CN103496213B - Slim anti-folding central layer design - Google Patents
Slim anti-folding central layer design Download PDFInfo
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- CN103496213B CN103496213B CN201310451395.2A CN201310451395A CN103496213B CN 103496213 B CN103496213 B CN 103496213B CN 201310451395 A CN201310451395 A CN 201310451395A CN 103496213 B CN103496213 B CN 103496213B
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Abstract
A kind of slim anti-folding central layer design, be made up of the second layers of copper of substrate and the first layers of copper and lower surface that are pressed on upper surface of base plate respectively, in described first layers of copper and the second layers of copper, etching has circuitous pattern, the marginal portion of described first layers of copper is provided with the first edge part, the marginal portion of the second layers of copper is provided with Second Edge edge, first edge part not identical with thickness direction region, Second Edge edge and on not overlapping, a stress area is formed between described first edge part and Second Edge edge thickness direction, disperse edges of boards stress during thinner central layer etching, reduce flap risk, this design prevents in the etching manufacturing process of core on-board circuitry layer of printed wiring board, edges of boards stress is too concentrated, central layer flap is caused to scrap.
Description
Technical field
The present invention relates to a kind of central layer, be specifically related to a kind of slim anti-folding central layer design.
Background technology
The central layer technique edges edges of boards design of existing printed wiring inner cord is all the copper bound coincidence design of upper and lower surface, and this type of design is greater than 0.100mm for core thickness (not cupric), because substrate thickness enough supports, there is not flap risk; But 0.100mm is less than or equal to for central layer (not cupric) thickness, especially this two classes central layer of 0.076mm and 0.050mm, because etching metacoxal plate is very thin, during etched figure, stress concentrates on upper and lower copper face coincident place, and flap probability is large, easily causes product rejection to increase production cost.
Summary of the invention
Based on this, be necessary for deficiency of the prior art, a kind of slim anti-folding central layer design is provided.
The present invention is achieved in the following ways: a kind of slim anti-folding central layer design, be made up of the second layers of copper of substrate and the first layers of copper and lower surface that are pressed on upper surface of base plate respectively, in described first layers of copper and the second layers of copper, etching has circuitous pattern, the marginal portion of described first layers of copper is provided with the first edge part, the marginal portion of the second layers of copper is provided with Second Edge edge, first edge part is not identical with thickness direction region, Second Edge edge and not overlapping, forms a stress area between described first edge part and Second Edge edge thickness direction.
Further, described first edge part and Second Edge edge are plane setting.
Further, 0.5mm is differed between described first edge part and Second Edge edge thickness direction.
Further, described first edge part is that zigzag is arranged, and comprise some the first projections be arranged side by side, each first projection is triangle; Described Second Edge edge is that zigzag is arranged, comprise some be arranged side by side second protruding, each second projection is triangle, the line between described first protruding outer dead centre and the line between the second protruding outer dead centre separated by a distance.
Further, each first protruding corresponding one second protruding alignment in front and back described.
Further, in being crisscross arranged on described first edge part and Second Edge edge thickness direction, described first projection corresponds to the centre of wherein 2 second projections in a thickness direction, and described second projection corresponds to the centre of wherein 2 first projections in a thickness direction.
Further, the first edge part of described first layers of copper is wave wire, and corresponding first edge part in Second Edge edge of described second layers of copper is wave wire.
Further, the first edge part of described first layers of copper is square-wave-shaped, and corresponding first edge part in Second Edge edge of described second layers of copper is square-wave-shaped.
In sum, the slim anti-folding central layer design of the present invention is provided with the first edge part and Second Edge edge by edge's correspondence of the first layers of copper and the second layers of copper, described first edge part not identical with thickness direction region, Second Edge edge and on not overlapping, a stress area is formed between described first edge part and Second Edge edge thickness direction, the shear force after extruding is made to be dispersed on stress area, disperse edges of boards stress during thinner central layer etching, reduce flap risk, prevent in the etching manufacturing process of core on-board circuitry layer of printed wiring board, edges of boards stress is too concentrated, central layer flap is caused to scrap.
Accompanying drawing explanation
Fig. 1 is the structural representation that the slim anti-folding central layer of the present invention designs the first embodiment.
Fig. 2 is the structural representation that the slim anti-folding central layer of the present invention designs the second embodiment.
Fig. 3 is the structural representation of the slim anti-folding central layer design of the present invention the 3rd embodiment.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 1, the slim anti-folding central layer design of the one for the first embodiment of the present invention, the first layers of copper 20 and lower surface second layers of copper 30 that this slim anti-folding central layer design comprises substrate 10 and is pressed on substrate 10 upper surface respectively.In described first layers of copper 20 and the second layers of copper 30, etching has circuitous pattern respectively.The marginal portion of described first layers of copper 20 is provided with the first edge part 21, the marginal portion of the second layers of copper 30 is provided with Second Edge edge 31, first edge part 21 is not identical with thickness direction region, Second Edge edge 31 and not overlapping, forms a stress area 40 between described first edge part 21 and Second Edge edge 31 thickness direction.
Particularly, this first edge part 21 and Second Edge edge 31 are plane setting in the present embodiment, 0.5mm is differed between described first edge part 21 and Second Edge edge 31 thickness direction, by the stress area 40 formed between described first edge part 21 and Second Edge edge 31 thickness direction, strengthen between the first layers of copper 20 and the marginal portion of the second layers of copper 30 by holding capacity during external force extruding, and make the shear force after extruding be dispersed on stress area 40, reduce flap risk.
