CN103531717A - OLED display device and manufacturing method thereof - Google Patents

OLED display device and manufacturing method thereof Download PDF

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Publication number
CN103531717A
CN103531717A CN201310513040.1A CN201310513040A CN103531717A CN 103531717 A CN103531717 A CN 103531717A CN 201310513040 A CN201310513040 A CN 201310513040A CN 103531717 A CN103531717 A CN 103531717A
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layer
substrate
packaging
base plate
graphene
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CN103531717B (en
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张玉婷
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority claimed from CN201310513040.1A external-priority patent/CN103531717B/en
Publication of CN103531717A publication Critical patent/CN103531717A/en
Priority to PCT/CN2014/083275 priority patent/WO2015058571A1/en
Priority to US14/429,532 priority patent/US9905797B2/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/814Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/824Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/127Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H10K59/1275Electrical connections of the two substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • H10K59/1315Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

Abstract

The embodiment of the invention provides an OLED (organic light-emitting diode) display device and a manufacturing method thereof, relates to the technical field of display, and solves the problem of high resistance of an anode or a cathode on an array substrate in the prior art. The OLED display device comprises the array substrate and a package substrate connected with each other, wherein the array substrate comprises a first substrate, an anode layer, a cathode layer and an electroluminescent layer arranged between the anode layer and the cathode layer; the anode layer or the cathode layer is arranged on a top layer of the array substrate; the package substrate comprises a second substrate and a graphene layer; the graphene layer is arranged on a topmost layer of the package substrate; conductive fillings are arranged between the array substrate and the package substrate connected with each other, so that the graphene layer is electrically connected with the cathode layer or the anode layer arranged on the top layer of the array substrate through the conductive fillings.

Description

A kind of OLED display unit and preparation method thereof
Technical field
The present invention relates to Display Technique field, relate in particular to a kind of OLED display unit and preparation method thereof.
Background technology
Organic Light Emitting Diode (Organic Light) Emitting Diode(is called for short: OLED) device due to self-luminous, all solid state, wide visual angle, respond the advantages such as fast, in flat panel display product, there is huge applications prospect, liquid crystal (Liquid Crystal Display is even considered to continue, be called for short: LCD), (plasma display panel is called for short: PDP) flat panel display product of new generation afterwards plasma.
Take color OLED display unit as example, comprise the base plate for packaging of box moulding and array base palte.Wherein, as shown in Figure 1, base plate for packaging 10 comprises the second substrate 1 and is arranged on black matrix rete 2 and the colored film layer 3 on described the second substrate 1, and wherein, colored film layer 3 comprises the pattern unit of R (red), G (green), three kinds of different colours of B (indigo plant).Array base palte 20 comprises the first substrate 4 and is arranged on anode layer 5, electroluminescence layer 6 and the cathode layer 7 etc. on described the first substrate 4.Between base plate for packaging and array base palte, fill 8 pairs of box-likes of filler and become display unit.Existing anode and negative electrode form by ITO, and its transmission resistance is large, affects display effect.
Summary of the invention
Embodiments of the invention provide a kind of OLED display unit and preparation method thereof, and the transmission resistance of the male or female of described display unit is little, promote display effect.
For achieving the above object, embodiments of the invention adopt following technical scheme:
The embodiment of the present invention provides a kind of OLED display unit, comprise: to the array base palte of box moulding and base plate for packaging, described array base palte comprise the first substrate, anode layer, cathode layer and be arranged at anode layer and cathode layer between electroluminescence layer, wherein, described anode layer or described cathode layer are arranged on the top layer of described array base palte; Described base plate for packaging comprises the second substrate and graphene layer, and wherein, described graphene layer is arranged on the top layer of described base plate for packaging; Between described array base palte and base plate for packaging, pass through filled conductive filler to box, so that described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
Optionally, described base plate for packaging also comprises: the protective layer between described the second substrate and described graphene layer.
Optionally, described protective layer is formed with protection pattern.
Optionally, described base plate for packaging also comprises: the chock insulator matter layer between described protective layer and described graphene layer, described chock insulator matter layer comprises chock insulator matter pattern.
Optionally, described chock insulator matter layer is identical with described protective layer material.
Optionally, described chock insulator matter layer and described protective layer one-shot forming.
