CN103457568A - Oscillator with full-ceramic-packaged resonator as outer cover and manufacturing method of oscillator - Google Patents
Oscillator with full-ceramic-packaged resonator as outer cover and manufacturing method of oscillator Download PDFInfo
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- CN103457568A CN103457568A CN2013103440244A CN201310344024A CN103457568A CN 103457568 A CN103457568 A CN 103457568A CN 2013103440244 A CN2013103440244 A CN 2013103440244A CN 201310344024 A CN201310344024 A CN 201310344024A CN 103457568 A CN103457568 A CN 103457568A
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Abstract
The invention discloses an oscillator with a full-ceramic-packaged resonator as an outer cover and a manufacturing method of the oscillator. The oscillator comprises an integrated circuit and a base. The base is a PCB base. The resonator is the full-ceramic-packaged resonator of which a base is provided with a concave portion and the surface is pasted with quartz crystals, and the resonator can serve as the outer cover of the oscillator. According to the oscillator, by using the full-ceramic-packaged resonator as the outer cover of the oscillator, production of the existing resonator can be effectively utilized, application of high-cost equipment and control technologies is avoided, and the oscillator with the surface pasted with the quartz crystals is simple in structure, low in cost, effective and durable.
Description
Technical field
The present invention relates to quartz oscillator and manufacture method thereof.Specifically, the invention relates to quartz crystal oscillator pasted on surface and the manufacture method thereof of full ceramic device resonator as enclosing cover.
Background technology
Quartz oscillator, due to accuracy and the stability of its frequency, is an indispensable part in the hyundai electronics industry as communication, computer, amusement equipment and other our related field.Up to the present, quartz oscillator is normally added corresponding oscillating circuit by the piezoelectric quartz crystal resonator, with an encapsulant that can be sealed someway by use, form, direct voltage can act on by hermetically sealed lead-in wire on quartz oscillator and produce vibration.
Generally, quartz crystal oscillator pasted on surface is comprised of a piezoelectric quartz crystal resonator, corresponding oscillating circuit, base of ceramic and metal enclosing cover.In order to reach hermetic operational environment, the pressure welding encapsulation process of this class base of ceramic and metal enclosing cover need to be used special equipment, and the special sealed in unit of this class is mainly controlled by Japanese equipment vendors, and special equipment requirement has also increased the production cost of this type of oscillator.
The base of ceramic of stacked structure be in integrated application overdo deposition technique, metal mixed technology and the manufacture of ceramet involution technology of metal form.This type of base of ceramic needs high-tech and special high-temp and high-strength equipment to be produced, and production cost is higher relatively, and all the time all more in short supply in supply side.Strictly, this class pedestal is controlled by three Japanese firm's monopolizations in the world at present, has increased the risk of material supply.Usually the precision of the output frequency of oscillator is decided by the precision of resonator used, and the precision of this quasi resonant oscillator needs to carry out once before capping or repeatedly accurate frequency adjustment.The accurate adjustment of this quefrency can increase the production cost of this quasi resonant oscillator undoubtedly.Comprehensive, as to use the base of ceramic of the stacked structure of Japan's monopolization to produce oscillator, wherein come from the base of ceramic of stacked structure itself and additional equipment cost and process costs more than 50 percent cost.
In the case, can provide simple structure, low-cost production, effectively durable quartz crystal oscillator pasted on surface has its obvious advantage and advantage.
Summary of the invention
For above-mentioned problem, the present invention proposes quartz crystal oscillator pasted on surface and the manufacture method thereof of full ceramic device resonator as enclosing cover, this oscillator and manufacture method have been broken away from the expensive pedestal and the special installation that use Japan to control, make product of the present invention and technological process simple and clear, be applicable to low cost fabrication.
Another object of the present invention is to provide the manufacture method of a kind of full ceramic device resonator as the quartz crystal oscillator pasted on surface of enclosing cover, it is little that the vibrator structure that this oscillator manufacture method is produced simply, highly hangs down volume, has durability, validity.
Be to provide the quartz crystal oscillator pasted on surface of a kind of full ceramic device resonator as enclosing cover another order of the present invention, this vibrator is easy to implement, easy to make, and cost of manufacture is cheap, can substitute the base of ceramic quartz oscillator of existing stacked structure.
