CN103579729B - A kind of spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss - Google Patents
A kind of spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss Download PDFInfo
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Abstract
A kind of spaceborne high-frequency microstrip belongs to microwave and millimeter wave transition and conversion technology between Waveguide-microbelt to the vertical change-over circuit of waveguide broad-band filter with low insertion loss.The change-over circuit includes the microstrip line that is linked in sequence, open circuit matching minor matters termination, micro-strip to the interconnection gold ribbon between coaxial line termination, and termination is flat and the coaxial glass body insulator that is sintered in cavity, is welded on the stepped probe of insulator termination.The present invention realizes the mode transition conversion of electromagnetic field between both rectangular waveguide and microstrip line main mould, complete the transmission of electromagnetic signal between rectangular waveguide and microstrip line, with ingenious in design, compact conformation, salable, converting transmission direction can be designed in the same direction, Insertion Loss is small, bandwidth, stationary wave characteristic are good the characteristics of.
Description
Technical field
The present invention relates to a kind of vertical change-over circuit of micro-strip to rectangular waveguide, specifically a kind of micro-strip passes through vertical
Coaxial configuration is transformed into the circuit of rectangular waveguide, is mainly used in HF receiver, emitter, antenna etc. and is related to signal transmission shape
The field of formula conversion.
Background technology
Micro-strip is a kind of conventional microwave circuit transformational structure to the conversion of waveguide, has developed polytype.From framework
Said in type, including micro-strip, to the direct transition of waveguide, micro-strip is by the coaxial transition for being transformed into waveguide again；From transmission direction
Say, including micro-strip is vertical with waveguide transmission direction, micro-strip two kinds of forms parallel with waveguide transmission direction；From sealing direction,
Including can be achieved complete airtight transition, and can not be airtight transition, but the micro-strip of general type is all difficult to the conversion of waveguide
Taking into account air-tightness, transmission simultaneously can same tropism and broadband filter with low insertion loss characteristic.
The content of the invention
The technology of the present invention solves problem：Overcome the deficiencies in the prior art wide to waveguide there is provided a kind of spaceborne high-frequency microstrip
The vertical change-over circuit of band filter with low insertion loss, with symport, air-tightness, bandwidth, insertion loss is low, the high advantage of reliability.
The technical solution of the present invention：A kind of spaceborne high-frequency microstrip to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, its
It is characterised by including：Microstrip line（1）, open circuit matching minor matters（2）, interconnection gold ribbon（3）, coaxial glass insulator（4）, silver-plated aluminum
Stepped probe（5）, dielectric substrate（6）, cylindrical cavity（7）, wave-guide cavity wave（8）With micro-strip cavity（9）；Wherein microstrip line
（1）Minor matters are matched with open circuit（2）Both of which is located at dielectric substrate（6）On, and be connected with each other, dielectric substrate（6）It is adhered to micro-strip
Cavity（9）On inner surface, coaxial glass insulator（4）It is sintered in micro-strip cavity（9）In, glass insulator（4）Lead upper end
It is exposed independent from lower end outside cavity, insulator must be ensured（4）Upper end and medium substrate（6）Between have gap, insulator（4）On
Termination matches minor matters with open circuit（2）By interconnecting gold ribbon（3）Crimping, the stepped probe of silver-plated aluminum（5）It is welded on glass insulation
Son（4）On lower end, with insulator（4）Gap, probe must be left between lower surface（5）It is centrally located at wave-guide cavity wave（8）Square wave
The half position on narrow side is led, as a/2 is indicated in Fig. 2, cylindrical cavity（7）Open in wave-guide cavity wave（8）On, it is silver-plated to stretch into
Aluminum probe（5）, cavity（7）Centre-to-centre spacing guide floor is certain value, as e is indicated in Fig. 2, and the size is about that correspondence transmission is believed
The 1/4 of number wavelength.