The embodiment of the present invention provides a kind of manufacture method of OLED display unit, comprising: form array base palte; Form base plate for packaging; By array base palte and base plate for packaging to box; Described formation array base palte specifically comprises: on the first substrate, form anode layer or cathode layer; Described formation base plate for packaging specifically comprises: on the second substrate, form graphene layer; Described array base palte and base plate for packaging are specifically comprised box: filled conductive filler between array base palte and base plate for packaging, again by array base palte and base plate for packaging to box, described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
Optionally, describedly on the second substrate, form graphene layer and comprise:
On the 3rd substrate, forming a layer thickness is 200) nickel of 500nm;
900) heat in the mixed airflow of methane, hydrogen and the argon gas of 1200 ℃, then be cooled to room temperature rapidly;
With solvent, nickel is eroded, so that graphene film swims in solution surface, form graphene layer;
Described graphene layer is transferred to the upper surface of described the second substrate.
Optionally, the described upper surface that described graphene layer is transferred to described the second substrate is specially:
Graphene layer swims in solution surface, base plate for packaging is placed in to the solution that is suspended with graphene layer, graphene layer is transferred to the upper surface of the second substrate.
Optionally, on the 3rd substrate, forming 200) nickel of 300nm (and heats in the mixed airflow of methane, hydrogen and the argon gas of 1000 ℃.
Optionally, formation base plate for packaging also comprised form graphene layer on the second substrate before: on the second substrate, form protective layer.
Optionally, before described formation base plate for packaging forms graphene layer on the second substrate, and form protective layer on the second substrate after, also comprise: on the second substrate, form chock insulator matter layer.
A kind of OLED display unit that the embodiment of the present invention provides and preparation method thereof, the top layer of the base plate for packaging of described OLED display unit is provided with graphene layer, and be electrically connected to anode layer or the cathode layer of the top layer of array base palte by conductive filler, and then can reduce the resistance of array base palte Anodic layer or cathode layer, promote display effect.
Accompanying drawing explanation
Fig. 1 is existing OLED display unit schematic diagram;
A kind of OLED display unit schematic diagram that Fig. 2 provides for the embodiment of the present invention;
Fig. 3 is the base plate for packaging schematic diagram in the OLED display unit of Fig. 2;
Protective layer patterning schematic diagram on the base plate for packaging of the another kind of OLED display unit that Fig. 4 provides for the embodiment of the present invention;
The base plate for packaging schematic diagram of the another kind of OLED display unit that Fig. 5 provides for the embodiment of the present invention;
The base plate for packaging schematic diagram of the another kind of OLED display unit that Fig. 6 provides for the embodiment of the present invention;
Fig. 7 is the OLED display unit schematic diagram that comprises base plate for packaging shown in Fig. 5;
Fig. 8 is the OLED display unit schematic diagram that comprises base plate for packaging shown in Fig. 6;
The base plate for packaging schematic diagram of the another kind of OLED display unit that Fig. 9 provides for the embodiment of the present invention;
A kind of method schematic diagram that forms graphene layer on the second substrate that Figure 10 provides for the embodiment of the present invention;
Figure 11 is the manufacture method schematic diagram of the base plate for packaging shown in Fig. 7;
Reference numeral:
1) the second substrate; 2) black matrix rete; 3) colored film layer; 4) the first substrate; 5) anode layer; 6) electroluminescence layer; 7) cathode layer; 8) filler; 9) protective layer; 10) base plate for packaging; 11) graphene layer; 12) chock insulator matter; 20) array base palte.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.
It should be noted that, the displaying principle of OLED display screen is: by cathode layer and anode layer are set on substrate, and between cathode layer and anode layer, be provided with luminous organic material layer, when negative electrode and anode are switched on simultaneously, due to the migration of electric charge, excite and make luminous organic material luminous, and then realize demonstration.And practical structures is more more complex than this board structure, for example, can also between organic luminous layer and anode, add again one deck hole transmission layer, to regulate injection rate and the injection rate in hole.Can also between organic luminous layer and negative electrode, add again one deck electronics transfer layer, be used for regulating injection rate and the injection rate of electronics.Because its concrete structure and inventive point of the present invention are irrelevant, the present invention is not described in detail its concrete structure.And in the embodiment of the present invention with array base palte Anodic be positioned at luminous organic material layer below, negative electrode be positioned at luminous organic material layer above for example describes.Wherein, described " on ", to take the order of making film be foundation to D score, the rete formerly forming under, at the rete of rear formation upper.