Based on this, the present invention realizes like this.
A kind of full ceramic device resonator is as the quartz crystal oscillator pasted on surface of enclosing cover, described oscillator includes resonator, integrated circuit (hereinafter to be referred as the IC silicon chip), pedestal for oscillator, it is characterized in that described pedestal is the PCB pedestal, described resonator has the full ceramic device surface mounting quartz crystal resonator of recess for its pedestal, and described resonator covers and is fixed on the PCB pedestal, as the enclosing cover of oscillator.
As a rule, the PCB pedestal is disk construction, and there are at least two metlbond thing dishes and electronic circuit in front, and reverse side has two metal pads at least.Metlbond thing dish and electronic circuit have electrical connection, and metal pad and electronic circuit also have electrical connection.Usually metlbond thing dish, electronic circuit and the metal pad on this kind of PCB pedestal can form by the technique of manufacturing general pcb board, the electrical connection of metlbond thing dish and electronic circuit and metal pad and electronic circuit just be connected electrically in while doing the PCB pedestal together with complete.The IC silicon chip is arranged at the middle part in PCB pedestal front, and the IC silicon chip has electrical connection by electronic circuit or the metlbond thing dish in metal binding alignment and PCB pedestal front.Pedestal has the full ceramic device surface mounting quartz crystal resonator of recess to be arranged on the front of PCB pedestal; the pad of resonator has electrical connection and mechanical connection by the metlbond thing dish in conductive adhesion thing and PCB pedestal front; the recess of resonator base has contained the protection binding of IC silicon chip, metal binding alignment and IC silicon chip and metal binding alignment outside substantially, and there is mechanical connection at the edge of resonator base by the edge in non-conductive binding and PCB pedestal front.Pedestal has the full ceramic device surface mounting quartz crystal resonator of recess to link together by the conductive adhesion thing on the metlbond thing dish in PCB pedestal front and non-conductive binding and the PCB pedestal on PCB pedestal front edge, has encapsulated the protection binding on IC silicon chip, metal binding alignment and IC and metal binding alignment.Described protection binding protection IC silicon chip and metal binding alignment are not subject to outside infringement.
At first the present invention uses a kind of PCB pedestal, described PCB pedestal is disk construction, and above-mentioned PCB pedestal is generally rectangle structure, but is not limited to rectangle, can be also other shape, as geometries such as ellipse, triangle, circle, trapezoidal, polygons.There are at least two metlbond thing dishes and electronic circuit in PCB pedestal front, and reverse side has two metal pads at least.The wiring of electronic circuit, live width, line shape, size and thickness thick, the PCB pedestal are determined by designing requirement.The size of metlbond thing dish and metal pad, thickness, shape and quantity are determined by designing requirement.
In concrete application, the material of pcb board can be common electronic circuit plate material, without any special material.The quantity of the exit of this PCB pedestal and size can be determined according to the specification of product, are generally but are not limited to six.Wherein four exits can be used for the outside line plate on circuit carry out the function connection, all the other two can be used for other function, carry out the programing work of IC silicon chip during such as the situation of selecting programmable I C silicon chip at IC.
With binding, the bottom at the IC silicon chip is bonded in the IC silicon chip on the electronic circuit of PCB pedestal middle body or middle body in the present invention.This binding that the IC silicon chip is bonded in to PCB pedestal central authorities is the conductive adhesion thing normally, while needing, so that after solidifying, the particular end of the bottom of IC silicon chip by the electronic circuit on the PCB pedestal is connected with the ground end of circuit on the outside line plate.
Then use metal pressure-welding (binding) technology with metal wire, the respective ends of the electronic circuit on the exit on the IC silicon chip and PCB pedestal or metlbond thing dish to be linked together in function aspects, IC silicon chip exit respectively holds with the electronic circuit on the PCB pedestal or the correspondence of metlbond thing dish is connected and can determines as the specification of the quartz crystal oscillator pasted on surface of enclosing cover according to specification and the full ceramic device resonator of IC silicon chip.Now the IC silicon chip links together on function by the electronic circuit on the PCB pedestal or metlbond thing dish and outside line plate circuit.The metal wire that metal pressure-welding (binding) technology is used is aluminum steel or gold thread normally, but also can be other applicable metal wire.
