CN103545437A - Bendable LED (light emitting diode) luminous element - Google Patents
Bendable LED (light emitting diode) luminous element Download PDFInfo
- Publication number
- CN103545437A CN103545437A CN201310474331.4A CN201310474331A CN103545437A CN 103545437 A CN103545437 A CN 103545437A CN 201310474331 A CN201310474331 A CN 201310474331A CN 103545437 A CN103545437 A CN 103545437A
- Authority
- CN
- China
- Prior art keywords
- chip
- flip
- emitting component
- led light
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a bendable LED (light emitting diode) luminous element. Six surfaces of the LED luminous can emit light, the process for the LED luminous element is simple, and the LED luminous element is convenient to machine and low in cost. According to the technical scheme, the bendable LED luminous element comprises an LED inverted chip, and is characterized by also comprising a support, a circuit is arranged on the surface of the support, the support is made of a transparent flexible material, an electrical surface of the LED inverted chip is fixed on the surface of the support through a conducting connecting material, and is electrically connected with the circuit, and fluorescent glue coats the front surface of the LED inverted chip and the back surface of the support corresponding to the chip.
Description
Technical field
The present invention relates to other transparent flexible materials such as a kind of LED flip-chip and plastics or organosilicon and be packaged into folding type LED light-emitting component as support.
Background technology
LED (Lighting emitting diode) is a kind of light-emitting diode, is the solid-state semiconductor device that is visible ray by electric energy conversion, is the green light source of a kind of high energy-conservation, high life, high light efficiency, environmental protection.
The support that at present LED Packaging Industry is used be all by harder material as package support, due to luminescence chip and support self character, even if transparent rack, namely the luminous illumination of support upper and lower surface is strong, the luminous intensities at other four sides a little less than; Affected the illuminating effect of LED.
In addition, Packaging Industry is all to utilize gold thread that common luminescence chip and support circuitry are coupled together at present, and such design is complex process not only, has also increased the cost of LED light-emitting component.
Summary of the invention
The object of the invention is to solve the deficiency of above-mentioned background technology, a kind of improvement of LED light-emitting component be provided, this LED light-emitting component should six luminous, and have technique simple, process convenient lower-cost feature.
Technical scheme provided by the invention is: folding type LED light-emitting component, comprises LED flip-chip; It is characterized in that described LED light-emitting component also comprises the support that surface is manufactured with circuit and makes of transparent flexible material, electric of described LED flip-chip connects material by conduction and is fixed on the surface of aforementioned brackets and is electrically connected to aforementioned circuit, separately by fluorescent glue, the back side of the positive of LED flip-chip and the corresponding support of this chip is together coated.
Described circuit is 1 series connection 1 parallel connection or 1 series connection 1 above circuit in parallel.
The material of described circuit is silver coating or Gold plated Layer or aluminium coated or nickel coating.
The width of described support is more than 0.5mm.
The width of described support is 2-5mm.
Described transparent flexible material is plastic sheet or silica gel piece.
Fluorescent material in described fluorescent glue is at least one in yellow fluorescent powder or red fluorescence powder or green emitting phosphor or blue colour fluorescent powder or purple fluorescence powder.
The invention has the beneficial effects as follows: owing to having adopted LED flip-chip and the support that is coated with circuit and makes of transparent flexible material with matching, not only save original gold thread and connected operation, significantly simplified production technology, and the LED light-emitting component forming can curve any shape as required, and then accomplished six faces, 360 degree uniformly light-emittings completely, and then illumination and the illuminating effect of LED have been increased substantially.
Accompanying drawing explanation
Fig. 1 is the structural representation of folding type LED light-emitting component of the present invention.
Fig. 2 is the A portion structure for amplifying schematic diagram in Fig. 1.
Embodiment
In figure: 1 is support, 2 is circuit, 3 conduction tie points, and 4 is LED flip-chip, 5 is fluorescent glue.
As described in Figure: the timbering material of folding type LED light-emitting component, adopt the material (thickness is preferably 2-5mm conventionally) of plastic sheet (such as polyethylene, polypropylene, nylon etc.) or silica gel piece or other transparent flexible materials, so just can make the LED light-emitting component forming be bent into needed any shape, thereby reach the effect that six faces can uniformly light-emitting.
For realizing and being electrically connected to of LED flip-chip 4, the surface of described support 1 is manufactured with circuit 2, and this circuit can adopt silver coating or Gold plated Layer or aluminium coated or nickel coating or other metal levels; On circuit, be also manufactured with conduction tie point 3(that the external positive and negative power supply of conducting uses as shown in Figure 2: the anodal pin 4-2 of each LED flip-chip and negative pole pin 4-1 are all welded on circuit and are isolated by the different branch on circuit).Described circuit can design (conventionally can adopt printed circuit) as required, recommends to be designed to 1 series connection 1 parallel connection or 1 series connection 1 above circuit in parallel.
