CN103594145A - High-heat-resistant composite insulating material and manufacturing method thereof - Google Patents
High-heat-resistant composite insulating material and manufacturing method thereof Download PDFInfo
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- CN103594145A CN103594145A CN201310480627.7A CN201310480627A CN103594145A CN 103594145 A CN103594145 A CN 103594145A CN 201310480627 A CN201310480627 A CN 201310480627A CN 103594145 A CN103594145 A CN 103594145A
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Abstract
The invention discloses a high-heat-resistant composite insulating material and a manufacturing method of the high-heat-resistant composite insulating material. The high-heat-resistant composite insulating material sequentially comprises heat-resistant aromatic polyamide fiber paper, an adhesive and a polyimide film from outside to inside, and the adhesive is a modified organic silicon resin adhesive. The manufacturing method of the high-heat-resistant composite insulating material is simple and convenient, compression molding can be formed at medium and low temperature, energy loss caused by high-temperature compression is avoided, the manufactured high-heat-resistant composite insulating material has excellent mechanics comprehensive performance and ultrahigh heat-resistant temperature and meanwhile has excellent moisture resistance and the electrical insulation property of organic silicon resin, the comprehensive performance of the heat-resistant composite insulating material is further improved, and the high-heat-resistant composite insulating material has high application value.
Description
Technical field
The present invention relates to insulating material technical field, particularly relate to a kind of high heat-resisting composite insulating material and preparation method thereof.
Background technology
The electrical equipment turn-to-turn insulation that insulation between the groove of the motor of thermal endurance class more than H level, electrical equipment, transformer etc., phase insulation and liner insulation and serviceability temperature are higher, wrapping insulation etc., all need to have the insulating material of higher thermal endurance class, high-strength mechanical properties.In prior art, the insulating material that is usually used in above-mentioned occasion is modification adhesive NHN composite insulating material, it uses modified epoxy as adhesive, there is excellent hot adhesiveness, good dielectric property and mechanical performance, but because epoxy resin cure temperature is high, moisture resistance and electrical insulating property not good enough, can not meet instructions for use completely, useful life is short.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of high heat-resisting composite insulating material and preparation method thereof.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of high heat-resisting composite insulating material is provided, be followed successively by from outside to inside heat-resisting aromatic polyamide paper, adhesive and polyimide film, described adhesive is modified organic silicone resin adhesive.
In a preferred embodiment of the present invention, described modified organic silicone resin adhesive is at least one in polyester modified organic silicon resin adhesive, phenol aldehyde modified organic siliconresin adhesive and epoxy modified silicone resin adhesive.
For solving the problems of the technologies described above, another technical solution used in the present invention is: a kind of preparation method of high heat-resistant insulation material is provided, comprises the following steps:
(1) in modified organic silicone resin adhesive, add appropriate solvent benzol ethyl ketone, stir adhesive is all dissolved, the viscosity number of adjusting adhesive is 20s;
(2) polyimide film is immersed in the modified organic silicone resin adhesive that regulates viscosity number in step (1), after taking out, frictioning makes polyimide film both sides gel content identical;
(3) two sides of the polyimide film after gluing in step (2) is respectively applied to the heat-resisting aromatic polyamide paper of one deck, then inserted in 100 ℃ of dryers and dried 1h, proceed to again the pressure with 2MPa in 60 ℃ of hot presses and press 6h, obtain high heat-resisting composite insulating material.
The invention has the beneficial effects as follows: the preparation method of a kind of high heat-resisting composite insulating material of the present invention is easy, can be compressing under middle low temperature, avoided the energy loss of high temperature compacting, the heat-resisting composite insulating material of prepared height has excellent mechanical property and the heat resisting temperature of superelevation, have moisture resistance and the electrical insulation capability of organic siliconresin excellence concurrently simultaneously, further improve the combination property of heat-resistant insulation material, there is higher using value.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of high heat-resisting composite insulating material of the present invention;
In accompanying drawing, the mark of each parts is as follows: 1. heat-resisting aromatic polyamide paper, 2. adhesive, 3. polyimide film.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
In the present invention, the raw material of not specified (NS) and experimental technique are all experimental techniques of raw material conventional in this area.
Refer to Fig. 1, the embodiment of the present invention comprises:
A heat-resisting composite insulating material, is followed successively by heat-resisting aromatic polyamide paper 1, adhesive 2 and polyimide film 3 from outside to inside, and described adhesive 2 is modified organic silicone resin adhesive.
Described modified organic silicone resin adhesive is at least one in polyester modified organic silicon resin adhesive, phenol aldehyde modified organic siliconresin adhesive and epoxy modified silicone resin adhesive.
(1) in polyester modified organic silicon resin adhesive, add appropriate solvent benzol ethyl ketone, stir adhesive is all dissolved, the viscosity number of adjusting adhesive is 20s;
(2) polyimide film is immersed in the polyester modified organic silicon resin adhesive that regulates viscosity number in step (1), after taking out, frictioning makes polyimide film both sides gel content identical;
(3) two sides of the polyimide film after gluing in step (2) is respectively applied to the heat-resisting aromatic polyamide paper of one deck, then inserted in 100 ℃ of dryers and dried 1h, proceed to again the pressure with 2MPa in 60 ℃ of hot presses and press 6h, obtain high heat-resisting composite insulating material.