The invention provides a kind of OLED display unit, comprise: to the array base palte of box moulding and base plate for packaging, on described array base palte, comprise the first substrate, anode layer, cathode layer and be arranged at anode layer and cathode layer between electroluminescence layer, wherein, described anode layer or described cathode layer are arranged on the top layer of described array base palte; Described base plate for packaging comprises: the second substrate and graphene layer, and wherein, described graphene layer is arranged on the top layer of described base plate for packaging; Between described array base palte and base plate for packaging, pass through filled conductive filler to box, so that described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
It should be noted that, on described array base palte, be provided with anode layer, cathode layer and be arranged on the electroluminescence layer between described anode layer and cathode layer, described anode layer and described cathode layer are relative two-layer, it can be that anode layer is formed on the side near the first substrate, and described cathode layer is formed on the side away from the first substrate; Or can be also that cathode layer is formed on the side near the first substrate, described anode layer be formed on the side away from the first substrate.In the embodiment of the present invention with described anode the side near described the first substrate, negative electrode is that example is elaborated away from one deck of described the first substrate.OLED display unit is according to luminous color, and it can be monochromatic, also can realize colored demonstration by colored film layer is set.In the embodiment of the present invention, take and be provided with colored film layer on the base plate for packaging of described OLED display unit and be elaborated as example.In addition, the substrate that array base palte and base plate for packaging comprise can be all transparency carriers, can be only also that bright dipping side is transparency carrier, in the embodiment of the present invention, take described base plate for packaging as transparency carrier be example.
Concrete, as shown in Figure 2, the embodiment of the present invention provides a kind of display unit, described display unit comprises the array base palte 20 of box moulding and base plate for packaging 10, and wherein said array base palte 20 comprises the first substrate 4 and is arranged on anode layer 5, cathode layer 7 and the electroluminescence layer 6 between anode layer 5 and cathode layer 7 on the first substrate 4.Described base plate for packaging 10 as shown in Figure 3, comprises the second substrate 1 and is arranged on the graphene layer 11 on described the second substrate 1.And array base palte 20 and base plate for packaging 10 are by 8 pairs of boxes of filled conductive filler, and the described cathode layer or the anode layer that are arranged at array base palte top layer are electrically connected to graphene layer 11 by conductive filler 8.
In by form a layer of metal layer on the protective layer of base plate for packaging, such as forming silver metal layer etc., then on metal level, deposit ITO (Indium tin oxide, tin indium oxide), ITO contacts with the negative electrode of array base palte.Due to this structure to resistivity to improve effect general, the way that therefore reduces resistivity by metal level is set is greatly limited.
Graphene (Graphene) is a kind of new material of the single-layer sheet structure consisting of carbon atom, and with respect to other conductive metallic material, it has advantages of, and transparency is high, resistivity is low, electron mobility is exceedingly fast.But due to the exclusive characteristic of Graphene, cannot directly adopt the technique similar to the way that forms metal level on base plate for packaging that Graphene is directly prepared on base plate for packaging.And in embodiments of the present invention, by first described graphene layer being formed on the 3rd substrate, and then graphene layer is transferred to the surface of described base plate for packaging, thereby realized, Graphene is arranged on to the scheme on base plate for packaging.In the scheme of embodiments of the invention, the transmission resistance of the negative electrode being electrically connected to graphene layer or anode is little, and voltage homogeneity is good, can further promote display effect.It should be noted that, described Graphene can single-layer graphene can be also multi-layer graphene, and the described Graphene of take in the embodiment of the present invention is elaborated as multi-layer graphene as example.
A kind of OLED display unit that the embodiment of the present invention provides, the top layer of array base palte of described display unit is provided with anode layer or cathode layer, the top layer of base plate for packaging is provided with graphene layer, and array base palte and base plate for packaging pass through the filler of conduction to box, the graphene layer of described base plate for packaging is electrically connected to the cathode layer or the anode layer that are arranged on the top layer of described array base palte by the filler of conduction, and then can reduce the resistance of described negative electrode or anode.
Optionally, described base plate for packaging also comprises: the protective layer between described the second substrate and described graphene layer.
It should be noted that, described protective layer is mainly used in making film or the pattern planarization on the second substrate.As shown in Figure 3, while being formed with black matrix rete 2 and colored film layer 3 on the second substrate 1, its upper surface is uneven, and described protective layer 9 is set can be so that the flattening surface of base plate for packaging contributes to promote display effect.Concrete, as shown in Figure 3, base plate for packaging 10 is also provided with protective layer 9 between the second substrate 1 and graphene layer 11.Certainly, on described the second substrate, colored film layer is not set and black matrix rete also can arrange described protective layer.