The present invention has the pad of function to bond together resonator with a kind of conductive adhesion thing on the metlbond thing dish of PCB pedestal, simultaneously, with a kind of non-conductive binding on PCB pedestal front edge, so that resonator has mechanical connection by non-conductive binding and PCB pedestal front edge.After solidifying, the conductive adhesion thing has the pad of function and the metlbond thing dish on the PCB pedestal to link together securely resonator bottom and the connection of electric aspect is arranged, the non-conductive binding also marginal portion of resonator base is firm and edge PCB pedestal front links together, and has encapsulated the quartz crystal oscillator pasted on surface of full ceramic device resonator as enclosing cover.Now, resonator has had the connection of function aspects by metallic circuit, metlbond thing dish and metal binding alignment and IC silicon chip, also obtained the quartz crystal oscillator pasted on surface of full ceramic device resonator as enclosing cover.
For the present invention, PCB pedestal, non-conductive binding and pedestal have the full ceramic device surface mounting quartz crystal resonator of recess that whole IC silicon chip, binding metal wire are packaged as a whole, and become the quartz crystal oscillator pasted on surface of full ceramic device resonator as enclosing cover.
Specifically, main manufacturing process of the present invention is as follows:
A, selection, choose suitable PCB pedestal;
B, installation integrated circuit, be fixed on the IC silicon chip at the middle part of PCB pedestal, and be electrically connected to the PCB pedestal;
C, fixing resonance device, have the full ceramic device surface mounting quartz crystal resonator of recess to be fixed on PCB pedestal front pedestal, forms the oscillator of full ceramic device resonator as enclosing cover.
Specifically, above-mentioned method further comprises following performing step.
A, select the PCB pedestal: according to designing requirement, choose the PCB pedestal.The PCB pedestal has electronic circuit, and the wiring of electronic circuit, live width, line shape, size and thickness thick, the PCB pedestal are determined by designing requirement.
B1, distribution IC location binding: a certain amount of conductive adhesion thing is assigned to the central part of PCB pedestal, so that bonding IC silicon chip.
B2, placement IC silicon chip: the IC silicon chip that oscillator is used is placed on the conductive adhesion thing of PCB pedestal, and guarantees that integrated circuit has preferably and contacts with the conductive adhesion thing.
B3, curing conductive binding: the semi-finished product of having placed the IC silicon chip are put into to baking oven curing conductive binding.Curing time and temperature are determined by the specification of binding.
B4, binding metal wire: use metal pressure-welding (binding) technology with metal wire, the corresponding endpoint of the electronic circuit on the exit on the IC silicon chip and PCB pedestal or metlbond thing dish to be coupled together.Metal wire can be gold thread, aluminum steel or other metal wire.
B5, distribution protection binding: a certain amount of protection binding is assigned to and all covers IC silicon chips and metal binding alignments, in order to protect IC silicon chip and metal binding alignment.
C1, distribution conductive adhesion thing: a certain amount of conductive adhesion thing is assigned on the metlbond thing dish in PCB pedestal front, so that bonding pedestal has the full ceramic device surface mounting quartz crystal resonator of recess.
C2, distribution connect binding: a certain amount of connection binding is assigned on the edge in PCB pedestal front, connecting binding is non-conductive adhesion thing, in order to make PCB pedestal and pedestal have the full ceramic device surface mounting quartz crystal resonator of recess to bond together.Non-conductive binding can be the point-like of separating, and can be also continuous strip, but not be assigned on the metlbond thing dish in PCB pedestal front.
C3, place resonator: have the full ceramic device surface mounting quartz crystal resonator of recess to be placed on the conductive adhesion thing and non-conductive binding in PCB pedestal front pedestal, and guarantee that resonator and conductive adhesion thing and non-conductive binding have preferably and contact; Now, pad on the pedestal of resonator bottom is pressed on the conductive adhesion thing on PCB pedestal front metal binding dish, so that resonator has the connection of electric aspect by the electronic circuit on conductive adhesion thing and metlbond thing dish and PCB pedestal, the lower edge of resonator base is pressed on the non-conductive binding of PCB pedestal front edge simultaneously, so that resonator has mechanical connection by non-conductive binding and PCB pedestal front edge.
