CN103481608A - 复合板及其制备方法和包含它的显示器基板 - Google Patents

复合板及其制备方法和包含它的显示器基板 Download PDF

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CN103481608A
CN103481608A CN201310232685.8A CN201310232685A CN103481608A CN 103481608 A CN103481608 A CN 103481608A CN 201310232685 A CN201310232685 A CN 201310232685A CN 103481608 A CN103481608 A CN 103481608A
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replacement
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annular siloxane
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CN103481608B (zh
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林成翰
金荣权
崔硕元
李尚杰
郑殷焕
李雨晋
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Cheil Industries Inc
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Abstract

文中公开了复合板,所述复合板包括基质和浸渍在所述基质中的增强材料。所述复合板在350℃具有约98%或更大的重量变化(△W)及在100μN的负荷下约1000MPa或更小的弛豫模量。所述复合板抑制环状结构的变形及在350℃或更高温度的热分解,从而防止在基板的制造中材料在高温被破坏。本文还公开制备所述复合板的方法和包括所述复合板显示器基板。

Description

复合板及其制备方法和包含它的显示器基板
技术领域
本发明涉及复合板及其制备方法和包含它的显示器基板。
背景技术
玻璃基板具有优异的耐热性、透明度和低的线性膨胀系数。因此,玻璃基板已经被广泛用作用于液晶显示装置、有机EL显示装置、彩色滤光器、太阳能电池等的基板。然而,由于厚度、重量和对冲击的脆弱性,玻璃基板对更薄和更轻的液晶显示器适用性受限。此外,由于玻璃材料的脆性,玻璃基板不适于用作显示器基板。
因此,本领域中由塑料光学膜材料制造的显示器基板作为玻璃基板的替代物受到关注。然而,塑料光学膜材料具有高的热膨胀系数,并在硬度方面是不利的。因此,使用通过浸渍包含玻璃纤维或玻璃布的增强材料到聚合基质树脂中来制备具有改善的硬度的透明基板的方法。
近来,已经提出了通过浸渍增强材料到橡胶材料来制备具有低的热膨胀系数的透明基板的方法。在这些材料中,线性聚有机硅氧烷树脂为主要的关注焦点。由线性聚有机硅氧烷树脂制造的透明基板具有在透明性、挠性等方面的优异的性质,并且重量轻。此外,虽然由于诸如优异的固化、化学稳定性等各种优点,线性聚有机硅氧烷树脂应用到各个工业领域,但是已知线性聚有机硅氧烷树脂在250℃或更高的温度在形成挥发性环状环三硅氧烷的过程中分解,因而限制了它作为基板材料的应用。
为解决这些问题,已做出了各种尝试以提高硅树脂的热稳定性。例如,JP2005-298606公开了通过1,3,5,7-四甲基环四硅氧烷与1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷反应制备的具有改善的耐热性的硅树脂。此外,US2009/0069525公开了通过1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷与1,4-双(二甲基甲硅烷基)苯反应制备的具有改善的耐热性的硅树脂。
然而,尽管有提高的耐热性的优点,但是这些树脂具有减小的挠性和脆性的缺点。由于硅基质的交联度增加,所以可抑制环三硅氧烷的形成。但是,硅树脂从橡胶相变为玻璃相,从而导致上述缺点。
