CN103614250A - Circuit board cleaning liquid as well as preparation and application thereof - Google Patents
Circuit board cleaning liquid as well as preparation and application thereof Download PDFInfo
- Publication number
- CN103614250A CN103614250A CN201310674716.5A CN201310674716A CN103614250A CN 103614250 A CN103614250 A CN 103614250A CN 201310674716 A CN201310674716 A CN 201310674716A CN 103614250 A CN103614250 A CN 103614250A
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- Prior art keywords
- wiring board
- circuit board
- scavenging solution
- parts
- cleaning liquid
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Abstract
The invention provides circuit board cleaning liquid. The circuit board cleaning liquid is prepared from the following raw material components in parts by volume: 65-68 parts of ethanol, 24-26 parts of water, 0.4-0.6 part of polyethylene glycol dioctyl ether, 1.8-2.2 parts of dihydroxy acetic acid ether and 4-6 parts of ethylene glycol. A preparation method of the circuit board cleaning liquid comprises the following steps of: proportioning the raw material components according to parts by volume and uniformly mixing. According to the circuit board cleaning liquid, the raw materials in a unique ratio are used as solvents of the circuit board cleaning liquid, thus the cleaning effect is better; the added components can adsorb dirt on the surface of the circuit board easily due to very strong surface activity and remove red watermarks on the surface of the circuit board due to very strong chelating capability for various heavy metal oxides, and the comprehensive removal rate of the dirt on the circuit board reaches more than 98%.
Description
Technical field
The present invention relates to a kind of wiring board scavenging solution and preparation and application thereof, belong to the technical field of wiring board sanitising agent.
Technical background
In electronic product making processes, use in a large number copper coating board, while particularly making electronic product by hand, PCB surface is easily adhered to the dirts such as one deck greasy dirt, finger mark, not only affecting circuit board corrosion makes, also affected its scolding tin performance, cause the problems such as rack of fusion, rosin joint, directly affect the quality of electronic product.Therefore, wiring board being cleaned is a very important ring in electronic product making processes.
People generally adopt the scavenging solutions such as dilute sulphuric acid, strong aqua, medical alcohol to clean with dirts such as wipe oil finger marks wiring board at present, but in manual operations, dilute sulphuric acid, strong aqua etc. all have corrodibility and danger, medical alcohol cleaning quality is not good enough, the dirt causing for more complicated metal oxide is difficult to remove, can only adopt artificial erased by rubber, much time power.
Summary of the invention
For above technical deficiency, the invention provides a kind of wiring board scavenging solution.
The present invention also discloses a kind of preparation method of above-mentioned scavenging solution.
The present invention also discloses a kind of using method of above-mentioned wiring board scavenging solution.
Technical scheme of the present invention is as follows:
A wiring board scavenging solution, feed composition and parts by volume thereof are as follows:
Preferred according to the present invention, described wiring board scavenging solution, feed composition and parts by volume thereof are as follows:
According to the present invention, the preparation method of described wiring board scavenging solution: by each component of raw material part proportioning by volume, mix, obtain.
A kind of using method of above-mentioned wiring board scavenging solution:
To unprocessed copper-clad plate, put into described wiring board scavenging solution and soak 1-2min, after taking-up, with clear water, rinse well, dry.
A kind of using method of above-mentioned wiring board scavenging solution:
For the complete circuit card of welding, dip described wiring board scavenging solution circuit card is carried out to wiping, after wiped clean, described circuit card is dried.
Preferred according to the present invention, dipping wiring board scavenging solution is to adopt tweezers gripping absorbent cotton or non-woven fabrics to dip.
Advantage of the present invention is:
The present invention adopts the raw material of unique proportioning as the solvent of this wiring board scavenging solution, has improved cleaning performance better.The composition adding has extremely strong surfactivity, can be easy to adsorb the dirt of PCB surface, and various heavy metal oxides are had to stronger sequestering power, and can remove the red watermark of PCB surface, comprehensively the clearance rate of the dirt of circuit card is reached more than 98%.
Embodiment
Below in conjunction with embodiment and comparative example, the present invention is described in detail.
Embodiment 1,
A wiring board scavenging solution, feed composition and parts by volume thereof are as follows:
Embodiment 2,
A wiring board scavenging solution, feed composition and parts by volume thereof are as follows:
Embodiment 3,
A wiring board scavenging solution, feed composition and parts by volume thereof are as follows:
Embodiment 4,
As described in embodiment 1-3 wiring board scavenging solution preparation method: by each component of raw material part proportioning by volume, mix, obtain.
