CN103517576A - Printed circuit board processing method, printed circuit board and electronic device - Google Patents
Printed circuit board processing method, printed circuit board and electronic device Download PDFInfo
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- CN103517576A CN103517576A CN201210203308.7A CN201210203308A CN103517576A CN 103517576 A CN103517576 A CN 103517576A CN 201210203308 A CN201210203308 A CN 201210203308A CN 103517576 A CN103517576 A CN 103517576A
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Abstract
Embodiments of the invention discloses a PCB (printed circuit board), a PCB processing method and an electronic device. The PCB processing method can comprise: processing a hole on the PCB, wherein the PCB comprises a metal base and at least two layers of base materials, at least one layer of base material from the at least two layers of base materials being provided with a geoelectrical layer thereon and the metal base being fixedly arranged in a groove provided on the base materials, and the processed hole contacting both the geoelectrical layer and the metal base; and arranging a conductive substance in the hole, the conductive substance in the hole contacting the inner layer of the geoelectrical layer and the metal base so as to switch on the inner layer of the geoelectrical layer and the metal base. The scheme of the embodiments of the invention is favourable to improving the reliability of connection between the geoelectrical layer and the metal base of the PCB and improving the transmission performance of a high-frequency signal.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, be specifically related to a kind of printed circuit board (PCB) processing method and printed circuit board (PCB) and electronic equipment.
Background technology
At present, (PCB, Printed Circuit Board) is of a great variety for printed circuit board (PCB), and range of application is also very extensive.In high-frequency high-speed PCB, be embedded into Metal Substrate in PCB mainly by being grounded with the conducting of PCB internal layer ground electricity layer.
In prior art, Metal Substrate and internal layer ground electricity layer are by wire conducting.Practice discovery, although existing connected mode makes ground electricity layer be communicated with Metal Substrate, this kind of mode of communicating reliability is poor, often easily occurs open circuit conditions; And the transmission performance of high-frequency signal is unstable.
Summary of the invention
The embodiment of the present invention provides a kind of PCB processing method and printed circuit board (PCB) and electronic equipment, the reliability being connected with Metal Substrate to improving the ground electricity layer of PCB, the transmission performance of lifting high-frequency signal.
The embodiment of the present invention provides a kind of PCB processing method, comprising:
On printed substrate, process and portal, wherein, described printed substrate comprises Metal Substrate and at least two-layer base material, has internal layer ground electricity layer at least one deck base material in described at least two-layer base material, and described Metal Substrate is fixedly arranged in the groove of offering on described base material;
In described hole, conductive materials is set, and the conductive materials in described hole contact with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity described in conducting layer and described Metal Substrate.
Optionally, described Metal Substrate is entirely embedded in or is partly embedded in described printed substrate, and described method also comprises:
On described printed substrate, offer the blind slot for mounting related components, wherein, the bottom surface portions of described blind slot or be all positioned in described Metal Substrate.
Optionally, described blind slot is partly absorbed in described Metal Substrate.
Optionally, described method also comprises: described blind slot is metallized.
Optionally, describedly on printed substrate, process and portal, comprising: remove the part edge of described base material and/or the part edge of described Metal Substrate to form hole;
Or,
Bonding by binding agent between described base material and described Metal Substrate, describedly on printed substrate, process and portal, comprising: remove part binding agent between described base material and described Metal Substrate with formation hole; Or remove the part edge of described base material and the part binding agent between described base material and described Metal Substrate to form hole; Or remove the part edge of described Metal Substrate and the part binding agent between described Metal Substrate and described base material to form hole; Or, remove the part binding agent between described Metal Substrate and described base material, and remove the part edge of described Metal Substrate and the part edge of described base material to form hole.
Optionally, described binding agent is prepreg, conducting resinl, resin or poly terephthalic acid class plastics.
Optionally, on described base material, also have Equations of The Second Kind wiring layer, wherein, described Equations of The Second Kind wiring layer is the wiring layer of non-ground electricity layer, part or all of Equations of The Second Kind wiring layer on described base material contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
Optionally, the part Equations of The Second Kind wiring layer in the Equations of The Second Kind wiring layer contacting with the hole wall in described hole contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
Optionally, describedly on printed substrate, process and portal, comprising:
The described laser that utilizes is processed and is portalled on printed substrate; Or,
Utilize power auger to process and portal on printed substrate; Or,
By plasma pit mode, on printed substrate, process and portal; Or,
By chemical reagent pit mode, on printed substrate, process and portal.
Optionally, describedly in described hole, conductive materials is set and comprises: the hole wall in described hole is carried out to metalized; Or clog conducting medium in described hole; Or welding lead in described hole.
Optionally, described hole is blind hole or through hole or buried via hole, and wherein, the axis in described hole intersects with described ground electricity layer or be substantially vertical.
The embodiment of the present invention also provides a kind of printed substrate, comprising:
Metal Substrate and at least two-layer base material;
Wherein, on at least one deck base material in described at least two-layer base material, there is internal layer ground electricity layer, described Metal Substrate is fixedly arranged in the groove of offering on described base material, in described printed substrate, also process porose, conductive materials in described hole contacts with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity layer and described Metal Substrate described in conducting.
Optionally, described Metal Substrate is embedded in or is partly embedded in described printed substrate entirely;
On described printed substrate, offer the blind slot for mounting related components, wherein, the bottom surface portions of described blind slot or be all positioned in described Metal Substrate.
Optionally, described blind slot is partly absorbed in described Metal Substrate.
Optionally, described blind slot is for carrying out metallized blind slot.
Optionally, on described base material, also have Equations of The Second Kind wiring layer, wherein, described Equations of The Second Kind wiring layer is the wiring layer of non-ground electricity layer, part or all of Equations of The Second Kind wiring layer on described base material contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
Optionally, described hole is blind hole or through hole or buried via hole, and wherein, the axis in described hole intersects with described ground electricity layer or be substantially vertical.
Optionally, described Metal Substrate is cylindricality Metal Substrate or step Metal Substrate.
The embodiment of the present invention also provides a kind of electronic equipment, comprising:
Components and parts and printed circuit board (PCB);
Wherein, described printed substrate, comprising:
Metal Substrate and at least two-layer base material;
Wherein, on at least one deck base material in described at least two-layer base material, there is internal layer ground electricity layer, described Metal Substrate is fixedly arranged in the groove of offering on described base material, in described printed substrate, also process porose, conductive materials in described hole contacts with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity layer and described Metal Substrate described in conducting.
Optionally, on described printed substrate, offer the blind slot for mounting related components,
Wherein, the bottom surface portions of described blind slot or be all positioned in described Metal Substrate; Wherein, described components and parts are installed in described blind slot.
Optionally, described blind slot is partly absorbed in described Metal Substrate.
Optionally, described blind slot is for carrying out metallized blind slot.
Optionally, on described base material, also have Equations of The Second Kind wiring layer, wherein, described Equations of The Second Kind wiring layer is the wiring layer of non-ground electricity layer, part or all of Equations of The Second Kind wiring layer on described base material contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
Optionally, described hole is blind hole or through hole or buried via hole, and wherein, the axis in described hole intersects with described ground electricity layer or be substantially vertical.