因此,需要对在耐热性、挠性、机械性质和光学性质方面具有突出的性质的适用作显示器基板的新的材料。
发明内容
本发明提供了在耐热性、热稳定性、挠性、机械性质和光学性质方面具有突出的性质的适用作显示器基板的复合板,可应用于更小、更薄、更轻和更便宜的显示器基板。
此外,本发明提供了制备所述复合板的方法,及使用它的显示器基板。
本发明的复合板可抑制环形结构的变形和甚至在350℃或更高温度的分解,从而防止在基板的制造中材料在高温被破坏。
本发明的一个方面涉及复合板。所述复合板包含基质和浸渍在所述基质中的增强材料。所述复合板在100μN的负荷下具有约1000MPa或更小的弛豫模量,并在350℃具有约98%或更大的根据等式1的重量变化(:△W)
[等式1]
ΔW = Wa Wb × 100 % ,
其中,Wa为在氮气气氛中以5℃/分钟的温度上升速率从25℃加热50mg的样品至350℃后,通过热重分析法(TGA/DSC1)测量的样品重量,并且Wb为所述样品在25℃的初始重量。
在一个实施方式中,所述基质可包括含环状硅氧烷的硅树脂。
在另一个实施方式中,所述基质可包括环状硅氧烷和含线性末端乙烯基的聚硅氧烷的反应产物。
所述环状硅氧烷可由化学通式1表示:
[化学通式1]
Figure BDA00003338934000022
其中,R1、R2和R3各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;n和m各自为0~6的整数;并且n+m为3~6的整数。
所述含线性末端乙烯基的聚硅氧烷可由化学通式2表示:
[化学通式2]
Figure BDA00003338934000031
其中,R1和R2各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;p为1~20的整数;并且q为0~20的整数。
所述环状硅氧烷和所述含线性末端乙烯基的聚硅氧烷可以约0.5∶1至约2.5∶1的摩尔当量比存在。
所述复合板在350℃可具有约98%或更大的根据等式1的重量变化(:△W)
[等式1]
ΔW = Wa Wb × 100 % ,
其中,Wa为在氮气气氛中以5℃/分钟的温度上升速率从25℃加热50mg的样品至350℃后,通过热重分析法(TGA/DSC1)测量的样品重量,并且Wb为所述样品在25℃的初始重量。
所述复合板在550nm的波长处可具有约90%或更大的透射率。
所述的复合板可具有根据ASTM D522的小于约5mm的抗弯强度及小于约10ppm/K的热膨胀系数(CTE)。
所述增强材料可包括玻璃纤维织物、玻璃布、无纺玻璃布和玻璃网状物中的至少一种。
本发明的另一个方面涉及制备复合板的方法。所述方法包括:制备包括环状硅氧烷和含线性末端乙烯基的聚硅氧烷的基质组合物;和用增强材料浸渍所述基质组合物,然后固化所述基质组合物。
本发明的再一个方面涉及包含所述复合板的显示器基板。
附图说明
图1为根据本发明的一个实施方式的复合板的截面示意图。
图2为环状硅氧烷与含线性末端乙烯基的聚硅氧烷的结合形态的示意图。
具体实施方式
图1为根据本发明的一个实施方式的复合板的截面示意图。参照图1,根据一个实施方式的复合板10包含基质1,基质1含有增强材料2。根据一个实施方式,增强材料2可具有层压结构,但不限于此。增强材料可作为支撑浸渍到基质中。在另一个实施方式中,增强材料可分散在基质中。在再一个实施方式中,增强材料可具有织物结构并可浸渍在基质中。在另一个实施方式中,增强材料可单向设置并可浸渍在基质中。增强材料可为单层或多层的形态。
在一个实施方式中,基质包括含有环状硅氧烷的硅树脂。
在一个实施方式中,基质可包括环状硅氧烷与含线性末端乙烯基的聚硅氧烷的反应产物。
在一个实施方式中,制备复合板的方法可包括:制备包括环状硅氧烷和含线性末端乙烯基的聚硅氧烷的基质组合物;和用增强材料浸渍该基质组合物,然后固化该基质组合物。
图2为环状硅氧烷与包含线性末端乙烯基的聚硅氧烷的结合形态的示意图。环状硅氧烷的氢与含线性末端乙烯基的聚硅氧烷的乙烯基反应,以使含线性末端乙烯基的聚硅氧烷(B)连接在两个环状硅氧烷部分(A)之间。
环状硅氧烷可由化学通式1表示:
[化学通式1]
Figure BDA00003338934000041
其中,R1、R2和R3各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;n和m各自为0~6的整数;并且n+m为3~6的整数。
在一个实施方式中,当m为0时,R1和R2中的任一个可为氢。
如文中所使用的,术语“取代的”表示至少一个氢原子被卤素原子、羟基、氨基、羰基、巯基、酯基、醚基、羧基或其盐、磺酸基或其盐、磷酸基或其盐、C1~C20烷基、C2~C20烯基、C2~C20炔基、C1~C20烷氧基、C6~C30芳基、C6~C30芳氧基、C3~C30环烷基、C3~C30环烯基、C3~C30环炔基或它们的组合取代。
环状硅氧烷的实例可包括四甲基环四硅氧烷、四乙基环四硅氧烷、四丙基环四硅氧烷、四丁基环四硅氧烷、五甲基环五硅氧烷、五乙基环五硅氧烷、六甲基环六硅氧烷等。
含线性末端乙烯基的聚硅氧烷为在它的末端具有乙烯基的线性硅氧烷,并可包含在满足当量比例的范围内的乙烯基。例如,在基质组合物中乙烯基的量可为约25mol%至约50mol%。在这个范围内,可获得高固化效率和固化后的橡胶性质。
在一个实施方式中,含线性末端乙烯基的聚硅氧烷可由化学通式2表示:
[化学通式2]
Figure BDA00003338934000051
其中,R1和R2各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;p为1~20的整数;并且q为0~20的整数。
例如,DMS-V03、V05、V21(Gelest有限公司制造的乙烯基末端的聚二甲基甲硅烷氧基硅烷)等可用作含线性末端乙烯基的聚硅氧烷。
在一个实施方式中,含线性末端乙烯基的聚硅氧烷可具有约100g/mol至约10,000g/mol的重均分子量。在这个范围内,基质组合物可呈现在热稳定性、透明度和抗弯强度方面的突出的性质。优选地,含线性末端乙烯基的聚硅氧烷具有约200g/mol至约5,000g/mol的重均分子量,更优选约300g/mol至约1,000g/mol,最优选约350g/mol至约700g/mol。可通过GPC(凝胶渗透色谱法)测量重均分子量。
根据实施方式,可通过控制含线性末端乙烯基的聚硅氧烷的重均分子量控制复合板的机械性质。
在一个实施方式中,环状硅氧烷和含线性末端乙烯基的聚硅氧烷可以约0.5∶1至约2.5∶1的摩尔当量比存在。摩尔当量比在这个范围内,基质组合物具有高的固化效率。优选地,环状硅氧烷和含线性末端乙烯基的聚硅氧烷可以约1.0∶1至约2.0∶1的摩尔当量比存在。摩尔当量比为环状硅氧烷中Si-H基团与含线性末端乙烯基的聚硅氧烷中乙烯基的摩尔比。
基质组合物可进一步包含典型的添加剂,例如催化剂、抑制剂等。
增强材料可包含玻璃纤维织物、玻璃布、无纺玻璃布和玻璃网状物中的至少一种。优选地,增强材料包含玻璃纤维织物。
增强材料与基质之间的折射率差异可为约0.01或更小。在这个范围内,基质组合物可呈现优异的透明度。优选地,它们之间的折射率差异为约0.0001至约0.007。
制备复合板的方法可包括:用增强材料浸渍基质组合物;在两个离型膜之间放置该基质组合物并层压,和固化该基质组合物。离型膜可以为离型的玻璃基板。
根据实施方式的复合板可包含约70∶30至约95∶5、优选约80∶20至约90∶10的重量比的基质组合物和增强材料。在这个范围内,复合板可具有适于显示器基板的性质。
如文中所使用的,术语“浸渍”及它的派生语可包含在所述基质中形成增强材料的单层或多层结构。
可在约40℃至约120℃,优选地约50℃至约100℃的温度进行固化约0.1分钟至约10小时,优选地约30分钟至约5小时。在这个范围内,在提供高的机械强度的同时,可获得基质和增强材料的充分固化。
根据实施方式的复合板可具有约15μm至约200μm厚度。在这个范围内,复合板可用于显示器基板。
在一个实施方式中,基质组合物可具有约-40℃至约-20℃的玻璃化转变温度。在这种情况下,在从室温至80℃的温度范围内,即,在当用于显示器基板的操作温度范围内,复合板具有优异的挠性和硬度及低的热膨胀系数。
根据等式1,所述复合板在350℃可具有约98%或更大,例如约98.5%至约99.9%的重量变化(:△W)
[等式1]
ΔW = Wa Wb × 100 % ,
