CN103567888A - Grinding tool with ceramic bonding agents and method for manufacturing grinding tool - Google Patents
Grinding tool with ceramic bonding agents and method for manufacturing grinding tool Download PDFInfo
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- CN103567888A CN103567888A CN201210269694.XA CN201210269694A CN103567888A CN 103567888 A CN103567888 A CN 103567888A CN 201210269694 A CN201210269694 A CN 201210269694A CN 103567888 A CN103567888 A CN 103567888A
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Abstract
The invention relates a grinding tool with ceramic bonding agents and a method for manufacturing the grinding tool, and provides a grinding tool with ceramic bonding agents for processing microelectronics molds and dies. The grinding tool and the method are used for processing microelectronics molds and dies. The grinding tool comprises corundum grinding compounds, kyanite and the ceramic bonding agents. The volume of the kyanite accounts for 9% to 45% of the total volume of the corundum grinding compounds and the kyanite.
Description
Technical field
The invention belongs to grinding tool field, relate to a kind of vitrified bonded grinding tool, more particularly, relate to a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining and production method thereof.
Background technology
Microelectric technique is the core technology of high-tech and information industry, is along with integrated circuit, especially Large Scale integrated circuit and the new technology that grows up.A series of special technology such as it comprises circuit system design, device physics, technology, material preparation, automatically test and encapsulate, assembling are the summations of the every technology in microelectronics.Microelectronic industry is also infrastructural industries simultaneously, why it develops so soon, except technology itself is to the huge contribution of national economy, also the permeability extremely strong with it is relevant, and the semiconductors such as the computer in daily life, mobile phone or communication apparatus all be unable to do without relevant microelectronic product, accessory or element.
Just because of this, the manufacturing of microelectronic product or element has larger demand to associated metal mould (also claiming " mold and dye "); And, because microelectronic product volume is conventionally less, the precision of metal die or quality are also had to higher requirement.
When the above-mentioned metal die of processing, need to by grinding tool or emery wheel, remove the non-surplus that needs of metal grinding tool, obtain specific shape, size, and acceptable workpiece surface finish etc.
Described grinding tool or emery wheel generally can be selected vitrified bonded grinding tool, but not other emery wheels such as resinoid bonded grinding tool.Reason is that the rigidity of vitrified bonded grinding tool is large, is applicable to retrofit, and can guarantee the grinding depth that work piece production is required, and resinoid bonded grinding tool has certain elasticity modification ability, and processing precise degree is lower.
Grinding depth (MDBB, max grinding depth before work piece getting burn) after referring to that grinding process starts, emery wheel starts grinding work piece, carrying out along with grinding process, emery wheel is passivation gradually, and grinding capacity declines, and directly causes producing in grinding process amount of heat, cause workpiece burn, the workpiece degree of depth that emery wheel grinds away before workpiece burn is " grinding depth ".
After workpiece burn, the crystalline phase tissue of workpiece, microstructure, firmness levels etc. can change, thereby affect use and the life-span of workpiece, and this is in material processing, to need to be avoided.Therefore, when workpiece approaches burn, just need to repair emery wheel, make its sharpening and again possess good grinding capacity.Yet the finishing of emery wheel can consume a large amount of abrasive material (consuming much larger than grinding work piece), also can expend a large amount of time.The workpiece degree of depth that emery wheel grinds away before workpiece burn is directly reacted the life-span of emery wheel and the efficiency of grinding, grinding depth is larger, illustrate emery wheel twice currying work every between workpiece stock removal more, thereby guarantee that emery wheel has longer life and higher grinding efficiency.
In prior art, the vitrified bonded grinding tool of processing microelectronic product mould is by abrasive material, vitrified bond, and pore forms.All by corundum abrasive, (100% corundum is selected Al to relevant grinding tool product in the market conventionally
2o
3content reaches white fused alumina more than 99.4% weight ratio) and vitrified bond (traditional vitreous binding material) produce, have no the report that uses other abrasive material to replace corundum.Document " application of kyanite in resin high speed grinding wheel is manufactured " (< < diamond and grinding materials and grinding tool engineering > >, the 3rd phase the 33rd volume in 2010, Wang Hao, Wang Zhiqiang, Wang Juntao) be once disclosed in emery wheel, use other mineral matters such as a small amount of kyanite as additive or filler to improve the technology of grinding wheel performance, but have no, use kyanite or other mineral parts to replace corundum to play the report of abrasive material effect, and additive or filler are used for resinoid bonded grinding tool.
