CN103571375A - Epoxy resin hot melt adhesive - Google Patents
Epoxy resin hot melt adhesive Download PDFInfo
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- CN103571375A CN103571375A CN201310505432.3A CN201310505432A CN103571375A CN 103571375 A CN103571375 A CN 103571375A CN 201310505432 A CN201310505432 A CN 201310505432A CN 103571375 A CN103571375 A CN 103571375A
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Abstract
The invention discloses epoxy resin hot melt adhesive. The epoxy resin hot melt adhesive is prepared from the following raw materials in parts by weight: 3-6 parts of angelica oil, 20-30 parts of epoxy resin E51, 15-20 parts of zinc borate, 45-55 parts of an ethylene vinyl-acetate copolymer (EVA), 1-2 parts of an antioxidant 168, 2-4 parts of ammonium polyphosphate, 5-7 parts of paraffin, 15-20 parts of terpene resin T110, 10-20 parts of a modified filler and 2-5 parts of chlorinated paraffin; wherein the modified filler is prepared from the following raw materials in parts by weight: 15-18 parts of montmorillonoid, 3-5 parts of jade powder, 7-12 parts of diatomite, 1-2 parts of precipitated barium sulfate, 1-2 parts of adipate, 1-2 parts of hydroquinone, 0.1-0.2 part of mica powder, 0.3-0.5 part of terpene resin T110, 0.5-0.8 part of epoxidized soybean oil, 0.3-0.5 part of Span-80 and 1-1.5 parts of a silane coupling agent KH580.
Description
Technical field
The invention belongs to binding agent field, relate in particular to a kind of epoxy resin hot melt adhesive.
Background technology
Hot melt adhesive is a kind of plastic tackiness agent, and in certain temperature range, its physical condition changes with temperature change, and chemical property is constant, and it is nonpoisonous and tasteless, belongs to environmental-protecting chemical product.
In recent years, the application of the novel materials such as matrix material and plastics on automobile made automobile stick with glue agent and the also sustainable growth of seal gum consumption, and wherein automotive upholstery is the field that tackiness agent consumption increases rapidly.The demand of automotive upholstery hot melt adhesive is more and more.
Epoxy resin is the thermosetting polymer synthetic materials that a class has the performances such as good bonding, corrosion-resistant, insulation, high strength.It has been widely used in the aspect such as bonding, corrosion resistant coating, insulating material of various metals and non-metallic material, in fields such as electric, electronics, optical-mechanical, engineering, civil construction and stationery sports goods manufactures, is widely applied.
Summary of the invention
The object of this invention is to provide a kind of epoxy resin hot melt adhesive.
The present invention adopts following technical scheme to achieve these goals:
A hot melt adhesive, is characterized in that, it is that raw material by following weight parts makes:
Radix Angelicae Sinensis oil 3-6, epoxy resin E51 20-30, zinc borate 15-20, EVA45-55, irgasfos 168 1-2, ammonium polyphosphate 2-4, paraffin 5-7, terpine resin T110 15-20, modified filler 10-20, clorafin 2-5;
Modified filler is made by the raw material of following weight parts: polynite 15-18, jade powder 3-5, diatomite 7-12, process white 1-2, adipic acid ester 1-2, Resorcinol 1-2, mica powder 0.1-0.2, terpine resin T110 0.3-0.5, epoxy soybean oil 0.5-0.8, department benzene-80 0.3-0.5, silane coupling agent KH580 1-1.5;
The preparation method of described modified filler is:
(1) after polynite, jade powder, diatomite mix, in dodging firing, 700-800 ℃ is dodged burning 12-15 second, pour into again in the hydrochloric acid soln that concentration is 5-8%, at 35-45 ℃, stir 15-20 minute, 500-600r/min centrifugal treating 7-12min, deionized water wash, oven dry, pulverize, cross 100-200 mesh sieve, obtain composite mineral powder;
(2) composite mineral powder and all the other raw materials and suitable quantity of water are mixed, adding 10-15% hydrochloric acid soln, to adjust PH be 5.5-6.5, and ground slurry is to 400-500 order, repeated hydrogenation sodium hydroxide solution is adjusted to neutrality, dry, then mix with surplus stock, after grinding to form nanometer powder and get final product.
Described a kind of epoxy resin hot melt adhesive, is characterized in that:
Preparation process is:
(1) epoxy resin E51, EVA, terpine resin T110 are put into kneader and mediate after 10-20 minute in 180-190 ℃, take out cooling mix standby;
(2) again by after step (1) gained material and all the other raw material blendings, in kneader, mediate after 10-15 minute at 185-188 ℃, take out coolingly, obtain.
