CN103591480B - 发光二极管照明装置 - Google Patents

发光二极管照明装置 Download PDF

Info

Publication number
CN103591480B
CN103591480B CN201210293669.5A CN201210293669A CN103591480B CN 103591480 B CN103591480 B CN 103591480B CN 201210293669 A CN201210293669 A CN 201210293669A CN 103591480 B CN103591480 B CN 103591480B
Authority
CN
China
Prior art keywords
light emitting
emitting diode
electrode
transparent substrates
printing opacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210293669.5A
Other languages
English (en)
Other versions
CN103591480A (zh
Inventor
陈隆欣
曾文良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Original Assignee
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rongchuang Energy Technology Co ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical Rongchuang Energy Technology Co ltd
Priority to CN201210293669.5A priority Critical patent/CN103591480B/zh
Priority to TW101131076A priority patent/TWI469316B/zh
Priority to US13/663,492 priority patent/US20140049955A1/en
Publication of CN103591480A publication Critical patent/CN103591480A/zh
Application granted granted Critical
Publication of CN103591480B publication Critical patent/CN103591480B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种发光二极管照明装置,其包括发光部以及承载座。所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管。所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极。发光二极管发出的光线可从发光二极管照明装置的正面射出,并且还可以穿过透光基板以及承载座从背面和侧面射出,从而实现了多角度发光。

Description

发光二极管照明装置
技术领域
本发明涉及一种发光二极管照明装置。
背景技术
发光二极管是一种节能、环保、长寿命的固体光源,因此近十几年来对发光二极管技术的研究一直非常活跃,发光二极管也有渐渐取代日光灯、白炽灯等传统光源的趋势。在现有技术中,发光二极管照明装置一般只能朝向一个方向发光,而无法实现多角度发光,在一些特定场合,不能够满足实际需要。
发明内容
有鉴于此,有必要提供一种可实现多角度发光的发光二极管照明装置。
一种发光二极管照明装置,其包括发光部以及承载座。所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管。所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极。
上述的发光二极管照明装置中,发光二极管发出的光线可从发光二极管照明装置的正面射出,并且还可以穿过透光基板以及承载座从背面和侧面射出,从而实现了多角度发光。
附图说明
图1为本发明实施方式中的发光二极管照明装置的结构示意图。
图2为图1中的发光二极管照明装置的分解结构示意图。
图3为图2中的发光二极管照明装置的发光部的俯视图。
图4为图2中的发光二极管照明装置的承载座的俯视图。
图5为图4中的承载座的沿VI-VI方向的截面图。
主要元件符号说明
发光二极管照明装置 100
发光部 10
承载座 20
透光基板 11
发光二极管 12
第一电极 13
第一荧光层 14
固定部 131
第一连接部 132
第二连接部 133
透光底壁 21
透光侧壁 22
凹槽 23
第二荧光层 24
第二电极 25
水平延伸部 251
垂直延伸部 252
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合附图,对本发明作进一步的详细说明。
请参阅图1以及图2,本发明实施方式提供的一种发光二极管照明装置100包括一发光部10以及承载该发光部10的一承载座20。
所述发光部10包括一透光基板11、设置在该透光基板11上的若干间隔设置的发光二极管12、分别设置在该透光基板11相对两端的第一电极13以及覆盖发光二极管12的第一荧光层14。
请接着参阅图3,所述透光基板11为纵长板状结构,其由玻璃、塑胶等透光材料构成。所述发光二极管12呈直线排列设置在透光基板11的远离承载座20的上表面上,各发光二极管12之间相互串联,并且两端的发光二极管12分别与第一电极13电连接。
所述第一电极13分别设置在透光基板11的相对两端,其包括一方形的固定部131、由该固定部131的底部延伸形成的第一连接部132以及由该固定部131的顶部延伸形成的第二连接部133。该固定部131固定在透光基板11的上表面。该第一连接部132及第二连接部133的延伸方向相反,且其末端均超出固定部的边缘并分别位于固定部的相对两侧。具体的,该第一连接部132贴附在所述透光基板11上表面并朝向发光二极管12水平延伸,用于与发光二极管12电连接。该第二连接部133朝向远离发光二极管12方向水平延伸,用于与所述承载座20电连接。所述固定部131的外侧面与所述透光基板11的两端的端面齐平。
所述第一荧光层14覆盖所述发光二极管12以及透光基板11表面,其为一透明结构,材质可为硅、玻璃、环氧树脂等。荧光粉材质可选自石榴石、硅酸盐、氮化物、氮氧化物、磷化物、硫化物中之一或几种组合的化合物。
请接着参阅图4以及图5,所述承载座20为透光材料构成,其包括一纵长板状结构的透光底壁21以及由该透光底壁21的四个侧边垂直向上延伸的透光侧壁22。该透光底壁21和该透光侧壁22共同围成一凹槽23,该凹槽23的大小与所述发光部10的透光基板11的大小大致相当,其用于***述透光基板11。该凹槽23的内表面涂覆有第二荧光层24。
所述承载座20与所述透光基板11上的第一电极13相对应的两透光侧壁22上分别设置有第二电极25。该第二电极25包括设置在透光侧壁22顶部的水平延伸部251以及由该水平延伸部251沿透光侧壁22外表面垂直向下延伸的垂直延伸部252。该第二电极25的水平延伸部251用于与第一电极13电连接,垂直延伸部252用于与外部电源电连接。
在组装时,首先将发光部10的透光基板11收容于承载座20的凹槽23中,此时,第一电极13的第二连接部133覆盖在第二电极25的水平延伸部251上,然后焊接第一电极13的第二连接部133与第二电极25的水平延伸部251,从而将发光部10固定于承载座20中。
在使用时,发光二极管12发出的光线可从发光二极管照明装置100的正面射出,并且发光二极管12发出的光线还可以穿过透光基板11以及承载座20的透光底壁21从背面射出,也可以穿过透光基板11以及承载座20的透光侧壁22从侧面射出,从而实现了多角度发光。另外,发光二极管12正向发出的光线主要激发第一荧光层14,而背向以及侧向发出的光线主要激发涂覆在凹槽23的内表面的第二荧光层24,因此通过选择不同的荧光粉材料,可以实现发光二极管照明装置100正向光线与背向以及侧向光线的颜色不同,可以满足不同的实际需要。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种像应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (3)