Those skilled in the art generally believe, can not too much add various mineral matters or various mineral parts are substituted to corundum abrasive in emery wheel, and its reason is, vitrified bonded grinding wheel goods have the demand of many performances, and emery wheel component is had to high requirement.The present inventor is by great many of experiments, finds that most mineral matter all can not be for the making of vitrified bonded grinding wheel, otherwise can affect the performance of emery wheel.
First, the component of vitrified bonded grinding wheel should be able to be resisted firing temperature, and the mineral matter fusing points such as garnet are very low, and at high temperature melting or decomposition, can not be for the manufacture of this kind of emery wheel.
Secondly, between vitrified bonded grinding wheel component, should there is no obvious interreaction, because at high temperature melting of vitrified bond is fluid substance, a lot of mineral matters are had to corrosivity, so a lot of mineral matters can not be for this product, such as flint clay, it at high temperature reacts with bonding agent, causes performance uncontrollable and cannot use.
Finally, the appearance and size difference between vitrified bonded grinding wheel component can not be too large, as wollastonite, because it presents acicular texture and very thin, can produce agglomeration, make grinding wheel performance uncontrollable and easily cause structure inhomogeneous, cause wheel strength lower, cannot use.
In view of the foregoing, consider the grinding performance of corundum abrasive excellence, and irreplaceability, those skilled in the art all use corundum as the abrasive material of vitrified bonded grinding tool.But the known corundum abrasive in this area is expensive, the cost of making emery wheel with it is also higher.
Up to now, a kind of excellent grinding performance, low cost, specious vitrified bonded grinding tool of having concurrently not yet developed in this area.
Summary of the invention
The invention provides a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining and production method thereof of novelty, thereby the defect and the problem that in prior art, exist have been solved, but also overcome the long-standing technology prejudice of those skilled in the art, be that corundum abrasive in vitrified bonded grinding tool can not partly be substituted by the lower material of hardness, otherwise can affect the service behaviour of grinding tool.
The present inventor finds after deliberation afterwards, utilize the kyanite of designated volume ratio partly to replace the abrasive ingredients (corundum) in vitrified bonded grinding tool in the market, can significantly reduce the manufacturing cost of vitrified bonded grinding tool, and the grinding performance of vitrified bonded grinding tool does not obviously reduce; Meanwhile, in vitrified bonded grinding tool, add the high temperature resistant colorant of designated volume ratio, can on vitrified bonded grinding tool surface, form the color of homogeneous, change the outward appearance flaw causing to grinding tool due to kyanite, make the final acquisition of Ceramic bond tool appearance attractive in appearance.Based on above-mentioned discovery, the present invention is accomplished.
On the one hand, the invention provides a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining, comprise corundum abrasive, kyanite, and vitrified bond, wherein, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%.
One preferred embodiment in, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 14% to 20%.
Another preferred embodiment in, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 20% to 26%.
Another preferred embodiment in, described kyanite volume account for corundum abrasive and kyanite cumulative volume 26% to 33%.
Another preferred embodiment in, described kyanite volume account for corundum abrasive and kyanite cumulative volume 33% to 41%.
Another preferred embodiment in, the particle size range of described kyanite is 50 to 800 microns.
Another preferred embodiment in, the particle size range of described kyanite is 200 to 600 microns.
Another preferred embodiment in, the particle size range of described corundum abrasive is 250 to 600 microns.
Another preferred embodiment in, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
Another preferred embodiment in, the hardness of described kyanite is less than the hardness of corundum abrasive.
Another preferred embodiment in, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
Another preferred embodiment in, described corundum abrasive is selected from white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more combination.
Another preferred embodiment in, described vitrified bond is vitreous binding material, its composition comprises: kaolin, borax and flux.
Another preferred embodiment in, in described vitrified bond, also comprise that colour temp is higher than the colorant of 900 ℃, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
Another preferred embodiment in, described colorant is selected from chrome green, dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
Another preferred embodiment in, described colorant is chrome green colorant, its composition comprises: the composition of chromium, aluminium, oxygen element.