C4, solidify protection binding, conductive adhesion thing and be connected binding: the product that will be placed with resonator puts into that baking oven is curing to be protected binding, conductive adhesion thing and be connected binding.The curing time is determined with the specification that is connected binding by protection binding, conductive adhesion thing with temperature.
Just forming the quartz crystal oscillator pasted on surface of full ceramic device resonator as enclosing cover after solidifying, is in programmable situation at the IC silicon chip, can also programme and adjust more accurately the frequency of oscillator by the silicon chip to IC.
Oscillator structure of the present invention is simple, convenient for production, can effectively reduce production costs, and enhances productivity.During making, the central authorities of PCB pedestal are for IC silicon chip and binding IC silicon chip are installed, and the metlbond thing dish on the PCB pedestal is for installing and being connected pedestal and the full ceramic device surface mounting quartz crystal resonator of recess being arranged and make resonator and the IC silicon chip has the connection of function aspects by the metal wire of binding on the electronic circuit on this metlbond thing dish, PCB pedestal and PCB pedestal.Adopt pcb board as the material of making pedestal, be convenient to the wiring of electronic circuit on pcb board, oscillating circuit is easy to make, simultaneously, pcb board can coordinate again pedestal to have the full ceramic device surface mounting quartz crystal resonator of recess to be encapsulated oscillator reliably, makes the cost of oscillator be able to decrease.
The present invention also has a characteristic, at the IC silicon chip, be in programmable situation exactly, resonator used can be produced by the technique after cost optimization, like this from the equipment aspect, material aspect, process time aspect and the qualification rate aspect all can save in a large number cost.Because IC silicon chip used is able to programme, can the final frequency of oscillator be adjusted to required requiring in frequency range by the programming to the IC silicon chip, so the resonant frequency of use is without being adjusted to accurately the frequency needed.So just avoided using expensive frequency trim equipment, also avoided due to the requirement of resonator precise frequency the disqualification rate produced due to a small amount of drift of frequency in each operation.
The accompanying drawing explanation
Fig. 1 is STRUCTURE DECOMPOSITION schematic diagram of the invention process.
The structural representation of the reverse side that Fig. 2 is PCB pedestal of the invention process.
The structural representation that Fig. 3 is full ceramic device resonator reverse side of the invention process.
Fig. 4 is semi-finished product structure schematic diagram of the invention process.
Fig. 5 is finished product structure schematic diagram of the invention process.
Execution mode
Below more by reference to the accompanying drawings shown in 1-5, enforcement of the present invention is further described, it should be noted that, for of the present invention, illustrate, not as the concrete restriction to invention, all technical schemes realized to be similar to mode, all be equal to the concrete enforcement of invention.
At first, shown in Fig. 1, architectural feature, enforcement of the present invention comprises three main parts: integrated circuit for vibrator (namely IC silicon chip) 30, full ceramic device surface mounting quartz crystal resonator 70 and PCB pedestal 10.IC silicon chip 30 is existing, can purchase and obtain as required from the market, full ceramic device surface mounting quartz crystal resonator 70 also can directly be purchased the product on market, but need to, according to the structure of Fig. 3, recess be produced in the bottom of this full ceramic device resonator; 10 of PCB pedestals are processed by existing pcb board production technology.Wherein, PCB pedestal 10 is disk construction, and there are at least two metlbond thing dishes 12 and electronic circuit 11 in front, and shown in Fig. 2, the reverse side of PCB pedestal 10 has two metal pads 13 at least.Metlbond thing dish 12 and electronic circuit 11 have electrical connection, and metal pad 13 and electronic circuit 11 also have electrical connection, and metlbond thing dish 12, electronic circuit 11 and metal pad 13 complete together with can be when producing pcb board.
Shown in Fig. 3, although full ceramic device surface mounting quartz crystal resonator 70 can be buied from the market, its bottom must possess the recess shown in Fig. 3, and this recess should be enough large, to hold IC silicon chip 30, this recess can be made by the mode of sandblast.The bottom of full ceramic device surface mounting quartz crystal resonator 70 also has two pads 71, and pad 71 is the original structures of full ceramic device surface mounting quartz crystal resonator 70, being electrically connected to control circuit.
