CN103572240B - A kind of film coating apparatus - Google Patents
A kind of film coating apparatus Download PDFInfo
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- CN103572240B CN103572240B CN201310589150.6A CN201310589150A CN103572240B CN 103572240 B CN103572240 B CN 103572240B CN 201310589150 A CN201310589150 A CN 201310589150A CN 103572240 B CN103572240 B CN 103572240B
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- 239000007888 film coating Substances 0.000 title claims abstract description 34
- 238000009501 film coating Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000008520 organization Effects 0.000 claims abstract description 4
- 238000005240 physical vapour deposition Methods 0.000 description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The invention provides a kind of film coating apparatus, comprising: for the base plate carrying plate of bearing substrate; For carrying target, with the target loading plate making described target and described substrate be oppositely arranged; And, for being arranged at the single magnetic stripe of the side away from described base plate carrying plate of described target loading plate; Described magnetic stripe at least can move in a predetermined range of movement, and described predetermined range of movement at least comprises: the target region corresponding with described target region; And, the non-target region corresponding with the region beyond described target; Described film coating apparatus also comprises one to carry out uniform motion in described target region controlling organization for controlling described magnetic stripe.In film coating apparatus of the present invention, the predetermined range of movement of magnetic stripe will much larger than target, uniform motion can be carried out when magnetic stripe moves to target region, ensure that the homogeneity of film forming to the full extent, simultaneously because the magneticstrength of each position of target is similar, therefore target utilization can be improved greatly.
Description
Technical field
The present invention relates to coating technique field, particularly relate to a kind of film coating apparatus.
Background technology
At present, substrate needs carry out physical vapor deposition (PhysicalVaporDeposition, PVD) when carrying out multicoating, generally substrate need be placed in PVD film coating apparatus and carry out plated film.
In PVD film coating apparatus, the detailed process of vacuum magnetic-control sputtering is: in high vacuum chamber, be filled with rare gas element (being generally argon gas), and permanent magnetic strip forms the magnetic field of 250 ~ 350 Gausses at target material surface, with high-voltage electric field composition crossed electric and magnetic field.Under the effect of electric field, argon gas is ionized into positive ion and electronics, target is added with certain negative high voltage, the electronics sent from target increases by the effect in magnetic field and the ionization probability of working gas, highdensity plasma body is formed near target, argon ion accelerates to fly to target surface under the effect of Lorentz force, with very high speed bombardment target surface, makes sputtered atom out on target depart from target surface with higher kinetic energy and flies to substrate deposition film forming.
Figure 1 shows that the perspective view of traditional single magnetic stripe PVD film coating apparatus; Figure 2 shows that the vertical view of traditional single magnetic stripe PVD film coating apparatus.As depicted in figs. 1 and 2, traditional single magnetic stripe PVD film coating apparatus comprises a vacuum chamber (not shown), the base plate carrying plate being used for bearing substrate 10 is set in vacuum chamber, the target loading plate for carrying the target 20 relative with described substrate 10 is provided with, the magnetic stripe 40 being provided with target cathode framework 30 and being arranged on target cathode framework above target 20 above base plate carrying plate.Wherein, wherein the size of target cathode framework 30 is similar to target 20, for magnetic stripe 40 provides tracks, magnetic stripe 40 can carry out bidirectional-movement along target cathode framework 30, thus the range of movement A(magnetic field range of magnetic stripe 40) similar to the size of target 20, magnetic stripe 40 moves to the second edge of target 20 by the first edge of target 20, and then reversing motion, be back to the first edge, in the process, on target 20, sputtered atom out flies to substrate 10 deposit film forming with higher kinetic energy disengaging target surface.
Single magnetic stripe PVD film coating apparatus of the prior art due to magnetic stripe range of movement similar to target size, therefore magnetic stripe needs the reversing motion when moving to the edge of target, magnetic stripe at edge's stay longer of target, therefore can understand film forming in the edge of target thicker.In order to ensure the homogeneity of plated film, magnetic stripe often adopts the pattern of variable velocity motion, such as: magnetic stripe first slows down in the first edge of target, then accelerates, again at the uniform velocity through the middle portion of target, accelerate then reversing motion when arriving the second edge of target again and slow down.But this mode of motion can only promote homogeneity to a certain extent, and effect is poor.Meanwhile, because the residence time of the edge's magnetic stripe at target is longer, target consumption is large, causes target utilization very low.
Summary of the invention
The object of this invention is to provide a kind of film coating apparatus, it can improve plated film homogeneity, improves the utilization ratio of target.
Technical scheme provided by the present invention is as follows:
A kind of film coating apparatus, comprising: for the base plate carrying plate of bearing substrate; For carrying target, with the target loading plate making described target and described substrate be oppositely arranged; And, for being arranged at the single magnetic stripe of the side away from described base plate carrying plate of described target loading plate; Described magnetic stripe at least can move in a predetermined range of movement, and described predetermined range of movement at least comprises: the target region corresponding with described target region; And, the non-target region corresponding with the region beyond described target; Described film coating apparatus also comprises one to carry out uniform motion in described target region controlling organization for controlling described magnetic stripe.