Its two, the invention provides a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining, comprise, with the stereometer of described grinding tool, following component:
The abrasive material of 44 volume % to 52 volume %, wherein, with the stereometer of described abrasive material, comprises 9% to 45% kyanite and 55% to 91% corundum abrasive;
The vitrified bond of 5 volume % to 15 volume %; And
The pore of surplus volume.
One preferred embodiment in, described abrasive material comprises the kyanite of 14 volume % to 20 volume % and the corundum abrasive of 80 volume % to 86 volume %.
Another preferred embodiment in, described abrasive material comprises the kyanite of 20 volume % to 26 volume % and the corundum abrasive of 74 volume % to 80 volume %.
Another preferred embodiment in, described abrasive material comprises that 26 volume % are to the kyanite of volume 33% and the corundum abrasive of 67 volume % to 74 volume %.
Another preferred embodiment in, described abrasive material comprises the kyanite of 33 volume % to 41 volume % and the corundum abrasive of 59 volume % to 67 volume %.
Another preferred embodiment in, the particle size range of described kyanite is 50 to 800 microns.
Another preferred embodiment in, the particle size range of described kyanite is 200 to 600 microns.
Another preferred embodiment in, the particle size range of described corundum abrasive is 250 to 600 microns.
Another preferred embodiment in, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
Another preferred embodiment in, the hardness of described kyanite is less than the hardness of corundum abrasive.
Another preferred embodiment in, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
Another preferred embodiment in, described corundum abrasive is selected from the combination of white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more.
Another preferred embodiment in, described vitrified bond is vitreous binding material, its composition comprises: kaolin, borax and flux.
Another preferred embodiment in, in described vitrified bond, also comprise that colour temp is higher than the colorant of 900 ℃, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
Another preferred embodiment in, described colorant is selected from chrome green, dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
Another preferred embodiment in, described colorant is chrome green colorant, its composition comprises: the composition of chromium, aluminium, oxygen element.
Its three, the invention provides a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining, comprise, with the weighing scale of described grinding tool, following component:
The abrasive material of 82 % by weight to 95 % by weight, wherein, with the weighing scale of described abrasive material, comprises the kyanite of 8 % by weight to 44 % by weight and the corundum abrasive of 56 % by weight to 92 % by weight; And
The vitrified bond of 5 % by weight to 18 % by weight.
One preferred embodiment in, described abrasive material comprises the kyanite of 13 % by weight to 20 % by weight and the corundum abrasive of 80 % by weight to 87 % by weight.
Another preferred embodiment in, described abrasive material comprises the kyanite of 19 % by weight to 25 % by weight and the corundum abrasive of 75 % by weight to 81 % by weight.
Another preferred embodiment in, described abrasive material comprises the kyanite of 25 % by weight to 32 % by weight and the corundum abrasive of 68% weight to 75 % by weight.
Another preferred embodiment in, described abrasive material comprises the kyanite of 31 % by weight to 40 % by weight and the corundum abrasive of 60 % by weight to 69 % by weight.
Another preferred embodiment in, the particle size range of described kyanite is 50 to 800 microns.
Another preferred embodiment in, the particle size range of described kyanite is 200 to 600 microns.
Another preferred embodiment in, the particle size range of described corundum abrasive is 250 to 600 microns.
Another preferred embodiment in, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
Another preferred embodiment in, the hardness of described kyanite is less than the hardness of corundum abrasive.
Another preferred embodiment in, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
Another preferred embodiment in, described corundum abrasive is selected from the combination of white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more.
Another preferred embodiment in, described vitrified bond is vitreous binding material, its composition comprises: kaolin, borax and flux.
Another preferred embodiment in, in described vitrified bond, also comprise that colour temp is higher than the colorant of 900 ℃, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
Another preferred embodiment in, described colorant is selected from chrome green, dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
Another preferred embodiment in, described colorant is chrome green colorant, its composition comprises: the composition of chromium, aluminium, oxygen element.
