CN103531414B - A kind of picosecond pulse laser cutting preparation method of grid-control TWT aperture plate - Google Patents
A kind of picosecond pulse laser cutting preparation method of grid-control TWT aperture plate Download PDFInfo
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Abstract
The invention discloses a kind of picosecond pulse laser cutting preparation method of grid-control TWT aperture plate, first the method cleans screen material, annealing in hydrogen atmosphere annealing in process, on punch press, the high sphere aperture plate blank of radius of curvature precision is pressed into again with mould, then the process of destressing annealing in hydrogen atmosphere is carried out to blank, eliminate the stress in the course of processing, thus ensure the stability of aperture plate spherical crown radius of curvature; Finally adopt the picosecond pulsed laser of Optimization Technology to carry out the cutting of aperture plate, prepare the grid-control TWT aperture plate that dimensional accuracy is high, consistency is good.The preparation method of the aperture plate of grid-control TWT provided by the invention, by the concrete technology parameter of the laser cutting of great many of experiments screening picosecond, workable, technological design is reasonable, has wide range of applications, the grid dimensions precision prepared is high, consistency is good, and yields is high, and reliability is high, there is important using value, effectively can solve the deficiency of existing spark machined aperture plate technology.
Description
Technical field
The present invention relates to a kind of preparation method of travelling wave tube accessory, be specifically related to a kind of picosecond pulse laser cutting preparation method of grid-control TWT aperture plate.
Background technology
Travelling wave tube is a kind of by modulating the speed of electron beam to realize the microwave tube of enlarging function, and the feature of travelling wave tube is bandwidth, gain is high, dynamic range is large and noise is low.Aperture plate is the strength member of grid-control TWT, but the processing method of sphere aperture plate is that lathe strikes out sphere blank and uses spark machined aperture plate again in prior art, precision and the clamping of the aperture plate that this method prepares and electrospark electrode have much relations, there is the shortcoming that the axiality of each wheel of radial-vane grid and the width accuracy of spoke are difficult to ensure, and the radial-vane grid of asymmetric figure, the aperture plate of multiple spherical crown, the aperture plate that string diameter is less than 0.05mm is all difficult to processing, and the consistency of existing spark machined aperture plate is not high, thus cause the travelling wave tube quality of assembling unstable.
Therefore necessary on the basis of prior art, a kind of technological design of design research and development is reasonable, workable, the preparation method of the grid-control TWT aperture plate that grid dimensions precision is high, consistency is good prepared.
Summary of the invention
Goal of the invention: the object of the invention is to solve the deficiencies in the prior art, a kind of strong operability is provided, technological design is reasonable, processing line width, edge quality are good, arbitrary shape and size can be processed, the aperture plate picosecond pulse laser that grid dimensions precision is high, consistency the is good cutting preparation method prepared.
Technical scheme: in order to realize above object, the technical solution used in the present invention is:
A picosecond pulse laser cutting preparation method for grid-control TWT aperture plate, it comprises the following steps:
A, get screen material punch die blanking after, the greasy dirt on screen material surface is removed in cleaning, then screen material is placed in hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, then screen material is placed on protruding spherical mould and is pressed into center in protruding spheric nahlock with punch press, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and clean, then the sphere aperture plate blank after cleaning is positioned over hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, the stress produced when removing shaping, obtains the sphere aperture plate blank removing stress, for subsequent use;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: be first fixed on by base on the objective table of picosecond laser process equipment, correct the center of base, then sphere aperture plate blank nut and trim ring are fixed on base, the center of base and the center superposition of sphere aperture plate blank, draw the figure needing processing with CAD, be then the laser cutting of picosecond with pulse, obtain the finished product of grid-control TWT aperture plate.
Preferably, the picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, the molybdenum of to be thickness be 0.03 to the 0.25mm of the screen material used by step a, molybdenum rhenium or oxygen-free copper, aperture plate picosecond pulse laser cutting technique provided by the invention, applied widely, the material cuttings such as oxygen-free copper, molybdenum or molybdenum rhenium can be adopted to prepare the aperture plate of required complicated shape, the deficiency that prior art Material selec-tion is limited can be overcome.
Preferably, the picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, the temperature of step a annealing in hydrogen atmosphere annealing in process is 650 ~ 950 DEG C, and annealing in hydrogen atmosphere annealing time is 10 ~ 20 minutes.Before compressing with punch press, it is to more thoroughly remove material surface impurity that the present invention carries out annealing in hydrogen atmosphere process to screen material, and effectively can remove the stress of screen material self, increases the formability of screen material.
Preferably, the picosecond pulse laser of above-described grid-control TWT aperture plate cutting preparation method, the annealing in hydrogen atmosphere annealing treating process in step b is: screen material be molybdenum or molybdenum rhenium time, at 950 DEG C, annealing in hydrogen atmosphere is annealed 15 minutes; When screen material is oxygen-free copper, at 650 DEG C, annealing in hydrogen atmosphere is annealed 15 minutes.Through annealing in hydrogen atmosphere process again, the stress produced when can effectively remove shaping, obtains the sphere aperture plate blank removing stress, ensures the stability of aperture plate spherical crown radius of curvature.
Preferably, the picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01 ~ 0.02mm, and power is 0.8W ~ 4W.The required precision of the control gate aperture plate of travelling wave tube is high, and shaping is complex-shaped, the spark machined mode of prior art is adopted to be difficult to processing, the present invention is screened by great many of experiments, the pulse laser mode of picosecond is adopted to process, preferably obtain the laser cutting process parameter of best picosecond, have the following advantages:
(1) there is high peak power, the various materials such as molybdenum, molybdenum rhenium or oxygen-free copper can be processed;
(2) processing line width, edge quality are good, and heat-affected zone is minimum even can be ignored; The picosecond pulse laser processing that the present invention adopts belongs to cold working, and its course of processing is: electronic state absorbs the eruption of---energy reaches lattice damage associative key---plasma.Present spark machined aperture plate technology, the minimum live width can only processing 0.05mm, and the present invention adopts picosecond pulse laser can process the live width of 0.03mm, and edge quality is good, compared to the prior art achieves good technique effect.
(3) experimental result shows, the laser cutting of the picosecond that the present invention adopts can process the aperture plate of arbitrary shape and size, and graphics processing can by CAD Software for Design; The technology of existing spark machined aperture plate can only process symmetric figure, and cannot process the aperture plate that spherical crown diameter is less than Φ 4mm; And picosecond pulse laser of the present invention can process any aperture plate drawing figure, as the radial-vane grid, honeycomb grid, grid, many note aperture plates etc. of odd number decile, the deficiency that prior art machining shape is limited can be overcome, achieve good technique effect.
Preferably, the picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step b, cleaning way is first with sodium hydroxide solution cleaning, then cleans with chromic acid solution.
Beneficial effect: the picosecond pulse laser cutting preparation method of grid-control TWT aperture plate provided by the invention compared with prior art has the following advantages:
The preparation method of the aperture plate of grid-control TWT provided by the invention, by the concrete technology parameter of the laser cutting of great many of experiments screening picosecond, workable, technological design is reasonable, have wide range of applications, the aperture plate of all grid-control TWTs in existing electrovacuum industry can be prepared, and the grid dimensions precision of processing is high, consistency is good, yields is high, reliability is high, has important using value, the unmanageable difficult problem of electrode that effectively can solve existing spark machined aperture plate technology and the aperture plate processing difficult problem solving very small dimensions and complicated shape.
Accompanying drawing explanation
Fig. 1 is the structural representation of the honeycomb aperture plate that method of the present invention prepares.
Fig. 2 is the wire-grid structure schematic diagram of the oxygen-free copper that method of the present invention prepares.
Fig. 3 is the frock clamp mounting structure schematic diagram of method of the present invention picosecond pulse laser cutting when preparing.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
The preparation of embodiment 1 molybdenum honeycomb aperture plate
A picosecond pulse laser cutting preparation method for honeycomb aperture plate, it comprises the following steps:
A, to get thickness be after 0.03mm molybdenum screen material punch die blanking, the greasy dirt on screen material surface is removed in cleaning, then screen material is placed in hydrogen-burning stove, at 800 DEG C, annealing in hydrogen atmosphere annealing in process 15 minutes, then screen material is placed on protruding spherical mould and is pressed into center in protruding spheric nahlock with punch press, obtain sphere aperture plate blank;
B, get sphere aperture plate blank that step a obtains first with sodium hydroxide solution cleaning, and then with chromic acid solution cleaning, then the sphere aperture plate blank after cleaning is positioned over hydrogen-burning stove, at 800 DEG C, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress produced when removing shaping, obtains the sphere aperture plate blank removing stress, for subsequent use;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: be first fixed on the objective table of picosecond laser process equipment by base (4), correct the center of base (4), then sphere aperture plate blank (1) nut (2) and trim ring (3) are fixed on base (4), the center of base (4) and the center superposition of sphere aperture plate blank (1), as shown in Figure 3, then the figure needing processing is drawn with CAD, then be the laser cutting of picosecond with pulse, obtain the finished product of grid-control TWT aperture plate, its structure as shown in Figure 1.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01mm, and power is 1W.
The preparation of the aperture plate of embodiment 2 oxygen-free copper
A picosecond pulse laser cutting preparation method for honeycomb aperture plate, it comprises the following steps:
A, to get thickness be after 0.1mm oxygen-free copper screen material punch die blanking, the greasy dirt on screen material surface is removed in cleaning, then screen material is placed in hydrogen-burning stove, at 650 DEG C, annealing in hydrogen atmosphere annealing in process 15 minutes, then screen material is placed on protruding spherical mould and is pressed into center in protruding spheric nahlock with punch press, obtain sphere aperture plate blank;
B, get sphere aperture plate blank that step a obtains first with sodium hydroxide solution cleaning, and then clean with chromic acid solution, then the sphere aperture plate blank after cleaning is positioned over hydrogen-burning stove, at 650 DEG C, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress produced when removing shaping, obtains the sphere aperture plate blank removing stress, for subsequent use;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: be first fixed on the objective table of picosecond laser process equipment by base (4), correct the center of base (4), then sphere aperture plate blank (1) nut (2) and trim ring (3) are fixed on base (4), the center of base (4) and the center superposition of sphere aperture plate blank (1), as shown in Figure 3, the figure needing processing is drawn with CAD, then be the laser cutting of picosecond with pulse, obtain the finished product of grid-control TWT aperture plate, its structure as shown in Figure 2.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.02mm, and power is 2W.
The preparation of the aperture plate of embodiment 3 molybdenum rhenium
A picosecond pulse laser cutting preparation method for honeycomb aperture plate, it comprises the following steps:
A, to get thickness be after 0.08mm molybdenum rhenium screen material punch die blanking, the greasy dirt on screen material surface is removed in cleaning, then screen material is placed in hydrogen-burning stove, at 900 DEG C, annealing in hydrogen atmosphere annealing in process 20 minutes, then screen material is placed on protruding spherical mould and is pressed into center in protruding spheric nahlock with punch press, obtain sphere aperture plate blank;
B, get sphere aperture plate blank that step a obtains first with sodium hydroxide solution cleaning, and then clean with chromic acid solution, then the sphere aperture plate blank after cleaning is positioned over hydrogen-burning stove, at 900 DEG C, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress produced when removing shaping, obtains the sphere aperture plate blank removing stress, for subsequent use;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: be first fixed on the objective table of picosecond laser process equipment by base (4), correct the center of base (4), then sphere aperture plate blank (1) nut (2) and trim ring (3) are fixed on base (4), the center of base (4) and the center superposition of sphere aperture plate blank (1), as shown in Figure 3, the figure needing processing is drawn with CAD, then be the laser cutting of picosecond with pulse, obtain the finished product of grid-control TWT aperture plate.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.02mm, and power is 3W.
The electron emission test experience of embodiment 4 oxygen-free copper control gate
The control aperture plate that Example 1 to 3 prepares assembles the travelling wave tube obtained, measure travelling wave tube and the electronic transmitting efficiency controlling aperture plate during more than 2500 watts high impulse power outputs is provided under 12 ~ 18GHz high-frequency, experimental result shows that the electron stream passband of the travelling wave tube of the aperture plate assembling prepared by the embodiment of the present invention 1 to 3 is respectively 90%, 98%, 96%.
Through the aperture plate that method provided by the invention prepares, precision is high, stable performance, and the electron emission of the obvious suppressor grid of energy, greatly lowers the noise of transmitter, improve the stability of transmitter supply, and the work of receiver is more stable.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (2)
1. a picosecond pulse laser cutting preparation method for grid-control TWT aperture plate, it is characterized in that, it comprises the following steps:
A, get screen material punch die blanking after, the greasy dirt on screen material surface is removed in cleaning, then screen material is placed in hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, then screen material is placed on protruding spherical mould and is pressed into center in protruding spheric nahlock with punch press, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and clean, then the sphere aperture plate blank after cleaning is positioned over hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, the stress produced when removing shaping, obtains the sphere aperture plate blank removing stress, for subsequent use;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first fixed by sphere aperture plate blank frock clamp, specific practice is for be first fixed on the objective table of picosecond laser process equipment by base (4), correct the center of base (4), then sphere aperture plate blank (1) nut (2) and trim ring (3) are fixed on base (4), the center of base (4) and the center superposition of sphere aperture plate blank (1), the figure needing processing is drawn with CAD, then be the laser cutting of picosecond with pulse, obtain the finished product of grid-control TWT aperture plate,
The temperature of step a annealing in hydrogen atmosphere annealing in process is 650 ~ 950 DEG C, and annealing in hydrogen atmosphere annealing time is 10 ~ 20 minutes;
Annealing in hydrogen atmosphere annealing treating process in step b is: screen material be molybdenum or molybdenum rhenium time, at 950 DEG C, annealing in hydrogen atmosphere is annealed 15 minutes; When screen material is oxygen-free copper, at 650 DEG C, annealing in hydrogen atmosphere is annealed 15 minutes;
In step b, cleaning way is for first cleaning with sodium hydroxide solution and then cleaning with chromic acid solution;
In step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01 ~ 0.02mm, and power is 0.8W ~ 4W.
2. the picosecond pulse laser cutting preparation method of grid-control TWT aperture plate according to claim 1, is characterized in that, the molybdenum of to be thickness be 0.03 to the 0.25mm of the screen material used by step a, molybdenum rhenium or oxygen-free copper.
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Effective date of registration: 20190424 Address after: 210009 Guangming Road, Pukou Economic Development Zone, Pukou District, Nanjing, Jiangsu 5 Patentee after: Nanjing Sanle Group Co., Ltd. Address before: 210009 Guangming Road, Pukou Economic Development Zone, Nanjing, Jiangsu 5 Patentee before: Nanjing Sanle Electronic Information Industry Group Co., Ltd. |
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