Optionally, described Metal Substrate is cylindricality Metal Substrate or step Metal Substrate.
Optionally, described Metal Substrate is entirely embedded in or is partly embedded in described printed substrate.
Optionally, bonding by binding agent between described base material and described Metal Substrate.Optionally, described binding agent is prepreg, conducting resinl, resin or poly terephthalic acid class plastics.
As from the foregoing, in the embodiment of the present invention owing to having processed a plurality of conductivity hole between the Metal Substrate in PCB and the ground on base material electricity layer, conductive materials in conductivity hole all contacts with Metal Substrate with PCB internal layer ground electricity layer, internal layer ground electricity layer can be by conductive materials and the conducting of Metal Substrate direct interconnection in hole like this, the ground connection performance of Metal Substrate is more reliable, also helps heat radiation performance; And due to the loop length having reduced between internal layer ground electricity layer and Metal Substrate, be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB; And the conductivity hole around processing in Metal Substrate, also can play the effect of signal shielding to the components and parts that set firmly in Metal Substrate, be conducive to further improving product performance.
Further, also can on PCB, offer the blind slot for mounting related components, wherein, the bottom surface portions of this blind slot or be all positioned in Metal Substrate.Also can to this blind slot, metallize by modes such as plating, surface-coated.After metallization blind slot, components and parts can be arranged in this metallized blind slot.Metallization blind slot is also conducive to welding and the heat radiation of components and parts, and Metal Substrate or be arranged on the components and parts in blind slot, may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting, can become the earth terminal of components and parts, components and parts also may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting.Like this, some internal layer ground electricity layer also can be by conductive materials and the conducting of Metal Substrate direct interconnection on blind slot sidewall, and the ground connection performance of Metal Substrate and components and parts is more reliable, also helps heat radiation performance; And due to the loop length that can reduce between internal layer ground electricity layer (and/or other wiring layer) and Metal Substrate; Or can reduce the grounded circuit length between components and parts and internal layer ground electricity layer (and/or other wiring layer), and then be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is a kind of PCB structural representation that the embodiment of the present invention provides;
Fig. 2-a is the schematic flow sheet of a kind of PCB processing method of providing of the embodiment of the present invention;
Fig. 2-b is the schematic diagram in the groove that processes of a kind of PCB that the embodiment of the present invention provides;
Fig. 2-c is the schematic diagram in the groove that processes of another kind of PCB that the embodiment of the present invention provides;
Fig. 2-d is the schematic diagram in the groove that processes of another kind of PCB that the embodiment of the present invention provides;
Fig. 2-e is the schematic diagram in the groove that processes of another kind of PCB that the embodiment of the present invention provides;
Fig. 2-f is the schematic diagram in the groove that processes of another kind of PCB that the embodiment of the present invention provides;
Fig. 3 is a kind of PCB work flow schematic diagram that the embodiment of the present invention provides;
Fig. 4 is the another kind of PCB processing method schematic flow sheet that the embodiment of the present invention provides;
Fig. 5 is the another kind of PCB processing method schematic flow sheet that the embodiment of the present invention provides;
Fig. 6 is the another kind of PCB processing method schematic flow sheet that the embodiment of the present invention provides;
Fig. 7 is the fully buried PCB structural representation of a kind of Metal Substrate that the embodiment of the present invention provides;
Fig. 8 is the buried PCB structural representation of a kind of Metal Substrate half that the embodiment of the present invention provides;
Fig. 9 is the PCB structural representation of a kind of Metal Substrate through type of providing of the embodiment of the present invention;
Figure 10 is a kind of PCB structural representation that comprises convex Metal Substrate that the embodiment of the present invention provides;
Figure 11 is the another kind of PCB structural representation that the embodiment of the present invention provides;
Figure 12 is the another kind of PCB structural representation that the embodiment of the present invention provides;
Figure 13 is the another kind of PCB structural representation that the embodiment of the present invention provides;
Figure 14-a is a kind of PCB of groove transboundary that offers that the embodiment of the present invention provides;
Figure 14-b is that the another kind that the embodiment of the present invention provides is offered the PCB of groove transboundary;
Figure 15-a is a kind of transboundary groove and the transboundary PCB in hole offered that the embodiment of the present invention provides;
Figure 15-b is that the another kind that the embodiment of the present invention provides is offered transboundary groove and the transboundary PCB in hole;
Figure 16 is that existing PCBShang Kong position arranges enlarged drawing;
Figure 17 is that the PCBShang Kong position that the embodiment of the present invention provides arranges enlarged drawing;
Figure 18 is a kind of PCB structural representation that sets firmly components and parts that the embodiment of the present invention provides.
Embodiment
The embodiment of the present invention provides a kind of PCB processing method and printed circuit board (PCB) and electronic equipment, the reliability being connected with Metal Substrate to improving the internal layer ground electricity layer of PCB, the transmission performance of lifting high-frequency signal.
For making those skilled in the art person understand better the present invention program, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, should belong to the scope of protection of the invention.
First referring to Fig. 1, Fig. 1 show for example internal layer circuit in PCB (as electricity layer) with a kind of mode of Metal Substrate conducting.Wherein, the base material that haves three layers altogether of the PCB shown in Fig. 1, has 2 layers of wiring layer totally 6 layers of wiring layer on every layer of base material, be expressed as L1 layer, L2 layer, L3 layer, L4 layer, L5 layer and L6 layer, bonding as bonding agent by prepreg 101 between each base material.Due to the iris action of prepreg 101, internal layer wiring layer L2, L3, L4, L5 cannot be communicated with Metal Substrate 102.A kind of mode drills through hole 103 near the Metal Substrate outside for the PCB after pressing, through hole 103 is carried out to metalized and make each wiring layer interconnection, outer wiring layer L1 and L6 are carried out to electroplating processes, outer wiring layer is directly communicated with Metal Substrate 102, thereby make internal layer wiring layer (as electricity layer) can pass through through hole 103, indirectly be communicated with Metal Substrate 102, conducting circuit as shown in phantom in Figure 1.Practice is found, although this mode can make circuit on internal layer base material (as electricity layer) be communicated with Metal Substrate, but, this kind of mode of communicating is owing to having perceptual hole (via produces secondary inductance), capacitive disc (parasitic capacitance that internal layer pad produces) to impact signal integrity in compare Chang Qie loop, earth return (loop as shown in L2 layer dotted line in way), affect the transmission performance of high-frequency signal, even can cause the final disappearance of high-frequency signal.
Continue to probe into other solution below.
An embodiment of PCB processing method of the present invention, can comprise: on PCB, process and portal, wherein this PCB comprises Metal Substrate and at least two-layer base material, has internal layer ground electricity layer at least one deck base material in this at least two-layer base material, and this Metal Substrate is fixedly arranged in the groove of offering on this base material; The conductive materials arranging in Gai hole in conductive materials ，Qie Gai hole contacts with this internal layer ground electricity layer and this Metal Substrate, with conducting this internal layer ground electricity layer and this Metal Substrate.