They are four years old, the invention provides a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining, comprise corundum abrasive, kyanite, vitrified bond, wherein, also comprise that colour temp is higher than the colorant of 900 ℃ in vitrified bond, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
One preferred embodiment in, described colorant is selected from chrome green, dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
Another preferred embodiment in, described colorant is chrome green colorant, its composition comprises: the composition of chromium, aluminium, oxygen element.
On the other hand, the present invention also provides the method for a kind of production for the vitrified bonded grinding tool of microelectronic industry Mould Machining, and its step comprises:
Step 1: corundum abrasive is mixed with kyanite;
Step 2: the compound abrasive of corundum abrasive and kyanite is put into mixer;
Step 3: add vitrified bond to stir, and form slurry;
Step 4: slurry is weighed and be pressed into prefabricated component;
Step 5: prefabricated component is sent into kiln and fire.
One preferred embodiment in, in above-mentioned steps one, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%.
Another preferred embodiment in, in above-mentioned steps three, be also included in vitrified bond and add colour temp higher than the step of the colorant of 900 ℃.
Another preferred embodiment in, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
Beneficial effect of the present invention is as follows:
Compare with vitrified bonded grinding tool in the market, the manufacturing cost of vitrified bonded grinding tool of the present invention declines to a great extent, and grinding performance is suitable, and specious.
Accompanying drawing explanation
Fig. 1 shows along with kyanite content increases, the variation of MDBB.
Fig. 2 shows the outward appearance of the vitrified bonded grinding tool making according to the embodiment of the present application 2.
Fig. 3 shows the outward appearance of the vitrified bonded grinding tool making according to the embodiment of the present application 3.
The specific embodiment
Technical conceive of the present invention is as follows:
Kyanite is a kind of natural mineral matter, and chemical formula is Al
2siO
5, mainly for the preparation of refractory material, its hardness is lower than conventional abrasives corundum, there are no coming part to replace the report of conventional abrasives corundum with it; But the price of kyanite is obviously at least cheap more than 50% than traditional corundum abrasive, therefore, utilize kyanite to replace the part abrasive material in emery wheel, the cost of emery wheel will obviously decline undoubtedly;
The component of vitrified bonded grinding wheel should be able to be resisted firing temperature, and kyanite can be resisted the firing temperature of the vitrified bonded grinding tool of 900-950 ℃;
Between the component of vitrified bonded grinding wheel, should significantly not react to each other, and kyanite can not occur significantly to react with vitreous binding material;
Appearance and size between vitrified bonded grinding wheel component can not have larger difference, and appearance and size difference between other component in kyanite and emery wheel goods is less;
Most importantly, utilize the kyanite of designated volume ratio partly to replace the abrasive ingredients (corundum) in vitrified bonded grinding tool in the market, significantly changing does not appear in the grinding performance of emery wheel;
In addition, add the vitrified bonded grinding tool of kyanite to form color spot on surface, and grinding tool buyer it has been generally acknowledged that the grinding tool with color spot has mass defect, and refusal is bought; So be necessary to add the colorant of designated volume ratio in vitrified bonded grinding tool, this colorant not only can form at wheel face the color of homogeneous, thereby make the specious of emery wheel, and will guarantee in emery wheel production process high temperature resistant, and in use colour-fast.
In a first aspect of the present invention, a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining is provided, comprise corundum abrasive, kyanite, and vitrified bond, wherein, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%, preferably 14% to 20%, more preferably 20% to 26%, more preferably 26% to 33%, most preferably 33% to 41%.
In a second aspect of the present invention, a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining is provided, comprise, with the stereometer of described grinding tool, following component:
The abrasive material of 44 volume % to 52 volume %, wherein, with the stereometer of described abrasive material, comprises 9% to 45% kyanite and 55% to 91% corundum abrasive;
The vitrified bond of 5 volume % to 15 volume %; And
The pore of surplus volume.
Preferably, described abrasive material comprises the kyanite of 14 volume % to 20 volume % and the corundum abrasive of 80 volume % to 86 volume %; More preferably, described abrasive material comprises the kyanite of 20 volume % to 26 volume % and the corundum abrasive of 74 volume % to 80 volume %; More preferably, described abrasive material comprises that 26 volume % are to the kyanite of volume 33% and the corundum abrasive of 67 volume % to 74 volume %; Most preferably, described abrasive material comprises the kyanite of 33 volume % to 41 volume % and the corundum abrasive of 59 volume % to 67 volume %.