The dielectric substrate（6）Height after bonding should be with glass insulator（4）Upper end it is highly consistent, to ensure
Interconnect gold ribbon（3）Two crimping points（Glass insulator（4）Upper end matches minor matters with open circuit（2））It is on sustained height, it is real
Now crimping interconnection gold ribbon（3）Length it is most short, reduction electromagnetic field transmission discontinuity, interconnection gold ribbon should be domed, Ke Yiti
The antivibration reliability of height interconnection.
Microstrip line（1）Minor matters termination is matched with open circuit（2）It is respectively positioned on same dielectric substrate, open circuit matching minor matters（2）It is main
If falling to interconnect gold ribbon for synthesis（3）Introduced inductance characteristic, so as to realize coaxial to the impedance matching between micro-strip.
Dielectric substrate（6）With glass insulator（4）The minimum distance of upper end should control 0.1mm, as d is marked in Fig. 2, can
To ensure interconnection gold ribbon（3）Crimping span is small, and path is short, insulator（4）Upper end not with dielectric substrate（6）The ground of bottom surface is short
Connect.
Glass insulator（4）It is sintered in using solder in micro-strip cavity, it is possible to achieve micro-strip cavity（9）With wave-guide cavity wave
（8）Between gas barrier.Glass insulator（4）Lower end is in wave-guide cavity wave（8）Cylindrical hole（7）In, cylinder is logical
Hole（7）Aperture is more than probe（5）Diameter, it is ensured that the probe that finishes of welding can be in deep enough wave-guide cavity wave.Cylindrical hole（7）
With probe（5）Between form equivalent electric capacity, take part in matching, be sized further to widen and use bandwidth,
Cylindrical hole（7）Away from wave-guide cavity wave（8）The distance of rectangular waveguide bottom surface is λ/4（λ is the wavelength of correspondence frequency transmission signal）,
As e is indicated in Fig. 2.
The silver-plated probe of aluminum（5）For stairstepping, waveguide is realized to the stepped change of impedance between coaxial, relative to straight tube
Type probe, can extend and use bandwidth, probe after welding（5）Upper surface is away from glass insulator（4）Lower surface should be 0.1mm, such as
H is indicated in Fig. 2, on the one hand prevents probe decentralization, and vibration radius is excessive, and on the other hand nearer distance can also be reduced
The introduced discontinuity of termination lead.Probe（5）Inside strengthens probe containing welding hole A as shown in Figure 2 and through hole B
Silver-plated quality and soldering reliability.
As a result of coaxial interconnection, the TEM mode of coaxial interior transmission determines the transmission of micro-strip cavity and wave-guide cavity wave
Direction can arbitrarily be set, and the design, using design in the same direction, is microwave current modular product main flow thinking, specifically such as Fig. 1 institutes
Show, signal is along microstrip line（1）Transmission direction, with signal in wave-guide cavity wave（8）In rectangular waveguide transmission direction it is consistent.
The realization principle of the present invention：
The present invention realize target be by signal from microstrip line converting transmission to waveguide.Implementing principle is, such as Fig. 1 institutes
Show, pass through microstrip line first（1）Minor matters are matched with open circuit（2）And interconnection crimping gold ribbon（3）Signal is introduced into coaxial insulator
（4）In, pass through coaxial glass insulator（4）It imported into the stepped probe for being welded on lower end（5）, the probe（5）It is placed in ripple
Guide cavity body（8）The magnetic field most strength of rectangular waveguide main mould TE10 moulds, the generally half on Narrow Wall of Waveguide side, as a/2 is marked in Fig. 2
Show, be λ/4 away from guide floor（The wavelength of correspondence transmission frequency）, as e is indicated in Fig. 2, now reflectance factor is about 1, that is, is believed
Number it is all-trans through guide floor and is emitted back towards probe（5）End face position, back wave and the incidence wave in-phase stacking at probe, to conversion
The energy of place's transmission is strengthened, it can be ensured that signal as much as possible is coupled into wave-guide cavity wave, so as to obtain relatively low
Insertion loss and preferable standing wave.Open circuit matching minor matters curb interconnection gold ribbon in the transmission, mainly（3）The transmission of introducing
Discontinuity, it is ensured that signal can be completely from microstrip line（1）It imported into coaxial insulator（4）In, stepped probe and rectangle
The Space Coupling of wave-guide cavity wave, completes coaxial 50 Ω impedances to the Broadband Matching of rectangular waveguide wave impedance, realizes broadband and turns
Change transmission.