Further, described film coating apparatus also comprises a target cathode framework, described target cathode framework is arranged at the side away from described target carrying sheet material of described magnetic stripe, and the size of described target cathode framework is greater than the size of the target on described target loading plate, described target cathode framework corresponding with described target region at least partially, at least another part is corresponding with the region beyond described target; Wherein, described magnetic stripe is arranged on described target cathode framework, and can along described target cathode frame movement.
Further, described target comprises the first edge and second edge relative with described first edge;
Described non-target region at least comprises the first non-target region corresponding with the region beyond the first edge of described target and second target region corresponding with the region beyond the second edge of described target.
Further, described target cathode framework comprises: with the first end of the first edge homonymy of described target; And, with the second end of the second edge homonymy of described target;
The first end of described target cathode framework is positioned at the region beyond the first edge of described target, and the second end of described target cathode framework is positioned at the region beyond the first edge of described target.
Further, described target is cuboid or the square bodily form.
Beneficial effect of the present invention is as follows:
In film coating apparatus of the present invention, the predetermined range of movement of magnetic stripe will much larger than target, uniform motion can be carried out when magnetic stripe moves to target region, ensure that the homogeneity of film forming to the full extent, simultaneously because the magneticstrength of each position of target is similar, therefore target utilization can be improved greatly.
Accompanying drawing explanation
Figure 1 shows that the perspective view of traditional single magnetic stripe PVD film coating apparatus;
Figure 2 shows that the schematic top plan view of magnetic stripe and target in traditional single magnetic stripe PVD film coating apparatus;
Figure 3 shows that the perspective view of film coating apparatus provided by the present invention;
Figure 4 shows that the schematic top plan view of film coating apparatus provided by the present invention.
Embodiment
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figure 3 and Figure 4, the invention provides a kind of film coating apparatus, described film coating apparatus comprises:
For the base plate carrying plate (not shown) of bearing substrate 100;
For carrying target 200, and make the target loading plate (not shown) that described target 200 is oppositely arranged with substrate 100;
Be arranged at the single magnetic stripe 400 of the side away from described base plate carrying plate of described target loading plate, described magnetic stripe 400 at least can move in a predetermined range of movement B, and described predetermined range of movement B at least comprises: the target region B1 corresponding with described target 200 region; And, the non-target region B2 corresponding with the region beyond described target 200;
And, a controlling organization (not shown) of to carry out uniform motion for controlling described magnetic stripe 400 in described target region B1.
By above scheme, in film coating apparatus of the present invention, the predetermined range of movement B of magnetic stripe 400 will much larger than the size of target 200, can move by non-target region B2 beyond the target 200 target region B1 corresponding with target 200 region, therefore, magnetic stripe 400 can carry out oppositely moving to non-target region B2, and uniform motion is carried out when target region B1, thus the mode of motion of the magnetic stripe 400 of PVD film coating apparatus in prior art is improved to uniform motion by variable velocity motion, promote homogeneity and target 200 utilization ratio of plated film.
In the present embodiment, preferably, as shown in Figure 3 and Figure 4, described film coating apparatus also comprises the target cathode framework 300 that is arranged at the side carried away from described target of described magnetic stripe 400, and the size of described target cathode framework 300 is greater than the size of the target 200 on described target loading plate, therefore, described target cathode framework 300 corresponding with described target 200 region at least partially, at least another part is corresponding with the region beyond described target 200; Wherein, described magnetic stripe 400 is arranged on described target cathode framework 300, and can move along described target cathode framework 300.
Adopt such scheme, the problem that plated film is thicker can be caused for target 200 edge, target cathode framework 300 in the existing PVD equipment of ratio designed by target cathode framework 300 in film coating apparatus is large, that is, target cathode framework 300 is designed and sized to the size being greater than target 200, thus make magnetic stripe 400 range of movement cover target region B1 and non-target region B2, thus, magnetic stripe 400 is when target region B1 moves, can guarantee that its motion is for uniform motion, to ensure that target 200 regional evenly consumes, improve the utilization ratio of target 200.
It should be noted that, in such scheme, by target cathode framework 300 for magnetic stripe 400 provides tracks, large by the size of the ratio target 200 that target cathode framework 300 size is done, expand the range of movement of magnetic stripe 400, it should be understood that, in actual applications, the predetermined range of movement of magnetic stripe 400 is realized to cover target region B1 and non-target region B2, also can be by other means, and the tracks of magnetic stripe 400 also can be realized by other structures, such as: magnetic stripe 400 guide rail is set separately, and make in the two ends of magnetic stripe 400 guide rail, to have at least one end to extend to beyond the edge of target 200, this be will not enumerate.
In addition, also it should be noted that, in the present invention, magnetic stripe 400 can, by beyond the opposite side edge moving to target 200 beyond a lateral edges of target 200, also can be the opposite side edge moving to target 200 beyond the lateral edges by target 200.Described target 200 can be cuboid or the square bodily form.Do not limit the shape of target 200 at this, preferably, described target 200 is cuboid.
