CN103471066A - Sealing process for LED (Light Emitting Diode) module - Google Patents
Sealing process for LED (Light Emitting Diode) module Download PDFInfo
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- CN103471066A CN103471066A CN2012101881591A CN201210188159A CN103471066A CN 103471066 A CN103471066 A CN 103471066A CN 2012101881591 A CN2012101881591 A CN 2012101881591A CN 201210188159 A CN201210188159 A CN 201210188159A CN 103471066 A CN103471066 A CN 103471066A
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Abstract
The invention provides a sealing process for an LED (Light Emitting Diode) module. The sealing process comprises the following steps that (1) a waterproof wire penetrates through a wire through hole of a heat radiation frame to be connected with a positive-negative welding point on a PCB (Printed Circuit Board); penetrating positions of the positive-negative welding point and the waterproof wire are subjected to glue sealing treatment; the waterproof wire and the wire through hole are subjected to sealed waterproof operation; (2) the PCB is fixedly arranged on the heat radiation frame; (3) a solid silica gel ring is placed at the periphery of a lens set; (4) liquid silica gel is coated along the periphery of the lens set and the amount of the liquid silica gel is limited by completely sticking the solid silica gel ring; (5) the heat radiation frame provided with the PCB and the waterproof wire is inversely buckled on the lens set which is treated by the step (4) and is provided with the solid silica gel ring and the liquid silica gel so as to fix the whole body of a heat radiator and the lens set. At least two waterproof sealing rings are used for completely isolating an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB, and the sealing rings are firmer when being compared with thin film sealing; the service life is longer and the guarantees to the sealing performance between the lens set and the heat radiation frame are realized.
Description
Technical field
The present invention relates to the LED lighting device, relate in particular to a kind of sealing technology for this LED module.
Background technology
Under the main trend of current high praise energy-conserving and environment-protective, LED is with its energy-conserving and environment-protective, long service life, the characteristics such as start-up time is short, safety and stability is good, obtain applying more and more widely, the lighting device of other light sources is replaced by the LED lighting device gradually at present.
In the LED use procedure, usually can be because steam or other pernicious gases infiltrate substrate, thereby or burning cause product to be out of order.When product is used for outdoor lighting, its sealing and water proofing property be a problem that needs are considered especially.
Traditional LED product waterproof construction adopts the box encapsulation with fastened by screw, and product is thick and heavy, larger on the heat radiation impact.A kind of waterproof sealing structure and preparation technology thereof of LED module are disclosed in the patent that is 200910054820.8 at application number, the waterproof sealing structure of its LED module comprises the LED element, substrate, electrode, wiring board, LED module integral surface coats one deck PARYLENE film, film thickness is 3～25 Μ M, this film is even, fine and close, transparent, without any hole and fully deposited shape, protection LED module is not subject to water, moisture, the erosion of air etc., do not affect the heat radiation of LED element, this PARYLENE film is PARYLENE N, PARYLENE C, PARYLENE D, a kind of in PARYLENE VT4.
Above-mentioned patent adopts the mode at LED module integral surface coating one deck parylene film to realize sealing and waterproof.Its weak point is: film easily scratches, damages, and service life is short; Will be at the complete overlay film in whole lamp surface, technology difficulty is higher, and cost is higher.
Summary of the invention
The object of the present invention is to provide a kind of sealing technology of LED module, to solve, the sealing cost is high, the technical problem of poor effect.
A kind of sealing technology of LED module comprises:
(1) water-proof wire is connected with the positive and negative solder joint on pcb board through the heat radiation rack cable-through hole, and described positive and negative solder joint and water-proof wire carry out the sealing processing through position, and carry out the water-tight operation between water-proof wire and cable-through hole;
(2) pcb board is fixed on heat radiation rack;
(3) will be at least with the set of lenses of inside and outside two circle grooves, be fixed in the stationary fixture of adhesive supplier, a sealing ring will be placed in one of them of two circle grooves inside and outside set of lenses;
(4) stamp uniformly a ring layer liquid silica gel along an other groove of this set of lenses, the liquid silica gel amount is lived the solid silicone sealing ring with complete adhesion and is limited;
(5) heat radiation rack that pcb board and water-proof wire are housed that will process through step (2) tips upside down on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step (4), and radiator integral and set of lenses are fixed;
(6), by standing 2 hours at normal temperatures of the LED module assembled, liquid silica gel is solidified.