1.一种发光二极管照明装置,其包括发光部以及承载座,其特征在于:所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管,所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极,所述承载座包含凹槽,所述透光基板收容于所述凹槽中,所述发光二极管照明装置还包括第一荧光层及第二荧光层,所述第一荧光层位于所述基板上且包覆所述发光二极管,所述第二荧光层连续设置、形成在凹槽的内表面并完全包覆所述基板的底面及侧面,所述承载座由透光底壁及由该透光底壁朝向发光部延伸的透光侧壁构成,所述透光底壁和透光侧壁共同围成所述凹槽,所述第二电极包括设置在透光侧壁顶部的水平延伸部及由该水平延伸部沿透光侧壁外表面垂直向下延伸的垂直延伸部,所述水平延伸部用于与所述透光基板的第一电极电连接,所述垂直延伸部用于与外部电源电连接,所述第一电极包括固定在透光基板表面的固定部以及从固定部的底部延伸的第一连接部和从固定部顶部延伸的第二连接部,该第一连接部及第二连接部的延伸方向相反,且其末端均超出固定部的边缘,该第一连接部朝向发光二极管水平延伸,以与发光二极管电连接,该第二连接部朝向远离发光二极管方向延伸,并覆盖在所述第二电极的水平延伸部上,与该水平延伸部焊接,所述水平延伸部夹设于所述第二连接部与透光侧壁顶部之间。
2.如权利要求1所述的发光二极管照明装置,其特征在于:所述第一荧光层和所述第二荧光层中含有不同的荧光粉。
3.如权利要求1所述的发光二极管照明装置,其特征在于:所述透光基板为纵长板状结构,所述发光二极管呈直线排列设置在该透光基板上,各发光二极管之间相互串联,并且两端的发光二极管分别与第一电极电连接。
CN201210293669.5A 2012-08-17 2012-08-17 发光二极管照明装置 Active CN103591480B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201210293669.5A CN103591480B (zh) 2012-08-17 2012-08-17 发光二极管照明装置
TW101131076A TWI469316B (zh) 2012-08-17 2012-08-27 發光二極體照明裝置
US13/663,492 US20140049955A1 (en) 2012-08-17 2012-10-30 Led illumination device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210293669.5A CN103591480B (zh) 2012-08-17 2012-08-17 发光二极管照明装置