In a third aspect of the present invention, a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining is provided, comprise, with the weighing scale of described grinding tool, following component:
The abrasive material of 82 % by weight to 95 % by weight, wherein, with the weighing scale of described abrasive material, comprises the kyanite of 8 % by weight to 44 % by weight and the corundum abrasive of 56 % by weight to 92 % by weight; And
The vitrified bond of 5 % by weight to 18 % by weight.
Preferably, described abrasive material comprises the kyanite of 13 % by weight to 20 % by weight and the corundum abrasive of 80 % by weight to 87 % by weight; More preferably, described abrasive material comprises the kyanite of 19 % by weight to 25 % by weight and the corundum abrasive of 75 % by weight to 81 % by weight; More preferably, described abrasive material comprises the kyanite of 25 % by weight to 32 % by weight and the corundum abrasive of 68% weight to 75 % by weight; Most preferably, described abrasive material comprises the kyanite of 31 % by weight to 40 % by weight and the corundum abrasive of 60 % by weight to 69 % by weight.
In a fourth aspect of the present invention, a kind of vitrified bonded grinding tool for microelectronic industry Mould Machining is provided, comprise corundum abrasive, kyanite, vitrified bond, wherein, also comprise that colour temp is higher than the colorant of 900 ℃ in vitrified bond, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
In the present invention, the particle size range of described kyanite is 50 to 800 microns, preferably 200 to 600 microns.
In the present invention, the particle size range of described corundum abrasive is 250 to 600 microns.
In the present invention, the hardness range of described kyanite is 4 to 7 mohs hardnesses.Preferably, the hardness of described kyanite is less than the hardness of corundum abrasive.
In the present invention, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
In the present invention, described corundum abrasive is selected from white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more combination.
In the present invention, described vitrified bond is vitreous binding material, and its composition comprises: kaolin, borax and flux, can be prepared voluntarily by applicant.
In the present invention, also comprise that colour temp is higher than the colorant of 900 ℃ in described vitrified bond, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
In the present invention, described colorant is selected from chrome green, and dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.Preferably, described colorant is chrome green colorant, and its composition comprises: the composition of chromium, aluminium, oxygen element.
In a fifth aspect of the present invention, the method for a kind of production for the vitrified bonded grinding tool of microelectronic industry Mould Machining is provided, its step comprises:
Step 1: corundum abrasive is mixed with kyanite;
Step 2: the compound abrasive of corundum abrasive and kyanite is put into mixer;
Step 3: add vitrified bond to stir, and form slurry;
Step 4: slurry is weighed and be pressed into prefabricated component;
Step 5: prefabricated component is sent into kiln and fire.
Preferably, in step 1, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%.
Preferably, in step 3, be also included in vitrified bond and add colour temp higher than the step of the colorant of 900 ℃.
Preferably, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
In the present invention, the firing temperature of described vitrified bonded grinding tool between 900-950 ℃, thereby can mate well with kyanite, can not produce kyanite and when high temperature sintering, produce irreversible expansion, directly cause emery wheel to prepare failed problem.
embodiment
Below in conjunction with specific embodiment, further set forth the present invention.The following example is only for explaining and explanation the present invention, and do not form limitation of the scope of the invention.
embodiment 1: use the kyanite of 23 volume % to prepare vitrified bonded grinding tool
According to following formula, prepare according to the method described in the present invention vitrified bonded grinding tool:
The abrasive material of 48 volume %, wherein, described abrasive material is by kyanite (35 sieve meshes (mesh) of 23 volume %, purchased from Virginia kyanite exploitation company (Virginia Kyanite Mining Corporation)) and the white fused alumina of 77 volume % (purchased from canal, Jining diamond dust factory, 46#) form, with the stereometer of described abrasive material;
The vitrified bond of 10 volume % (that is the vitreous binding material that, applicant prepares voluntarily);
The chrome green colorant (purchased from Zibo Fulu New Material Co., Ltd) of 2 quality %, in the quality of described vitrified bond.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
embodiment 2: use the kyanite of 30 volume % to prepare vitrified bonded grinding tool
Except using the abrasive material being formed by the kyanite of 30 volume % and the corundum of 70 volume %, by the formula with identical shown in embodiment 1, prepare according to the method described in the present invention vitrified bonded grinding tool.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
The outward appearance of the vitrified bonded grinding tool making as shown in Figure 2.As can be seen from Figure 2, at the wheel face making, form the color of homogeneous, without obvious dim spot, thereby make the specious of emery wheel.