In preferred embodiment provided by the present invention, described target 200 comprises the first edge and second edge relative with described first edge; Described non-target region B2 at least comprises the first non-target region corresponding with the region beyond the first edge of described target 200 and the second non-target region corresponding with the region beyond the second edge of described target 200.Described target cathode framework 300 comprises: with the first end of the first edge homonymy of described target 200; And, with the second end of the second edge homonymy of described target 200; The first end of described target cathode framework 300 is positioned at the region beyond the first edge of described target 200, and the second end of described target cathode framework 300 is positioned at the region beyond the first edge of described target 200.
Adopt such scheme, magnetic stripe 400 can be made by beyond the opposite side edge moving to target 200 beyond a lateral edges of target 200, thus magnetic stripe 400 can carry out reversing motion by the first non-target region B2 beyond a lateral edges of target 200, uniform motion is to the opposite side edge of target 200 again, and the second non-target region B2 beyond the opposite side edge of target 200 carries out reversing motion again, thus guarantee the uniform motion of magnetic stripe 400 at target region B1 further.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (5)
1. a film coating apparatus, comprising: for the base plate carrying plate of bearing substrate; For carrying target, with the target loading plate making described target and described substrate be oppositely arranged; And, for being arranged at the single magnetic stripe of the side away from described base plate carrying plate of described target loading plate; It is characterized in that, described magnetic stripe at least can move in a predetermined range of movement, and described predetermined range of movement at least comprises in the direction of motion of described magnetic stripe: the target region corresponding with described target region; And, the non-target region corresponding with the region beyond described target, wherein said magnetic stripe can carry out oppositely moving to described non-target region, and carries out uniform motion when described target region;
Described film coating apparatus also comprises one to carry out uniform motion in described target region controlling organization for controlling described magnetic stripe.
2. film coating apparatus according to claim 1, is characterized in that,
Described film coating apparatus also comprises a target cathode framework, described target cathode framework is arranged at the side away from described target loading plate of described magnetic stripe, and in the direction of motion of described magnetic stripe, the size of described target cathode framework is greater than the size of the target on described target loading plate, described target cathode framework corresponding with described target region at least partially, at least another part is corresponding with the region beyond described target; Wherein, described magnetic stripe is arranged on described target cathode framework, and can along described target cathode frame movement.
3. film coating apparatus according to claim 2, is characterized in that,
Described target comprises the first edge and second edge relative with described first edge;
Described non-target region at least comprises the first non-target region corresponding with the region beyond the first edge of described target and the second non-target region corresponding with the region beyond the second edge of described target in the direction of motion of described magnetic stripe.
4. film coating apparatus according to claim 3, is characterized in that,
Described target cathode framework comprises: with the first end of the first edge homonymy of described target; And, with the second end of the second edge homonymy of described target;
The first end of described target cathode framework is positioned at the region beyond the first edge of described target, and the second end of described target cathode framework is positioned at the region beyond the second edge of described target.
5. the film coating apparatus according to any one of Claims 1-4, is characterized in that, described target is cuboid or the square bodily form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310589150.6A CN103572240B (en) | 2013-11-20 | 2013-11-20 | A kind of film coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310589150.6A CN103572240B (en) | 2013-11-20 | 2013-11-20 | A kind of film coating apparatus |
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| CN103572240A CN103572240A (en) | 2014-02-12 |
| CN103572240B true CN103572240B (en) | 2016-01-06 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105256281A (en) * | 2015-11-24 | 2016-01-20 | 深圳市华星光电技术有限公司 | Magnetron sputtering coating device and target device thereof |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| CN111179793B (en) | 2020-01-06 | 2022-03-25 | 京东方科技集团股份有限公司 | Detection method and device for display substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1161401A (en) * | 1997-08-21 | 1999-03-05 | Matsushita Electric Ind Co Ltd | Sputtering and device therefor |
| CN1621559A (en) * | 2003-11-28 | 2005-06-01 | 中国科学院金属研究所 | Magnetron sputtering target capable of improving the availability of target materials |
| CN201890921U (en) * | 2010-11-26 | 2011-07-06 | 黄瑞安 | Magnetron sputtering target device of vacuum film coating machine |
| CN102187010A (en) * | 2008-10-16 | 2011-09-14 | 株式会社爱发科 | Sputtering apparatus, method for forming thin film, and method for manufacturing field effect transistor |
-
2013
- 2013-11-20 CN CN201310589150.6A patent/CN103572240B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1161401A (en) * | 1997-08-21 | 1999-03-05 | Matsushita Electric Ind Co Ltd | Sputtering and device therefor |
| CN1621559A (en) * | 2003-11-28 | 2005-06-01 | 中国科学院金属研究所 | Magnetron sputtering target capable of improving the availability of target materials |
| CN102187010A (en) * | 2008-10-16 | 2011-09-14 | 株式会社爱发科 | Sputtering apparatus, method for forming thin film, and method for manufacturing field effect transistor |
| CN201890921U (en) * | 2010-11-26 | 2011-07-06 | 黄瑞安 | Magnetron sputtering target device of vacuum film coating machine |
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