The advantage of the present invention compared with prior art is：
（1）Compared with the vertical converting transmission side of the conversion of micro-strip to waveguide, and the conversion of micro-strip-horizontal coaxial-waveguide
To the present invention uses the micro-strip that vertical coaxial configuration is realized to the conversion of waveguide, it is possible to achieve symport, in whole star layout
In can be with more compact.
（2）Compared with the patent No.：CN101752631A,《Rectangular waveguide based on magnetic coupling principle changes electricity with microstrip transition
Road》Patent described by change-over circuit, the design is that can realize symport, and good air-tightness can be realized again, right
It is more reliable for the spaceborne product built using bare chip.
（3）Soft lap joint process, compared with the change-over circuit that existing use soldering is built, resistance to shock are interconnected using gold ribbon
It is higher, it is more suitable for spaceborne use.
（4）Using stepped probe and open circuit matching minor matters, extend and use bandwidth, reduce insertion loss, and probe
Include welding hole and through hole（The bubble that export welding is produced）, as A and B are indicated in Fig. 2, silver-plated quality and welding can be improved
Quality, further improves the reliability of product.
In a word, the present invention realizes micro-strip to the transition and conversion of rectangular waveguide using vertical coaxial configuration, possesses in the same direction
Transmission, air-tightness, bandwidth, insertion loss are low, the characteristics of reliability is high.
Brief description of the drawings
Fig. 1 is circuit diagram of the invention；
Fig. 2 is circuit partial, detailed view of the invention；
Fig. 3 is wave-guide cavity wave dimensional structure diagram in one embodiment of the invention；
Fig. 4 is the schematic diagram of the dielectric substrate containing a pair of back-to-back transition and conversion circuits in one embodiment of the invention；
Fig. 5 is dielectric substrate and the top view after the assembling of micro-strip cavity in one embodiment of the invention；
Fig. 6 is micro-strip cavity and wave-guide cavity wave assembling trailing flank schematic diagram in one embodiment of the invention；
Fig. 7 is micro-strip cavity and front schematic view after wave-guide cavity wave assembling in one embodiment of the invention；
Fig. 8 is the S21 simulation result figures in one embodiment of the invention in Ka frequency ranges；
Fig. 9 is the S11 simulation result figures in one embodiment of the invention in Ka frequency ranges；
Figure 10 be one embodiment of the invention in sample Ka frequency ranges S21 measured result figures；
Figure 11 be one embodiment of the invention in sample Ka frequency ranges S11 measured result schematic diagrames；
Embodiment
As shown in figure 1, a kind of spaceborne high-frequency microstrip to the vertical change-over circuit of waveguide broad-band filter with low insertion loss includes：Microstrip line 1, open
Road matching minor matters 2, interconnection gold ribbon 3, coaxial glass insulator 4, the stepped probe 5 of silver-plated aluminum, dielectric substrate 6, cylinder are logical
Chamber 7, wave-guide cavity wave 8 and micro-strip cavity 9；Wherein microstrip line 1 matches the both of which of minor matters 2 with open circuit on dielectric substrate 6, and phase
Connect, dielectric substrate 6 is adhered on the inner surface of micro-strip cavity 9, and coaxial glass insulator 4 is sintered in micro-strip cavity 9, coaxially
The lead upper end of insulator 4 and lower end are exposed independent from outside cavity, are matched the upper end of insulator 4 with open circuit by interconnecting gold ribbon 3
Minor matters 2 are crimped, and the stepped probe 5 of silver-plated aluminum is then welded on the lower end of insulator 4, and cylindrical cavity 7 is opened in wave-guide cavity wave 8
On, to stretch into silver-plated aluminum probe 5.