Described LED flip-chip is electrically connected to by welding manner with support; Specifically can make metallic conduction material on the electrode of LED flip-chip 4 own in molten condition by high-temperature heating, then on the assigned address of support, be welded and fixed and (specifically can complete by normal welding machinery; For example, directly with chip mounter, chip is fixed on support, then by Reflow Soldering mode, LED flip-chip is electrically connected to); Also can LED flip-chip 4 be accurately welded on the circuit of support by tin cream or scolding tin.
Then can carry out fluorescent glue application; Specifically that deployed fluorescent glue 5 is all coated LED flip-chip by coating method, and be all coated (effect is as shown in the figure) together with support reverse side corresponding to this flip-chip; At support width hour, also can adopt fluorescent glue to be coated whole piece support (360 ° of plastic packagings wrap up mode entirely), the similar cylinder of shape.
Described LED flip-chip is blue light flip-chip, ruddiness flip-chip, gold-tinted flip-chip, green glow flip-chip, purple light flip-chip etc. other all can the chip of glow color in any one or a few mixing.
Described conduction tie point, can be on support the silver coating on both ends or one end or Gold plated Layer or other coats of metal as conduction tie point; Conduction tie point can, directly in above-mentioned metal layer plane, also can be bored a hole at conduction tie point place.
The described fluorescent glue technology that can directly follow conventional lines; Together with fluorescent material is allocated according to required ratio with glue, stir, vacuumizing and defoaming, then fluorescent glue point is coated in to LED flip-chip surface and around and support reverse side (can adopt this spot printing to be coated mode when support width is larger) corresponding to LED flip-chip; Or use 360 ° of plastic packagings full parcel mode with fluorescent glue, the positive and negative of support is all wrapped up to (support width comparatively hour can adopt this full parcel mode).
Described fluorescent material comprises one or more of the random color fluorescent material such as yellow fluorescent powder, red fluorescence powder, green emitting phosphor, blue colour fluorescent powder.
Claims (8)
1. folding type LED light-emitting component, comprises LED flip-chip (4); It is characterized in that described LED light-emitting component also comprises the support (1) that surface is manufactured with circuit (2) and makes of transparent flexible material, electric of described LED flip-chip connects material by conduction and is fixed on the surface of aforementioned brackets and is electrically connected to aforementioned circuit, separately by fluorescent glue (5), the back side of the positive of LED flip-chip and the corresponding support of this chip is together coated.
2. folding type LED light-emitting component according to claim 1, is characterized in that described circuit is the in parallel or 1 series connection 1 above circuit in parallel of 1 series connection 1.
3. according to folding type LED light-emitting component described in claim 1 or 2, the material that it is characterized in that described circuit is silver coating or Gold plated Layer or aluminium coated or nickel coating.
4. folding type LED light-emitting component according to claim 3, the width that it is characterized in that described support is more than 0.5mm.
5. folding type LED light-emitting component according to claim 4, the width that it is characterized in that described support is 2-5mm.
6. folding type LED light-emitting component according to claim 5, is characterized in that described transparent flexible material is plastic sheet or silica gel piece.
7. folding type LED light-emitting component according to claim 6, is characterized in that the fluorescent material in described fluorescent glue is at least one in yellow fluorescent powder or red fluorescence powder or green emitting phosphor or blue colour fluorescent powder or purple fluorescence powder.
8. folding type LED light-emitting component according to claim 7, is characterized in that described LED flip-chip is at least one in blue light flip-chip or ruddiness flip-chip or purple light flip-chip or green glow flip-chip or gold-tinted flip-chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310474331.4A CN103545437A (en) | 2013-10-11 | 2013-10-11 | Bendable LED (light emitting diode) luminous element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310474331.4A CN103545437A (en) | 2013-10-11 | 2013-10-11 | Bendable LED (light emitting diode) luminous element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103545437A true CN103545437A (en) | 2014-01-29 |
Family
ID=49968688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310474331.4A Pending CN103545437A (en) | 2013-10-11 | 2013-10-11 | Bendable LED (light emitting diode) luminous element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103545437A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023918A (en) * | 2014-07-17 | 2015-11-04 | 王志根 | Flexible lamp strip and machining method thereof |
| CN105336832A (en) * | 2015-09-29 | 2016-02-17 | 杭州派尼澳电子科技有限公司 | LED lamp filament and preparation method thereof |
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED (Light Emitting Diode) surface light source and preparation method thereof |
| CN105870297A (en) * | 2016-05-27 | 2016-08-17 | 福建鸿博光电科技有限公司 | LED light source and packaging method thereof |
| CN105870298A (en) * | 2016-05-27 | 2016-08-17 | 福建鸿博光电科技有限公司 | Packaging method of LED light source |
| CN108155280A (en) * | 2017-12-15 | 2018-06-12 | 广东昭信照明科技有限公司 | A kind of LED filament and its manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188077A (en) * | 2007-12-21 | 2008-05-28 | 北京星光影视设备科技股份有限公司 | Foldable LED display screen |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201549151U (en) * | 2009-11-16 | 2010-08-11 | 东莞市邦臣光电有限公司 | Protective structure of LED display screen |
| US20120112220A1 (en) * | 2010-11-08 | 2012-05-10 | Bridgelux, Inc. | LED-Based Light Source Utilizing Asymmetric Conductors |
| CN202473919U (en) * | 2011-12-31 | 2012-10-03 | 苏州晶品光电科技有限公司 | Flexible circuit substrate double-side lighting LED array light source |
| CN203674267U (en) * | 2013-10-11 | 2014-06-25 | 杭州恒诚光电科技有限公司 | Bendable LED lighting element |
-
2013
- 2013-10-11 CN CN201310474331.4A patent/CN103545437A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188077A (en) * | 2007-12-21 | 2008-05-28 | 北京星光影视设备科技股份有限公司 | Foldable LED display screen |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201549151U (en) * | 2009-11-16 | 2010-08-11 | 东莞市邦臣光电有限公司 | Protective structure of LED display screen |
| US20120112220A1 (en) * | 2010-11-08 | 2012-05-10 | Bridgelux, Inc. | LED-Based Light Source Utilizing Asymmetric Conductors |
| CN202473919U (en) * | 2011-12-31 | 2012-10-03 | 苏州晶品光电科技有限公司 | Flexible circuit substrate double-side lighting LED array light source |
| CN203674267U (en) * | 2013-10-11 | 2014-06-25 | 杭州恒诚光电科技有限公司 | Bendable LED lighting element |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023918A (en) * | 2014-07-17 | 2015-11-04 | 王志根 | Flexible lamp strip and machining method thereof |
| CN105336832A (en) * | 2015-09-29 | 2016-02-17 | 杭州派尼澳电子科技有限公司 | LED lamp filament and preparation method thereof |
| CN105336832B (en) * | 2015-09-29 | 2017-09-22 | 旭宇光电（深圳）股份有限公司 | A kind of LED filament |
| CN107452724A (en) * | 2015-09-29 | 2017-12-08 | 杭州派尼澳电子科技有限公司 | A kind of preparation method of LED filament |
| CN107452724B (en) * | 2015-09-29 | 2019-06-18 | 杭州派尼澳电子科技有限公司 | A kind of preparation method of LED filament |
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED (Light Emitting Diode) surface light source and preparation method thereof |
| CN105870297A (en) * | 2016-05-27 | 2016-08-17 | 福建鸿博光电科技有限公司 | LED light source and packaging method thereof |
| CN105870298A (en) * | 2016-05-27 | 2016-08-17 | 福建鸿博光电科技有限公司 | Packaging method of LED light source |
| CN108155280A (en) * | 2017-12-15 | 2018-06-12 | 广东昭信照明科技有限公司 | A kind of LED filament and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103545437A (en) | Bendable LED (light emitting diode) luminous element | |
| CN105226167A (en) | A kind of flexible LED filament of full angle luminescence and manufacture method thereof | |
| CN102032483B (en) | Light-emitting diode (LED) plane light source | |
| CN104282831A (en) | LED packaging structure and technique | |
| CN104282676A (en) | Integrated LED lamp panel packaging structure and technology | |
| CN105590994A (en) | LED light source substrate and manufacturing method thereof | |
| CN203674267U (en) | Bendable LED lighting element | |
| CN202758885U (en) | Light emitting diode module packaging structure | |
| CN206370442U (en) | Display screen, light fixture and its LED encapsulation structure | |
| CN202855802U (en) | Heat radiating structure of COB type LED packaging unit | |
| CN105508895A (en) | Filament-lamp-structure-simulated LED (light-emitting diode) lamp | |
| CN204441330U (en) | Extraordinary LED360 ° of light-emitting component | |
| CN207909874U (en) | A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED | |
| CN205535106U (en) | ACCOB light source module | |
| CN201982991U (en) | Light-emitting diode (LED) area light source | |
| CN208538851U (en) | Multi-panel bonding LED filament | |
| CN207250564U (en) | A kind of LED filament | |
| CN202855794U (en) | Direct insert type LED packaging structure | |
| CN202712177U (en) | Two-sided light emitting plane sheet type LED package structure | |
| CN102392948B (en) | Modular high-definition LED (light emitting diode) daylight lamp | |
| CN203979983U (en) | Flexible lamp strip | |
| CN203932053U (en) | All-round angle no dark space LED360 ° light-emitting filament | |
| CN204693325U (en) | A kind of reflector for light emitting diode module | |
| CN204011469U (en) | LED package and lighting device | |
| CN203932052U (en) | 360 ° of light-emitting filaments of some glue formula |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140129 |