CN103545421B - A kind of light source for LED lamp - Google Patents
A kind of light source for LED lamp Download PDFInfo
- Publication number
- CN103545421B CN103545421B CN201310462603.9A CN201310462603A CN103545421B CN 103545421 B CN103545421 B CN 103545421B CN 201310462603 A CN201310462603 A CN 201310462603A CN 103545421 B CN103545421 B CN 103545421B
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- adjusting part
- fixed
- light source
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004411 aluminium Substances 0.000 claims abstract description 56
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000741 silica gel Substances 0.000 claims description 15
- 229910002027 silica gel Inorganic materials 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/404—Connecting portions
- H01L2224/40475—Connecting portions connected to auxiliary connecting means on the bonding areas
- H01L2224/40491—Connecting portions connected to auxiliary connecting means on the bonding areas being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310462603.9A CN103545421B (en) | 2013-09-30 | 2013-09-30 | A kind of light source for LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310462603.9A CN103545421B (en) | 2013-09-30 | 2013-09-30 | A kind of light source for LED lamp |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103545421A CN103545421A (en) | 2014-01-29 |
CN103545421B true CN103545421B (en) | 2016-04-06 |
Family
ID=49968675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310462603.9A Active CN103545421B (en) | 2013-09-30 | 2013-09-30 | A kind of light source for LED lamp |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103545421B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106122783A (en) * | 2016-06-24 | 2016-11-16 | 安庆市奥立德光电有限公司 | A kind of LED light source board |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101709858A (en) * | 2009-09-27 | 2010-05-19 | 广州南科集成电子有限公司 | LED lighting high-efficiency heat-radiating aluminum baseplate, LED light source and making methods thereof |
CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
CN102956764A (en) * | 2011-08-31 | 2013-03-06 | 盈胜科技股份有限公司 | Packaging method for airtight multilayer arrayed light-emitting diodes |
CN202799399U (en) * | 2012-09-10 | 2013-03-13 | 深圳市领德辉科技有限公司 | Light-emitting diode (LED) straight guide aluminium-based circuit board |
CN203434205U (en) * | 2013-09-30 | 2014-02-12 | 浙江长兴金盛光电科技有限公司 | Luminous source for LED lamp |
-
2013
- 2013-09-30 CN CN201310462603.9A patent/CN103545421B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101709858A (en) * | 2009-09-27 | 2010-05-19 | 广州南科集成电子有限公司 | LED lighting high-efficiency heat-radiating aluminum baseplate, LED light source and making methods thereof |
CN102956764A (en) * | 2011-08-31 | 2013-03-06 | 盈胜科技股份有限公司 | Packaging method for airtight multilayer arrayed light-emitting diodes |
CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
CN202799399U (en) * | 2012-09-10 | 2013-03-13 | 深圳市领德辉科技有限公司 | Light-emitting diode (LED) straight guide aluminium-based circuit board |
CN203434205U (en) * | 2013-09-30 | 2014-02-12 | 浙江长兴金盛光电科技有限公司 | Luminous source for LED lamp |
Also Published As
Publication number | Publication date |
---|---|
CN103545421A (en) | 2014-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A kind of LED lamp light emitting source Effective date of registration: 20170629 Granted publication date: 20160406 Pledgee: Changxin Zhejiang rural commercial bank Limited by Share Ltd Pledgor: ZHEJIANG CHANGXING JINSHENG ELECTRO-OPTIC TECHNOLOGY Co.,Ltd. Registration number: 2017990000561 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200616 Granted publication date: 20160406 Pledgee: Changxin Zhejiang rural commercial bank Limited by Share Ltd. Pledgor: ZHEJIANG CHANGXING JINSHENG ELECTRO-OPTIC TECHNOLOGY Co.,Ltd. Registration number: 2017990000561 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Light source for LED lamp Effective date of registration: 20200616 Granted publication date: 20160406 Pledgee: Changxin Zhejiang rural commercial bank Limited by Share Ltd. Pledgor: ZHEJIANG CHANGXING JINSHENG ELECTRO-OPTIC TECHNOLOGY Co.,Ltd. Registration number: Y2020990000625 |