Further preferred, described protective layer is formed with protection pattern.Concrete, as shown in Figure 4, the upper surface of described protective layer 9 arranges a plurality of protuberances, forms protection pattern.Certainly, the protection pattern of described protective layer can also be other Thinfilm patterns, and the embodiment of the present invention only be take describing as example shown in Fig. 4.And protective layer is arranged to the transmitance that patterning can also regulate oled light, and refractive index etc., reduce scattering and improve contrast.
Optionally, described base plate for packaging also comprises: the chock insulator matter layer between described protective layer and described graphene layer, described chock insulator matter comprises chock insulator matter pattern.
Concrete, as shown in Figure 5, described base plate for packaging 10 is also provided with chock insulator matter layer between protective layer 9 and graphene layer 11, and described chock insulator matter layer comprises chock insulator matter 12.Certainly, as shown in Figure 6, can also be chock insulator matter layer 12 to be set being provided with between the protection protective layer 9 of pattern and graphene layer 11.It should be noted that, described chock insulator matter can be the pattern of any other shape, such as can also be rectangle etc., in the embodiment of the present invention, only take being elaborated as example shown in Fig. 5, Fig. 6.
Optionally, described chock insulator matter layer is identical with described protective layer material.And further, described chock insulator matter layer and described protective layer one-shot forming.Concrete, as shown in Figure 9, described chock insulator matter layer is identical with described protective layer material, and it can be by the one-shot forming of a composition technique, and the chock insulator matter layer and the protective layer that form are like this integral body, can not have the problem of loose contact, and easy to make.Certainly, described chock insulator matter layer can also adopt different materials and through one-time process, form respectively from described protective layer.
The embodiment of the present invention provides a kind of manufacture method of OLED display unit, comprising: form array base palte; Form base plate for packaging; By array base palte and base plate for packaging to box; Wherein, described formation array base palte specifically comprises: on the first substrate, form anode layer or cathode layer; Described formation base plate for packaging specifically comprises: on the second substrate, form graphene layer; Described array base palte and base plate for packaging are specifically comprised box: filled conductive filler between array base palte and base plate for packaging, again by array base palte and base plate for packaging to box, described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
It should be noted that, array base palte comprises cathode layer and anode layer, and be provided with electroluminescence layer between cathode layer and anode layer, the position of described cathode layer and described anode layer can be relative, but in the embodiment of the present invention, in the top of substrate, form anode layer or cathode layer, described anode layer or cathode layer are positioned at the top layer of described substrate.Described formation base plate for packaging specifically comprises: on the second substrate, form graphene layer, and described graphene layer is positioned at the top layer of described base plate for packaging.
It should be noted that, between electroluminescence layer and cathode layer, can also be provided with electron injecting layer, electron transfer layer, between electroluminescence layer and anode layer, can also be provided with hole injection layer and hole transmission layer.
It should be noted that, Graphene is a kind of new material of the single-layer sheet structure consisting of carbon atom, and it has advantages of, and transparency is high, resistivity is low, electron mobility is exceedingly fast.
Optionally, as shown in figure 10, describedly on the second substrate, form graphene layer and specifically comprise:
Step 101, on the 3rd substrate, to form a layer thickness be 200) nickel of 500nm.
Described the 3rd substrate can be the substrate etc. that is used to form other films or layer structure.Preferably, on described the 3rd substrate, forming thickness is 200) nickel of 300nm.
Step 102,900) heat in the mixed airflow of methane, hydrogen and the argon gas of 1200 ℃, then be cooled to room temperature rapidly.
Preferably, in the mixed airflow of the methane of 1000 ℃, hydrogen and argon gas, heat, then be cooled to room temperature rapidly.
Step 103, with solvent, nickel is eroded, so that graphene film swims in solution surface, form graphene layer.
It should be noted that, the method that forms graphene layer has multiple, for example can form Graphene by Physical, also can form Graphene by chemical method, in the embodiment of the present invention, only take and by chemical vapour deposition technique, form graphene film and be elaborated as example.
Step 104, described graphene layer is transferred to the upper surface of described the second substrate.
It should be noted that, the surface that the graphene layer of formation is formed on to described the second substrate can be by transparent glue etc., described graphene film to be sticked to the upper surface of described the second substrate.
Optionally, formation base plate for packaging also comprised form graphene layer on the second substrate before: on the second substrate, form protective layer.Described protective layer can be used for making substrate surface planarization, improves display effect.If described display unit, for realizing colored demonstration, can also arrange colored film layer etc. on base plate for packaging certainly.It can carry out corresponding making step according to concrete display unit, because itself and inventive point of the present invention are irrelevant, does not here just enumerate.