Concrete preparation method is as follows.
1. select the PCB pedestal: according to designing requirement, choose PCB pedestal 10.PCB pedestal 10 has electronic circuit 11, and the wiring of electronic circuit 11, live width, line shape, size and thickness thick, PCB pedestal 10 are determined by designing requirement.PCB pedestal 10 is plate, and there are at least two metlbond thing dishes 12 and electronic circuit 11 in front, and reverse side has two metal pads 13 at least.Metlbond thing dish 12 and electronic circuit 11 have electrical connection, and metal pad 13 and electronic circuit 11 also have electrical connection.Position, shape, size, thickness and the quantity of metlbond thing dish 12 and metal pad 13 are determined by designing requirement.
2. distribute IC location binding: a certain amount of conductive adhesion thing 20 is assigned to the central part of PCB pedestal 10, so that bonding IC silicon chip 30.The position of conductive adhesion thing 20 and amount can be determined by designing requirement.
3. place the IC silicon chip: the IC silicon chip 30 that oscillator is used is placed on the conductive adhesion thing 20 of PCB pedestal 10.Want slight pressing during placement, so that IC silicon chip 30 has preferably and contacts with conductive adhesion thing 20.
4. solidify IC location binding: the semi-finished product of having placed IC silicon chip 30 are put into to baking oven curing conductive binding 20.Curing time and temperature are determined by the specification of binding 20.
5. binding metal wire: use metal pressure-welding (binding) technology with metal wire 40, the corresponding endpoint of the electronic circuit 11 on the exit on IC silicon chip 30 and PCB pedestal 10 or metlbond thing dish 12 to be coupled together.Metal wire 40 can be gold thread, aluminum steel or other metal wire.Connection line is determined by designing requirement, now obtains semi-finished product 80, as shown in Figure 4.
6. distribute the protection binding: a certain amount of protection binding 50 is assigned to and all covers IC silicon chip 30 and metal binding alignment 40, so that protection IC silicon chip 30 and metal binding alignment 40.Position and the amount of protection binding 50 can be determined by designing requirement.
7. distribute the resonator binding: a certain amount of conductive adhesion thing 60 is assigned on the metlbond thing dish 12 in PCB pedestal 10 fronts, so that bonding pedestal has the full ceramic device surface mounting quartz crystal resonator 70 of recess.The position of conductive adhesion thing 60 and amount can be determined by designing requirement.
8. distribute and connect binding: a certain amount of non-conductive binding 90 is assigned on the edge in PCB pedestal 10 fronts, in order to make PCB pedestal 10 and pedestal have the full ceramic device surface mounting quartz crystal resonator 70 of recess to bond together.Non-conductive binding 90 can be the point-like of separating, and can be also continuous strip, but not be assigned on the metlbond thing dish 12 in PCB pedestal 10 fronts.Non-conductive binding 90 can be determined by designing requirement in Shang position, edge and amount.
9. placement resonator: have the full ceramic device surface mounting quartz crystal resonator 70 of recess to be placed on the conductive adhesion thing 60 and non-conductive binding 90 in PCB pedestal 10 fronts pedestal.Want slight pressing during placement, so that resonator 70 and conductive adhesion thing 60 and non-conductive binding 90 have preferably contact.Now, pad 71 on resonator 70 pedestals is pressed on the conductive adhesion thing 60 on PCB pedestal 10 front metal binding dishes 12, so that resonator 70 has the connection of electric aspect by the electronic circuit 11 on conductive adhesion thing 60 and metlbond thing dish 12 and PCB pedestal 10.The lower edge of resonator 70 pedestals is pressed on the non-conductive binding 90 of PCB pedestal 10 front edge simultaneously, so that resonator 70 has mechanical connection by non-conductive binding 90 and PCB pedestal 10 front edge.
10. solidify protection binding, resonator binding and be connected binding: the product that will be placed with resonator 70 is put into the curing protection of baking oven binding 50, resonator binding 60 and is connected binding 90.The curing time is determined with the specification that is connected binding 90 by protection binding 50, resonator binding 60 with temperature.Obtain the quartz crystal oscillator pasted on surface 100 of full ceramic device resonator as enclosing cover after solidifying, as shown in Figure 5.