embodiment 3: use the kyanite of 30 volume % to prepare vitrified bonded grinding tool
Except using the chrome green colorant of 3 quality %, by the formula with identical shown in embodiment 2, prepare according to the method described in the present invention vitrified bonded grinding tool.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
The outward appearance of the vitrified bonded grinding tool making as shown in Figure 3.As can be seen from Figure 3, at the wheel face making, form the color of homogeneous, without obvious dim spot, thereby make the specious of emery wheel.
embodiment 4: use the kyanite of 34 volume % to prepare vitrified bonded grinding tool
Except using the abrasive material being formed by the kyanite of 34 volume % and the corundum of 66 volume %, by the formula with identical shown in embodiment 1, prepare according to the method described in the present invention vitrified bonded grinding tool.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
embodiment 5: use the kyanite of 40 volume % to prepare vitrified bonded grinding tool
Except using the abrasive material being formed by the kyanite of 40 volume % and the corundum of 60 volume %, by the formula with identical shown in embodiment 1, prepare according to the method described in the present invention vitrified bonded grinding tool.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
comparative example 1: use the kyanite of 0 volume % to prepare vitrified bonded grinding tool
Except the abrasive material that the corundum using by 100 volume % forms, press and formula identical shown in embodiment 1, according to this area conventional method, prepare vitrified bonded grinding tool.
" grinding depth (MDBB) " of the vitrified bonded grinding tool making according to the test of this area conventional method, result is as shown in table 1 below.
Table 1
From upper table 1, in conjunction with Fig. 1, can obviously must find out, utilize the kyanite of designated volume ratio partly to replace the abrasive ingredients (corundum) in vitrified bonded grinding tool in the market, significantly changing does not appear in the grinding performance of emery wheel, and the manufacturing cost of vitrified bonded grinding tool significantly declines; And, owing to having added the colorant of designated volume ratio, at wheel face, form the color of homogeneous, thereby make the specious of emery wheel.
All documents of mentioning in the present invention are all quoted as a reference in this application, just as each piece of document, are quoted as a reference separately.In addition should be understood that, after having read foregoing of the present invention, those skilled in the art can make various changes or modifications the present invention, these are equal to change and fall within equally the application's appended claims limited range.
Claims (55)
1. for a vitrified bonded grinding tool for microelectronic industry Mould Machining, comprise corundum abrasive, kyanite, and vitrified bond, wherein, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%.
2. vitrified bonded grinding tool as claimed in claim 1, is characterized in that, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 14% to 20%.
3. vitrified bonded grinding tool as claimed in claim 1, is characterized in that, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 20% to 26%.
4. vitrified bonded grinding tool as claimed in claim 1, is characterized in that, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 26% to 33%.
5. vitrified bonded grinding tool as claimed in claim 1, is characterized in that, the volume of described kyanite account for corundum abrasive and kyanite cumulative volume 33% to 41%.
6. the vitrified bonded grinding tool as described in any one in claim 1 to 5, is characterized in that, the particle size range of described kyanite is 50 to 800 microns.
7. vitrified bonded grinding tool as claimed in claim 6, is characterized in that, the particle size range of described kyanite is 200 to 600 microns.
8. the vitrified bonded grinding tool as described in any one in claim 1 to 5, is characterized in that, the particle size range of described corundum abrasive is 250 to 600 microns.
9. the vitrified bonded grinding tool as described in any one in claim 1 to 5, is characterized in that, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
10. vitrified bonded grinding tool as claimed in claim 9, is characterized in that, the hardness of described kyanite is less than the hardness of corundum abrasive.
11. vitrified bonded grinding tools as described in any one in claim 1 to 5, is characterized in that, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
12. vitrified bonded grinding tools as described in any one in claim 1 to 5, is characterized in that, described corundum abrasive is selected from white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more combination.
13. vitrified bonded grinding tools as claimed in claim 1, is characterized in that, described vitrified bond is vitreous binding material, and its composition comprises: kaolin, borax and flux.