Height after the dielectric substrate 6 is bonded should be highly consistent with the upper end of glass insulator 4, specifically such as Fig. 1 institutes
Show, can so ensure that 3 two crimping point upper ends of glass insulator 4 of interconnection gold ribbon match minor matters 2 with open circuit and are in same height
On degree, so as to realize most short crimping length.
The interconnection crimping of gold ribbon 3 shape should be camber line, it is specific as shown in Fig. 2 sagitta should control 0.05~0.1mm it
Between, the span between 2 crimping points should ensure that within 0.3mm, it is ensured that shorter crimping length about 0.4~0.5mm, interconnection gold
3 points of band is rectangle and fan-shaped two kinds, it is specific as in Fig. 2 C and D indicate.
The minimum distance of the dielectric substrate 6 and the termination of glass insulator 4 should control 0.1mm, it is specific as in Fig. 2 d mark
Show, 3 liang of crimping point spans of interconnection gold ribbon can either be ensured within 0.3mm, the transmission that the long interconnection gold ribbon 3 of reduction is introduced is not
Continuity, ensure that in large area short circuit of the upper end of insulator 4 not with the back side of dielectric substrate 6, causes mismatch again.
The diameter of the cylindrical cavity 7 should be greater than the diameter of probe 5, it is ensured that be welded on the probe 5 of the termination of insulator,
In the deep enough wave-guide cavity wave 8 of energy, the distance of the centre-to-centre spacing rectangular waveguide bottom surface of cylindrical cavity 7 is the corresponding transmission frequency in λ/4
Wavelength, as e is indicated in Fig. 2.
Institute's weld probe 5 is 0.1mm away from the lower surface of insulator 4 distance, as h is indicated in Fig. 2, it is ensured that the upper surface of probe 5
The lower surface of insulator 4 close as far as possible, reduces electrical transmission discontinuity, while preventing that probe 5 and the end face of micro-strip cavity 9 are short
Connect, cause mismatch, probe 5 is centrally located at the position of the half on the narrow side of the rectangular waveguide of wave-guide cavity wave 8, as a/2 is indicated in Fig. 2.
The probe 5 is stairstepping, includes termination lead welding hole, and through hole, as A and B are indicated in Fig. 2, guarantor
Probe 5 is demonstrate,proved silver-plated when, silver layer can smooth opening inwall, and bubble can be excluded effectively when welding, from
And improve welding quality.
The transmission direction of the micro-strip cavity 9 and wave-guide cavity wave 8 is design in the same direction, as shown in figure 1, signal is in microstrip line 1
On transmission direction it is consistent with the transmission direction in the rectangular waveguide of cavity cavity 8.
The course of work of the present invention：The present invention is for passive circuit therefore regardless of static and two kinds of mode of operations of dynamic, and its signal is passed
Defeated path is that signal is transmitted first since micro-strip cavity 9, and branch is matched with open circuit by the microstrip line 1 on dielectric substrate 6
After section 2, signal is imported to the upper end of coaxial glass insulator 4 by interconnection gold ribbon 3, is transferred to through the coaxial parts of insulator 4
Stretch on the silver-plated stepped aluminum probe 5 in cylindrical hole 7, then be coupled into by probe 5 in wave-guide cavity wave 8, most passed through afterwards
Waveguide mouthful output.
During signal converting transmission, open circuit matching minor matters 2 integrate the discontinuity for falling to interconnect the introducing of gold ribbon 3, realize
50 Ω's between microstrip line 1 and the coaxial line of insulator 4 continuously transmits, the coupling of stepped probe 5 and the rectangular waveguide of waveguide cavity 8,
The Ω of 4 coaxial line of insulator 50 is realized to the step conversion of wave impedance, so as to ensure the matching transmission of microwave signal.