Preferably, carrying out the water-tight operation between water-proof wire and cable-through hole further comprises:
Put successively two-way wedge sealing ring, external screw thread nut on water-proof wire, then pass the cable-through hole of heat radiation rack, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, by the cable-through hole of external screw thread nut precession radiator, make it compress the opposite side of two-way wedge-type seal circle.
Preferably, the external screw thread nut is hollow structure, water-proof wire and sealing ring Ke Cong center are passed, helicitic texture is arranged on through-hole wall, with the external screw thread nut, coordinated, a side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, and when opposite side wedge part is screwed by the external screw thread nut, extruding installs, the deformation that described through hole, sealing ring, water-proof wire external screw thread nut are caused when in said process, sealing ring is squeezed fits tightly, to reach waterproof effect.
Preferably, the position sealing of passing at the positive and negative solder joint of pcb board and heat radiation rack water-proof wire with the two-component insulating fluid sealant, solidify and process at normal temperatures after sealing.
Preferably, radiator integral and set of lenses are fixed further and comprise:
Radiator integral is pressed in the back-off structure of set of lenses, and make solid silicon cushion rubber and liquid silica gel carry out deformation, the scioptics group back-off structure of a week is so that heat radiation rack and closing of set of lenses are fixedly connected with, and reaches protection by the deformation of solid silicon cushion rubber and liquid silica gel.
Preferably, this process also comprises: the described heat radiation rack that plays lamp bracket and radiator double effects can be cut into by section bar, and heat radiation rack can be selected difform section bar.
A kind of sealing technology of LED module is characterized in that: comprising:
(1) water-proof wire is connected with the positive and negative solder joint on pcb board through the heat radiation rack cable-through hole, and described positive and negative solder joint and water-proof wire carry out the sealing processing through position, and carry out the water-tight operation between water-proof wire and cable-through hole;
(2) pcb board is fixed on heat radiation rack;
(3) set of lenses is fixed in the stationary fixture of adhesive supplier, a sealing ring is placed on to set of lenses;
(4) stamp uniformly a ring layer liquid silica gel along this set of lenses periphery, the liquid silica gel amount is lived the solid silicone sealing ring with complete adhesion and is limited;
(5) heat radiation rack that pcb board and water-proof wire are housed that will process through step (2) tips upside down on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step (4), and radiator integral and set of lenses are fixed;
(6), by standing 2 hours at normal temperatures of the LED module assembled, liquid silica gel is solidified.
The periphery of set of lenses is not provided with groove; In step (3) and step (4), sealing ring and liquid silica gel are set up in parallel on periphery respectively.
The periphery of set of lenses only arranges a groove, and one of them of the middle sealing ring of step (3) and step (4) and liquid silica gel is arranged on this groove, and another one was arranged on the interior week or periphery of this groove.
Preferably, carrying out the water-tight operation between water-proof wire and cable-through hole further comprises:
Put successively two-way wedge sealing ring, external screw thread nut on water-proof wire, then pass the cable-through hole of heat radiation rack, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, by the cable-through hole of external screw thread nut precession radiator, make it compress the opposite side of two-way wedge-type seal circle.
Preferably, the external screw thread nut is hollow structure, water-proof wire and sealing ring Ke Cong center are passed, helicitic texture is arranged on through-hole wall, with the external screw thread nut, coordinated, a side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, and when opposite side wedge part is screwed by the external screw thread nut, extruding installs, the deformation that described through hole, sealing ring, water-proof wire external screw thread nut are caused when in said process, sealing ring is squeezed fits tightly, to reach waterproof effect.
A kind of sealing technology of LED lighting device, the LED lighting device comprises the heat radiation rack that comprises varying number lamp bracket unit, the corresponding pcb board in each lamp bracket unit, a set of lenses form a LED module, and each LED module adopts the described sealing technology of claim 1 to carry out seal operation.
