabletting 8 on motion bar 7 can be made to compress wiring board thin plate by rotating adjusting nut 11.
Described tabletting 8 is welded on described motion bar 7, described tabletting 8 is iron plate or plastic sheet, regulate described motion bar 7 by adjusting nut 11 to move left and right between each dividing plate 13, tabletting 8 is driven to move left and right, when making motion bar 7 be moved to the left when rotating adjusting nut 11, tabletting 8 just compresses the wiring board thin plate in left indent 9, and when making motion bar 7 move right when rotating adjusting nut 11, tabletting 8 just compresses the wiring board thin plate in right indent 10.Therefore the unification of wiring board thin plate is contained in left indent 9 or right indent 10, for ease of distinguishing left indent 9 and right indent 10, preventing workman's wrong plug indent in fast quick-mounting plate process, be additionally provided with the indent mark 12 identifying left indent 9 position on described clamp, described indent mark 12 is protruding or groove.Said one indent only fills one piece of wiring board thin plate, and tabletting pushes down is two edges of boards up and down that wiring board thin plate is big in advance, and these edges of boards are without any circuit, and in being transported to last gong plate operation, edges of boards are by cut.Therefore after each wiring board thin plate being separated compression with tabletting 8, carry out the transhipment of each inter process, wiring board will not be had any impact, and flower is wiped in the plate face being avoided that between plate and plate bending collision and causing.
Described bracing frame 1 both sides are provided with horizontal sliding bar 2, and described front clamp 3 is weldingly fixed on one end of described horizontal sliding bar 2.Described rear clamp 4 is provided with the sliding sleeve 5 that can slide along described horizontal sliding bar 2, can at horizontal sliding bar 2 slidably by sliding sleeve 5, the clamp 4 position on horizontal sliding bar 2 after size adjustment according to wiring board thin plate, described sliding sleeve 5 is provided with screwed hole, it is provided with the bolt 6 that top is pressed onto on horizontal sliding bar 2 in described screwed hole, is fixed with bolt 6 when rear clamp 4 is adjusted to suitable position.
This pig cage using method is as follows:
1. according to wiring board thin plate size, rear clamp 4 is moved to suitable position, with the fixing rear clamp 4 of bolt 6；
2. insert wiring board thin plate toward the left indent 9 of clamp or right indent 10 are unified；
3. rotating adjusting nut 11, regulate after tabletting 8 compresses wiring board thin plate and are transported through.
Claims (9)
1. the production method of a wiring board thin plate, it is characterised in that include following operation:
A) heavy copper: amass out one layer of conducting layers of copper between layers by the method for heavy copper at the inner hole deposition of laminated circuit plate of holing, make described hole become via；
B) outer-layer circuit Graphic transitions: paste last layer sensitive material at described laminated circuit plate copper foil surface, exposure imaging forms line pattern；
C) graphic plating and etching；
D) turmeric: adopt cord (14), through hole, location (29) and the beading (15) of wiring board thin plate (16), each wiring board thin plate (16) separates turmeric respectively；
E) washing: drive wiring board thin plate (16) level excessively to draw (17) to wash away the liquid medicine on wiring board thin plate (16) surface the slab (18) of the wiring board thin plate (16) after turmeric；
F) electrical testing: the electric property of detection wiring board thin plate (16) each layer；
G) gong plate: wiring board thin plate (16) qualified for electrical testing is gone out finished unit plate by customer requirement gong；
H) packaging: adopt wiring board thin plate packaging tray (19) that the finished unit plate after gong plate is packed；
Pig cage device is adopted from outer-layer circuit Graphic transitions to gong plate operation, the transhipment of each inter process is carried out after wiring board thin plate (16) being compressed with indent, described pig cage device includes bracing frame (1), described bracing frame (1) is provided with front clamp (3) and rear clamp (4), multiple spaced apart dividing plate (13) it is provided with between each described clamp, vertical slot is formed between described dividing plate (13), described clamp is provided with through the motion bar (7) of dividing plate (13), the positioner that the motion bar after by movement (7) positions it is provided with between described clamp and motion bar (7), described motion bar (7) be provided with multiple can mobile with motion bar (7) and extend in vertical slot tabletting (8), vertical slot is separated into the left indent (9) and right indent (10) that can insert wiring board thin plate by described tabletting (8), the left indent (9) of described front clamp (3) is relative with the left indent (9) of rear clamp (4) and right indent (10) respectively with right indent (10).
2. according to the production method of the wiring board thin plate described in claim 1, it is characterized in that: described bracing frame (1) both sides are provided with horizontal sliding bar (2), described rear clamp (4) is provided with the sliding sleeve (5) that can slide along described horizontal sliding bar (2), described sliding sleeve (5) is provided with screwed hole, is provided with the bolt (6) that top is pressed onto on horizontal sliding bar (2) in described screwed hole；Described front clamp (3) is fixed on described horizontal sliding bar (2).
3. according to the production method of the wiring board thin plate described in claim 1, it is characterized in that: one end that described positioner includes being located at motion bar (7) the adjusting nut (11) being stuck on clamp, described motion bar (7) is screw rod.
4. the production method of wiring board thin plate according to claim 1, it is characterised in that: in described gong plate operation, wiring board thin plate (16) surface adds the cover plate that layer prevents wiring board thin plate (16) from being picked up.
5. the production method of wiring board thin plate according to claim 1, it is characterised in that: described gong plate operation must first be washed and electrical testing before starting.
6. the production method of wiring board thin plate according to claim 1, it is characterized in that: described wiring board thin plate packaging tray (19) includes substrate (20), it is provided with holding tank (21) in described substrate (20), described holding tank (21) includes the main groove that can put into finished unit plate (22), groove (24) centered by described main groove centre, described central channel (24) rear and front end is communicated with front end slot (25) and rear end slot (26), described central channel (24) two ends, left and right are communicated with the left grabbing groove (27) and right grabbing groove (28) that can capture finished unit plate (22), the locating dowel (23) that the hole, location (29) of described finished unit plate (22) is inserted it is provided with mean in described front end slot (25) and rear end slot (26).
7. the production method of wiring board thin plate according to claim 6, it is characterised in that: described central channel (24) degree of depth and described left grabbing groove (27), right grabbing groove (28) degree of depth are consistent.
8. the production method of wiring board thin plate according to claim 6, it is characterised in that: described central channel (24) degree of depth is more than the degree of depth of described front end slot (25), rear end slot (26).
9. the production method of wiring board thin plate according to claim 6, it is characterised in that: described wiring board thin plate packaging tray (19) is plastics package dish.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310608409.7A CN103619124B (en) | 2013-11-25 | 2013-11-25 | A kind of production method of wiring board thin plate |
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| CN201310608409.7A CN103619124B (en) | 2013-11-25 | 2013-11-25 | A kind of production method of wiring board thin plate |
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| CN103619124A CN103619124A (en) | 2014-03-05 |
| CN103619124B true CN103619124B (en) | 2016-06-29 |
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| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
| CN202679791U (en) * | 2012-07-17 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Heat dissipation aluminum-based circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6380633B1 (en) * | 2000-07-05 | 2002-04-30 | Siliconware Predision Industries Co., Ltd. | Pattern layout structure in substrate |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
| CN202679791U (en) * | 2012-07-17 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Heat dissipation aluminum-based circuit board |
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