The beneficial effect of the invention: the melt viscosity knotting strength that the present invention produces is high, and resistance to deterioration is good, resistance to acids and bases, snappiness are strong, and the modified filler and the epoxy resin compatibility that add are good.
Embodiment
A hot melt adhesive, it is that raw material by following weight kg makes:
Radix Angelicae Sinensis oil 6, epoxy resin E51 30, zinc borate 15, EVA 55, irgasfos 168 2, ammonium polyphosphate 2, paraffin 5, terpine resin T110 20, modified filler 20, clorafin 5;
Modified filler is made by the raw material of following weight kg: polynite 18, jade powder 5, diatomite 12, process white 2, adipic acid ester 2, Resorcinol 2, mica powder 0.2, terpine resin T110 0.5, epoxy soybean oil 0.8, department benzene-80 0.5, silane coupling agent KH580 1.5;
The preparation method of described modified filler is:
(1) after polynite, jade powder, diatomite mix, in dodging firing, 800 ℃ are dodged and burn 12 seconds, then to pour concentration into be in 8% hydrochloric acid soln, at 45 ℃, stir 20 minutes, 600r/min centrifugal treating 12min, deionized water wash, oven dry, pulverize, cross 200 mesh sieves, obtain composite mineral powder;
(2) composite mineral powder and all the other raw materials and suitable quantity of water are mixed, adding 15% hydrochloric acid soln, to adjust PH be 6.5, and after ground slurry to 500 order, repeated hydrogenation sodium hydroxide solution is adjusted to neutrality, dry, then mixes with surplus stock, after grinding to form nanometer powder and get final product.
Described a kind of epoxy resin hot melt adhesive, preparation process is:
(1) epoxy resin E51, EVA, terpine resin T110 are put into kneader and mediate after 20 minutes in 190 ℃, take out cooling mix standby;
(2) again by after step (1) gained material and all the other raw material blendings, in kneader, mediate after 10 minutes at 188 ℃, take out coolingly, obtain.
The apparent viscosity of the binding agent of the present embodiment is 4900MPa.s, stripping strength 53N/2.5cm
2, initial bonding strength reaches steel ball No. 5, open hour 41s, and within 24 hours, thermally-stabilised proterties is stable.
Claims (2)
1. an epoxy resin hot melt adhesive, is characterized in that, it is that raw material by following weight parts makes:
Radix Angelicae Sinensis oil 3-6, epoxy resin E51 20-30, zinc borate 15-20, EVA45-55, irgasfos 168 1-2, ammonium polyphosphate 2-4, paraffin 5-7, terpine resin T110 15-20, modified filler 10-20, clorafin 2-5;
Modified filler is made by the raw material of following weight parts: polynite 15-18, jade powder 3-5, diatomite 7-12, process white 1-2, adipic acid ester 1-2, Resorcinol 1-2, mica powder 0.1-0.2, terpine resin T110 0.3-0.5, epoxy soybean oil 0.5-0.8, department benzene-80 0.3-0.5, silane coupling agent KH580 1-1.5;
The preparation method of described modified filler is:
(1) after polynite, jade powder, diatomite mix, in dodging firing, 700-800 ℃ is dodged burning 12-15 second, pour into again in the hydrochloric acid soln that concentration is 5-8%, at 35-45 ℃, stir 15-20 minute, 500-600r/min centrifugal treating 7-12min, deionized water wash, oven dry, pulverize, cross 100-200 mesh sieve, obtain composite mineral powder;
(2) composite mineral powder and all the other raw materials and suitable quantity of water are mixed, adding 10-15% hydrochloric acid soln, to adjust PH be 5.5-6.5, and ground slurry is to 400-500 order, repeated hydrogenation sodium hydroxide solution is adjusted to neutrality, dry, then mix with surplus stock, after grinding to form nanometer powder and get final product.
