CN103594990A - Heat conduction type bus duct - Google Patents
Heat conduction type bus duct Download PDFInfo
- Publication number
- CN103594990A CN103594990A CN201310477416.8A CN201310477416A CN103594990A CN 103594990 A CN103594990 A CN 103594990A CN 201310477416 A CN201310477416 A CN 201310477416A CN 103594990 A CN103594990 A CN 103594990A
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- Prior art keywords
- heat
- heat conduction
- bus duct
- conducting bars
- shell
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Abstract
The invention relates to a heat conduction type bus duct which is used for power transmission and distribution system. The heat conduction type bus duct comprises a shell and multi-phase conducting bars installed in the shell. At least one phase in the conducting bars is composed of two half pieces in parallel, and a heat conduction plate is fixed between the two half pieces in a clamping mode. The edges of the two sides of the heat conduction plate are close to wall panels of the shell. The two-piece type conducting bars are arranged, so that a large surface area is obtained with the same sectional area, the current-carrying capacity of the conducting bars is improved, consumption of conductor material is reduced, and cost is reduced. Through the arrangement of the heat conduction plate, heat of the conducting bars can be rapidly transmitted to the outer shell, so that the heat dissipation capacity of the whole bus duct is improved.
Description
Technical field
The present invention relates to a kind of heat-conducting bus duct for electrical power trans mission/distribution system.
Background technology
Bus duct in electrical power trans mission/distribution system generally includes housing and is placed in the heterogeneous bus in housing, and each phase bus adopts the busbar of single square-section conventionally.Due to the kelvin effect of power transmission conductor in transmission of electricity process, and the surface area limitation of busbar the raising of its current capacity, thereby it is long-pending to increase cross-sectional area of conductor, thereby improves the cost of product.In addition, the housing sealing in traditional bus duct structure makes conductor heat radiation more difficult, has affected the reliability service of equipment.
Summary of the invention
Technical problem to be solved by this invention is, provides that a kind of current capacity is strong, material consumption is few, the heat-conducting bus duct of good heat dissipation effect.
Heat-conducting bus duct of the present invention includes housing and is arranged on the heterogeneous busbar in housing, in described busbar, have at least one by two and half sheets that walk abreast, to be formed, between two and half sheets, gripped a heat-conducting plate, the both sides of the edge of heat-conducting plate are near the wallboard of housing.
On the wallboard of described housing, be provided with the radiating fin corresponding with heat-conducting plate position.
The present invention, by the busbar of two-piece type is set, can obtain larger surface area, thereby improve the current capacity of busbar under same sectional area, has reduced conductor material consumption, has reduced cost; By heat-conducting plate is set, makes the heat of busbar can pass to quickly shell, thereby improved the heat-sinking capability of whole bus duct.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As shown in the figure, this heat-conducting bus duct includes housing 1 and is arranged on the heterogeneous busbar 2 in housing, in described busbar 2, have at least one two and half sheets 21 that walk abreast, to consist of, gripped a heat-conducting plate 3 between two and half sheets, the both sides of the edge of heat-conducting plate are near the wallboard of housing 1.On the wallboard of housing, be provided with the radiating fin corresponding with heat-conducting plate position 4.
Claims (2)
1. a heat-conducting bus duct, include housing (1) and be arranged on the heterogeneous busbar (2) in housing, it is characterized in that: in described busbar (2), have at least one by two and half sheets (21) that walk abreast, to be formed, between two and half sheets, gripped a heat-conducting plate (3), the both sides of the edge of heat-conducting plate are near the wallboard of housing (1).
2. heat-conducting bus duct according to claim 1, is characterized in that: on the wallboard of housing, be provided with the radiating fin corresponding with heat-conducting plate position (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310477416.8A CN103594990A (en) | 2013-10-14 | 2013-10-14 | Heat conduction type bus duct |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310477416.8A CN103594990A (en) | 2013-10-14 | 2013-10-14 | Heat conduction type bus duct |
Publications (1)
Publication Number | Publication Date |
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CN103594990A true CN103594990A (en) | 2014-02-19 |
Family
ID=50085025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310477416.8A Pending CN103594990A (en) | 2013-10-14 | 2013-10-14 | Heat conduction type bus duct |
Country Status (1)
Country | Link |
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CN (1) | CN103594990A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106102403A (en) * | 2016-07-25 | 2016-11-09 | 东泽节能技术(苏州)有限公司 | A kind of busbar group and the mounting assembly of power semiconductor |
CN106558859A (en) * | 2015-09-26 | 2017-04-05 | 江苏向荣电气有限公司 | A kind of assembling bus duct |
CN111327006A (en) * | 2020-04-02 | 2020-06-23 | 青岛东山集团母线智造有限公司 | Balanced heat dissipation lock joint formula intensive bus duct |
CN112003219A (en) * | 2020-09-17 | 2020-11-27 | 吉林澳奇机电集团有限公司 | Small busbar combined fully-insulated enclosed bus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001028824A (en) * | 1999-07-12 | 2001-01-30 | Hitachi Cable Ltd | Bus duct |
CN2805169Y (en) * | 2005-06-15 | 2006-08-09 | 林清棻 | Novel and high performance bus casing |
CN2817156Y (en) * | 2005-06-28 | 2006-09-13 | 骆建华 | Busway |
CN101473504A (en) * | 2006-04-24 | 2009-07-01 | 刘斪博 | Multiple-run bus duct system |
CN203574333U (en) * | 2013-10-14 | 2014-04-30 | 镇江众志电力设备有限公司 | Heat conduction type bus duct |
-
2013
- 2013-10-14 CN CN201310477416.8A patent/CN103594990A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001028824A (en) * | 1999-07-12 | 2001-01-30 | Hitachi Cable Ltd | Bus duct |
CN2805169Y (en) * | 2005-06-15 | 2006-08-09 | 林清棻 | Novel and high performance bus casing |
CN2817156Y (en) * | 2005-06-28 | 2006-09-13 | 骆建华 | Busway |
CN101473504A (en) * | 2006-04-24 | 2009-07-01 | 刘斪博 | Multiple-run bus duct system |
CN203574333U (en) * | 2013-10-14 | 2014-04-30 | 镇江众志电力设备有限公司 | Heat conduction type bus duct |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106558859A (en) * | 2015-09-26 | 2017-04-05 | 江苏向荣电气有限公司 | A kind of assembling bus duct |
CN106102403A (en) * | 2016-07-25 | 2016-11-09 | 东泽节能技术(苏州)有限公司 | A kind of busbar group and the mounting assembly of power semiconductor |
CN111327006A (en) * | 2020-04-02 | 2020-06-23 | 青岛东山集团母线智造有限公司 | Balanced heat dissipation lock joint formula intensive bus duct |
CN111327006B (en) * | 2020-04-02 | 2024-04-19 | 青岛东山集团母线智造有限公司 | Balanced heat dissipation fastening type intensive bus duct |
CN112003219A (en) * | 2020-09-17 | 2020-11-27 | 吉林澳奇机电集团有限公司 | Small busbar combined fully-insulated enclosed bus |
CN112003219B (en) * | 2020-09-17 | 2021-08-20 | 吉林澳奇机电集团有限公司 | Small busbar combined fully-insulated enclosed bus |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |