CN103555002A - Inorganic filler for copper-clad plate and preparation method of filler - Google Patents
Inorganic filler for copper-clad plate and preparation method of filler Download PDFInfo
- Publication number
- CN103555002A CN103555002A CN201310540105.1A CN201310540105A CN103555002A CN 103555002 A CN103555002 A CN 103555002A CN 201310540105 A CN201310540105 A CN 201310540105A CN 103555002 A CN103555002 A CN 103555002A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- black talc
- mineral filler
- raw material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000945 filler Substances 0.000 title abstract description 3
- 239000011256 inorganic filler Substances 0.000 title abstract 5
- 229910003475 inorganic filler Inorganic materials 0.000 title abstract 5
- 239000000454 talc Substances 0.000 claims abstract description 46
- 229910052623 talc Inorganic materials 0.000 claims abstract description 46
- 239000002994 raw material Substances 0.000 claims abstract description 42
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000012764 mineral filler Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 238000001354 calcination Methods 0.000 abstract description 16
- 238000003754 machining Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009156 water cure Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Abstract
The invention discloses inorganic filler for a copper-clad plate and a preparation method of the filler. The preparation method comprises the following steps: crushing black talc raw material, and carrying out superfine treatment and grading to obtain black talc powder; calcining the obtained black talc powder in a temperature range of 850-1150 DEG C to obtain the inorganic filler for the copper-clad plate. The preparation method of the inorganic filler for the copper-clad plate can be used for preparing the inorganic filler which is applicable to machining the copper-clad plate and has the low rigidity, and the subsequent machining performance of the copper-clad plate is improved.
Description
Technical field
The invention belongs to copper-clad plate raw material production processing technique field, be specifically related to mineral filler and preparation method thereof for a kind of copper-clad plate.
Background technology
As everyone knows, in copper-clad plate, with adding the common practice that inorganic powder is copper-clad plate industry in resin glue, add inorganic powder to improve mechanical property, dimensional performance and the electric property of the rear material of resin assimilation.As United States Patent (USP) 5264056 is pointed out, mineral filler add the dimensional stability that can improve the copper-clad base plate after Resin adhesive water cure, dimensional stability is a very important index in copper-clad base plate Hou road complete processing.Meanwhile, Japanese Patent points out for No. 222950, No. 97633, inorganic powder add the mobility that weakens resin glue, improve punching performance.In addition, in resin glue, add the good aluminum oxide inorganic powder of heat conductivility, also can improve the thermal conductivity of copper-clad plate.
In the filler of existing copper-clad plate, generally include common silica powder, this can cause the hardness of copper-clad plate to increase in ，Hou road machining and occur white edge phenomenon, and tool wear is accelerated simultaneously, and production cost significantly rises.
In view of this, a kind of novel inorganic powder material need to be provided, copper-clad plate can be met for the demand of soft.
Summary of the invention
One of object of the present invention is to provide the preparation method of a kind of copper-clad plate with mineral filler, and it can meet the process requirements of copper-clad plate.
The present invention also aims to provide a kind of copper-clad plate mineral filler.
One of for achieving the above object, the invention provides the preparation method of mineral filler for a kind of copper-clad plate, the method comprises the following steps:
By black talc raw material pulverize, micronization, classification obtain black talc powder;
The described black talc powder obtaining is calcined and obtained copper-clad plate mineral filler in the temperature range of 850 ℃ ~ 1150 ℃.
As a further improvement on the present invention, SiO in described black talc raw material
2with MgO be by weight percentage:
SiO
2:?46%~64%；
MgO:?23%~32%。
As a further improvement on the present invention, in described black talc raw material, also comprise the Fe that is less than by weight percentage 2%
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
As a further improvement on the present invention, the time range of described " the described black talc powder obtaining is calcined in the temperature range of 850 ℃ ~ 1150 ℃ " is 1.5 ~ 4.5 hours.
As a further improvement on the present invention, the loss on ignition scope of described black talc raw material is 4.8% ~ 17%.
As a further improvement on the present invention, the copper-clad plate obtaining described in is 12us/cm ~ 80us/cm with the conductivity range of mineral filler.
As a further improvement on the present invention, the copper-clad plate obtaining described in is 2.0 ~ 5.5 by the durometer level of mineral filler.
For realizing above-mentioned another goal of the invention, the invention provides a kind of copper-clad plate mineral filler, it is characterized in that, described copper-clad plate comprises by weight percentage with mineral filler: 50% ~ 66% SiO
2, and 26% ~ 33% MgO.
As a further improvement on the present invention, described copper-clad plate is with also comprising the Al that is less than by weight percentage 3% in mineral filler
2o
3, be less than 2% Fe
2o
3, be less than 3% CaO.
As a further improvement on the present invention, described copper-clad plate is 2.0 ~ 5.5 by the durometer level of mineral filler.
Compared with prior art, copper-clad plate provided by the invention by the preparation method of mineral filler by black talc raw material is pulverized, micronization, classification obtain black talc powder, and the black talc powder obtaining is calcined and obtained copper-clad plate mineral filler in the temperature range of 850 ℃ ~ 1150 ℃, it has lower hardness, can meet the needs of copper-clad plate following process, and processing characteristics is excellent.
Accompanying drawing explanation
Fig. 1 is the preparation method's of mineral filler schema for copper-clad plate of the present invention.
Embodiment
Below with reference to specific embodiment describe the present invention (with reference to Fig. 1).
Embodiment mono-
1) take black talc raw material, control SiO in black talc raw material
2with MgO be SiO by weight percentage
2: 46%, MgO:30%, also comprises the Fe that is less than by weight percentage 2% in black talc raw material
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
2) the black talc raw material in step (1) is pulverized, micronization, classification obtain black talc powder.
3) by the black talc raw material in step (2) the temperature lower calcination of 850 ℃ 2 hours, make black talc powder form required copper-clad plate mineral filler.
The loss on ignition scope of the black talc raw material wherein, taking in step (1) is 4.8% ~ 17%.Calcination process can so that copper-clad plate mineral filler volume stability, and the black talc after calcining can have higher whiteness, conventionally can be up to 95%.
The copper-clad plate finally obtaining is that 12us/cm ~ 80us/cm, durometer level are 2.0 ~ 5.5 with the conductivity range of mineral filler.
Embodiment bis-
1) take black talc raw material, control SiO in black talc raw material
2with MgO be SiO by weight percentage
2: 64%, MgO:24%, also comprises the Fe that is less than by weight percentage 2% in black talc raw material
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
2) the black talc raw material in step (1) is pulverized, micronization, classification obtain black talc powder.
3) by the black talc raw material in step (2) the temperature lower calcination of 900 ℃ 1.5 hours, make black talc powder form required copper-clad plate mineral filler.
The loss on ignition scope of the black talc raw material wherein, taking in step (1) is 4.8% ~ 17%.Calcination process can so that copper-clad plate mineral filler volume stability, and the black talc after calcining can have higher whiteness, conventionally can be up to 95%.
The copper-clad plate finally obtaining is that 12us/cm ~ 80us/cm, durometer level are 2.0 ~ 5.5 with the conductivity range of mineral filler.
Embodiment tri-
1) take black talc raw material, control SiO in black talc raw material
2with MgO be SiO by weight percentage
2: 55%, MgO:26%, also comprises the Fe that is less than by weight percentage 2% in black talc raw material
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
2) the black talc raw material in step (1) is pulverized, micronization, classification obtain black talc powder.
3) by the black talc raw material in step (2) the temperature lower calcination of 1000 ℃ 3 hours, make black talc powder form required copper-clad plate mineral filler.
The loss on ignition scope of the black talc raw material wherein, taking in step (1) is 4.8% ~ 17%.Calcination process can so that copper-clad plate mineral filler volume stability, and the black talc after calcining can have higher whiteness, conventionally can be up to 95%.
The copper-clad plate finally obtaining is that 12us/cm ~ 80us/cm, durometer level are 2.0 ~ 5.5 with the conductivity range of mineral filler.
Embodiment tetra-
1) take black talc raw material, control SiO in black talc raw material
2with MgO be SiO by weight percentage
2: 55%, MgO:23%, also comprises the Fe that is less than by weight percentage 2% in black talc raw material
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
2) the black talc raw material in step (1) is pulverized, micronization, classification obtain black talc powder.
3) by the black talc raw material in step (2) the temperature lower calcination of 1150 ℃ 4.5 hours, make black talc powder form required copper-clad plate mineral filler.
The loss on ignition scope of the black talc raw material wherein, taking in step (1) is 4.8% ~ 17%.Calcination process can so that copper-clad plate mineral filler volume stability, and the black talc after calcining can have higher whiteness, conventionally can be up to 95%.
The copper-clad plate finally obtaining is that 12us/cm ~ 80us/cm, durometer level are 2.0 ~ 5.5 with the conductivity range of mineral filler.
Embodiment five
1) take black talc raw material, control SiO in black talc raw material
2with MgO be SiO by weight percentage
2: 48%, MgO:32%, also comprises the Fe that is less than by weight percentage 2% in black talc raw material
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
2) the black talc raw material in step (1) is pulverized, micronization, classification obtain black talc powder.
3) by the black talc raw material in step (2) the temperature lower calcination of 950 ℃ 4.5 hours, make black talc powder form required copper-clad plate mineral filler.
The loss on ignition scope of the black talc raw material wherein, taking in step (1) is 4.8% ~ 17%.Calcination process can so that copper-clad plate mineral filler volume stability, and the black talc after calcining can have higher whiteness, conventionally can be up to 95%.
The copper-clad plate finally obtaining is that 12us/cm ~ 80us/cm, durometer level are 2.0 ~ 5.5 with the conductivity range of mineral filler.
The copper-clad plate making by above-described embodiment comprises by weight percentage with mineral filler: 50% ~ 66% SiO2 and 26% ~ 33% MgO, and, wherein also comprise being less than by weight percentage 3% Al2O3, being less than 2% Fe
2o
3, be less than 3% CaO.
The present invention has following beneficial effect by above-described embodiment: copper-clad plate provided by the invention by the preparation method of mineral filler by black talc raw material is pulverized, micronization, classification obtain black talc powder, and the black talc powder obtaining is calcined and obtained copper-clad plate mineral filler in the temperature range of 850 ℃ ~ 1150 ℃, it has lower hardness, can meet the needs of copper-clad plate following process, and processing characteristics is excellent.
Be to be understood that, although this specification sheets is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification sheets is only for clarity sake, those skilled in the art should make specification sheets as a whole, technical scheme in each embodiment also can, through appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present invention; they are not in order to limit the scope of the invention, all disengaging within equivalent embodiment that skill spirit of the present invention does or change all should be included in protection scope of the present invention.
Claims (10)
1. a preparation method for mineral filler for copper-clad plate, is characterized in that, the method comprises the following steps:
By black talc raw material pulverize, micronization, classification obtain black talc powder;
The described black talc powder obtaining is calcined and obtained copper-clad plate mineral filler in the temperature range of 850 ℃ ~ 1150 ℃.
2. method according to claim 1, is characterized in that, SiO in described black talc raw material
2with MgO be by weight percentage:
SiO
2:?46%~64%；
MgO:?23%~32%。
3. method according to claim 2, is characterized in that, in described black talc raw material, also comprises the Fe that is less than by weight percentage 2%
2o
3, be less than 3% CaO, be less than 3% Al
2o
3.
4. method according to claim 1, is characterized in that, the time range of described " the described black talc powder obtaining is calcined in the temperature range of 850 ℃ ~ 1150 ℃ " is 1.5 ~ 4.5 hours.
5. method according to claim 1, is characterized in that, the loss on ignition scope of described black talc raw material is 4.8% ~ 17%.
6. method according to claim 1, is characterized in that, described in the copper-clad plate that obtains with the conductivity range of mineral filler, be 12us/cm ~ 80us/cm.
7. method according to claim 1, is characterized in that, described in the copper-clad plate that obtains by the durometer level of mineral filler, be 2.0 ~ 5.5.
8. a copper-clad plate mineral filler, is characterized in that, described copper-clad plate comprises by weight percentage with mineral filler: 50% ~ 66% SiO
2, and 26% ~ 33% MgO.
9. copper-clad plate mineral filler according to claim 8, is characterized in that, described copper-clad plate is with also comprising the Al that is less than by weight percentage 3% in mineral filler
2o
3, be less than 2% Fe
2o
3, be less than 3% CaO.
10. copper-clad plate mineral filler according to claim 8, is characterized in that, described copper-clad plate is 2.0 ~ 5.5 by the durometer level of mineral filler.
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|---|---|---|---|
| CN201310540105.1A CN103555002B (en) | 2013-11-05 | 2013-11-05 | Inorganic filler for copper-clad plate and preparation method of filler |
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|---|---|---|---|
| CN201310540105.1A CN103555002B (en) | 2013-11-05 | 2013-11-05 | Inorganic filler for copper-clad plate and preparation method of filler |
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| CN103555002A true CN103555002A (en) | 2014-02-05 |
| CN103555002B CN103555002B (en) | 2015-06-10 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109179432A (en) * | 2018-09-27 | 2019-01-11 | 内蒙古超牌建材科技有限公司 | Low calcium calcines black talc production equipment, low calcium calcining black talc and preparation method thereof |
| CN112961578A (en) * | 2021-02-10 | 2021-06-15 | 浙江工业大学 | Epoxy resin anticorrosive paint based on black talc and preparation method thereof |
| CN113122023A (en) * | 2021-04-20 | 2021-07-16 | 湖南鑫天源新材料有限公司 | Method for preparing pigment and filler for composite material by using black talc |
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|---|---|
| CN103555002B (en) | 2015-06-10 |
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Effective date of registration: 20141231 Address after: 404508 No. 188, Man Road, Yunyang Industrial Park, Chongqing, Chongqing Applicant after: Jin Yi silicon materials development corporation, Ltd. of Chongqing City Applicant after: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. Address before: 215021 No. 50, Jiangpu Road, wins Town, Suzhou Industrial Park, Jiangsu Applicant before: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. |
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Effective date of registration: 20181218 Address after: 215500 Eleventh Floor of Binjiang International Building, 88 Tonggang Road, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Jinyi New Material Science & Technology Co., Ltd. Address before: 404508 Ren Dao 188, Yunyang Industrial Park, Chongqing Co-patentee before: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. Patentee before: Jin Yi silicon materials development corporation, Ltd. of Chongqing City |
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Address after: 215536 No. 25-1 Xinggang Road, Bixi street, Changshu, Suzhou, Jiangsu Patentee after: Suzhou Jinyi New Material Technology Co.,Ltd. Address before: 215500 Eleventh Floor of Binjiang International Building, 88 Tonggang Road, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU JINYI NEW MATERIAL SCIENCE & TECHNOLOGY Co.,Ltd. |