2. a kind of epoxy resin hot melt adhesive according to claim 1, is characterized in that:
Preparation process is:
(1) epoxy resin E51, EVA, terpine resin T110 are put into kneader and mediate after 10-20 minute in 180-190 ℃, take out cooling mix standby;
(2) again by after step (1) gained material and all the other raw material blendings, in kneader, mediate after 10-15 minute at 185-188 ℃, take out coolingly, obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310505432.3A CN103571375A (en) | 2013-10-24 | 2013-10-24 | Epoxy resin hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310505432.3A CN103571375A (en) | 2013-10-24 | 2013-10-24 | Epoxy resin hot melt adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103571375A true CN103571375A (en) | 2014-02-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310505432.3A Pending CN103571375A (en) | 2013-10-24 | 2013-10-24 | Epoxy resin hot melt adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN103571375A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952094A (en) * | 2014-03-24 | 2014-07-30 | 铜陵市松马食品包装机械制造有限责任公司 | Paper-plastic package heat-sealing glue and preparation method thereof |
| CN104087202A (en) * | 2014-06-26 | 2014-10-08 | 滁州市光威化工有限公司 | Rare earth hot melt adhesive |
| CN104194657A (en) * | 2014-07-31 | 2014-12-10 | 吕明肇 | Temperature-resistant and oil-resistant hot melt adhesive for perfect binding of notebook |
| CN111609172A (en) * | 2020-04-28 | 2020-09-01 | 福建盛辉科技发展有限公司 | Inner valve core pipe and manufacturing method thereof |
| CN114806416A (en) * | 2022-05-05 | 2022-07-29 | 广西众昌树脂有限公司 | High-performance environment-friendly safe hot melt adhesive resin and preparation method thereof |
| WO2023201795A1 (en) * | 2022-04-18 | 2023-10-26 | 广东汇齐新材料有限公司 | Hot melt adhesive film having high-viscosity metal force and preparation method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289599A (en) * | 2008-06-04 | 2008-10-22 | 金尔昇 | Process for dispersing hot-melt adhesive fillers |
| WO2010003038A2 (en) * | 2008-07-03 | 2010-01-07 | Bostik, Inc. | Hot melt wetness indicator adhesive composition containing uv fluorescent agent |
| CN102653666A (en) * | 2012-04-28 | 2012-09-05 | 成都鑫三洋科技发展有限公司 | Method for preparing hot melt adhesive |
-
2013
- 2013-10-24 CN CN201310505432.3A patent/CN103571375A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289599A (en) * | 2008-06-04 | 2008-10-22 | 金尔昇 | Process for dispersing hot-melt adhesive fillers |
| WO2010003038A2 (en) * | 2008-07-03 | 2010-01-07 | Bostik, Inc. | Hot melt wetness indicator adhesive composition containing uv fluorescent agent |
| CN102653666A (en) * | 2012-04-28 | 2012-09-05 | 成都鑫三洋科技发展有限公司 | Method for preparing hot melt adhesive |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952094A (en) * | 2014-03-24 | 2014-07-30 | 铜陵市松马食品包装机械制造有限责任公司 | Paper-plastic package heat-sealing glue and preparation method thereof |
| CN103952094B (en) * | 2014-03-24 | 2016-04-06 | 铜陵市松马食品包装机械制造有限责任公司 | A kind of paper-plastic package heat-seal adhesive and preparation method thereof |
| CN104087202A (en) * | 2014-06-26 | 2014-10-08 | 滁州市光威化工有限公司 | Rare earth hot melt adhesive |
| CN104087202B (en) * | 2014-06-26 | 2016-03-23 | 滁州市光威化工有限公司 | A kind of rare earth hot melt adhesive |
| CN104194657A (en) * | 2014-07-31 | 2014-12-10 | 吕明肇 | Temperature-resistant and oil-resistant hot melt adhesive for perfect binding of notebook |
| CN104194657B (en) * | 2014-07-31 | 2016-02-10 | 吕明肇 | A kind of notebook glue of heatproof oil resistant is ordered and is used hot melt adhesive |
| CN111609172A (en) * | 2020-04-28 | 2020-09-01 | 福建盛辉科技发展有限公司 | Inner valve core pipe and manufacturing method thereof |
| WO2023201795A1 (en) * | 2022-04-18 | 2023-10-26 | 广东汇齐新材料有限公司 | Hot melt adhesive film having high-viscosity metal force and preparation method therefor |
| CN114806416A (en) * | 2022-05-05 | 2022-07-29 | 广西众昌树脂有限公司 | High-performance environment-friendly safe hot melt adhesive resin and preparation method thereof |
| CN114806416B (en) * | 2022-05-05 | 2023-08-29 | 广州市合盛实业有限公司 | High-performance environment-friendly safe hot melt adhesive resin and preparation method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140212 |
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| RJ01 | Rejection of invention patent application after publication |