CN103531506A - 一种用于贴片晶体的筛选排序定位治具 - Google Patents

一种用于贴片晶体的筛选排序定位治具 Download PDF

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Publication number
CN103531506A
CN103531506A CN201310504723.0A CN201310504723A CN103531506A CN 103531506 A CN103531506 A CN 103531506A CN 201310504723 A CN201310504723 A CN 201310504723A CN 103531506 A CN103531506 A CN 103531506A
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optical sensor
fibre optical
optical fiber
fiber sensor
sensor adjusting
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CN201310504723.0A
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屈新球
刘剑
张欢
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Suizhou Run Jing Electronic Science And Technology Co Ltd
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Suizhou Run Jing Electronic Science And Technology Co Ltd
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Priority to CN201310504723.0A priority Critical patent/CN103531506A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Recording Or Reproduction (AREA)

Abstract

本发明涉及到定位治具领域，是一种用于贴片晶体的筛选排序定位治具。其特征是在圆形振盘的上面有出料口轨道；在圆形振盘的外侧分别装有光纤传感器调整支架A、光纤传感器调整支架B、光纤传感器调整支架C和光纤传感器调整支架D；在光纤传感器调整支架A上装有光纤传感器A，在光纤传感器调整支架B上装有光纤传感器B，在光纤传感器调整支架C上装有光纤传感器C，在光纤传感器调整支架D上装有光纤传感器D。由于采用了本技术方案，结构简单，节约了人力，提高了生产效率，降低了生产成本。

Description

一种用于贴片晶体的筛选排序定位治具
技术领域
 本发明涉及到定位治具领域，是一种用于贴片晶体的筛选排序定位治具。
背景技术
在贴片晶体生产领域，需要对贴片晶体电参数进行测试及后续的封装编带，自动化设备必须把振盘中一堆混杂无序的产品进行整理，按照要求进行筛选排序定位，才能有效的对其电参数进行测试及后续的封装编带。
发明内容
本发明的目的是要提供一种用于贴片晶体的筛选排序定位治具。
本发明的技术方案是：一种用于贴片晶体的筛选排序定位治具，其特征是在圆形振盘的上面有出料口轨道；在圆形振盘的外侧分别装有光纤传感器调整支架A、光纤传感器调整支架B、光纤传感器调整支架C和光纤传感器调整支架D；在光纤传感器调整支架A上装有光纤传感器A，在光纤传感器调整支架B上装有光纤传感器B，在光纤传感器调整支架C上装有光纤传感器C，在光纤传感器调整支架D上装有光纤传感器D。
由于采用了上述技术方案，结构简单，节约了人力，提高了生产效率，降低了生产成本。
附图说明
图1是本发明的结构示意图。
在图中：1、光纤传感器A；2、光纤传感器调整支架A；3、出料口轨道；4、圆形振盘；5、光纤传感器B；6、光纤传感器调整支架B；7、光纤传感器调整支架C；8、光纤传感器C；9、光纤传感器调整支架D；10、光纤传感器D。 
具体实施方式
下面结合实施例对本发明作进一步的说明。
在图1中，在圆形振盘4的上面有出料口轨道3；在圆形振盘4的外侧分别装有光纤传感器调整支架A2、光纤传感器调整支架B6、光纤传感器调整支架C7和光纤传感器调整支架D9；在光纤传感器调整支架A2上装有光纤传感器A1，在光纤传感器调整支架B6上装有光纤传感器B5，在光纤传感器调整支架C7上装有光纤传感器C8，在光纤传感器调整支架D9上装有光纤传感器D10。
将一定数量的产品倒入圆形振盘4内，接通圆形振盘4的开关，调至稳定振动频率，这时贴片晶体产品会沿着圆形振盘4设计的路径，逐个送至出料口轨道3，在此过程中各组光纤传感器会通过贴片晶体产品镀锡电极金属面监测到不符合要求的产品，之后把信号传给执行机构将其吹掉，反复筛选，将符合要求的产品从出料口陆续送出。

Claims (1)

1. 一种用于贴片晶体的筛选排序定位治具，其特征是在圆形振盘(4)的上面有出料口轨道(3)；在圆形振盘(4)的外侧分别装有光纤传感器调整支架A(2)、光纤传感器调整支架B(6)、光纤传感器调整支架C(7)和光纤传感器调整支架D(9)；在光纤传感器调整支架A(2)上装有光纤传感器A(1)，在光纤传感器调整支架B(6)上装有光纤传感器B(5)，在光纤传感器调整支架C(7)上装有光纤传感器C(8)，在光纤传感器调整支架D(9)上装有光纤传感器D(10)。
CN201310504723.0A 2013-10-24 2013-10-24 一种用于贴片晶体的筛选排序定位治具 Pending CN103531506A (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
CN201776559U (zh) * 2010-07-13 2011-03-30 东莞市俊知自动机械有限公司 焊片式自动焊接机
CN102248392A (zh) * 2011-07-06 2011-11-23 杭州电子科技大学 一种基于光纤和位移传感器筛选弹子锁锁芯弹子的装置
CN102328161A (zh) * 2011-06-14 2012-01-25 周志玉 一种自动点焊装置
CN102553837A (zh) * 2012-01-10 2012-07-11 梅州市宇通科技有限公司 一种石英晶片外观分选装置
CN202427653U (zh) * 2011-12-08 2012-09-12 深圳市惠世光科技有限公司 一种高频变压器全自动综合测试机

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
CN201776559U (zh) * 2010-07-13 2011-03-30 东莞市俊知自动机械有限公司 焊片式自动焊接机
CN102328161A (zh) * 2011-06-14 2012-01-25 周志玉 一种自动点焊装置
CN102248392A (zh) * 2011-07-06 2011-11-23 杭州电子科技大学 一种基于光纤和位移传感器筛选弹子锁锁芯弹子的装置
CN202427653U (zh) * 2011-12-08 2012-09-12 深圳市惠世光科技有限公司 一种高频变压器全自动综合测试机
CN102553837A (zh) * 2012-01-10 2012-07-11 梅州市宇通科技有限公司 一种石英晶片外观分选装置

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Application publication date: 20140122