Referring to Fig. 2-a, a kind of PCB processing method that the embodiment of the present invention provides, can comprise following content:
Wherein, above-mentioned PCB can comprise Metal Substrate and at least two-layer base material, on at least one deck base material in this at least two-layer base material, have internal layer ground electricity layer (electricity layer be a kind of wiring layer for ground connection, internal layer ground electricity layer is the internal layer wiring layer of PCB), this Metal Substrate is fixedly arranged in the groove of offering on this base material.Be understandable that, the above-mentioned hole processing can be cylindrical hole, prismatic hole (as triangular prism shaped hole or four prism type hole or hexagon hole etc.) or irregular cylindrical hole (being that cross section is irregular shape), and wherein non-cylindrical hole also can be referred to as slotted eye or groove.Wherein, the Metal Substrate in PCB is for example the Metal Substrate of cylindricality Metal Substrate or step Metal Substrate or other shape, and Metal Substrate can be embedded in PCB entirely, or also can lead directly in PCB, also can partly be embedded in PCB.
In some embodiments of the invention, the above-mentioned hole processing on PCB, for example can be blind hole or through hole or buried via hole, wherein, the cross section in this hole is for example for example basic vertical or crossing with ground electricity layer with the axis in electric layer substantially parallel ，Gai hole, ground, certainly, the axis in this hole can not be also the hole that straight line ，Ji Gai hole can the bending of Shi Yige path.
In some embodiments of the invention, for example can be bonding by binding agent between base material in PCB and Metal Substrate, between each layer of base material, also can pass through binding agent, wherein, the one or both sides of every layer of base material can have wiring layer, wiring layer can be divided into ground electricity layer or non-ground electricity layer (for ease of citation, the wiring layer of non-ground electricity layer can be referred to as to Equations of The Second Kind wiring layer below).Wherein, binding agent for example can be prepreg, conducting resinl, resin or poly terephthalic acid class plastics or other binding agent.In some embodiments of the invention, on base material in PCB, for example also there is (one or more layers) Equations of The Second Kind wiring layer, wherein, conductive materials in the hole processing on this PCB also can contact with the part or all of Equations of The Second Kind wiring layer on base material, makes this part or all of Equations of The Second Kind wiring layer by conductive materials and Metal Substrate conducting in this hole.
Wherein, base material can be the base material of common material, or the base material of low frequency material, intermediate frequency material or high frequency material or mixing use.
In some embodiments of the invention, conductive materials in the hole processing on PCB for example can contact with the electric layer in ground (and/or Equations of The Second Kind wiring layer) point, line contacts or face contact, and the conductive materials in this hole contacts with metal basic point, line contacts or face contact.Wherein, the ground electricity layer contacting with conductive materials in above-mentioned hole can be internal layer wiring layer and/or the outer wiring layer of PCB.
Be understandable that, the contact of so-called point, the area that can think contact site is less than certain value (being for example less than 0.1 square millimeter or other value), and contact site length and width are all less than certain value (as 1 millimeter), and so-called face contact, can think that the wide of contact site is less than certain value, and grow up in certain value; So-called face contact, can think that the area of contact site is greater than length and wide certain value that is all greater than of certain value (being for example less than 0.1 square millimeter or other value) ，Qie contact site.Therefore some contact, line contact or face contact are comparatively speaking, and under different references, some contact may become face contact, face contact also may become a contact.
In some embodiments of the invention, if bonding by binding agent between base material and Metal Substrate in PCB, on PCB, processing is portalled and for example can be comprised: remove part binding agent between this base material and this Metal Substrate with formation hole; Or, can remove the part edge of this base material and the part binding agent Yi Xing hole between this base material and Metal Substrate; Or, can remove the part edge of this Metal Substrate and the part binding agent between Metal Substrate and base material, to form hole; Or, can remove the part binding agent between this Metal Substrate and base material, and remove the part edge of this Metal Substrate and the part edge of base material to form hole.In other embodiment of the present invention, for example also can directly Metal Substrate be fixedly arranged in the groove of offering on base material, for example can be first by Metal Substrate freezing (the freezing Metal Substrate volume that makes diminishes), Metal Substrate after freezing is inserted in the groove of offering on base material, treat that Metal Substrate temperature raises volume change afterwards greatly, just can be fixed on this groove and suffer; Or also can directly Metal Substrate be suppressed in the groove of offering on base material, under this scene, on PCB, processing is portalled and can be comprised: remove the part edge of above-mentioned base material and/or the part edge of above-mentioned Metal Substrate to form hole.
In some embodiments of the invention, for example can utilize laser to process and portal on above-mentioned PCB; Or can utilize power auger to process and portal on above-mentioned PCB; Or, can on above-mentioned PCB, process by plasma pit mode portal or, by chemical reagent pit mode, on above-mentioned PCB, process and portal, certainly, also by the combination of above-mentioned at least two kinds of modes or process and portal on above-mentioned PCB by alternate manner, do not limit herein.
In some embodiments of the invention, can in the above-mentioned hole processing, conductive materials be set in several ways, for example, can carry out metalized to the hole wall in the hole processing; Or Gai clogs conducting medium in hole; Or welding lead in Ke Gai hole certainly, also by the combination of above-mentioned at least two kinds of modes or in the above-mentioned hole processing, conductive materials is set by alternate manner, to make it having conductivity, does not limit herein.
Conductive materials contact in part Equations of The Second Kind wiring layer Yu Gai hole in the Equations of The Second Kind wiring layer of the hole wall in ，Yu hole contact in some embodiments of the invention, to pass through conductive materials and this Metal Substrate conducting in this hole.So, optionally part Equations of The Second Kind wiring layer and Metal Substrate are passed through to the conducting of conductivity hole, be conducive to meet many scenes demand.
In some embodiments of the invention, if Metal Substrate is entirely embedded in or is partly embedded in above-mentioned PCB, also can on this PCB, offer the blind slot for mounting related components, wherein, the bottom surface portions of this blind slot or be all positioned in Metal Substrate.So, being arranged on components and parts (as power device) in blind slot can also can dispel the heat or ground connection etc. by Metal Substrate by Metal Substrate.In some embodiments of the invention, (this blind slot for mounting related components can partly be absorbed in this Metal Substrate, while processing this blind slot, removed part metals base), certainly this blind slot for mounting related components can not be absorbed in this Metal Substrate (being that is removal part metals base while, processing this blind slot) yet.
Referring to Fig. 2-b～Fig. 2-f, wherein, Fig. 2-b～Fig. 2-f gives an example in several PCB partly imbedding Metal Substrate and offers several scenes for the blind slot of mounting related components.Wherein, in Fig. 2-b, it is upper that the blind slot 2B bottom surface of offering is all positioned at Metal Substrate 2A, and blind slot 2B bottom surface surrounded by Metal Substrate 2A, and this blind slot 2B is partly trapped in Metal Substrate 2A and (during processing blind slot 2B, has removed part metals base 2A).It is upper that the blind slot 2B bottom surface of offering in Fig. 2-c is all positioned at Metal Substrate 2A, and this blind slot 2B is partly trapped in Metal Substrate 2A and (during processing blind slot 2B, has removed part metals base 2A), but blind slot 2B bottom surface is by being surrounded by Metal Substrate 2A.It is upper that the bottom surface portions of the blind slot 2B offering in Fig. 2-d is positioned at Metal Substrate 2A, and this blind slot 2B is partly trapped in Metal Substrate 2A and (during processing blind slot 2B, has removed part metals base 2A).In Fig. 2-e, the blind slot 2B bottom surface of offering is all positioned on Metal Substrate 2A, and blind slot 2B bottom surface is surrounded by Metal Substrate 2A, but this blind slot 2B is not trapped in Metal Substrate 2A and (during processing blind slot 2B, does not remove part metals base 2A), in Fig. 2-f, it is upper that the bottom surface portions of the blind slot 2B offering is positioned at Metal Substrate 2A, and blind slot 2B is not trapped in Metal Substrate 2A and (during processing blind slot 2B, does not remove part metals base 2A).Be appreciated that also may on PCB, set out in actual applications for other structure of blind slot of mounting related components, give an example no longer one by one herein.
In some embodiments of the invention, also can further to the above-mentioned blind slot for mounting related components, metallize, such as metallizing to this blind slot by modes such as plating, surface-coated.After metallization blind slot, components and parts (as PA, other power amplifier components and parts or other components and parts) can be arranged in this metallized blind slot.Metallization blind slot is also conducive to welding and the heat radiation of components and parts, and Metal Substrate or be arranged on the components and parts in blind slot, may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting, can become the earth terminal of components and parts, components and parts also may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting.Like this, some internal layer ground electricity layer also can be by conductive materials and the conducting of Metal Substrate direct interconnection on blind slot sidewall, and the ground connection performance of Metal Substrate and components and parts is more reliable, also helps heat radiation performance; And due to the loop length that can reduce between internal layer ground electricity layer (and/or other wiring layer) and Metal Substrate; Maybe can reduce the grounded circuit length between components and parts and internal layer ground electricity layer (and/or other wiring layer), and then be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB.
Therefore, in the present embodiment owing to having processed one or more conductivity hole between the Metal Substrate in PCB and the ground on base material electricity layer, conductive materials in this conductivity hole all contacts with Metal Substrate with PCB internal layer ground electricity layer, internal layer ground electricity layer can be by conductive materials and the conducting of Metal Substrate direct interconnection in hole like this, the ground connection performance of Metal Substrate is more reliable, also helps heat radiation performance; And due to the loop length having reduced between internal layer ground electricity layer and Metal Substrate, be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB; And the conductivity hole around processing in Metal Substrate, also can play the effect of signal shielding to the components and parts that set firmly in Metal Substrate, be conducive to further improving product performance.
For ease of better understanding and implement the such scheme of the embodiment of the present invention, below by accompanying drawing, execution mode is illustrated.
The PCB illustrating for example referring to Fig. 3, Fig. 3 is the PCB that comprises 3 layers of base material.
Wherein, have 2 layers of wiring layer on every layer of base material, be respectively L1 layer, L2 layer, L3 layer, L4 layer, L5 layer and L6 layer, wherein, L2 layer is the internal layer ground electricity layer for ground connection, between wiring layer, is base material 104, embeds Metal Substrate 102 among base material.Wherein, between internal layer wiring layer L2 and L3, be prepreg 101 between L4 and L5, between each layer of wiring layer and Metal Substrate 102, be the gummosis 101B of prepreg.
Wherein, after Metal Substrate 102 and base material pressing, for before offering conductivity hole, owing to there being the obstruct of the gummosis 101B of prepreg between each layer of wiring layer and Metal Substrate 102, so each layer of wiring layer and Metal Substrate 102 interconnection not.It should be noted that, Metal Substrate 102 in Fig. 2 is to lead directly among the base material of PCB, the both sides up and down that are Metal Substrate 102 are all exposed at outside base material, certainly, under other scene, Metal Substrate also can partly be embedded among base material, and Metal Substrate only has one side to be exposed, and remaining part is wrapped among the base material of PCB, or Metal Substrate also can be embedded among PCB entirely, Metal Substrate is entirely wrapped among PCB and does not expose face.
Shown in Fig. 3 in processing mode (A1-A2-A3-A4), by removing the gummosis 101B of the part prepreg between base material and Metal Substrate 102, to form hole K1.For example, by conductive materials (hole wall of hole K1 being metallized) is set in the K1 of hole, so that the internal layer of base material ground electricity layer L1 passes through conductive materials and the Metal Substrate 102 direct interconnection conductings in the K1 of hole, conducting circuit as shown in phantom in Figure 3.Wherein, at hole K1, conductive materials being set can be, by the hole wall of hole K1 being carried out to metalized (as electroplate), make hole K1 there is conductivity (in Fig. 3 be take the hole wall of plated-through hole K1 be example), or, can make hole K1 there is conductivity by fill in conductive materials in the K1 of hole, or can make hole K1 there is conductivity by welding lead in the K1 of hole.Wherein, conductive materials in the K1 of hole all contacts with the ground electricity layer L2 of Metal Substrate 102 and base material, make the ground electricity layer L2 of Metal Substrate 102 and base material by the conductive materials conducting in the K1 of hole, the conductive materials in the K1 of hole may contact for line with Metal Substrate 102, the conductive materials in the K1 of hole also may contact for line with a ground electricity layer L2.Conductive materials in Fig. 3 mesopore K1 also contacts with other wiring layer except ground electricity layer, so that this other wiring layer is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K1 of hole.
Therefore, due to the conductive materials in the K1 of hole and ground electricity layer L2 and Metal Substrate 102 all line contact, internal layer ground electricity layer L2 is by conductive materials and Metal Substrate 102 conductings in the K1 of hole like this, an internal layer ground electricity layer L2 do not need to relend and helps outer wiring to realize with Metal Substrate 102 to lead, reduced the loop length between internal layer ground electricity layer L2 and Metal Substrate 102, be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance.Metal Substrate 102 is connected more abundant with earth terminal, simultaneously, to the part in L1 layer, L3 layer, L4 layer, L5 layer and L6, can also carry out metallization removal processing, for example, by line design, realize part metallization removal, thereby can realize Metal Substrate 102 and the not conducting between the wiring layer of metallization removal.
The PCB illustrating for example referring to Fig. 4, Fig. 4 also comprises the PCB of 3 layers of base material.
The main distinction of the processing mode of giving an example with Fig. 3 is, shown in Fig. 4 in processing mode (B1-B2-B3-B4), by removing the gummosis 101B of the part prepreg between base material and Metal Substrate 102, and the part edge of removal base material, to form hole K2, for example, by conductive materials (hole wall of hole K2 being metallized) is set in the K2 of hole, so that internal layer ground electricity layer L1 is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K2 of hole.Wherein, the conductive materials in the K2 of hole may be for line contacts with Metal Substrate 102, and the conductive materials in the K2 of hole is that face contacts with ground electricity layer L2 and base material, is appreciated that face contact is because contact area is larger, and conduction property is also just better more reliable.Conductive materials in Fig. 4 mesopore K2 also contacts with other wiring layer except ground electricity layer, so that this other wiring layer is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K2 of hole.
The PCB illustrating for example referring to Fig. 5, Fig. 5 also comprises the PCB of 3 layers of base material.
The main distinction of the processing mode of giving an example with Fig. 3 is, shown in Fig. 5 in processing mode (C1-C2-C3-C4), by removing the gummosis 101B of the part prepreg between base material and Metal Substrate 102, and the part edge of removing Metal Substrate 102, to form hole K3, for example, by conductive materials (hole wall of hole K3 being metallized) is set in the K3 of hole, so that internal layer ground electricity layer L1 is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K3 of hole.Wherein, the conductive materials in the K3 of hole is with Metal Substrate 102 for face contacts, and the conductive materials in the K3 of hole may contact for line with ground electricity layer L2 and base material, is appreciated that face contact is because contact area is larger, and conduction property is also just better more reliable.Fig. 5 mesopore K3 also contacts with other wiring layer except ground electricity layer, so that this other wiring layer is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K3 of hole.
The PCB illustrating for example referring to Fig. 6, Fig. 6 also comprises the PCB of 3 layers of base material.
The main distinction of the processing mode of giving an example with Fig. 3 is, shown in Fig. 6 in processing mode (D1-D2-D3-D4), by removing the gummosis 101B of the part prepreg between base material and Metal Substrate 102, and the part edge of removing Metal Substrate 102, and the part edge of removing base material, to form hole K4, for example, by conductive materials (hole wall of hole K4 being metallized) is set in the K4 of hole, so that internal layer ground electricity layer L1 is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K4 of hole.Wherein, the conductive materials in the K4 of hole is with Metal Substrate 102 for face contacts, and the conductive materials in the K4 of hole contacts with ground electricity layer L2 and base material upper thread, is appreciated that face contact is because contact area is larger, and conduction property is also just better more reliable.Fig. 6 mesopore K4 also contacts with other wiring layer except ground electricity layer L2, so that this other wiring layer is by conductive materials and Metal Substrate 102 direct interconnection conductings in the K4 of hole.
Need explanation, above-mentioned accompanying drawing is to be introduced so that the PCB of certain structure is processed as to example, for processing electrically conductive hole on the PCB of other structure, with realize wiring layer (as electricity layer) and Metal Substrate pass through the mode of conductivity hole conducting, can be by that analogy.
The embodiment of the present invention also provides a kind of printed substrate, can comprise:
Metal Substrate and at least two-layer base material; Wherein, on at least one deck base material in this at least two-layer base material, there is internal layer ground electricity layer, this Metal Substrate is fixedly arranged in the groove of offering on this base material, in this printed substrate, also process porose, conductive materials in this hole all contacts with Metal Substrate with this internal layer ground electricity layer, with conducting internal layer ground electricity layer and Metal Substrate.
In one embodiment of this invention, above-mentioned hole can be cylindrical hole, prismatic hole (as triangular prism shaped hole or four prism type hole or hexagon hole etc.) or irregular cylindrical hole (being that cross section is irregular shape), wherein, non-cylindrical hole also can be referred to as slotted eye or groove.Wherein, the above-mentioned Metal Substrate in PCB is for example the Metal Substrate of cylindricality Metal Substrate or step Metal Substrate or other shape, and Metal Substrate can be embedded in PCB entirely, or also can lead directly in PCB, also can partly be embedded in PCB.
In some embodiments of the invention, the above-mentioned hole processing on PCB, for example can be blind hole or through hole or buried via hole, wherein, the cross section in this hole is for example for example basic vertical or crossing with ground electricity layer with the axis in electric layer substantially parallel ，Gai hole, ground, certainly, the axis in this hole can not be also the hole that straight line ，Ji Gai hole can the bending of Shi Yige path.
In some embodiments of the invention, for example can be bonding by binding agent between base material in PCB and Metal Substrate, between each layer of base material, also can pass through binding agent, no the two sides of layer base material all can not have wiring layer, wiring layer can be divided into ground electricity layer or non-ground electricity layer (for ease of citation, the wiring layer of non-ground electricity layer can be referred to as to Equations of The Second Kind wiring layer below).Wherein, binding agent for example can be prepreg, conducting resinl, resin or poly terephthalic acid class plastics or other binding agent.In some embodiments of the invention, for example also have (one or more layers) Equations of The Second Kind wiring layer on the base material in PCB, wherein, the conductive materials in above-mentioned hole also can contact with the part or all of Equations of The Second Kind wiring layer on base material.
In other embodiment of the present invention, for example also can directly Metal Substrate be fixedly arranged in the groove of offering on base material, for example can be first by Metal Substrate freezing (the freezing Metal Substrate volume that makes diminishes), Metal Substrate after freezing is inserted in the groove of offering on base material, treat that Metal Substrate temperature raises volume change afterwards greatly, just can be fixed on this groove and suffer; Or also can directly Metal Substrate be suppressed in the groove of offering on base material.Under this scene, can be by removing the part edge of above-mentioned base material and/or the part edge of above-mentioned Metal Substrate to form above-mentioned hole.
In some embodiments of the invention, the conductive materials in the above-mentioned hole on PCB for example can contact with the internal layer electric layer in ground (and/or Equations of The Second Kind wiring layer) point, line contacts or face contact, and this hole contacts with metal basic point, line contacts or face contact.Wherein, the ground electricity layer contacting with conductive materials in above-mentioned hole also can comprise the outer wiring layer of PCB.
In some embodiments of the invention, Metal Substrate can entirely be embedded in or partly be embedded in or lead directly in above-mentioned PCB, also offers the blind slot for mounting related components on this PCB, wherein, and the bottom surface portions of this blind slot or be all positioned in Metal Substrate.So, being arranged on components and parts (as power device) in blind slot can also can dispel the heat or ground connection etc. by Metal Substrate by Metal Substrate.In some embodiments of the invention, (this blind slot for mounting related components can partly be absorbed in this Metal Substrate, while processing this blind slot, removed part metals base), certainly this blind slot for mounting related components can not be absorbed in this Metal Substrate (being that is removal part metals base while, processing this blind slot) yet.
In some embodiments of the invention, the above-mentioned blind slot for mounting related components for example can be the blind slot of carrying out metalized, such as metallizing to this blind slot by modes such as plating, surface-coated.After metallization blind slot, components and parts (as PA, other power amplifier components and parts or other components and parts) can be arranged in this metallized blind slot.Metallization blind slot is also conducive to welding and the heat radiation of components and parts, and Metal Substrate or be arranged on the components and parts in blind slot, may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting, can become the earth terminal of components and parts, components and parts also may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting.Like this, some internal layer ground electricity layer also can be by conductive materials and the conducting of Metal Substrate direct interconnection on blind slot sidewall, and the ground connection performance of Metal Substrate and components and parts is more reliable, also helps heat radiation performance; And due to the loop length that can reduce between internal layer ground electricity layer (and/or other wiring layer) and Metal Substrate; Or can reduce the grounded circuit length between components and parts and internal layer ground electricity layer (and/or other wiring layer), and then be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB.
Therefore, in the present embodiment owing to having processed a plurality of conductivity hole between the Metal Substrate in PCB and the ground on base material electricity layer, conductive materials in this conductivity hole all contacts with Metal Substrate with PCB internal layer ground electricity layer, internal layer ground electricity layer can be by conductive materials and the conducting of Metal Substrate direct interconnection in hole like this, the ground connection performance of Metal Substrate is more reliable, also helps heat radiation performance; And due to the loop length having reduced between internal layer ground electricity layer and Metal Substrate, be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB; And the conductivity hole around processing in Metal Substrate, also can play the effect of signal shielding to the components and parts that set firmly in Metal Substrate, be conducive to further improving product performance.