As shown in Figure 2, it is the slim anti-folding central layer design of the second embodiment of the present invention, and in the present embodiment, this first edge part 21a is that zigzag is arranged in the present embodiment, comprise some the first protruding 211a be arranged side by side, each first protruding 211a is triangle.Described Second Edge edge 31a is that zigzag is arranged, comprise some the second protruding 311a be arranged side by side, each second protruding 311a is triangle, the corresponding one second protruding 311a of each first protruding 211a be front and back alignment settings, the line between described first protruding 211a outer dead centre and the line between the second protruding 311a outer dead centre separated by a distance.By the stress area 40 formed between described first edge part 21a and Second Edge edge 31a thickness direction, strengthen between the first layers of copper 20 and the marginal portion of the second layers of copper 30 by holding capacity during external force extruding, and make the shear force after extruding be dispersed on stress area 40, reduce flap risk.
As shown in Figure 3, it is the slim anti-folding central layer design of the third embodiment of the present invention, and this first edge part 21b is that zigzag is arranged in the present embodiment, comprises some protruding 211b of triangle first be arranged side by side.Described Second Edge edge 31b be zigzag arrange, comprise some protruding 311b of triangle second be arranged side by side, the line between described first protruding 211b outer dead centre and the line between the second protruding 311b outer dead centre separated by a distance.In being crisscross arranged on described first edge part 21 and Second Edge edge 31 thickness direction, particularly, described first protruding 211b corresponds to the centre of wherein 2 second protruding 311b in a thickness direction, described second protruding 311b corresponds to the centre of wherein 2 first protruding 211b in a thickness direction, by the stress area 40 formed between described first edge part 21b and Second Edge edge 31b thickness direction, strengthen between the first layers of copper 20 and the marginal portion of the second layers of copper 30 by holding capacity during external force extruding, and make the shear force after extruding be dispersed on stress area 40, reduce flap risk.
Understandably, in other embodiments of the invention, first edge part 21 of described first layers of copper 20 is in wave wire or square-wave-shaped, corresponding first edge part 21 in Second Edge edge 31 of described second layers of copper 30 is in wave wire or square-wave-shaped, described first edge part 21 is not identical with thickness direction region, Second Edge edge 31 and not overlapping, differs certain distance between described first edge part 21 and Second Edge edge 31 thickness direction.
In sum, the slim anti-folding central layer design of the present invention is provided with the first edge part 21 and Second Edge edge 31 by edge's correspondence of the first layers of copper 20 and the second layers of copper 30, described first edge part 21 not identical with thickness direction region, Second Edge edge 31 and on not overlapping, a stress area 40 is formed between described first edge part 21 and Second Edge edge 31 thickness direction, the shear force after extruding is made to be dispersed on stress area 40, disperse edges of boards stress during thinner central layer etching, reduce flap risk, prevent in the etching manufacturing process of core on-board circuitry layer of printed wiring board, edges of boards stress is too concentrated, central layer flap is caused to scrap.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a slim anti-folding central layer design, be made up of the second layers of copper of substrate and the first layers of copper and lower surface that are pressed on upper surface of base plate respectively, in described first layers of copper and the second layers of copper, etching has circuitous pattern, it is characterized in that: the marginal portion of described first layers of copper is provided with the first edge part, the marginal portion of the second layers of copper is provided with Second Edge edge, first edge part is not identical with thickness direction region, Second Edge edge and not overlapping, forms a stress area between described first edge part and Second Edge edge thickness direction.
2. slim anti-folding central layer design according to claim 1, is characterized in that: described first edge part and Second Edge edge are plane setting.
3. slim anti-folding central layer design according to claim 2, is characterized in that: differ 0.5mm between described first edge part and Second Edge edge thickness direction.
4. slim anti-folding central layer design according to claim 1, is characterized in that: described first edge part is that zigzag is arranged, and comprise some the first projections be arranged side by side, each first projection is triangle; Described Second Edge edge is that zigzag is arranged, comprise some be arranged side by side second protruding, each second projection is triangle, the line between described first protruding outer dead centre and the line between the second protruding outer dead centre separated by a distance.
5. slim anti-folding central layer design according to claim 4, is characterized in that: each first protruding corresponding one second protruding alignment in front and back described.
6. slim anti-folding central layer design according to claim 1, is characterized in that: the first edge part of described first layers of copper is wave wire, and corresponding first edge part in Second Edge edge of described second layers of copper is wave wire.
7. slim anti-folding central layer design according to claim 1, is characterized in that: the first edge part of described first layers of copper is square-wave-shaped, and corresponding first edge part in Second Edge edge of described second layers of copper is square-wave-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310451395.2A CN103496213B (en) | 2013-09-27 | 2013-09-27 | Slim anti-folding central layer design |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310451395.2A CN103496213B (en) | 2013-09-27 | 2013-09-27 | Slim anti-folding central layer design |
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| Publication Number | Publication Date |
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| CN103496213A CN103496213A (en) | 2014-01-08 |
| CN103496213B true CN103496213B (en) | 2015-08-19 |
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| CN201310451395.2A Active CN103496213B (en) | 2013-09-27 | 2013-09-27 | Slim anti-folding central layer design |
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| CN103496212B (en) * | 2013-09-27 | 2015-08-19 | 东莞美维电路有限公司 | Slim anti-folding central layer design |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5021216B2 (en) * | 2006-02-22 | 2012-09-05 | イビデン株式会社 | Printed wiring board and manufacturing method thereof |
| US8014154B2 (en) * | 2006-09-27 | 2011-09-06 | Samsung Electronics Co., Ltd. | Circuit substrate for preventing warpage and package using the same |
| JP5120267B2 (en) * | 2007-02-08 | 2013-01-16 | 住友ベークライト株式会社 | Laminated body, circuit board including laminated body, semiconductor package, and laminated body manufacturing method |
| CN103496212B (en) * | 2013-09-27 | 2015-08-19 | 东莞美维电路有限公司 | Slim anti-folding central layer design |
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