CN103561374A - Electret sound head shell sound access hole structure and sound transmission method thereof - Google Patents
Electret sound head shell sound access hole structure and sound transmission method thereof Download PDFInfo
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- CN103561374A CN103561374A CN201310535862.XA CN201310535862A CN103561374A CN 103561374 A CN103561374 A CN 103561374A CN 201310535862 A CN201310535862 A CN 201310535862A CN 103561374 A CN103561374 A CN 103561374A
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- entering hole
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Abstract
The invention relates to the technical field of sound generation instruments and components, in particular to an electret sound head shell sound access hole structure and a sound transmission method thereof. The sound transmission method is characterized in that sound enters from a sound head shell, one part of the sound directly enters a sound head sound access hole through a semi-circular hole, the other part of the sound is reflected to a compensation plate through the upper surface of a sound head and then reflected by the compensation plate and enters the sound head sound access hole, the process runs in cycle, and therefore strengthening of low frequency and compensation of high frequency can be achieved. Compared with an electret sound head shell sound access hole structure in the prior art, the electret sound head shell sound access hole structure and the sound transmission method thereof have the advantages that the sound path of the sound from the sound head shell sound access hole to a sound head sound access hole is lengthened, acoustic mass Maf becomes large, resonant frequency fh becomes small, frequency response F0 moves forwards, and the technical problem that low frequency is insufficient is solved; in addition, the compensation of high frequency is conducted by additionally arranging the compensation plate according to the reflection mechanism; the sound head shell is simple in overall structure, however, the low-frequency strengthening effect and high-frequency compensation effect are obvious, and the use effect of an electret microphone is improved.
Description
[technical field]
The present invention relates to apparatus component technology field, a kind of by changing the position of the sound casing tone-entering hole of Electret condenser microphone specifically, change electret sound casing tone-entering hole structure and the transaudient method thereof of the frequency response of microphone.
[background technology]
After polarization, can keep for a long time the dielectric of polarization intensity electret, along with the appearance of electret technology and improving constantly of performance, electret technology has replaced additional polarizing voltage gradually, and obtains application widely.
As the Electret condenser microphone of extensive use in the electrical equipment such as radio-cassette player, telephone set, it is an example of application electret technology, this microphone has the advantages that volume is little, simple in structure, electroacoustic performance is good, price is low, be widely used in the circuit such as cassette recorder, wireless microphone and acoustic control, belong to the most frequently used capacitor microphone.But current sound casing, often the direct diaphone head of sound casing tone-entering hole tone-entering hole is offered, and in the selection of diameter, tone-entering hole diameter on sound casing is larger than the diameter of sound head tone-entering hole, so structure easily causes sound directly via through sound head tone-entering hole, the technical bottleneck that Electret condenser microphone low frequency is inadequate of entering of sound casing tone-entering hole.
[summary of the invention]
The object of the invention is to overcome the inadequate technical bottleneck of existing Electret condenser microphone low frequency, by the sound casing structure changing, provide a kind of frequency response in sound casing structure front, that can strengthen low frequency, extend compensation high frequency.
For achieving the above object, design a kind of electret sound casing tone-entering hole structure, comprise sound casing, sound casing tone-entering hole, sound head and sound head tone-entering hole, the upper surface that it is characterized in that described sound head is provided with some sound head tone-entering holes, described sound head is placed in sound casing, the upper surface of described sound casing is provided with some semicircle orifices, described some semicircle orifices are equidistantly arranged on the circumference at outer rim place, sound head cross section, and just block sound head tone-entering hole, described some semicircle orifices are sound casing tone-entering hole, form the acoustic path structure lengthening.
As prioritization scheme, also can in sound casing, be provided with the compensating plate relative with sound head upper surface, form high frequency compensation structure.
The edge of described compensating plate is equidistantly provided with the circular arc cutaway corresponding with semicircle orifice, and sound head tone-entering hole is blocked just in the central authorities of described compensating plate.
When sound head diameter is 16mm, the preferred 6mm of described semicircle orifice diameter, preferred amount is 6.
The transaudient method of above-mentioned electret sound casing tone-entering hole structure, it is characterized in that when recording, sound enters from sound casing, a part directly enters sound head tone-entering hole via semicircle orifice, another part arrives sound head upper surface and reflexes to compensating plate via semicircle orifice, then enters sound head tone-entering hole by compensating plate reflection, goes round and begins again, loop, realize the reinforcement of low frequency, the compensation of high frequency.
Described method relates to following technical parameter, acoustic pressure P, acoustic compliance C
a, acoustic mass M
af, acoustic resistance R
arand resonance frequency f
h,
Wherein, M
af=4pl
af/ π a
4 af, in formula, p is atmospheric density; l
affor the semicircle orifice degree of depth; a
affor semicircle orifice radius;
R
ar=8 μ l
af/ π a
4 af, in formula, μ is the air coefficient of viscosity;
C
a=V
a/ pc
2, V in formula
aante-chamber volume, c is the velocity of sound that air is heavy;
When sound enters from sound casing, produce acoustic pressure P, acoustic pressure P enters via semicircle orifice, produces acoustic mass M
afwith acoustic resistance R
ar, because the actual propagation of sound from sound casing tone-entering hole to sound head tone-entering hole is apart from increase, cause acoustic mass M
afbecome large, due to resonance frequency f
hbe and acoustic resistance M
afbe inversely proportional to, now resonance frequency f
hdiminish, thereby strengthen low frequency, compensation high frequency.
Compare with existing electret sound casing tone-entering hole structure, lengthened the acoustic path of sound from sound casing tone-entering hole to sound head tone-entering hole, make acoustic mass M
afbecome large, resonance frequency f
hdiminish, frequency response F
0move forward, improve the technical problem that low frequency is inadequate, in addition also by setting up compensating plate, by the mechanism of reflection, extend compensation high frequency, this sound casing overall structure is simple, but the stiffening effect of low frequency and the compensation effect of high frequency are remarkable, has improved the result of use of Electret condenser microphone.
[accompanying drawing explanation]
Fig. 1 is sound casing structural representation;
Fig. 2 is the sectional view of sound casing;
Fig. 3 is the front view of sound head;
Fig. 4 is equivalent circuit diagram of the present invention;
1. sound casings in figure, 2. semicircle orifice, 3. sound head, 4. compensating plate, 5. sound head tone-entering hole.
[embodiment]
Now in conjunction with the drawings and the specific embodiments technical scheme of the present invention is further elaborated, the structure of believing this electret sound casing is clearly for a person skilled in the art.
Embodiment
The sound head part of general Electret condenser microphone mainly comprises, comprise sound casing 1, sound casing tone-entering hole, sound head 3, sound head tone-entering hole 5 and necessary circuitry as shown in Figure 4, the upper surface of described sound head 3 is provided with some sound head tone-entering holes 5, described sound head 3 is placed in sound casing 1, sound head 3 in the present embodiment as shown in Figure 3, for cylinder configuration, some sound head tone-entering holes are a centre bore in conjunction with equidistant discrete the arranging in some satellites hole.
Principle of the present invention is mainly to increase the actual propagation distance of sound from sound casing tone-entering hole to sound head tone-entering hole, realizes the change of various technical parameters in communication process, as acoustic pressure P, acoustic compliance C
a, acoustic mass M
af, acoustic resistance R
arand resonance frequency f
h, wherein, M
af=4pl
af/ π a
4 af, in formula, p is atmospheric density; l
affor the semicircle orifice degree of depth; a
affor semicircle orifice radius;
R
ar=8 μ l
af/ π a
4 af, in formula, μ is the air coefficient of viscosity;
C
a=V
a/ pc
2, V in formula
aante-chamber volume, c is the velocity of sound that air is heavy;
Its embodiment is to change the sound casing tone-entering hole positional structure relative with sound head tone-entering hole, specifically, sound casing tone-entering hole is selected some semicircle orifices 2, and be arranged on the upper surface of sound casing 1, described some semicircle orifices 2 are equidistantly arranged on the circumference at sound head 3 outer rim places, cross section, and just block sound head tone-entering hole 5, form the acoustic path structure lengthening, as depicted in figs. 1 and 2, in practical operation, first pack sound head 3 into sound casing 1, next rotates sound head to misplacing with semicircle orifice 2, make to see from front sound casing 1, cannot see that sound head tone-entering hole 6 is as the criterion.In the selection of sized data, when sound head diameter is 16mm, the preferred 6mm of described semicircle orifice diameter, preferred amount is 6.
As prioritization scheme, also can in sound casing 1, be provided with the compensating plate 4 relative with sound head 3 upper surfaces, form high frequency compensation structure.The edge of described compensating plate 4 is equidistantly provided with the circular arc cutaway corresponding with semicircle orifice 2, and sound head tone-entering hole 5 is blocked just in the central authorities of described compensating plate.When recording, sound enters from sound casing 1, a part directly enters sound head tone-entering hole 5 via semicircle orifice 2, another part arrives sound head 3 upper surfaces and reflexes to compensating plate 4 via semicircle orifice 2, by compensating plate 4 reflections, enter sound head tone-entering hole 5 again, go round and begin again, loop, realize the reinforcement of low frequency, the compensation of high frequency.Its principle is, when sound enters from sound casing, produces acoustic pressure P, and acoustic pressure P enters via semicircle orifice, produces acoustic mass M
afwith acoustic resistance R
ar, because the actual propagation of sound from sound casing tone-entering hole to sound head tone-entering hole is apart from increase, cause acoustic mass M
afbecome large, due to resonance frequency f
hbe and acoustic resistance M
afbe inversely proportional to, now resonance frequency f
hdiminish, thereby strengthen low frequency, compensation high frequency.
Claims (6)
1. an electret sound casing tone-entering hole structure, comprise sound casing, sound casing tone-entering hole, sound head and sound head tone-entering hole, the upper surface that it is characterized in that described sound head is provided with some sound head tone-entering holes, described sound head is placed in sound casing, the upper surface of described sound casing is provided with some semicircle orifices, described some semicircle orifices are equidistantly arranged on the circumference at outer rim place, sound head cross section, and just block sound head tone-entering hole, described some semicircle orifices are sound casing tone-entering hole, form the acoustic path structure lengthening.
2. a kind of electret sound casing tone-entering hole structure as claimed in claim 1, is characterized in that being also provided with the compensating plate relative with sound head upper surface in described sound casing, forms high frequency compensation structure.
3. a kind of electret sound casing tone-entering hole structure as claimed in claim 2, is characterized in that the edge of described compensating plate is equidistantly provided with the circular arc cutaway corresponding with semicircle orifice, and sound head tone-entering hole is blocked just in the central authorities of described compensating plate.
4. a kind of electret sound casing tone-entering hole structure as claimed in claim 1, is characterized in that when sound head diameter is 16mm, the preferred 6mm of described semicircle orifice diameter, and preferred amount is 6.
5. the transaudient method of electret sound casing tone-entering hole structure as claimed in claim 1, it is characterized in that when recording, sound enters from sound casing, a part directly enters sound head tone-entering hole via semicircle orifice, another part arrives sound head upper surface and reflexes to compensating plate via semicircle orifice, then enters sound head tone-entering hole by compensating plate reflection, goes round and begins again, loop, realize the reinforcement of low frequency, the compensation of high frequency.
6. transaudient method as claimed in claim 5, is characterized in that described method relates to following technical parameter, acoustic pressure P, acoustic compliance C
a, acoustic mass M
af, acoustic resistance R
arand resonance frequency f
h,
Wherein, M
af=4pl
af/ π a
4 af, in formula, p is atmospheric density; l
affor the semicircle orifice degree of depth; a
affor semicircle orifice radius;
R
ar=8 μ l
af/ π a
4 af, in formula, μ is the air coefficient of viscosity;
C
a=V
a/ pc
2, V in formula
aante-chamber volume, c is the velocity of sound that air is heavy;
When sound enters from sound casing, produce acoustic pressure P, acoustic pressure P enters via semicircle orifice, produces acoustic mass M
afwith acoustic resistance R
ar, because the actual propagation of sound from sound casing tone-entering hole to sound head tone-entering hole is apart from increase, cause acoustic mass M
afbecome large, due to resonance frequency f
hbe and acoustic resistance M
afbe inversely proportional to, now resonance frequency f
hdiminish, thereby strengthen low frequency, compensation high frequency.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107835477A (en) * | 2017-11-24 | 2018-03-23 | 歌尔股份有限公司 | A kind of MEMS microphone |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101742390A (en) * | 2009-12-16 | 2010-06-16 | 创达电子(潍坊)有限公司 | Miniature microphone for inhibiting interference signal |
CN102790940A (en) * | 2012-07-25 | 2012-11-21 | 中山市天键电声有限公司 | Wind-proof microphone |
-
2013
- 2013-11-01 CN CN201310535862.XA patent/CN103561374A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101742390A (en) * | 2009-12-16 | 2010-06-16 | 创达电子(潍坊)有限公司 | Miniature microphone for inhibiting interference signal |
CN102790940A (en) * | 2012-07-25 | 2012-11-21 | 中山市天键电声有限公司 | Wind-proof microphone |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107835477A (en) * | 2017-11-24 | 2018-03-23 | 歌尔股份有限公司 | A kind of MEMS microphone |
WO2019100432A1 (en) * | 2017-11-24 | 2019-05-31 | 歌尔股份有限公司 | Mems microphone |
KR20190073309A (en) * | 2017-11-24 | 2019-06-26 | 고어텍 인크 | MEMS microphone |
KR102128668B1 (en) * | 2017-11-24 | 2020-06-30 | 웨이팡 고어텍 마이크로일렉트로닉스 컴퍼니 리미티드 | MEMS microphone |
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Application publication date: 20140205 |