The structure of the PCB embodiment of the present invention being provided below by accompanying drawing is done for example and is introduced.
Referring to Fig. 7, in the PCB shown in Fig. 7, Metal Substrate 102 is all wrapped among PCB, conductive materials in the K5 of conductivity hole all contacts with Metal Substrate 102 with internal layer ground electricity layer L2, conductive materials in the K5 of conductivity hole also contacts with the some or all of wiring layer except internal layer ground electricity layer L2, makes so that this some or all of wiring layer passes through conductive materials and the Metal Substrate 102 direct interconnection conductings in the K5 of hole.
Referring to Fig. 8, in the PCB shown in Fig. 8, Metal Substrate 102 half is embedded in PCB, and Metal Substrate 102 runs through base material in upper end, and exposed outside base material, remainder is wrapped among base material.Referring to Fig. 9, in the PCB shown in Fig. 9, Metal Substrate 102 leads directly in PCB, and base material is run through at the two ends up and down of Metal Substrate 102, and upper and lower side is all exposed outside base material.
L1 in Fig. 7～Fig. 9, L3, L4, L5 and L6 layer can carry out the processing of part metallization removal, thereby realize not wiring layer and the Metal Substrate of metallization removal, pass through the conductive materials conducting in conductivity hole.
The shape that is appreciated that Metal Substrate also can be for diversified.As shown in figure 10, Metal Substrate 103 is convex, and the L2 layer on base material is the internal layer ground electricity layer for ground connection, and conductivity hole K8 can be blind hole (certainly also can be through hole).Be appreciated that the conductive materials in the hole processing in PCB also can only all contact with part wiring layer with Metal Substrate, and this part wiring layer comprises internal layer ground electricity layer and/or outer ground electricity layer.Figure 11～Figure 13 be respectively given an example out have through type Metal Substrate PCB, there is the PCB of half buried Metal Substrate and there is the PCB of fully buried Metal Substrate, the conductivity hole of its processing can be through hole, blind hole, buried via hole or the combination of polytype hole, the hole of concrete which kind of type of processing can be determined by actual demand, each wiring layer also can design and be processed as corresponding circuit simultaneously, makes Metal Substrate 102 optionally by the conductive materials in above-mentioned hole and each wiring layer conducting.
Further it should be noted that, the conductivity hole in the embodiment of the present invention between wiring layer and Metal Substrate is not limited to cylindrical hole, can be other arbitrary shape.Between Metal Substrate 102 and wiring layer, can whole offer that a conductivity groove K10(conductivity groove as shown in Figure 14-a also belongs to is conductivity hole).Also can between Metal Substrate 102 and wiring layer, offer a plurality of conductivity groove K11 as shown in Figure 14-b in interval.Also can as shown in Figure 15-a, between Metal Substrate 102 and wiring layer, both offer conductivity hole K4, offer again conductivity groove K10.Or as shown in Figure 15-b, between Metal Substrate 102 and wiring layer, both offered conductivity KongK4，You interval and offered a plurality of conductivity groove K11.Conductivity groove K10, conductivity groove K11 can be the groove that buries of blind slot, groove or full flush type.
Referring to Figure 16, Figure 16 is a kind of partial enlarged drawing of possible perforate on PCB.A plurality of hole K0 are arranged on Metal Substrate 102 around, and hole K0 has certain distance from Metal Substrate 102 edge.Suppose that Metal Substrate 102 is of a size of M * N, the hole wall of hole K0 is that a ，KongK0 aperture is b to the spacing of Metal Substrate 102.
Referring to Figure 17, Figure 17 provides a kind of partial enlarged drawing of the Metal Substrate edge perforate at PCB for the embodiment of the present invention, and the conductive materials in Figure 17 Zhong hole K4 can contact with 102 of Metal Substrate.
In the base material range limiting, if will make Figure 16 Zhong hole site constant, and the conductive materials in this hole is contacted with Metal Substrate 102, need increase the area of Metal Substrate 102.Wherein, by can be calculated the area of Metal Substrate increase, be S=(M+N+2a+b) (2a+b).Suppose that original Metal Substrate is of a size of 30x40mm, distance between Metal Substrate and hole wall is 0.4mm, Kong aperture is 0.4mm, bring the Metal Substrate area S=85.44mm that formula can increase into, the increase of Metal Substrate area, can improve the effect of its heat radiation, this application to high power device provides larger selection space.In addition, in the base material range limiting, if make the invariant position of the Metal Substrate in Figure 16, conductive materials in the K0 of Qie Shi hole forms and contacts with Metal Substrate 102, dwindle the shielding ring that existing hole K0 surrounds, can save the shielding surface of base material like this, the shielding surface saving can be used as other purposes.
Further, referring to Figure 18, in the embodiment of the present invention, also can open groove or the processing of open-blind groove to Metal Substrate, for welding component.In Figure 18, transboundary the conductive materials in the K13 of hole is not only the intermediary of internal layer circuit and the direct conducting of Metal Substrate, and or the signal shielding hole of components and parts, transboundary hole K13 has good shield effectiveness; Meanwhile, along with the increase of hole K13 quantity, this transboundary hole K13 also increased the area of dissipation of Metal Substrate 102, played good heat radiation impetus.
The embodiment of the present invention also provides a kind of electronic equipment, can comprise: components and parts and printed circuit board (PCB); Wherein, printed substrate comprises: Metal Substrate and at least two-layer base material; Wherein, on at least one deck base material in this at least two-layer base material, there is internal layer ground electricity layer, this Metal Substrate is fixedly arranged in the groove of offering on this base material, in this printed substrate, also process porose, conductive materials in this hole all contacts with Metal Substrate with this internal layer ground electricity layer, with conducting internal layer ground electricity layer and Metal Substrate; Wherein, on printed substrate, offer the blind slot for mounting related components, wherein, the bottom surface portions of blind slot or be all positioned in Metal Substrate; Wherein, components and parts are installed in blind slot.
In one embodiment of this invention, above-mentioned hole can be cylindrical hole, prismatic hole (as triangular prism shaped hole or four prism type hole or hexagon hole etc.) or irregular cylindrical hole (being that cross section is irregular shape), wherein, non-cylindrical hole also can be referred to as slotted eye or groove.Wherein, the above-mentioned Metal Substrate in PCB is for example the Metal Substrate of cylindricality Metal Substrate or step Metal Substrate or other shape, and Metal Substrate can be embedded in PCB entirely, or also can lead directly in PCB, also can partly be embedded in PCB.
In some embodiments of the invention, for example can be bonding by binding agent between base material in PCB and Metal Substrate, between each layer of base material, also can pass through binding agent, no the two sides of layer base material all can not have wiring layer, wiring layer can be divided into ground electricity layer or non-ground electricity layer (for ease of citation, the wiring layer of non-ground electricity layer can be referred to as to Equations of The Second Kind wiring layer below).Wherein, binding agent for example can be prepreg, conducting resinl, resin or poly terephthalic acid class plastics or other binding agent.In some embodiments of the invention, for example also have (one or more layers) Equations of The Second Kind wiring layer on the base material in PCB, wherein, the conductive materials in above-mentioned hole also can contact with the part or all of Equations of The Second Kind wiring layer on base material.
In other embodiment of the present invention, for example also can directly Metal Substrate be fixedly arranged in the groove of offering on base material, for example can be first by Metal Substrate freezing (the freezing Metal Substrate volume that makes diminishes), Metal Substrate after freezing is inserted in the groove of offering on base material, treat that Metal Substrate temperature raises volume change afterwards greatly, just can be fixed on this groove and suffer; Or also can directly Metal Substrate be suppressed in the groove of offering on base material.Under this scene, can be by removing the part edge of above-mentioned base material and/or the part edge of above-mentioned Metal Substrate to form above-mentioned hole.
In some embodiments of the invention, the conductive materials in the above-mentioned hole on PCB for example can contact with the internal layer electric layer in ground (and/or Equations of The Second Kind wiring layer) point, line contacts or face contact, and this hole contacts with metal basic point, line contacts or face contact.Wherein, the ground electricity layer contacting with conductive materials in above-mentioned hole also can comprise the outer wiring layer of PCB.
In some embodiments of the invention, Metal Substrate can entirely be embedded in or partly be embedded in or lead directly in above-mentioned PCB, also offers the blind slot for mounting related components on this PCB, wherein, and the bottom surface portions of this blind slot or be all positioned in Metal Substrate.So, being arranged on components and parts (as power device) in blind slot can also can dispel the heat or ground connection etc. by Metal Substrate by Metal Substrate.In some embodiments of the invention, (this blind slot for mounting related components can partly be absorbed in this Metal Substrate, while processing this blind slot, removed part metals base), certainly this blind slot for mounting related components can not be absorbed in this Metal Substrate (being that is removal part metals base while, processing this blind slot) yet.
In some embodiments of the invention, the above-mentioned blind slot for mounting related components for example can be the blind slot of carrying out metalized, such as metallizing to this blind slot by modes such as plating, surface-coated.After metallization blind slot, components and parts (as PA, other power amplifier components and parts or other components and parts) can be arranged in this metallized blind slot.Metallization blind slot is also conducive to welding and the heat radiation of components and parts, and Metal Substrate or be arranged on the components and parts in blind slot, may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting, can become the earth terminal of components and parts, components and parts also may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting.Like this, some internal layer ground electricity layer also can be by conductive materials and the conducting of Metal Substrate direct interconnection on blind slot sidewall, and the ground connection performance of Metal Substrate and components and parts is more reliable, also helps heat radiation performance; And due to the loop length that can reduce between internal layer ground electricity layer (and/or other wiring layer) and Metal Substrate; Or can reduce the grounded circuit length between components and parts and internal layer ground electricity layer (and/or other wiring layer), and then be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part of detailed description, can be referring to the associated description of other embodiment.Simultaneously, Metal Substrate in the present invention in PCB can be the Metal Substrate of any shape, size design, selection design, processes design, technical flow design and matching board design, the setting of Metal Substrate on PCB do not limit, can be half buried, through type, fully buried etc., the form in the hole of processing does not limit yet, and can be through hole, blind hole, buried via hole etc.Those skilled in the art can be not paying other PCB that can obtain in substantive creative activity situation, all in protection scope of the present invention.
To sum up, in the embodiment of the present invention owing to having processed a plurality of conductivity hole between the Metal Substrate in PCB and the ground on base material electricity layer, conductive materials in this conductivity hole all contacts with Metal Substrate with PCB internal layer ground electricity layer, internal layer ground electricity layer can be by conductive materials and the conducting of Metal Substrate direct interconnection in hole like this, the ground connection performance of Metal Substrate is more reliable, also helps heat radiation performance; And due to the loop length having reduced between internal layer ground electricity layer and Metal Substrate, be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB; And the conductivity hole around processing in Metal Substrate, also can play the effect of signal shielding to the components and parts that set firmly in Metal Substrate, be conducive to further improving product performance.
In addition, also can on PCB, offer the blind slot for mounting related components, wherein, the bottom surface portions of blind slot or be all positioned in Metal Substrate.Also can to this blind slot, metallize by modes such as plating, surface-coated.After metallization blind slot, components and parts can be arranged in this metallized blind slot.Metallization blind slot is also conducive to welding and the heat radiation of components and parts, and Metal Substrate or be arranged on the components and parts in blind slot, may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting, can become the earth terminal of components and parts, components and parts also may be by the conductive materials on blind slot sidewall and internal layer ground electricity layer or other wiring layer conducting.Like this, some internal layer ground electricity layer also can be by conductive materials and the conducting of Metal Substrate direct interconnection on blind slot sidewall, and the ground connection performance of Metal Substrate and components and parts is more reliable, also helps heat radiation performance; And due to the loop length that can reduce between internal layer ground electricity layer (and/or other wiring layer) and Metal Substrate; Or can reduce the grounded circuit length between components and parts and internal layer ground electricity layer (and/or other wiring layer), and then be conducive to reduce the generation of secondary inductance and parasitic capacitance, and then be conducive to reduce secondary inductance and the impact of parasitic capacitance on signal transmission, and then be conducive to improve high-frequency signal transmission performance, and be conducive to promote the integrated level of miniaturization of PCB.
The PCB above embodiment of the present invention being provided and PCB processing method are described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (13)
1. a processing method for printed substrate, is characterized in that, comprising:
On printed substrate, process and portal, wherein, described printed substrate comprises Metal Substrate and at least two-layer base material, has internal layer ground electricity layer at least one deck base material in described at least two-layer base material, and described Metal Substrate is fixedly arranged in the groove of offering on described base material;
In described hole, conductive materials is set, and the conductive materials in described hole contact with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity described in conducting layer and described Metal Substrate.
2. method according to claim 1, is characterized in that, described Metal Substrate is entirely embedded in or is partly embedded in described printed substrate.
3. method according to claim 1 and 2, is characterized in that,
Describedly on printed substrate, process and portal, comprising: remove the part edge of described base material and/or the part edge of described Metal Substrate to form hole;
Or,
Bonding by binding agent between described base material and described Metal Substrate, describedly on printed substrate, process and portal, comprising: remove part binding agent between described base material and described Metal Substrate with formation hole; Or remove the part edge of described base material and the part binding agent between described base material and described Metal Substrate to form hole; Or remove the part edge of described Metal Substrate and the part binding agent between described Metal Substrate and described base material to form hole; Or, remove the part binding agent between described Metal Substrate and described base material, and remove the part edge of described Metal Substrate and the part edge of described base material to form hole.
4. according to the method described in claims 1 to 3 any one, it is characterized in that, on described base material, also there is Equations of The Second Kind wiring layer, wherein, described Equations of The Second Kind wiring layer is the wiring layer of non-ground electricity layer, part or all of Equations of The Second Kind wiring layer on described base material contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
5. method according to claim 4, is characterized in that, the part Equations of The Second Kind wiring layer in the Equations of The Second Kind wiring layer contacting with the hole wall in described hole contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
6. according to the method described in claim 1 to 5 any one, it is characterized in that,
Describedly on printed substrate, process and portal, comprising:
The described laser that utilizes is processed and is portalled on printed substrate;
Or,
Utilize power auger to process and portal on printed substrate;
Or,
By plasma pit mode, on printed substrate, process and portal;
Or,
By chemical reagent pit mode, on printed substrate, process and portal.
7. according to the method described in claim 1 to 6 any one, it is characterized in that, describedly in described hole, conductive materials is set and comprises: the hole wall in described hole is carried out to metalized; Or clog conducting medium in described hole; Or welding lead in described hole.
8. according to the method described in claim 1 to 7 any one, it is characterized in that,
Described hole is blind hole or through hole or buried via hole, and wherein, the axis in described hole intersects with described ground electricity layer or be substantially vertical.
9. a printed substrate, is characterized in that, comprising:
Metal Substrate and at least two-layer base material;
Wherein, on at least one deck base material in described at least two-layer base material, there is internal layer ground electricity layer, described Metal Substrate is fixedly arranged in the groove of offering on described base material, in described printed substrate, also process porose, conductive materials in described hole contacts with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity layer and described Metal Substrate described in conducting.
10. printed substrate according to claim 9, it is characterized in that, on described base material, also there is Equations of The Second Kind wiring layer, wherein, described Equations of The Second Kind wiring layer is the wiring layer of non-ground electricity layer, part or all of Equations of The Second Kind wiring layer on described base material contacts with the conductive materials in described hole, with the conductive materials by described hole and described Metal Substrate conducting.
11. according to the printed substrate described in claim 9 or 10, it is characterized in that,
Described hole is blind hole or through hole or buried via hole, and wherein, the axis in described hole intersects with described ground electricity layer or be substantially vertical.
12. according to the printed substrate described in claim 9 to 11 any one, it is characterized in that, described Metal Substrate is cylindricality Metal Substrate or step Metal Substrate.
13. 1 kinds of electronic equipments, is characterized in that, comprising: components and parts and printed circuit board (PCB);
Wherein, described printed substrate, comprising:
Metal Substrate and at least two-layer base material;
Wherein, on at least one deck base material in described at least two-layer base material, there is internal layer ground electricity layer, described Metal Substrate is fixedly arranged in the groove of offering on described base material, in described printed substrate, also process porose, conductive materials in described hole contacts with described internal layer ground electricity layer and described Metal Substrate, with internal layer ground electricity layer and described Metal Substrate described in conducting.
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| CN106163083A (en) * | 2016-06-30 | 2016-11-23 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN107734836A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN108282957A (en) * | 2018-01-30 | 2018-07-13 | 维沃移动通信有限公司 | The production method and mobile terminal of a kind of printed circuit board, printed circuit board |
| CN108738230A (en) * | 2017-04-19 | 2018-11-02 | 南亚电路板股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN109001617A (en) * | 2018-09-10 | 2018-12-14 | 上海泽丰半导体科技有限公司 | ATE test board and electronic component setting method based on ATE test board |
| CN114430609A (en) * | 2020-10-29 | 2022-05-03 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
| CN114521041A (en) * | 2020-11-18 | 2022-05-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204077A (en) * | 2000-12-28 | 2002-07-19 | Ngk Spark Plug Co Ltd | Wiring substrate, wiring substrate main body, and chip capacitor |
| US20050243527A1 (en) * | 2004-04-29 | 2005-11-03 | Harris Corporation | Printed wiring board with enhanced structural integrity |
| CN1768559A (en) * | 2003-04-07 | 2006-05-03 | 揖斐电株式会社 | Multilayer printed wiring board |
| US20070159753A1 (en) * | 2006-01-09 | 2007-07-12 | Randall Michael S | System for EMI/RFI filtering and transient voltage suppression |
| US7705246B1 (en) * | 2007-12-28 | 2010-04-27 | Emc Corporation | Compact differential signal via structure |
| CN102131346A (en) * | 2010-01-15 | 2011-07-20 | 欣兴电子股份有限公司 | Circuit board and manufacturing process thereof |
| CN202759661U (en) * | 2012-06-19 | 2013-02-27 | 深南电路有限公司 | Printed circuit board and electronic equipment |
-
2012
- 2012-06-19 CN CN201210203308.7A patent/CN103517576B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204077A (en) * | 2000-12-28 | 2002-07-19 | Ngk Spark Plug Co Ltd | Wiring substrate, wiring substrate main body, and chip capacitor |
| CN1768559A (en) * | 2003-04-07 | 2006-05-03 | 揖斐电株式会社 | Multilayer printed wiring board |
| US20050243527A1 (en) * | 2004-04-29 | 2005-11-03 | Harris Corporation | Printed wiring board with enhanced structural integrity |
| US20070159753A1 (en) * | 2006-01-09 | 2007-07-12 | Randall Michael S | System for EMI/RFI filtering and transient voltage suppression |
| US7705246B1 (en) * | 2007-12-28 | 2010-04-27 | Emc Corporation | Compact differential signal via structure |
| CN102131346A (en) * | 2010-01-15 | 2011-07-20 | 欣兴电子股份有限公司 | Circuit board and manufacturing process thereof |
| CN202759661U (en) * | 2012-06-19 | 2013-02-27 | 深南电路有限公司 | Printed circuit board and electronic equipment |
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| CN105722302B (en) * | 2014-12-04 | 2019-03-01 | 深南电路有限公司 | It is embedded in the circuit board and its processing method of boss Metal Substrate |
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| CN106163083A (en) * | 2016-06-30 | 2016-11-23 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN106163083B (en) * | 2016-06-30 | 2017-08-15 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN108738230B (en) * | 2017-04-19 | 2021-07-09 | 南亚电路板股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN108738230A (en) * | 2017-04-19 | 2018-11-02 | 南亚电路板股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN107734836A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| WO2019149148A1 (en) * | 2018-01-30 | 2019-08-08 | 维沃移动通信有限公司 | Printed circuit board, manufacturing method for printed circuit board, and mobile terminal |
| CN108282957B (en) * | 2018-01-30 | 2019-10-15 | 维沃移动通信有限公司 | The production method and mobile terminal of a kind of printed circuit board, printed circuit board |
| CN108282957A (en) * | 2018-01-30 | 2018-07-13 | 维沃移动通信有限公司 | The production method and mobile terminal of a kind of printed circuit board, printed circuit board |
| US11490520B2 (en) | 2018-01-30 | 2022-11-01 | Vivo Mobile Communication Co., Ltd. | Printed circuit board, method of manufacturing the same, and mobile terminal |
| CN109001617A (en) * | 2018-09-10 | 2018-12-14 | 上海泽丰半导体科技有限公司 | ATE test board and electronic component setting method based on ATE test board |
| CN109001617B (en) * | 2018-09-10 | 2023-08-01 | 上海泽丰半导体科技有限公司 | ATE test board and electronic component setting method based on ATE test board |
| CN114430609A (en) * | 2020-10-29 | 2022-05-03 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
| WO2022088413A1 (en) * | 2020-10-29 | 2022-05-05 | 深南电路股份有限公司 | Battery protection board, machining method therefor, and electronic device |
| CN114521041A (en) * | 2020-11-18 | 2022-05-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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