Compared with prior art, the present invention has the following advantages:
At first, with at least double silicon rubber loop, LED chip is thoroughly completely cut off with extraneous, stop all steam or other pernicious gases and corrode chip and pcb board, and firmer with respect to diaphragm seal, life-span is longer, with respect to sealant pouring and sealing, can reduce glue use amount and product weight.By playing adhesive process, particular design and the sealed solid circle of set of lenses in addition, realize the guarantee of the sealing property between set of lenses and heat radiation rack.
By sealing ring and the nut of two-way wedge, in addition pcb board, water-proof wire junction coating technique arrange, and realize that heat radiation rack goes out the guarantee of water-proof wire through hole sealing property.
The design of the back-off structure of set of lenses, in addition the double protection effect of solid silicon cushion rubber and liquid silica gel, reach good sealing effectiveness between set of lenses and heat radiation rack.Due to the back-off structure on set of lenses, make solid silicon cushion rubber and liquid silica gel can produce identical deformation quantity on whole circle position, the each several part pressurized is consistent, so can guarantee that module reaches whole unified on closure, not there will be the defect at indivedual positions.
According to different demands, can select difform heat radiation rack, and described heat radiation rack can comprise the lamp bracket unit of varying number to meet the demand of different capacity, each lamp bracket unit is a corresponding pcb board, set of lenses and sealing silica gel separately, when heat radiation rack comprises a plurality of lamp brackets unit, the large-area sealing of whole lamp just is decomposed into the sealing of a plurality of lamp brackets unit, by improving the sealing of lamp bracket unit, can improve the sealing of whole lamp.And, because lamp bracket unit sealing ring girth is less than whole lamp, more easily improve sealing property.
Just can reach good sealing effectiveness by simple technique, with low cost, life-span is long, product nothing itself is damaged, production efficiency is high: whole product sealing technology can reduce costs, simultaneously can reach good sealing effectiveness, realize waterproof, protection against the tide, anticorrosion, anti-oxidation, be beneficial to the prolongation in LED illuminating product service life and the raising of security.
The product of making by this sealing technology can be by harsh experimental verification, except common test under water, can also pass through the boiling red ink test to boil water of 100 ℃, in double protection, often all to experience together the test of the test to boil water more than 30 minutes, after having boiled, put into immediately the cold water of room temperature, with quenching, examine its waterproof ability.Double protection will be experienced the above to boil water and quenching test of 6 circulations in 3 hours together.
The accompanying drawing explanation
The embodiment explosive view that Fig. 1 is the LED module;
Fig. 2 is wire hole structure cross-sectional schematic;
Fig. 3 is a glue schematic diagram;
The embodiment explosive view that Fig. 4 is the LED lighting device;
The structural representation of a kind of embodiment that Fig. 5 is the LED heat radiation rack;
The structural representation of the sealing technology that Fig. 6 is a kind of LED lighting device.
The specific embodiment
embodiment 1
Refer to Fig. 1 to Fig. 3, the technical scheme that a kind of LED sealing technology adopts is: a kind of LED lighting device, comprise heat radiation rack 11, pcb board 12, LED chip, sealing silica gel and set of lenses 13, LED chip is welded on pcb board 12, pcb board 12 and heat radiation rack 11 laminatings, set of lenses 13 is arranged on the LED chip top.
Heat radiation rack can comprise a lamp bracket unit or a plurality of lamp brackets unit, and each lamp bracket unit is a corresponding pcb board 12, set of lenses 13 and a sealing silica gel separately.Below to take single lamp bracket unit be example:
It is step-like through hole 21 that heat radiation rack 11 is provided with cross section, and the water-proof wire 22 of pcb board 12 passes from through hole 21, in through hole 21 and the gap of water-proof wire 22, sealing ring 31 is installed.The sealing ring that sealing ring 31 is two-way wedge, one side wedge partly is arranged in the gap of through hole 21 and water-proof wire 22, fixedly mount downwards by nut 32 between opposite side wedge part and through-hole wall, 22 of described through hole 21 and water-proof wires are fitted by sealing ring 31.