The performance of the heat-resisting composite insulating material of height that said method is prepared is as follows:
Thickness 0.33mm, hot strength 26MPa, elongation rate of tensile failure 300% ,-30～200 ℃ of bondings are not stratified, non-foaming, and long-term heat resistance temperature index is 278 ℃.
(1) in phenol aldehyde modified organic siliconresin adhesive, add appropriate solvent benzol ethyl ketone, stir adhesive is all dissolved, the viscosity number of adjusting adhesive is 20s;
(2) polyimide film is immersed in the phenol aldehyde modified organic siliconresin adhesive that regulates viscosity number in step (1), after taking out, frictioning makes polyimide film both sides gel content identical;
(3) two sides of the polyimide film after gluing in step (2) is respectively applied to the heat-resisting aromatic polyamide paper of one deck, then inserted in 100 ℃ of dryers and dried 1h, proceed to again the pressure with 2MPa in 60 ℃ of hot presses and press 6h, obtain high heat-resisting composite insulating material.
The performance of the heat-resisting composite insulating material of height that said method is prepared is as follows:
Thickness 0.31mm, hot strength 24MPa, elongation rate of tensile failure 340% ,-30～200 ℃ of bondings are not stratified, non-foaming, and long-term heat resistance temperature index is 275 ℃.
(1) in epoxy organic silicon resin adhesive, add appropriate solvent benzol ethyl ketone, stir adhesive is all dissolved, the viscosity number of adjusting adhesive is 20s;
(2) polyimide film is immersed in the epoxy modified silicone resin adhesive that regulates viscosity number in step (1), after taking out, frictioning makes polyimide film both sides gel content identical;
(3) two sides of the polyimide film after gluing in step (2) is respectively applied to the heat-resisting aromatic polyamide paper of one deck, then inserted in 100 ℃ of dryers and dried 1h, proceed to again the pressure with 2MPa in 60 ℃ of hot presses and press 6h, obtain high heat-resisting composite insulating material.
The performance of the heat-resisting composite insulating material of height that said method is prepared is as follows:
Thickness 0.28mm, hot strength 22MPa, elongation rate of tensile failure 310% ,-30～200 ℃ of bondings are not stratified, non-foaming, and long-term heat resistance temperature index is 270 ℃.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes specification of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a high heat-resisting composite insulating material, is followed successively by heat-resisting aromatic polyamide paper, adhesive and polyimide film from outside to inside, it is characterized in that, described adhesive is modified organic silicone resin adhesive.
2. the heat-resisting composite insulating material of height according to claim 1, it is characterized in that, described modified organic silicone resin adhesive is at least one in polyester modified organic silicon resin adhesive, phenol aldehyde modified organic siliconresin adhesive and epoxy modified silicone resin adhesive.
3. a preparation method for high heat-resistant insulation material claimed in claim 1, is characterized in that, comprises the following steps:
(1) in modified organic silicone resin adhesive, add appropriate solvent benzol ethyl ketone, stir adhesive is all dissolved, the viscosity number of adjusting adhesive is 20s;
(2) polyimide film is immersed in the modified organic silicone resin adhesive that regulates viscosity number in step (1), after taking out, frictioning makes polyimide film both sides gel content identical;
(3) two sides of the polyimide film after gluing in step (2) is respectively applied to the heat-resisting aromatic polyamide paper of one deck, then inserted in 100 ℃ of dryers and dried 1h, proceed to again the pressure with 2MPa in 60 ℃ of hot presses and press 6h, obtain high heat-resisting composite insulating material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310480627.7A CN103594145A (en) | 2013-10-15 | 2013-10-15 | High-heat-resistant composite insulating material and manufacturing method thereof |
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| CN201310480627.7A CN103594145A (en) | 2013-10-15 | 2013-10-15 | High-heat-resistant composite insulating material and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513725A (en) * | 2016-01-29 | 2016-04-20 | 郝福 | Compound mica tape and preparation method thereof |
| CN106531374A (en) * | 2016-10-31 | 2017-03-22 | 青岛安信绝缘材料有限公司 | Flame-retardant insulated composite material and preparation technology thereof |
| CN108864973A (en) * | 2018-06-15 | 2018-11-23 | 苏州巨峰电气绝缘***股份有限公司 | A kind of film low resin mica tape of heat-resistant fireproof |
| CN111139682A (en) * | 2019-11-12 | 2020-05-12 | 南通中菱电力科技股份有限公司 | Heat-resistant synthetic fiber paper |
-
2013
- 2013-10-15 CN CN201310480627.7A patent/CN103594145A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513725A (en) * | 2016-01-29 | 2016-04-20 | 郝福 | Compound mica tape and preparation method thereof |
| CN106531374A (en) * | 2016-10-31 | 2017-03-22 | 青岛安信绝缘材料有限公司 | Flame-retardant insulated composite material and preparation technology thereof |
| CN108864973A (en) * | 2018-06-15 | 2018-11-23 | 苏州巨峰电气绝缘***股份有限公司 | A kind of film low resin mica tape of heat-resistant fireproof |
| CN108864973B (en) * | 2018-06-15 | 2023-06-23 | 苏州巨峰电气绝缘***股份有限公司 | High-temperature-resistant flame-retardant thin film less-adhesive mica tape |
| CN111139682A (en) * | 2019-11-12 | 2020-05-12 | 南通中菱电力科技股份有限公司 | Heat-resistant synthetic fiber paper |
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Application publication date: 20140219 |