其中,Wa为在氮气气氛中以5℃/分钟的温度上升速率从25℃加热50mg的样品至350℃后,通过热重分析法(TGA/DSC1)测量的样品重量,并且Wb为所述样品在25℃的初始重量。
复合板在100μN的负荷下可具有约1000MPa或更小,例如约10MPa至约200MPa,在实施方式中约20Mpa至约150MPa的弛豫模量。在一个实施方式中,复合板可具有约20Mpa至约100MPa的弛豫模量。
复合板在550nm的波长处可具有约90%或更高,优选地约90%至约99%的透射率。
复合板可具有根据ASTM D522的小于约5mm,例如约0.1mm至约3.5mm的抗弯强度,和小于约10ppm/K,例如约0.1ppm/K至约5ppm/K的热膨胀系数(CTE)。
在另一个实施方式中,复合板在它的至少一侧上可进一步包含平滑层、气体阻挡层等。本领域普通技术人员可容易地进行形成这些层的工艺。
本发明的再一个方面涉及包含复合板的显示器基板。显示器基板可用作用于显示器和其它光学装置,例如液晶显示装置(LCD)、彩色滤光器、有机EL显示装置、太阳能电池、触屏面板等的基板。
现在,将参照一些实施例更详细地说明本发明。然而,应注意的是提供这些实施例仅用于说明,而不应以任何方式解释为限制本发明。
为了清楚,将省略对本领域普通技术人员显而易见的说明。
实施例
实施例1
四甲基环四硅氧烷和线性乙烯基末端的聚硅氧烷DMS-V03(MW500,DP5,Gelest有限公司)以2∶1的摩尔当量比共混,并用旋涡混合器充分地混合。在用D-玻璃类玻璃纤维(Nittobo有限公司产品3313)浸渍所述混合物后,浸渍的玻璃纤维放置在一离型的玻璃基板上,并放置于室温24小时,直至粘度增加。然后,用另一离型的玻璃基板覆盖浸渍的玻璃纤维的上表面,用层压机从玻璃纤维去除剩余的树脂,然后在100℃的烘箱中热固化4小时,从而生产透明的硅树脂复合板。
实施例2
除了DMS-05(MW800,DP9,Gelest有限公司)代替DMS-V03用作乙烯基末端的聚有机硅氧烷之外,以与实施例1相同的方式制备硅树脂复合板。
实施例3
除了DMS-21(MW6000,DP65,Gelest有限公司)代替DMS-V03用作乙烯基末端的聚有机硅氧烷之外,以与实施例1相同的方式制备硅树脂复合板。
对比例1
在以1∶10的重量比共混Dow Corning公司制造的聚有机硅氧烷Sylgard184的A部分和B部分之后,用旋涡混合器充分地混合所述混合物。在用E-玻璃类玻璃纤维(产品名称3313,Nittobo有限公司)浸渍混合物后,浸渍的玻璃纤维放置在两个离型的玻璃基板之间。然后,用层压机从玻璃纤维去除剩余的树脂,然后在100℃的烘箱中热固化4小时,从而生产透明的硅树脂复合板。
对比例2
除了四乙烯基四甲基环四硅氧烷用作乙烯基末端的聚有机硅氧烷之外,以与实施例1相同的方式制备硅树脂复合板。
评价实施例和对比例中制备的复合板的如下性质,结果显示于表1中。
性质评价
热稳定性:在装50mg的样品到热重分析检测仪TGA/DSC1(Mettler Toledo有限公司)后,通过在氮气气氛中以5℃/分钟的温度上升速率从25℃加热样品至350℃而测量样品的重量损失。测量样品的初始重量和样品在250℃、300℃和350℃的每个重量,根据等式1计算样品的重量变化(:△W)
[等式1]
ΔW = Wa Wb × 100 % ,
其中,Wa为在氮气气氛中以5℃/分钟的温度上升速率从25℃加热50mg的样品至350℃后,通过热重分析仪TGA/DSC1测量的样品重量,并且Wb为所述样品在25℃的初始重量。
(2)弛豫模量:在室温用Triboindentor(Hysitron公司)以100μN的力控制模式测量弛豫模量(单位:MPa)。
(3)透射率(%):在550nm的波长处用紫外-可见分光光度计V-550(JASCOInstrument)测量透射率。
(4)抗弯强度(mm):将切割成1cm的宽度的复合板缠绕在具有0.5mm至10mm的直径的SUSS圆筒上,并根据ASTM D522施加1kg的力到复合板一分钟之后,通过用显微镜观察对复合板的损坏来测量抗弯强度。
(5)CTE(ppm/K):在以5℃/分钟的温度上升速率从10℃加热样品至300℃的同时,用热机械分析仪模型Q400(TA Instruments有限公司)以拉伸模式测量CTE。
表1
Figure BDA00003338934000081
如表1所示,可看到实施例1~3中制备的复合板呈现在热稳定性、透射率、抗弯强度和热膨胀系数方面的突出的性质。相反,可看到对比例1的复合板与实施例1~3的复合板相比在热稳定性、透射率和抗弯强度方面具有不足的性质。此外,可看到,对比例2中制备的复合板具有良好的热稳定性,但是与实施例1~3的复合板相比,呈现在透射率、抗弯强度和热膨胀系数上的不足的性质。特别地,可看到对比例2中制备的复合板具有高的热膨胀系数,因而不适于用作显示器基板。
虽然已经说明了一些实施方式,但对本领域普通技术人员显然的是,这些实施方式仅以说明的方式提出,并能进行各种修改、变更、替换和等效实施方式而不背离本发明的精神和范围。本发明的范围应仅由所附权利要求书及其等同方式限定。

Claims (14)

1.一种复合板,包括:基质和浸渍在所述基质中的增强材料,所述复合板在100μN的负荷下具有1000MPa或更小的弛豫模量,并在350℃具有98%或更高的根据等式1的重量变化△W:
[等式1]
ΔW = Wa Wb × 100 % ,
其中,Wa为在氮气气氛中以5℃/分钟的温度上升速率从25℃加热50mg的样品至350℃后,通过热重分析法测量的样品重量,并且Wb为所述样品在25℃的初始重量。
2.根据权利要求1所述的复合板,其中,所述基质包括含环状硅氧烷的硅树脂。
3.根据权利要求1所述的复合板,其中,所述基质包括环状硅氧烷和含线性末端乙烯基的聚硅氧烷的反应产物。
4.根据权利要求2或3所述的复合板,其中,所述环状硅氧烷包括由化学通式1表示的化合物:
[化学通式1]
Figure FDA00003338933900012
其中,R1、R2和R3各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;n和m各自为0~6的整数;并且n+m为3~6的整数。
5.根据权利要求3所述的复合板,其中,所述含线性末端乙烯基的聚硅氧烷包括由化学通式2表示的化合物:
[化学通式2]
Figure FDA00003338933900013
其中,R1和R2各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;p为1~20的整数;并且q为0~20的整数。
6.根据权利要求3所述的复合板,其中,所述环状硅氧烷和所述含线性末端乙烯基的聚硅氧烷以0.5∶1至2.5∶1的摩尔当量比存在。
7.根据权利要求1所述的复合板,在550nm的波长处具有90%或更大的透射率。
8.根据权利要求1所述的复合板,具有根据ASTM D522的小于5mm的抗弯强度及小于10ppm/K的热膨胀系数。
9.根据权利要求1所述的复合板,其中,所述增强材料包括玻璃纤维织物、玻璃布、无纺玻璃布和玻璃网状物中的至少一种。
10.一种制备复合板的方法,包括:
制备包括环状硅氧烷和含线性末端乙烯基的聚硅氧烷的基质组合物;和
用增强材料浸渍所述基质组合物,然后固化。
11.根据权利要求10所述的方法,其中,所述环状硅氧烷包括由化学通式1表示的化合物:
[化学通式1]
Figure FDA00003338933900021
其中,R1、R2和R3各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;n和m各自为0~6的整数;并且n+m为3~6的整数。
12.根据权利要求10所述的方法,其中,所述含线性末端乙烯基的聚硅氧烷包括由化学通式2表示的化合物:
[化学通式2]
Figure FDA00003338933900022
其中,R1和R2各自独立地为氢、取代或未取代的C1~C5烷基、或取代或未取代的C6~C12芳基;p为1~20的整数;并且q为0~20的整数。
13.根据权利要求10所述的方法,其中,所述环状硅氧烷和所述含线性末端乙烯基的聚硅氧烷以0.5∶1至2.5∶1的摩尔当量比存在。
14.一种显示器基板,包括权利要求1至9任一所述的复合板或由权利要求10至13任一所述的方法制备的复合板。
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