Be provided with pcb board 12 on described heat radiation rack 11,11 one-tenth face contacts of pcb board 12 and heat radiation rack are connected, and are screwed, and the heat produced on pcb board 12 can conduct and scatter rapidly by heat radiation rack 11.
Described pcb board 12 is provided with LED light source, and LED light source can be the LED light source of belt supporting frame, can be also the LED light source of belt supporting frame not, directly overlays on pcb board 12.
Described sealing silica gel comprises the solid silicon cushion rubber 14 be arranged on set of lenses 13, and the gel silica gel ring 15 that is coated in the liquid silica gel formation of solid silicon cushion rubber 14 sides.On the position of the lens plane that described solid silicon cushion rubber 14 sides are corresponding, have groove, for coating liquid silica gel.
Described set of lenses has several lens on 13 planes, the corresponding LED light source of each lens.
Set of lenses is designed with back-off structure 18 in 13 1 weeks, by back-off structure 18, the heat radiation rack 11 that pcb board 12 is installed is tipped upside down on to formation on the set of lenses 13 that is provided with silica gel ring 14 and liquid silica gel 15 and closes fixing.
Its principle technique can be:
(1) water-proof wire is connected with the positive and negative solder joint on pcb board through the heat radiation rack cable-through hole, and described positive and negative solder joint and water-proof wire carry out the sealing processing through position, and carry out the water-tight operation between water-proof wire and cable-through hole;
(2) pcb board is fixed on heat radiation rack;
(3) will be fixed in the stationary fixture of adhesive supplier with the set of lenses of inside and outside two circle grooves, a sealing ring is placed in set of lenses inner ring groove;
(4) stamp uniformly a ring layer liquid silica gel along the outer ring groove of this set of lenses, the liquid silica gel amount is lived the solid silicone sealing ring with complete adhesion and is limited;
(5) will accomplish fluently that the set of lenses of glue is standing solidifies 2 hours at normal temperatures;
(6) heat radiation rack that pcb board and water-proof wire are housed that will process through step (2) tips upside down on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step (5), and radiator integral and set of lenses are fixed.With at least double silicon rubber loop, LED chip is thoroughly completely cut off with extraneous, stop all steam or other pernicious gases and corrode chip and pcb board, and firmer with respect to diaphragm seal, the life-span is longer, with respect to sealant pouring and sealing, can reduce glue use amount and product weight.
Application examples
The concrete technology flow process is as follows:
1, put successively two-way wedge sealing ring, external screw thread nut on water-proof wire, then pass the cable-through hole of heat radiation rack, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, by the cable-through hole of external screw thread nut precession radiator, make it compress the opposite side of two-way wedge-type seal circle.
The external screw thread nut is hollow structure, and water-proof wire and sealing ring Ke Cong center are passed.Helicitic texture is arranged on through-hole wall, coordinated with the external screw thread nut.One side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, when opposite side wedge part is screwed by the external screw thread nut, extruding installs, the deformation that described through hole, sealing ring, water-proof wire external screw thread nut are caused when in said process, sealing ring is squeezed fits tightly, and reaches waterproof effect.
2, water-proof wire through after the heat radiation rack cable-through hole with after positive and negative solder joint on pcb board is connected, the position sealing 33 of passing at the positive and negative solder joint of pcb board and heat radiation rack water-proof wire with the two-component insulating fluid sealant, after sealing curing 1 hour at normal temperatures.Further strengthen the sealing effectiveness of water-proof wire in through hole.Two-component insulating glue is herein selected tough epoxy colloid system, and binding metal has splendid shock-resistant and chemical resistance performance.
3, by secure component, by pcb board, the mode with the face laminating is fixed on heat radiation rack.
4, will be fixed in the stationary fixture of adhesive supplier 16 with the set of lenses of inside and outside two circle grooves, a sizeable solid silicon cushion rubber 14 is placed in set of lenses inner ring groove.
5, set desktop machine people and point gum machine by glue rifle 19, along outer ring groove on set of lenses, make a call to equably a circle liquid silica gel.The liquid silica gel amount is lived the solid silicon cushion rubber with adhesion fully and is as the criterion, and under normal temperature, solidifies 2 hours.Liquid glue is selected silica gel, and silica gel has splendid viscosity, shock-resistant and uvioresistant performance to metal and PC material.
6, will, through the heat radiation rack back-off 18 that pcb board and water-proof wire are housed of step 2 on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step 3, radiator integral be pressed in the back-off structure of set of lenses.The scioptics group back-off structure of a week, realize that heat radiation rack and closing of set of lenses are fixedly connected with, and reach the effect of double protection by the deformation of solid silicon cushion rubber and liquid silica gel.
Embodiment 2
Embodiment 2 is roughly the same with embodiment 1 processing step, and difference is: the solid silicon cushion rubber is arranged in the outer ring groove of set of lenses, then makes a call to equably a circle liquid silica gel along the inner ring groove of set of lenses.Other processing steps are identical with embodiment 1, repeat no more.
Embodiment 3
The periphery of set of lenses only arranges a groove, and one of them of sealing ring and liquid silica gel is arranged on this groove, and another one was arranged on the interior week or periphery of this groove.
Embodiment 4
The periphery of set of lenses is not provided with groove; Sealing ring and liquid silica gel are set up in parallel on periphery respectively.
Application examples:
As shown in Figure 4,5, a kind of sealing technology of LED lighting device, the LED lighting device comprises the heat radiation rack 11 that comprises varying number lamp bracket unit, lamp bracket unit on heat radiation rack 11 can be as shown in Figure 4 transversely arranged, it can be also the longitudinal arrangement as Fig. 5, the corresponding pcb board in each lamp bracket unit, a set of lenses form a LED module, and each LED module adopts a kind of seal operation of carrying out in above-mentioned two kinds of sealing technologies.Also be provided with power supply compartment 42 and mounting bracket 41 for external driving power is installed on described heat radiation rack, lighting device rotates by mounting bracket and is fixing.
As shown in Figure 6, a kind of sealing technology of LED lighting device, the LED lighting device comprises lamp bracket 11', set of lenses 13, pcb board 12 and power pack 51, adopt lamp bracket 11' alternative heat spreader frame 11, lamp bracket 11', pcb board 12 and set of lenses 13 form a LED module, a kind of seal operation of carrying out in the above-mentioned two kinds of sealing technologies of the employing of LED module.Lamp bracket is connected in described power pack 51 by lamp bracket connector 52, and driving power 53 is arranged in power pack 51.One storage tank 54 is set on described lamp bracket, and storage tank 54 bottoms are provided with the groove matched with the back-off of set of lenses, and the back-off of set of lenses can be pressed in this groove.Set of lenses 13 is fixed in storage tank 54 together with pcb board 12, and the one side of described pcb board is provided with LED light source, and the bottom surface face of its another side and described lamp bracket storage tank 54 is fitted and connected and is dispelled the heat, and described lamp bracket adopts the good aluminium sheet of heat-conducting effect to make.
Above disclosed be only several specific embodiments of the application, but the application is not limited thereto, the changes that any person skilled in the art can think of, all should drop in the application's protection domain.
Claims (12)
1. the sealing technology of a LED module is characterized in that: comprising:
(1) water-proof wire is connected with the positive and negative solder joint on pcb board through the heat radiation rack cable-through hole, and described positive and negative solder joint and water-proof wire carry out the sealing processing through position, and carry out the water-tight operation between water-proof wire and cable-through hole;
(2) pcb board is fixed on heat radiation rack;
(3) will at least with inside and outside two set of lenses of enclosing grooves, be fixed in the stationary fixture of adhesive supplier, a sealing ring will be placed in a wherein groove of set of lenses Internal and external cycle groove;
(4) stamp uniformly a circle liquid silica gel on an other groove of this set of lenses, the liquid silica gel amount is lived the solid silicone sealing ring with complete adhesion and is limited;
(5) heat radiation rack that pcb board and water-proof wire are housed that will process through step (2) tips upside down on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step (4), and radiator integral and set of lenses are fixed;
(6) the LED module assembled is standing, liquid silica gel is solidified.
2. the sealing technology of a kind of LED module as claimed in claim 1, is characterized in that, carries out the water-tight operation between water-proof wire and cable-through hole and further comprise:
Put successively two-way wedge sealing ring, external screw thread nut on water-proof wire, then pass the cable-through hole of heat radiation rack, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, by the cable-through hole of external screw thread nut precession radiator, make it compress the opposite side of two-way wedge-type seal circle.
3. the sealing technology of a kind of LED module as claimed in claim 2, it is characterized in that, the external screw thread nut is hollow structure, water-proof wire and sealing ring Ke Cong center are passed, helicitic texture is arranged on through-hole wall, with the external screw thread nut, coordinated, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, when opposite side wedge part is screwed by the external screw thread nut, extruding installs, the deformation that described through hole, sealing ring, water-proof wire external screw thread nut are caused when in said process, sealing ring is squeezed fits tightly, to reach waterproof effect.
4. the sealing technology of a kind of LED module as claimed in claim 1 or 2, is characterized in that, the position sealing of passing at the positive and negative solder joint of pcb board and heat radiation rack water-proof wire with the two-component insulating fluid sealant is solidified and processed at normal temperatures after sealing.
5. the sealing technology of a kind of LED module as claimed in claim 1, is characterized in that, radiator integral and set of lenses are fixed further and comprise:
Radiator integral is pressed in the back-off structure of set of lenses, and make solid silicon cushion rubber and liquid silica gel carry out deformation, the scioptics group back-off structure of a week is so that heat radiation rack and closing of set of lenses are fixedly connected with, and reaches protection by the deformation of solid silicon cushion rubber and liquid silica gel.
6. the sealing technology of a kind of LED module as claimed in claim 1, is characterized in that, also comprises:
The described heat radiation rack that plays lamp bracket and radiator double effects can be cut into by section bar, and heat radiation rack can be selected difform section bar.
7. the sealing technology of a LED module is characterized in that: comprising:
(1) water-proof wire is connected with the positive and negative solder joint on pcb board through the heat radiation rack cable-through hole, and described positive and negative solder joint and water-proof wire carry out the sealing processing through position, and carry out the water-tight operation between water-proof wire and cable-through hole;
(2) pcb board is fixed on heat radiation rack;
(3) set of lenses is fixed in the stationary fixture of adhesive supplier, a sealing ring is placed on the set of lenses periphery;
(4) stamp a circle liquid silica gel along this set of lenses periphery, the liquid silica gel amount is lived the solid silicone sealing ring with complete adhesion and is limited;
(5) heat radiation rack that pcb board and water-proof wire are housed that will process through step (2) tips upside down on the set of lenses that is provided with solid silicon cushion rubber and liquid silica gel of processing through step (4), and radiator integral and set of lenses are fixed;
(6) the LED module assembled is standing, liquid silica gel is solidified.
8. the sealing technology of a kind of LED module as claimed in claim 7 is characterized in that: also comprise:
The periphery of set of lenses is not provided with groove;
In step (3) and step (4), sealing ring and liquid silica gel are set up in parallel on periphery respectively.
9. the sealing technology of a kind of LED module as claimed in claim 7 is characterized in that: also comprise:
The periphery of set of lenses only arranges a groove;
One of them of the middle sealing ring of step (3) and step (4) and liquid silica gel is arranged on this groove, and another one was arranged on the interior week or periphery of this groove.
10. the sealing technology of a kind of LED module as claimed in claim 7, is characterized in that, carries out the water-tight operation between water-proof wire and cable-through hole and further comprise:
Put successively two-way wedge sealing ring, external screw thread nut on water-proof wire, then pass the cable-through hole of heat radiation rack, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, by the cable-through hole of external screw thread nut precession radiator, make it compress the opposite side of two-way wedge-type seal circle.
11. the sealing technology of a kind of LED module as claimed in claim 10, it is characterized in that, the external screw thread nut is hollow structure, water-proof wire and sealing ring Ke Cong center are passed, helicitic texture is arranged on through-hole wall, with the external screw thread nut, coordinated, one side wedge of two-way wedge-type seal circle partly is arranged in the gap of through hole and water-proof wire, when opposite side wedge part is screwed by the external screw thread nut, extruding installs, make described through hole, sealing ring, the deformation that water-proof wire external screw thread nut causes when in said process, sealing ring is squeezed fits tightly, to reach waterproof effect.
12. the sealing technology of a LED lighting device, the LED lighting device comprises the heat radiation rack that comprises varying number lamp bracket unit, the corresponding pcb board in each lamp bracket unit, a set of lenses form a LED module, and each LED module adopts the described sealing technology of claim 1 or 7 to carry out seal operation.
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210188159.1A CN103471066B (en) | 2012-06-08 | 2012-06-08 | A kind of sealing technology of LED module |
| PL13800354T PL2863119T3 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
| TR2018/07698T TR201807698T4 (en) | 2012-06-08 | 2013-06-07 | LED MODULE SEALING TECHNOLOGY. |
| ES13800354.6T ES2663994T3 (en) | 2012-06-08 | 2013-06-07 | LED module sealing technology |
| KR1020147026960A KR101820391B1 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
| BR112014028070-3A BR112014028070B1 (en) | 2012-06-08 | 2013-06-07 | sealing process for led module and sealing process of a led lighting device |
| EP13800354.6A EP2863119B1 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
| JP2015513012A JP5953428B2 (en) | 2012-06-08 | 2013-06-07 | LED module sealing method |
| PCT/CN2013/076937 WO2013182077A1 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
| HUE13800354A HUE037199T2 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
| AU2013271129A AU2013271129B2 (en) | 2012-06-08 | 2013-06-07 | An LED module sealing technology |
| US14/403,108 US9788444B2 (en) | 2012-06-08 | 2013-06-07 | LED module sealing technology |
| ZA2014/07956A ZA201407956B (en) | 2012-06-08 | 2014-10-31 | An led module sealing technology |
| US15/695,709 US10243341B2 (en) | 2012-06-08 | 2017-09-05 | LED module sealing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210188159.1A CN103471066B (en) | 2012-06-08 | 2012-06-08 | A kind of sealing technology of LED module |
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| Publication Number | Publication Date |
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| CN103471066A true CN103471066A (en) | 2013-12-25 |
| CN103471066B CN103471066B (en) | 2015-12-02 |
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| CN201210188159.1A Active CN103471066B (en) | 2012-06-08 | 2012-06-08 | A kind of sealing technology of LED module |
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| CN (1) | CN103471066B (en) |
| BR (1) | BR112014028070B1 (en) |
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| CN104296025A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with protective packaging |
| CN104296026A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with gold bump soldering |
| CN115296139A (en) * | 2022-10-11 | 2022-11-04 | 昆山三智达自动化设备科技有限公司 | COS (chip operating System) assembling method and equipment based on modular base |
| WO2024092958A1 (en) * | 2022-10-31 | 2024-05-10 | 何季岭 | Waterproof festival lamp |
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| BR202022001001U2 (en) * | 2022-01-19 | 2022-09-06 | Stella Imp E Exportacao De Luminarias Ltda | CONSTRUCTIVE LAYOUT IN CONNECTOR FOR EXTERNAL LIGHTING PRODUCTS |
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| CN202118617U (en) * | 2011-06-17 | 2012-01-18 | 杭州华普永明光电股份有限公司 | LED (light-emitting diode) lighting device |
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| KR100657590B1 (en) * | 2006-09-19 | 2006-12-14 | 주식회사 누리플랜 | Line type led lighting of capsule style |
| CN101769457A (en) * | 2009-12-25 | 2010-07-07 | 大连好利维尔科技发展有限公司 | Production method of high-power LED illuminating lamp and lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104296025A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with protective packaging |
| CN104296026A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with gold bump soldering |
| CN115296139A (en) * | 2022-10-11 | 2022-11-04 | 昆山三智达自动化设备科技有限公司 | COS (chip operating System) assembling method and equipment based on modular base |
| WO2024092958A1 (en) * | 2022-10-31 | 2024-05-10 | 何季岭 | Waterproof festival lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014028070A8 (en) | 2019-08-06 |
| BR112014028070A2 (en) | 2017-08-08 |
| BR112014028070B1 (en) | 2020-11-17 |
| CN103471066B (en) | 2015-12-02 |
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