Publications (2)

Publication Number Publication Date
CN103591480A CN103591480A (zh) 2014-02-19
CN103591480B true CN103591480B (zh) 2016-02-17

Family

ID=50081724

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210293669.5A Active CN103591480B (zh) 2012-08-17 2012-08-17 发光二极管照明装置

Country Status (3)

Country Link
US (1) US20140049955A1 (zh)
CN (1) CN103591480B (zh)
TW (1) TWI469316B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104048204A (zh) * 2014-07-10 2014-09-17 宋勇飞 Led光源及其制造方法
US11125412B2 (en) 2014-12-01 2021-09-21 Current Lighting Solutions, Llc Lighting device with efficient light-spreading lens system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674316A (zh) * 2004-03-25 2005-09-28 西铁城电子股份有限公司 半导体发光器件
CN201007995Y (zh) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360°出光led灯
CN201661884U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 全角度照射的led灯泡
CN201868426U (zh) * 2010-10-28 2011-06-15 王元成 一种led光源
CN201892119U (zh) * 2010-11-18 2011-07-06 郑皓嵘 全方位发光led灯泡

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040173808A1 (en) * 2003-03-07 2004-09-09 Bor-Jen Wu Flip-chip like light emitting device package
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
TW201038113A (en) * 2009-04-08 2010-10-16 Aussmak Optoelectronic Corp Light emitting apparatus
TW201044904A (en) * 2009-06-02 2010-12-16 Taiwan Solutions Systems Corp Light emitting diode module and manufacture method thereof
TWM391722U (en) * 2010-05-03 2010-11-01 Ru-Yuan Yang Packing structure of white light-emitting diode with high efficiency
EP2492979A4 (en) * 2010-12-27 2012-11-28 Panasonic Corp LIGHT EMITTING DEVICE AND LAMP

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674316A (zh) * 2004-03-25 2005-09-28 西铁城电子股份有限公司 半导体发光器件
CN201007995Y (zh) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360°出光led灯
CN201661884U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 全角度照射的led灯泡
CN201868426U (zh) * 2010-10-28 2011-06-15 王元成 一种led光源
CN201892119U (zh) * 2010-11-18 2011-07-06 郑皓嵘 全方位发光led灯泡

Also Published As

Publication number Publication date
US20140049955A1 (en) 2014-02-20
TWI469316B (zh) 2015-01-11
CN103591480A (zh) 2014-02-19
TW201409661A (zh) 2014-03-01

Similar Documents

Publication Publication Date Title
EP3203280A1 (en) Substrate for color conversion, manufacturing method therefor, and display device comprising same
US10088132B2 (en) Quantum dot light source and quantum dot backlight module
CN104979455A (zh) 一种led光源装置及其封装方法及背光模组及显示装置
CN102620215B (zh) Led背光光源
CN110998880A (zh) 具有高显色指数和均匀平面照明的照明***
CN103591480B (zh) 发光二极管照明装置
CN102867820B (zh) 发光二极管封装结构
EP2720266A2 (en) Luminescence device
US9166117B2 (en) Light emitting device and method for mixing light thereof
CN204680689U (zh) 发光装置、照明用光源以及照明装置
WO2016078015A1 (zh) Led发光单元
CN102709280A (zh) 一种cob集成光源模块
CN102800782A (zh) 发光二极管光源装置
EP2416359A3 (en) Warm white light led lamp with high luminance and high color rendering index
KR20140067281A (ko) 발광 소자 패키지
CN204345536U (zh) 一种侧入式背光模组的量子点材料导光板
CN103807665A (zh) 液晶显示器、背光模块及其发光二极管组件
CN105023986B (zh) Led发光器件
CN104712922B (zh) 有机发光二极管照明装置
KR100934494B1 (ko) 백라이트 광원용 엘이디 패키지
CN105276481A (zh) 发光装置和车辆用灯具
CN104465936A (zh) 发光二极管
CN105101606A (zh) 三维电路板及具有该三维电路板的发光二极管灯具
CN204651352U (zh) 基于二次光学设计的柔性荧光基板及led光源
CN103062653B (zh) Led照明设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant