CN103556211B - A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof - Google Patents
A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof Download PDFInfo
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- CN103556211B CN103556211B CN201310478261.XA CN201310478261A CN103556211B CN 103556211 B CN103556211 B CN 103556211B CN 201310478261 A CN201310478261 A CN 201310478261A CN 103556211 B CN103556211 B CN 103556211B
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- microetch
- copper
- major trough
- cathode
- attached groove
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- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to a kind of printed circuit board copper surface micro etching method of roughening and equipment thereof.In current circuit board fabrication industry, copper face roughening process monthly every production line discharging of waste liquid amount is all more than 30 tons, and in monthly discharge 30 tons of waste liquids, useless cupric 800 kilograms has no idea to recycle efficiently.This printed circuit board copper surface micro etching roughening equipment includes microetch major trough, electroplates attached groove, circulation line and power supply, described microetch major trough is connected with electroplating attached groove by two circulating lines and is connected, microetch major trough and the attached groove of plating are all filled with microetch liquid medicine, wherein electroplate and attached groove is provided with at least one block of anode titanium plate and at least one piece of cathode titanium plates, wherein anode titanium plate electrically connects with positive source, cathode titanium plates electrically connects with power cathode, and anode titanium plate and cathode titanium plates lower end are all stretched in microetch liquid medicine.The present invention is recycled and the electrolytic recovery of microetch copper scrap by microetch medicinal liquid, the most significantly decreases industrial wastewater discharge, and avoids the wasting of resources of copper metal.
Description
Technical field
The present invention relates to print circuit plates making technical field, micro-particularly to a kind of printed circuit board copper surface
Erosion method of roughening and equipment thereof.
Background technology
Recently as the fast development of electron trade, as electronics industry basic link, printed circuit board row
Industry is always maintained at the annual growth rate of 10-20%, the most domestic printed circuit board manufacturing enterprise having multiple scale
Family more than 3500, monthly output reaches 1.2 hundred million square metres.
In the manufacture process of printed circuit board, need to consume a large amount of essence copper, the most domestic printed circuit
Plate manufacturing enterprise essence copper consumption more than 60,000 tons/month, in the copper waste etching solution of output total copper amount 50,000 tons/
More than Yue, and copper is a kind of heavy metal element being present in soil and people and animals' body, and in soil, content typically exists
About 0.2ppm, the copper of excess can precipitate/complex reaction with the enzyme in people and animals' body, generation poisoning by enzyme and
Lose physiological function.Copper in nature is transferred in people and animals' body by water body, plant etc., if intake
Too high, the Equilibrium of Trace Elements in people and animals' body will be made to be destroyed, cause heavy metal in vivo abnormal long-pending
Tired, produce the result such as degeneration, carcinogenecity of causing a disease.So, produce in the manufacture process of printed circuit board
A large amount of copper waste etching solutions, as the most effectively processed, undoubtedly can be to environment especially printed circuit board factory periphery
Water resource and the soil in area cause severe contamination hidden danger.In the industrial wastewater discharge standard of China, copper
Monitor control index is 0.5ppm, and drinking water standard is 0.03ppm, and American-European relevant criterion is the severeest.By
In the copper scrap etching solution that printed circuit board processing produces, copper content is tens supreme hundred grams per liters, therefore,
State Environmental Protection Administration orientates printed circuit board copper scrap etching solution (useless copper etching liquor) as dangerous liquid refuse, it is stipulated that
Treatment in situ, forbids transboundary movement.
At present in circuit board fabrication industry, copper face roughening process has two kinds of processing methods, one be first with sulphuric acid+
Hydrogen peroxide+water joins groove, is then placed in copper-clad plate and carries out copper face microetch roughening, medicine adding sulphuric acid and dioxygen
Water removal waste fluid on one side；Another kind is first to join groove with (sulphuric acid+sodium peroxydisulfate+water), is then placed in copper-clad plate and enters
Row copper face microetch is roughened, medicine adding (sulphuric acid and sodium peroxydisulfate) removal waste fluid on one side.Both approaches is every
The moon, every production line discharging of waste liquid amount was all more than 30 tons, and useless cupric in monthly discharge 30 tons of waste liquids
Have no idea for 800 kilograms to recycle efficiently.
Summary of the invention
The technical problem to be solved in the present invention is the drawbacks described above how overcoming prior art, it is provided that a kind of printing
Circuit board copper surface micro etching method of roughening and equipment thereof.
For solve above-mentioned technical problem, this printed circuit board copper surface micro etching roughening equipment include microetch major trough,
Electroplate attached groove, circulation line and power supply, described microetch major trough and the attached groove of plating to be connected also by two circulating lines
Connection, microetch major trough and the attached groove of plating are all filled with microetch liquid medicine, wherein electroplate in attached groove and be provided with at least one piece
Anode titanium plate and at least one piece of cathode titanium plates, wherein anode titanium plate electrically connect with positive source, cathode titanium plates with
Power cathode electrically connects, and anode titanium plate and cathode titanium plates lower end are all stretched in microetch liquid medicine.
As optimization, described microetch liquid medicine be sulphuric acid, trivalent iron salt and deionized water solution according to a certain percentage
Formulated.
It is so designed that, first joins microetch major trough with sulphuric acid+ferric iron+deionized water, be then placed in copper-clad plate, profit
Use following reaction principle: 2Fe3++Cu=2Fe2++Cu2+,Carry out copper face microetch roughening；Then at electroplating attached groove
Middle by copper ion, utilize following reaction principle: Cu2++2e-=CuFe2+-e-=Fe3+Electroplate out Cheng Chun
Copper.Balance is reached between major trough and attached groove.
As optimization, the attached groove of described plating is provided with two blocks of anode titanium plates and one piece of cathode titanium plates, its Anodic
Titanium plate is arranged on cathode titanium plates both sides.Being so designed that, precipitating metal copper position is concentrated, it is simple to collect.
As optimization, spaced in the attached groove of described plating it is laid with four blocks of anode titanium plates and three pieces of cathode titanium
Plate.Being so designed that, the precipitation efficiency of metallic copper is high.
As optimization, the described a length of 3000mm of microetch major trough, a width of 800mm, a height of 1000mm；Institute
State plating attached flute length be 1600mm, a width of 800mm, a height of 1000mm；The external diameter of described circulating line
For 40mm.
This printed circuit board copper surface micro etching method of roughening comprises the following steps:
Step 1): by sulphuric acid, the deionized water solution mix homogeneously according to a certain percentage of trivalent salt, prepares
Microetch liquid medicine；
Step 2): the microetch liquid medicine that step 1) prepares is filled with as described in claim 1 to 5 is arbitrary
Microetch major trough, to microetch liquid medicine be full of microetch major trough and electroplate attached groove；
Step 3): circuit copper-clad plate is inserted in microetch major trough, microetch a period of time；
Step 4): power-on, electroplates and starts precipitating metal copper at attached groove inner cathode titanium plate；
Step 5): microetch takes out circuit copper-clad plate after terminating, and continues energising a period of time；
Step 6): deenergization, collects the metallic copper separated out near cathode titanium plates.
One printed circuit board copper surface micro etching method of roughening of the present invention and device structure thereof are simple, user
Just, it is recycled and the electrolytic recovery of microetch copper scrap by microetch medicinal liquid, the most significantly decreases work
Industry discharge of wastewater, within one month, a production line waste water is reduced to 1 ton by 30 tons, and avoids copper metal
The wasting of resources, month production line recyclable go out 800kg fine copper.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings one printed circuit board copper surface micro etching method of roughening of the present invention and equipment thereof are made
Further illustrate:
Fig. 1 is the planar structure signal of the embodiment one of this printed circuit board copper surface micro etching roughening equipment
Figure；
Fig. 2 is the stereochemical structure signal of the embodiment two of this printed circuit board copper surface micro etching roughening equipment
Figure.
In figure: 1-microetch major trough, 2-electroplate attached groove, 3-circulation line, 4-microetch liquid medicine, 5-anode titanium plate,
6-cathode titanium plates, 7-circuit copper-clad plate.
Detailed description of the invention
Embodiment one: as it is shown in figure 1, this printed circuit board copper surface micro etching roughening equipment includes microetch master
Groove 1, electroplating attached groove 2, circulation line 3 and power supply, described microetch major trough 1 and the attached groove of plating 2 are by two
Circulating line 3 connects and connects, and is all filled with microetch liquid medicine 4, wherein in microetch major trough 1 and the attached groove 2 of plating
Electroplate and attached groove 2 is provided with at least one block of anode titanium plate 5 and at least one block of cathode titanium plates 6, wherein anode titanium plate
5 electrically connect with positive source, cathode titanium plates 6 electrically connects with power cathode, anode titanium plate 5 and cathode titanium plates
6 lower ends are all stretched in microetch liquid medicine 4.
Described microetch liquid medicine 4 be sulphuric acid, trivalent iron salt and deionized water solution prepare according to a certain percentage and
Become.
The attached groove of described plating 2 is provided with two blocks of anode titanium plates 5 and one block of cathode titanium plates 6, wherein anode titanium plate
5 are arranged on cathode titanium plates 6 both sides.
The described a length of 3000mm of microetch major trough 1, a width of 800mm, a height of 1000mm；Described plating is attached
The a length of 1600mm of groove 2, a width of 800mm, a height of 1000mm；The external diameter of described circulating line 3 is
40mm。
This printed circuit board copper surface micro etching method of roughening comprises the following steps:
Step 1): by sulphuric acid, the deionized water solution mix homogeneously according to a certain percentage of trivalent salt, prepares
Microetch liquid medicine 4；
Step 2): the microetch liquid medicine 4 that step 1) prepares is filled with in institute as arbitrary in claim 1 to 5
The microetch major trough 1 stated, is full of microetch major trough 1 to microetch liquid medicine 4 and electroplates attached groove 2；
Step 3): circuit copper-clad plate 7 is inserted in microetch major trough 1, microetch a period of time；
Step 4): power-on, electroplates and starts precipitating metal copper at attached groove 2 inner cathode titanium plate 6；
Step 5): microetch takes out circuit copper-clad plate 7 after terminating, and continues energising a period of time；
Step 6): deenergization, collects the metallic copper separated out near cathode titanium plates 6.
Embodiment two: as shown in Figure 2: this printed circuit board copper surface micro etching roughening equipment includes microetch master
Groove 1, electroplating attached groove 2, circulation line 3 and power supply, described microetch major trough 1 and the attached groove of plating 2 are by two
Circulating line 3 connects and connects, and is all filled with microetch liquid medicine 4, wherein in microetch major trough 1 and the attached groove 2 of plating
Electroplate and attached groove 2 is provided with at least one block of anode titanium plate 5 and at least one block of cathode titanium plates 6, wherein anode titanium plate
5 electrically connect with positive source, cathode titanium plates 6 electrically connects with power cathode, anode titanium plate 5 and cathode titanium plates
6 lower ends are all stretched in microetch liquid medicine 4.
Described microetch liquid medicine 4 be sulphuric acid, trivalent iron salt and deionized water solution prepare according to a certain percentage and
Become.
Spaced in the attached groove of described plating 2 it is laid with four blocks of anode titanium plates 5 and three pieces of cathode titanium plates 6.As
This design, the precipitation efficiency of metallic copper is high.
The described a length of 3000mm of microetch major trough 1, a width of 800mm, a height of 1000mm；Described plating is attached
The a length of 1600mm of groove 2, a width of 800mm, a height of 1000mm；The external diameter of described circulating line 3 is
40mm。
This printed circuit board copper surface micro etching method of roughening comprises the following steps:
Step 1): by sulphuric acid, the deionized water solution mix homogeneously according to a certain percentage of trivalent salt, prepares
Microetch liquid medicine 4；
Step 2): the microetch liquid medicine 4 that step 1) prepares is filled with in institute as arbitrary in claim 1 to 5
The microetch major trough 1 stated, is full of microetch major trough 1 to microetch liquid medicine 4 and electroplates attached groove 2；
Step 3): circuit copper-clad plate 7 is inserted in microetch major trough 1, microetch a period of time；
Step 4): power-on, electroplates and starts precipitating metal copper at attached groove 2 inner cathode titanium plate 6；
Step 5): microetch takes out circuit copper-clad plate 7 after terminating, and continues energising a period of time；
Step 6): deenergization, collects the metallic copper separated out near cathode titanium plates 6.
It can be that professional and technical personnel in the field realize or use that above-mentioned embodiment is intended to illustrate the present invention,
Above-mentioned embodiment is modified and will be apparent from for those skilled in the art, therefore this
Invention includes but not limited to above-mentioned embodiment, any meets the claims or description describes, and meets
With principles disclosed herein and novelty, the method for inventive features, technique, product, each fall within this
Within bright protection domain.
Claims (1)
1. a printed circuit board copper surface micro etching method of roughening, is characterized in that: the microetch roughening used sets
For including microetch major trough (1), electroplating attached groove (2), circulation line (3) and power supply, described microetch master
Groove (1) is connected with electroplating attached groove (2) by two circulating lines (3) and is connected, microetch major trough (1)
All it is filled with microetch liquid medicine (4) with electroplating in attached groove (2), wherein electroplates in attached groove (2) and be provided with at least one
Block anode titanium plate (5) and at least one piece of cathode titanium plates (6), wherein anode titanium plate (5) and positive source
Electrical connection, cathode titanium plates (6) electrically connect with power cathode, anode titanium plate (5) and cathode titanium plates (6)
Lower end is all stretched in microetch liquid medicine (4), and the method comprises the following steps,
Step 1): by sulphuric acid, the deionized water solution mix homogeneously according to a certain percentage of trivalent iron salt,
Prepare microetch liquid medicine (4)；
Step 2): by step 1) the microetch liquid medicine (4) for preparing is filled with microetch major trough (1), to the most micro-
Erosion liquid medicine (4) is full of microetch major trough (1) and electroplates attached groove (2)；
Step 3): circuit copper-clad plate (7) is inserted in microetch major trough (1), microetch a period of time；
Step 4): power-on, electroplate attached groove (2) inner cathode titanium plate (6) place and start to separate out gold
Belong to copper；
Step 5): microetch takes out circuit copper-clad plate (7) after terminating, and continues energising a period of time；
Step 6): deenergization, collect the metallic copper separated out near cathode titanium plates (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310478261.XA CN103556211B (en) | 2013-10-14 | 2013-10-14 | A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310478261.XA CN103556211B (en) | 2013-10-14 | 2013-10-14 | A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103556211A CN103556211A (en) | 2014-02-05 |
| CN103556211B true CN103556211B (en) | 2016-08-10 |
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|---|---|---|---|
| CN201310478261.XA Expired - Fee Related CN103556211B (en) | 2013-10-14 | 2013-10-14 | A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106488658B (en) * | 2016-12-28 | 2023-05-23 | 华进半导体封装先导技术研发中心有限公司 | Seed layer rapid etching method for high-density substrate semi-addition process |
| CN110528042B (en) * | 2019-08-28 | 2021-02-09 | 深圳赛意法微电子有限公司 | Semiconductor device electroplating method and activation tank for electroplating |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518558A (en) * | 1978-07-27 | 1980-02-08 | Kagaku Gijutsu Shinkoukai | Recovering method for copper from ferric chloride etching waste solution containing copper |
| US4269678A (en) * | 1978-11-22 | 1981-05-26 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Method for regenerating a cupric chloride and/or ferric chloride containing etching solution in an electrolysis cell |
| US4490224A (en) * | 1984-04-16 | 1984-12-25 | Lancy International, Inc. | Process for reconditioning a used ammoniacal copper etching solution containing copper solute |
| US4545877A (en) * | 1983-01-20 | 1985-10-08 | Hillis Maurice R | Method and apparatus for etching copper |
| US5186811A (en) * | 1991-04-18 | 1993-02-16 | Nippon Cmk Corp. | Method of manufacturing printed wiring boards |
| CN1802456A (en) * | 2003-06-13 | 2006-07-12 | 德国艾托科技公司 | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
| CN101608337A (en) * | 2009-07-15 | 2009-12-23 | 深圳市惠尔能科技有限公司 | Technology for regenerating and cycling circuit board microetching waste liquid |
| CN102321908A (en) * | 2011-09-02 | 2012-01-18 | 广州市天承化工有限公司 | Recycling and regenerating process method and metal copper recovery system of acid chloride etching solution |
| TW201233853A (en) * | 2010-12-03 | 2012-08-16 | Ebara Udylite Kk | Method for maintaining etching liquid and system therefor |
| CN102851730A (en) * | 2011-07-01 | 2013-01-02 | 东莞市海力环保设备科技有限公司 | Method for recycling waste acid etching solution of printed circuit board and recovering copper |
-
2013
- 2013-10-14 CN CN201310478261.XA patent/CN103556211B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518558A (en) * | 1978-07-27 | 1980-02-08 | Kagaku Gijutsu Shinkoukai | Recovering method for copper from ferric chloride etching waste solution containing copper |
| US4269678A (en) * | 1978-11-22 | 1981-05-26 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Method for regenerating a cupric chloride and/or ferric chloride containing etching solution in an electrolysis cell |
| US4545877A (en) * | 1983-01-20 | 1985-10-08 | Hillis Maurice R | Method and apparatus for etching copper |
| US4490224A (en) * | 1984-04-16 | 1984-12-25 | Lancy International, Inc. | Process for reconditioning a used ammoniacal copper etching solution containing copper solute |
| US5186811A (en) * | 1991-04-18 | 1993-02-16 | Nippon Cmk Corp. | Method of manufacturing printed wiring boards |
| CN1802456A (en) * | 2003-06-13 | 2006-07-12 | 德国艾托科技公司 | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
| CN101608337A (en) * | 2009-07-15 | 2009-12-23 | 深圳市惠尔能科技有限公司 | Technology for regenerating and cycling circuit board microetching waste liquid |
| TW201233853A (en) * | 2010-12-03 | 2012-08-16 | Ebara Udylite Kk | Method for maintaining etching liquid and system therefor |
| CN102851730A (en) * | 2011-07-01 | 2013-01-02 | 东莞市海力环保设备科技有限公司 | Method for recycling waste acid etching solution of printed circuit board and recovering copper |
| CN102321908A (en) * | 2011-09-02 | 2012-01-18 | 广州市天承化工有限公司 | Recycling and regenerating process method and metal copper recovery system of acid chloride etching solution |
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| CN103556211A (en) | 2014-02-05 |
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