Embodiment 5,
A kind of as described in embodiment 1-3 the using method of wiring board scavenging solution:
To unprocessed copper-clad plate, put into described wiring board scavenging solution and soak 1-2min, after taking-up, with clear water, rinse well, dry.
Embodiment 6,
A kind of as described in embodiment 1-3 the using method of wiring board scavenging solution:
For the complete circuit card of welding, dip described wiring board scavenging solution circuit card is carried out to wiping, after wiped clean, described circuit card is dried.
Dipping wiring board scavenging solution is to adopt tweezers gripping absorbent cotton or non-woven fabrics to dip.
Comparative example,
According to the conventional wiring board scavenging solution of prior art arrangement as comparative example of the present invention:
It is solvent that described scavenging solution adopts water, comprises the solvent of following weight ratio: polyoxyethylene glycol dioctyl ether: 1-2%, dihydroxy acetic acid ether: 0.4-1%, amino trimethylene methyl acid phosphate: 0.1-0.2% at described water solvent.
Get described in the comparative example of same volume scavenging solution and wiring board scavenging solution described in the embodiment of the present invention 1 respectively to identical 2 wiring boards of dirty degree clean (wiring board is of a size of 20cm * 20cm, and its fouling product comprises greasy dirt, finger mark, rosin, metal oxide etc.:
| Scavenging solution classification | Cleaning way | Scavenging period | Degree of cleaning |
| The present invention | Dip wiping | 30sec-60sec | 99% |
| Comparative example | Dip wiping | 2min-3min | 89% |
| The present invention | Soak wiping | 1min-2min | 100% |
| Comparative example | Soak wiping | 8min-12min | 95% |
Described degree of cleaning refer to, the per-cent of the shared total dirt area of area of described cleaning elimination dirt, the contrast of employing Taking Pictures recording mark.
Claims (6)
1. a wiring board scavenging solution, is characterized in that, feed composition and the parts by volume thereof of described wiring board scavenging solution are as follows:
2. wiring board scavenging solution according to claim 1, is characterized in that, feed composition and parts by volume thereof are as follows:
3. the preparation method of the wiring board scavenging solution as described in claim 1,2: by each component of raw material part proportioning by volume, mix, obtain.
4. the using method of a wiring board scavenging solution as described in claim 1,2:
To unprocessed copper-clad plate, put into described wiring board scavenging solution and soak 1-2min, after taking-up, with clear water, rinse well, dry.
5. the using method of a wiring board scavenging solution as described in claim 1,2:
For the complete circuit card of welding, dip described wiring board scavenging solution circuit card is carried out to wiping, after wiped clean, described circuit card is dried.
6. the using method of wiring board scavenging solution according to claim 5, is characterized in that, dipping wiring board scavenging solution is to adopt tweezers gripping absorbent cotton or non-woven fabrics to dip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674716.5A CN103614250A (en) | 2013-12-11 | 2013-12-11 | Circuit board cleaning liquid as well as preparation and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674716.5A CN103614250A (en) | 2013-12-11 | 2013-12-11 | Circuit board cleaning liquid as well as preparation and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103614250A true CN103614250A (en) | 2014-03-05 |
Family
ID=50164970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310674716.5A Pending CN103614250A (en) | 2013-12-11 | 2013-12-11 | Circuit board cleaning liquid as well as preparation and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103614250A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372749A (en) * | 2008-10-14 | 2009-02-25 | 东莞市伟浩电子材料有限公司 | Cleaning fluid for cleaning circuit board gold board and use thereof |
-
2013
- 2013-12-11 CN CN201310674716.5A patent/CN103614250A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372749A (en) * | 2008-10-14 | 2009-02-25 | 东莞市伟浩电子材料有限公司 | Cleaning fluid for cleaning circuit board gold board and use thereof |
Non-Patent Citations (2)
| Title |
|---|
| 周志春: "印制电路板的清洗技术（二）", 《洗净技术》, vol. 2, no. 7, 31 July 2004 (2004-07-31) * |
| 唐艳冬 等: "ODS清洗替代技术为清洗行业带来的机遇和挑战", 《清洗世界》, vol. 23, no. 9, 30 September 2007 (2007-09-30) * |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |