CN103534055B - 激光器基标记方法和设备 - Google Patents

激光器基标记方法和设备 Download PDF

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CN103534055B
CN103534055B CN201180070636.8A CN201180070636A CN103534055B CN 103534055 B CN103534055 B CN 103534055B CN 201180070636 A CN201180070636 A CN 201180070636A CN 103534055 B CN103534055 B CN 103534055B
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约瑟夫·达拉罗萨
安德雷·奈迈雷
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Abstract

设计了一种标记薄工件的方法，以防止工件变形。多个激光器与工件的相应的相反一侧相对，从而热处理两侧。激光器可以以相对于的发射光束彼此对准的方式同步操作。结果，工件在标记完成时不会呈现变形迹象。工件由塑料或金属制成，并具有不超过2毫米的厚度。每个激光器被配置为光纤激光器或气体激光器。可以由被均匀地或不均匀地配置的激光器进行标记，并且该标记包括退火、刻蚀和烧蚀。可以同步地或顺序地进行标记。多表面标记也可以用来以更加受控或希望的方式引起该表面的″扭曲″。

Description

激光器基标记方法和设备
技术领域
本公开内容涉及金属和塑料工件的激光器产生热处理，特别地，本公开内容涉及用于标记薄的金属和塑料板的激光器基方法和激光器***。
背景技术
标记通常是广泛使用的术语，包括本领域技术人员公知的退火、雕刻和烧蚀技术。光纤激光退火在不去除或损坏材料的情况下形成由热量引起的永久标记。(颜色标记实际上引起形成氧化层，因此在所标记的材料中产生多种颜色。)
工业市场场所需要以结合可承受性和速度的方式用于容易地以独特的标识符标记金属和塑料的方法。这种需要通常由激光器且特别地由光纤激光器成功地满足。
存在三种用于标记的主要激光器技术-光纤激光器Nd：YAG和Nd:YV04。虽然来自所有三种技术的波长相同且在1064nm附近变化，***特性和所产生的光束明显不同。一种最大的不同在于光纤激光器的维护需要，其实际上不需要显著的维护。
已经注意到，标记薄的金属，如不锈钢和塑料，引起将被处理的工件变形。例如，针对多种目的标记不锈钢：广告材料的标记、奖品以及工业用途。后者通常在薄金属板上设置与既定产品或制造者相关的标志。当在高温处处理工件，工件趋于变形。这当然是不可接受的，因为它破坏了所标记产品的美学外观。
因此存在对至少最小化并且优选地完全消除薄金属和塑料的变形的可变激光器基标记工艺的需求。
还存在对可操作以执行所公开的工艺的激光器***的需求。
发明内容
通过所公开的工艺和设备满足这些需求。特别地，本公开内容教导了加热将被处理的工件的相反两侧，同时标记所加热侧中的一个。实验表明由被以所公开的方法处理的金属和塑料制成的薄工件不具有可见变形的迹象。
因而，所公开的方法提供用于确定指定用于在工件的一侧上的标记的区域。随后，两个激光器彼此对准，同时面对工件的相应的一侧和另一侧。最后，当一个激光器参与在一侧(即正面)上形成标记时，另一个激光器照射在工件的另一侧(即背面)上的区域，该区域与在所述一侧上的可扫描区域相对。
所公开的用来执行所公开的方法的激光器***包括支撑两个激光器的多种配置的X-Y标绘器型机构。将被处理的工件安装在激光器之间。任意一个激光器相对于彼此和相对于金属板是可移动的，或者反过来，金属板相对于对准至目标位置的激光器或所有对准的激光器是可移动的，并且工件相对于彼此是可移动的。该***还配置有控制器，该控制器可操作以监控和调整该工艺的参数并操纵所述机构以产生所希望的标记，而不存在工件的变形。
附图说明
根据接下来伴随附图的描述，所公开的方法和结构的上述和其它特征和优点将变得容易明白，在附图中：
图1是根据本公开配置的示例性激光器基标记***的示意图。
具体实施方式
图1图示分别包括两个激光器***12和14的示例性***10的示意图。优选地，激光器被配置为光纤激光器，但是诸如气体激光器的其它激光器配置也可以执行所公开的方法。激光器的配置优选地是一致的，但只要满足下文公开的条件，本公开内容的范围包括不同的配置。
支架18沿着光程分别地位于激光器12和14之间，并且可以具有多种配置，每种配置用作由塑料或金属制成的薄的单件工件16的支撑件。虽然***10被图示为在水平平面中发挥作用，但其它配置是明显的设计选择。例如，激光器12和14可以相对于彼此定位在垂直平面中。工件16可以具有不受限制的形状和形式，所有的形状和形式共同都具有范围在数十毫米和甚至数百毫米之间和不大于约2mm的厚度。如实践表明，厚于2mm的金属工件在标记期间通常不变形。工件16，如果是由金属制成的，除了别的以外，其中可以包括钛、铝、黄铜、铜和含碳金属。
市场通常需要诸如不锈钢之类的金属的彩色标记。后者的标记与表面氧化现象相关。通常以比诸如刻蚀更慢的扫描速度进行退火。速度越慢，由工件16吸收的热量越大。典型地，当需要黑色标记时，对光彩色标记来说温度通常较高。然而，工件16在温度升高的情况经历高的热应力，这会引起工件16变形。
根据本公开内容，通过加热工件16的相反侧最小化变形。如已知的那样，激光器标记中最重要的参数是焦斑直径、工件上的功率、标记速度、线间距、重复率、标记方向和脉冲长度(如果采用脉冲式激光器)。所有上文列出的和其它参数是在经验上和理论上被收集的并存储在中央处理单元(″CPU″)24中。
从美国专利7，763，179中已知塑料工件的相反两侧的热处理。然而，与本公开内容相反，现有技术不解决薄工件变形的间题，并教导以不同的图案刻蚀塑料ID卡的相反两侧。
根据***10的一种配置，激光器12，14分别同步操作。激光器在被均匀地配置时以均匀的焦距相对于工件16定位，具有相同的功率，以均匀的标记速度和均匀的重复率以及脉冲长度进行相同的扫描图案。激光器12和14可以具有相应的致动器20和22，主要地能够响应于在负载工件16和每个激光器之间的距离，但如果需要，可以在XY平面中移位。支架18在XY平面中还可以具有几个自由度。
优选地，两个激光器是单模Yb光纤激光器，每个单模Yb光纤激光器设置有将高斯光束修改成顶帽形光束的简单匀束器。可替换地，激光器12和14可以基于具有支撑多个模的芯的激活光纤，如Yb。而且，激光器可以在CW或脉冲状态中操作。
可替换地，激光器12和14中的一个可以在另一个激光器之前或之后开始操作。优选地，在将工件16冷却至环境温度之前进行激光器的异步操作。激光器可以被不同地配置，如光纤激光器和固态激光器、气体激光器，并且具有彼此不同的相似参数。可行的是利用用于处理工件16的相对两侧的不同类型的激光器的组合。
可以以两种公知的方式设计光束传输。第一种技术是通过移动连接至X-Y标图机的一组反射镜和透镜实现的。这种技术称为″飞行光学″***，因为反射镜和聚焦透镜在二维空间中移动。另一种技术采用一组检流计并称为″检流计″***。检流计相对于彼此成90度角定位，反射镜固定至每个检流计。激光束被引入检流计组中，激光束在检流计组中从第一和第二反射镜连续地反射，并且随后通过聚焦透镜(如果存在)离开，从而相对于输入光束成90度入射在工件上。通过旋转检流计组中的反射镜，输出激光束定位在工件上的X-Y平面中。
前述描述和示例已经被提出仅用于说明本公开内容并且意图不是限制性的。因而，本公开内容应当被宽泛地解释以包括在随附权利要求的保护范围内的所有变型。

Claims (13)

1.一种热处理工件的方法，包括下述步骤：
通过第一激光器产生光束标记工件的正面的预定区域；以及
通过第二激光器产生光束加热工件的背面的与所述正面上的所述预定区域相对的区域，从而最小化金属工件的变形，工件是金属或塑料并具有2毫米的厚度；
其中标记和加热被顺序地进行。
2.根据权利要求1所述的方法，其中激光器产生光束由相应的光纤激光器或气体激光器发射。
3.根据权利要求2所述的方法，其中每个光纤激光器是从由CW和脉冲式激光器组成的组中选择的，分别提供标记和加热的光纤激光器被均匀地配置或被不均匀地配置。
4.根据权利要求2所述的方法，还包括控制从由焦斑直径、工件上的功率、标记速度、线间距、重复率、标记方向和脉冲长度及其组合组成的组中选择的激光器参数。
5.根据权利要求2所述的方法，其中所述标记包括退火、刻蚀或烧蚀工件。
6.一种用于热处理工件的激光器***包括：
支架，支撑被配置具有高达2mm的厚度并由金属或塑料制成的工件；
多个激光器，与工件的相应正面和背面相对并且可操作以顺序地发射对应的光束以标记工件，使得工件在热处理期间不存在明显的变形。
7.根据权利要求6所述的激光器***，还包括控制器，该控制器连接至所述多个激光器和支架并设置有机器可读介质。
8.根据权利要求7所述的激光器***，其中控制器可操作以激励所述多个激光器，激光器发射彼此对齐的相应光束。
9.根据权利要求7所述的激光器***，其中控制器可操作以彼此激励所述多个激光器，使得激光器异步操作。
10.根据权利要求7所述的激光器***，其中控制器可操作以通过控制激光器参数控制激光器操作，该激光器参数是从由焦斑直径、工件上的功率、标记速度、线间距、重复率、标记方向和脉冲长度及其组合组成的组中选择的。
11.根据权利要求6所述的激光器***，其中分别加热工件的正面和背面的每个激光器是从由CW激光器和脉冲式激光器组成的组中选择的，分别提供顺序的标记和加热的每个激光器是从光纤激光器或固态激光器或气体激光器选择的。
12.根据权利要求11所述的激光器***，其中分别热处理工件的正面和背面的激光器被均匀地配置或被彼此不同地配置。
13.根据权利要求6所述的激光器***，其中激光器可操作以退火、刻蚀或烧蚀工件。
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9815139B2 (en) * 2014-01-22 2017-11-14 Siemens Energy, Inc. Method for processing a part with an energy beam
CN106298563B (zh) * 2015-05-14 2019-12-20 比亚迪股份有限公司 用于对晶圆进行检测的装置和方法以及制备硅晶片的方法
WO2017207179A1 (en) * 2016-06-03 2017-12-07 Dover Europe Sarl Systems and method for generating laser markings on metallised substrates
CN107138857B (zh) * 2017-05-08 2019-03-05 广东工业大学 一种双激光束自动补偿同步校形与强化装置及方法
KR102409423B1 (ko) * 2017-09-22 2022-06-16 주식회사 엘지에너지솔루션 레이저 송출 특성 값 결정방법
KR102441811B1 (ko) * 2021-04-14 2022-09-08 (주)논스톱테크 진공 청소기
CN114985945B (zh) * 2022-05-19 2024-02-20 深圳市铭镭激光设备有限公司 图案标刻方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689467A (en) * 1982-12-17 1987-08-25 Inoue-Japax Research Incorporated Laser machining apparatus
CN1159967A (zh) * 1996-03-14 1997-09-24 三菱电机株式会社 系杆切割方法和系杆切割装置
CN1604410A (zh) * 2003-09-29 2005-04-06 激光先进技术股份公司 激光二级管模块、激光器设备和激光加工设备
CN2920510Y (zh) * 2006-04-05 2007-07-11 上海久元拉丝模有限公司 用于拉丝模模孔激光同轴成形技术的旋转工作台

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055235B2 (ja) * 1981-03-23 1985-12-04 アマダ エンジニアリング アンド サ−ビスカンパニ− インコ−ポレ−テツド レ−ザ加工方法
DE3728622C1 (de) * 1987-08-27 1988-05-19 Daimler Benz Ag Kennzeichnung von industriellen Erzeugnissen oder Einzelteilen davon
DE4234342C2 (de) * 1992-10-12 1998-05-14 Fraunhofer Ges Forschung Verfahren zur Materialbearbeitung mit Laserstrahlung
KR100255689B1 (ko) * 1993-05-27 2000-05-01 윤종용 반도체 레이져 소자 및 그 제조방법
JP3348334B2 (ja) * 1995-09-19 2002-11-20 ソニー株式会社 薄膜半導体装置の製造方法
US5855969A (en) * 1996-06-10 1999-01-05 Infosight Corp. CO2 laser marking of coated surfaces for product identification
GB2315445A (en) * 1996-07-20 1998-02-04 British Aerospace Method and apparatus for laser ablation
US6208458B1 (en) * 1997-03-21 2001-03-27 Imra America, Inc. Quasi-phase-matched parametric chirped pulse amplification systems
EP1147020B1 (en) * 1999-11-11 2007-08-22 Koninklijke Philips Electronics N.V. Marking of an anodized layer of an aluminium object
JP2004122233A (ja) * 2000-08-28 2004-04-22 Sumitomo Heavy Ind Ltd レーザマーキング装置、マーキング方法及びマーキングされた光学部材
JP4176968B2 (ja) * 2001-02-14 2008-11-05 富士通株式会社 レーザ曲げ加工方法及びレーザ曲げ加工装置
JP3925092B2 (ja) * 2001-03-02 2007-06-06 セイコーエプソン株式会社 基板割断方法、基板割断装置および液晶パネルの製造方法
SG122749A1 (en) * 2001-10-16 2006-06-29 Inst Data Storage Method of laser marking and apparatus therefor
TWI289896B (en) * 2001-11-09 2007-11-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
DE10217678A1 (de) * 2002-04-19 2003-11-06 Fraunhofer Ges Forschung Laser-Materialbearbeitung mit hybriden Prozessen
JP2003340577A (ja) * 2002-05-24 2003-12-02 Nippon Sharyo Seizo Kaisha Ltd レーザ加工装置
JP2004017104A (ja) * 2002-06-18 2004-01-22 Kowa Co レーザーマーカ
US6804574B2 (en) * 2002-07-25 2004-10-12 Matsushita Electric Industrial Co., Ltd. Method of using a computer with a laser drilling system
US6829517B2 (en) * 2002-07-25 2004-12-07 Matsushita Electronic Industrial Co., Ltd. Computer system for use with laser drilling system
US7436423B2 (en) * 2005-05-23 2008-10-14 Matsushita Electric Industrial Co., Ltd. Apparatus and method of making a grayscale photo mask and an optical grayscale element
JP4775313B2 (ja) * 2007-05-01 2011-09-21 セイコーエプソン株式会社 レーザ切断方法
CN101842946B (zh) * 2007-10-31 2012-03-21 松下电器产业株式会社 光纤激光光源
GB2457720A (en) * 2008-02-23 2009-08-26 Philip Thomas Rumsby Method for laser processing on the opposite sides of thin transparent substrates
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689467A (en) * 1982-12-17 1987-08-25 Inoue-Japax Research Incorporated Laser machining apparatus
CN1159967A (zh) * 1996-03-14 1997-09-24 三菱电机株式会社 系杆切割方法和系杆切割装置
CN1604410A (zh) * 2003-09-29 2005-04-06 激光先进技术股份公司 激光二级管模块、激光器设备和激光加工设备
CN2920510Y (zh) * 2006-04-05 2007-07-11 上海久元拉丝模有限公司 用于拉丝模模孔激光同轴成形技术的旋转工作台

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