Optionally, before described formation base plate for packaging forms Graphene on the second substrate, and form protective layer on the second substrate after, also comprise: on the second substrate, form chock insulator matter layer.The chock insulator matter forming is between described graphene layer and described protective layer.In addition, described chock insulator matter layer can also be made with described protective layer simultaneously.
Below, the present invention will provide a specific embodiment, and the making step that forms base plate for packaging is described in detail in detail, as shown in figure 11, specifically comprise:
Step 201, on the second substrate, form black matrix rete.
It should be noted that, described the second substrate can be transparent glass substrate.Concrete, can be on the second substrate, to form described black matrix rete by a composition technique.
Step 202, on the second substrate, form colored film layer.
Concrete, form described colored film layer being formed with on the second substrate of black matrix rete.Described colored film layer can be to form by a composition technique.
Step 203, on the second substrate, form protective layer.
Concrete, on the second substrate that is formed with black matrix rete and colored film layer, forming again described protective layer, described protective layer can be so that the surface protection of described substrate.Certainly, on described protective layer, can also form chock insulator matter layer, preferred, and the one-shot forming identical with described protective layer material of described chock insulator matter layer.Described chock insulator matter can be used for alleviating the pressure of screen.
Step 204, on the second substrate, form graphene layer.
Finally, on described the second substrate, form graphene layer, described graphene layer is arranged on the top layer of described the second substrate.The base plate for packaging forming as shown in Figure 7.Base plate for packaging shown in Fig. 8 is the protective layer with patterning.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.

Claims (12)

1. an OLED display unit, comprise: to the array base palte of box moulding and base plate for packaging, it is characterized in that, described array base palte comprise the first substrate, anode layer, cathode layer and be arranged at anode layer and cathode layer between electroluminescence layer, wherein, described anode layer or described cathode layer are arranged on the top layer of described array base palte; Described base plate for packaging comprises the second substrate and graphene layer, and wherein, described graphene layer is arranged on the top layer of described base plate for packaging; Between described array base palte and base plate for packaging, pass through filled conductive filler to box, so that described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
2. display unit according to claim 1, is characterized in that, described base plate for packaging also comprises: the protective layer between described the second substrate and described graphene layer.
3. display unit according to claim 2, is characterized in that, described protective layer is formed with protection pattern.
4. display unit according to claim 1, is characterized in that, described base plate for packaging also comprises: the chock insulator matter layer between described protective layer and described graphene layer, described chock insulator matter layer comprises chock insulator matter pattern.
5. display unit according to claim 4, is characterized in that, described chock insulator matter layer is identical with described protective layer material.
6. display unit according to claim 5, is characterized in that, described chock insulator matter layer and described protective layer one-shot forming.
7. a manufacture method for OLED display unit, comprising: form array base palte; Form base plate for packaging; By array base palte and base plate for packaging to box; It is characterized in that, described formation array base palte specifically comprises: on the first substrate, form anode layer or cathode layer; Described formation base plate for packaging specifically comprises: on the second substrate, form graphene layer; Described array base palte and base plate for packaging are specifically comprised box: filled conductive filler between array base palte and base plate for packaging, again by array base palte and base plate for packaging to box, described graphene layer is electrically connected to the described cathode layer or the anode layer that are arranged at array base palte top layer by conductive filler.
8. manufacture method according to claim 7, is characterized in that, describedly on the second substrate, forms graphene layer and comprises:
On the 3rd substrate, forming a layer thickness is 200) nickel of 500nm;
900) heat in the mixed airflow of methane, hydrogen and the argon gas of 1200 ℃, then be cooled to room temperature rapidly;
With solvent, nickel is eroded, so that graphene film swims in solution surface, form graphene layer;
Described graphene layer is transferred to the upper surface of described the second substrate.
9. manufacture method according to claim 8, is characterized in that, the described upper surface that described graphene layer is transferred to described the second substrate is specially:
Graphene layer swims in solution surface, base plate for packaging is placed in to the solution that is suspended with graphene layer, graphene layer is transferred to the upper surface of the second substrate.
10. manufacture method according to claim 8, is characterized in that, on the 3rd substrate, forming thickness is 200) nickel of 300nm (and heats in the mixed airflow of methane, hydrogen and the argon gas of 1000 ℃.
11. manufacture methods according to claim 7, is characterized in that, formation base plate for packaging also comprised form graphene layer on the second substrate before: on the second substrate, form protective layer.
12. manufacture methods according to claim 10, is characterized in that, before described formation base plate for packaging forms graphene layer on the second substrate, and form protective layer on the second substrate after, also comprise: on substrate, form chock insulator matter layer.
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