14. vitrified bonded grinding tools as described in claim 1 or 13, is characterized in that, also comprise that colour temp is higher than the colorant of 900 ℃ in described vitrified bond, and the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
15. vitrified bonded grinding tools as claimed in claim 14, is characterized in that, described colorant is selected from chrome green, and dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
16. vitrified bonded grinding tools as claimed in claim 15, is characterized in that, described colorant is chrome green colorant, and its composition comprises: the composition of chromium, aluminium, oxygen element.
17. 1 kinds of vitrified bonded grinding tools for microelectronic industry Mould Machining, comprise, with the stereometer of described grinding tool, and following component:
The abrasive material of 44 volume % to 52 volume %, wherein, with the stereometer of described abrasive material, comprises 9% to 45% kyanite and 55% to 91% corundum abrasive;
The vitrified bond of 5 volume % to 15 volume %; And
The pore of surplus volume.
18. vitrified bonded grinding tools as claimed in claim 17, is characterized in that, described abrasive material comprises the kyanite of 14 volume % to 20 volume % and the corundum abrasive of 80 volume % to 86 volume %.
19. vitrified bonded grinding tools as claimed in claim 17, is characterized in that, described abrasive material comprises the kyanite of 20 volume % to 26 volume % and the corundum abrasive of 74 volume % to 80 volume %.
20. vitrified bonded grinding tools as claimed in claim 17, is characterized in that, described abrasive material comprises that 26 volume % are to the kyanite of volume 33% and the corundum abrasive of 67 volume % to 74 volume %.
21. vitrified bonded grinding tools as claimed in claim 17, is characterized in that, described abrasive material comprises the kyanite of 33 volume % to 41 volume % and the corundum abrasive of 59 volume % to 67 volume %.
22. vitrified bonded grinding tools as described in any one in claim 17 to 21, is characterized in that, the particle size range of described kyanite is 50 to 800 microns.
23. vitrified bonded grinding tools as claimed in claim 22, is characterized in that, the particle size range of described kyanite is 200 to 600 microns.
24. vitrified bonded grinding tools as described in any one in claim 17 to 21, is characterized in that, the particle size range of described corundum abrasive is 250 to 600 microns.
25. vitrified bonded grinding tools as described in any one in claim 17 to 21, is characterized in that, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
26. vitrified bonded grinding tools as claimed in claim 25, is characterized in that, the hardness of described kyanite is less than the hardness of corundum abrasive.
27. vitrified bonded grinding tools as described in any one in claim 17 to 21, is characterized in that, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
28. vitrified bonded grinding tools as described in any one in claim 17 to 21, is characterized in that, described corundum abrasive is selected from the combination of white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more.
29. vitrified bonded grinding tools as claimed in claim 17, is characterized in that, described vitrified bond is vitreous binding material, and its composition comprises: kaolin, borax and flux.
30. vitrified bonded grinding tools as described in claim 17 or 29, is characterized in that, also comprise that colour temp is higher than the colorant of 900 ℃ in described vitrified bond, and the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
31. vitrified bonded grinding tools as claimed in claim 30, is characterized in that, described colorant is selected from chrome green, and dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
32. vitrified bonded grinding tools as claimed in claim 31, is characterized in that, described colorant is chrome green colorant, and its composition comprises: the composition of chromium, aluminium, oxygen element.
33. 1 kinds of vitrified bonded grinding tools for microelectronic industry Mould Machining, comprise, with the weighing scale of described grinding tool, and following component:
The abrasive material of 82 % by weight to 95 % by weight, wherein, with the weighing scale of described abrasive material, comprises the kyanite of 8 % by weight to 44 % by weight and the corundum abrasive of 56 % by weight to 92 % by weight; And
The vitrified bond of 5 % by weight to 18 % by weight.
34. vitrified bonded grinding tools as claimed in claim 33, is characterized in that, described abrasive material comprises the kyanite of 13 % by weight to 20 % by weight and the corundum abrasive of 80 % by weight to 87 % by weight.
35. vitrified bonded grinding tools as claimed in claim 33, is characterized in that, described abrasive material comprises the kyanite of 19 % by weight to 25 % by weight and the corundum abrasive of 75 % by weight to 81 % by weight.