As shown in figure 1, this transformational structure is containing the micro-strip cavity 9 for being bonded dielectric substrate 6, on dielectric substrate 6
Microstrip line 1, open circuit matching minor matters termination 2, micro-strip is sintered in coaxial in structural member to the interconnection gold ribbon 3 between coaxial line termination
Vitreum insulator 4, and through the cylindrical hole 7 on wave-guide cavity wave 8, and it is welded on the step type of the lower end of insulator 4
The silver-plated probe 5 of aluminum.
Embodiment
For convenient test, two identical change-over circuits of the present invention are symmetrically arranged at same medium first
On substrate 6, and the microstrip line 1 in two change-over circuits is connected, make two change-over circuit connections as shown in figure 4, being ready for
The micro-strip cavity of two insulators has been sintered, and has included two cylinder cavities（Go deep into for probe）With the waveguide of two rectangular waveguides
Cavity is as shown in Figure 3（Cavity all surface is silver-plated）, by the medium substrate conductive adhesive shown in Fig. 4 to micro-strip cavity,
It is 0.1mm to ensure distance of the substrate away from two insulator terminations, and substrate setting height(from bottom) is concordant with insulation subport, will with gold ribbon
Open circuit matching minor matters and insulator termination are interconnected, gold ribbon interconnection paths take it is most short, sagitta between 0.05mm to 0.1mm, across
Degree is within 0.3mm.The stepped probe of insulator termination lower end welding, it is ensured that probe end face is maintained at insulator end face
0.1mm distance.Welding finish after micro-strip cavity is assembled in wave-guide cavity wave, two cavitys fastens with screw, such as Fig. 6 and
It is externally two Waveguide interfaces, it is easy to test shown in Fig. 7.
Below according to above-mentioned theory, simulation optimization design is first carried out on computers, then processes real according to optimization design
Thing sample, is finally tested sample.
The software of simulation calculation uses HFSS14 Microwave simulation softwares, and medium substrate uses A493 potsherds, dielectric constant
9.9, thickness 0.38mm, 2~3um of gold plating thickness, micro belt line width use the Ω line widths of standard 50, and 0.38mm, open circuit minor matters are located at
Microstrip line port, width >=0.38mm, gold ribbon sagitta is set between 0.05~0.1mm, between 0.25~0.3mm of span, rectangle
Waveguide uses BJ260 sizes.
Emulation, analog simulation result such as Fig. 8, Fig. 9 institute are simulated to above-mentioned example in 18~34GHz frequency ranges
Show, 22GHz~31GHz return losses are better than -20dB, insertion loss is better than 0.1dB, the design according to corresponding to the optimum results
The corresponding exemplar of dimensioned, is tested using AgilentE8363C to exemplar, and test result as shown in Figure 10, can
To see that test result is essentially identical with simulation result, insertion loss 1.1dB deducts loss of the test waves with conversion 0.6dB, then
Unilateral change-over circuit insertion loss is better than 0.3dB, as shown in figure 11, and return loss is better than -15dB in 21.5~28GHz.Thus
Prove that the present invention is not only feasible, and implementation result has met or exceeded prior art.Therefore the present invention is not only microwave
A kind of brand-new selection in the engineering design of transition and conversion between millimeter wave frequency band rectangular waveguide and microstrip line, and structure is tight
Gather, dependable performance, can symport, can be airtight, with wide, Insertion Loss is low, with very high value.
Claims (8)
1. a kind of spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, it is characterised in that including：Microstrip line (1),
Open circuit matching minor matters (2), interconnection gold ribbon (3), coaxial glass insulator (4), probe (5), dielectric substrate (6), cylindrical cavity
(7), wave-guide cavity wave (8) and micro-strip cavity (9), wave-guide cavity wave (8) include wave-guide cavity wave (8) wall, wave-guide cavity wave (8) cavity, micro-
Attached cavity (9) includes micro-strip cavity (9) wall, micro-strip cavity (9) cavity, and coaxial glass insulator (4) is by insulated part and insertion
Lead to insulated part is constituted；Wherein microstrip line (1) matches minor matters (2) both of which with open circuit on dielectric substrate (6), and
It is connected with each other, dielectric substrate (6) is adhered on micro-strip cavity (9) wall inner surface, and coaxial glass insulator (4) is sintered in micro-strip chamber
In body (9) wall, realize on the gas barrier between micro-strip cavity (9) and wave-guide cavity wave (8), coaxial glass insulator (4) lead
Termination is stretched into micro-strip cavity (9) cavity, and coaxial glass insulator (4) lead lower end is stretched into wave-guide cavity wave (8) cavity, together
There are gap, coaxial glass insulator (4) lead upper end between axle glass insulator (4) lead upper end and medium substrate (6)
Crimped with open circuit matching minor matters (2) by interconnecting gold ribbon (3), probe (5) is welded on coaxial glass insulator (4) lead lower end
On, gap is left between the lower surface of the insulated part of coaxial glass insulator (4), the remote coaxial glass of probe (5) is exhausted
The end face of edge (4) insulated part is located at the half position on wave-guide cavity wave (8) narrow side of rectangular waveguide, and the narrow side is and probe
(5) the parallel side of bearing of trend, cylindrical cavity (7) is opened on wave-guide cavity wave (8) wall, and to stretch into probe (5), cylinder is logical
Equivalent electric capacity is formd between chamber (7) and probe (5)；The dielectric substrate (6) and coaxial glass glass insulator (4) lead
The minimum distance of upper end be 0.1mm, it is ensured that interconnection gold ribbon (3) path it is short, coaxial glass insulator (4) lead upper end not with
The short circuit in large area at dielectric substrate (6) back side.
2. spaceborne high-frequency microstrip according to claim 1 is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, it is characterised in that：
Height after dielectric substrate (6) bonding should be highly consistent with coaxial glass insulator (4) lead upper end, to ensure
(3) two crimping points of interconnection gold ribbon are on sustained height, and this two crimping points are separately positioned on coaxial glass insulator (4) and drawn
Line upper end, open circuit matching minor matters (2), realize that the length of crimping interconnection gold ribbon (3) is most short.
3. spaceborne high-frequency microstrip according to claim 1 is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, it is characterised in that：
Interconnection gold ribbon (3) crimping is shaped as camber line, and it is short that the control of sagitta and span should meet path, antivibration.
4. spaceborne high-frequency microstrip according to claim 1 is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, it is characterised in that：
The diameter of the cylindrical cavity (7) should be greater than the diameter of probe (5), it is ensured that probe (5), can deep enough wave-guide cavity wave (8) sky
In chamber, cylindrical cavity (7) centre-to-centre spacing guide floor is the wavelength that λ/4, λ is correspondence frequency transmission signal.
5. spaceborne high-frequency microstrip according to claim 1 is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss, it is characterised in that
The distance of the insulated part of the probe (5) away from coaxial glass insulator (4) is 0.1mm, it is ensured that probe (5) is close as far as possible
The lower surface of the insulated part of coaxial glass insulator (4), reduces electrical transmission discontinuity, while preventing probe (5) and micro-strip
Cavity (9) wall end face short circuit.
6. spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss according to claim 1, it is characterised in that：Institute
State probe (5) stepped for silver-plated aluminum, include termination lead welding hole (A), and through hole (B), it is ensured that probe (5) it is silver-plated
And welding quality.
7. spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss according to claim 1, it is characterised in that：Institute
The transmission direction for stating micro-strip cavity (9) and wave-guide cavity wave (8) is design in the same direction, and signal is along microstrip line (1) transmission direction, with signal
The transmission direction of rectangular waveguide in wave-guide cavity wave (8) is consistent.
8. spaceborne high-frequency microstrip is to the vertical change-over circuit of waveguide broad-band filter with low insertion loss according to claim 1, it is characterised in that：Institute
It is rectangle or sector to state interconnection gold ribbon (3).
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