36. vitrified bonded grinding tools as claimed in claim 33, is characterized in that, described abrasive material comprises the kyanite of 25 % by weight to 32 % by weight and the corundum abrasive of 68% weight to 75 % by weight.
37. vitrified bonded grinding tools as claimed in claim 33, is characterized in that, described abrasive material comprises the kyanite of 31 % by weight to 40 % by weight and the corundum abrasive of 60 % by weight to 69 % by weight.
38. vitrified bonded grinding tools as described in any one in claim 33 to 37, is characterized in that, the particle size range of described kyanite is 50 to 800 microns.
39. vitrified bonded grinding tools as claimed in claim 38, is characterized in that, the particle size range of described kyanite is 200 to 600 microns.
40. vitrified bonded grinding tools as described in any one in claim 33 to 37, is characterized in that, the particle size range of described corundum abrasive is 250 to 600 microns.
41. vitrified bonded grinding tools as described in any one in claim 33 to 37, is characterized in that, the hardness range of described kyanite is 4 to 7 mohs hardnesses.
42. vitrified bonded grinding tools as claimed in claim 41, is characterized in that, the hardness of described kyanite is less than the hardness of corundum abrasive.
43. vitrified bonded grinding tools as described in any one in claim 33 to 37, is characterized in that, the purity of described kyanite is kyanite mass percentage content 90% to 100%.
44. vitrified bonded grinding tools as described in any one in claim 33 to 37, is characterized in that, described corundum abrasive is selected from the combination of white fused alumina, brown corundum, fused alumina zirconia, pink fused alumina and above-mentioned one or more.
45. vitrified bonded grinding tools as claimed in claim 33, is characterized in that, described vitrified bond is vitreous binding material, and its composition comprises: kaolin, borax and flux.
46. vitrified bonded grinding tools as described in claim 33 or 45, is characterized in that, also comprise that colour temp is higher than the colorant of 900 ℃ in described vitrified bond, and the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
47. vitrified bonded grinding tools as claimed in claim 46, is characterized in that, described colorant is selected from chrome green, and dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
48. vitrified bonded grinding tools as claimed in claim 47, is characterized in that, described colorant is chrome green colorant, and its composition comprises: the composition of chromium, aluminium, oxygen element.
49. 1 kinds of vitrified bonded grinding tools for microelectronic industry Mould Machining, comprise corundum abrasive, kyanite, vitrified bond, wherein, also comprise that colour temp is higher than the colorant of 900 ℃ in vitrified bond, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
50. vitrified bonded grinding tools as claimed in claim 49, is characterized in that, described colorant is selected from chrome green, and dark chrome green is dark blue, praseodymium yellow, chestnut palm fibre, black palm fibre, zirconium iron pink and purple.
51. vitrified bonded grinding tools as claimed in claim 35, is characterized in that, described colorant is chrome green colorant, and its composition comprises: the composition of chromium, aluminium, oxygen element.
52. 1 kinds of productions are used for the method for the vitrified bonded grinding tool of microelectronic industry Mould Machining, and its step comprises:
Step 1: corundum abrasive is mixed with kyanite;
Step 2: the compound abrasive of corundum abrasive and kyanite is put into mixer;
Step 3: add vitrified bond to stir, and form slurry;
Step 4: slurry is weighed and be pressed into prefabricated component;
Step 5: prefabricated component is sent into kiln and fire.
53. methods as claimed in claim 52, is characterized in that, in step 1, the volume of kyanite account for corundum abrasive and kyanite cumulative volume 9% to 45%.
54. methods as claimed in claim 52, is characterized in that, in step 3, are also included in vitrified bond and add colour temp higher than the step of the colorant of 900 ℃.
55. methods as claimed in claim 54, is characterized in that, the mass percent scope of described colorant in described vitrified bond is 1% to 10%.
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| CN201210269694.XA CN103567888A (en) | 2012-07-31 | 2012-07-31 | Grinding tool with ceramic bonding agents and method for manufacturing grinding tool |
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| CN201210269694.XA CN103567888A (en) | 2012-07-31 | 2012-07-31 | Grinding tool with ceramic bonding agents and method for manufacturing grinding tool |
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