Pedestal has the full ceramic device surface mounting quartz crystal resonator 70 of recess to link together by connecting binding 90 and conductive adhesion thing 60 and PCB pedestal 10, encapsulate IC silicon chip 30, metal binding alignment 40, formed the quartz crystal oscillator pasted on surface finished product of a full ceramic device resonator as enclosing cover.
Be in programmable situation at IC silicon chip 30, can adjust more accurately by the programming to IC silicon chip 30 frequency of oscillator.
By this method, can produce in enormous quantities the quartz crystal oscillator pasted on surface of a kind of full ceramic device resonator as enclosing cover.This oscillator structure is simply, highly low volume is little, have durability, validity, easy to implement, with low cost, be convenient to manufacture and and usually oscillator have same or surmount the characteristics such as index.
In a word, the present invention is by using the full ceramic device resonator as enclosing cover, can effectively utilize the production of existing oscillator, avoid the application of expensive equipment and control technique, simple structure, low cost, effective durable quartz crystal oscillator pasted on surface are provided.
In a word, the above, be only to specific descriptions of the invention process, do not represent all modes that the present invention implements.The equivalent variations of doing on the basis of the object of the invention and technical scheme and modification, all in the protection range of invention.
Claims (8)
1. a full ceramic device resonator is as the oscillator of enclosing cover, described oscillator includes integrated circuit, pedestal and resonator, it is characterized in that described pedestal is the PCB pedestal, described resonator is the full ceramic device surface mounting quartz crystal resonator, and the bottom base of this resonator has recess, this recess is corresponding to the PCB pedestal, and described resonator covers and is fixed on the PCB pedestal, as the enclosing cover of oscillator.
2. full ceramic device resonator as claimed in claim 1, as the oscillator of enclosing cover, is characterized in that described PCB pedestal is disk construction, and there are at least two metlbond thing dishes and electronic circuit in front, and reverse side has two metal pads at least; Metlbond thing dish and electronic circuit have electrical connection, and metal pad and electronic circuit also are electrically connected to.
3. full ceramic device resonator as claimed in claim 2 is as the oscillator of enclosing cover, it is characterized in that described integrated circuit is arranged at the middle part of PCB pedestal, pedestal has the full ceramic device surface mounting quartz crystal resonator of recess to be arranged on the front of PCB pedestal, and the pad of resonator bottom has electrical connection and mechanical connection by the metlbond thing dish in conductive adhesion thing and PCB pedestal front.
4. full ceramic device resonator as claimed in claim 1, as the oscillator of enclosing cover, is characterized in that described oscillator has metal binding alignment and protection binding, and the protection binding has covered described integrated circuit and metal binding alignment fully; The recess of described resonator base has contained described integrated circuit, metal binding alignment and protection binding; Described pedestal has the full ceramic device surface mounting quartz crystal resonator of recess to encapsulate oscillator integrated circuit, metal binding alignment and protection binding by connecting binding together with the PCB pedestal.
5. full ceramic device resonator as claimed in claim 4 is as the oscillator of enclosing cover, it is characterized in that described connection binding is non-conductive binding, there is mechanical connection at the edge of the pedestal of described resonator by the edge in non-conductive binding and PCB pedestal front; Non-conductive binding is the point-like of separating, or continuous strip.
6. a full ceramic device resonator, as the manufacture method of the oscillator of enclosing cover, is characterized in that the method comprises the steps:
A, selection, choose suitable PCB pedestal;
B, installation integrated circuit, be fixed on integrated circuit at the middle part of PCB pedestal, and be electrically connected to the PCB pedestal;
C, fixing resonance device, have the full ceramic device surface mounting quartz crystal resonator of recess to be fixed on PCB pedestal front pedestal, forms the quartz crystal oscillator pasted on surface of full ceramic device resonator as enclosing cover.
7. full ceramic device resonator as claimed in claim 6, as the manufacture method of the oscillator of enclosing cover, is characterized in that further comprising in the B step:
B1, distribution location binding: a certain amount of conductive adhesion thing is assigned to the central part of PCB pedestal, so that bonding integrated circuit;
B2, placement integrated circuit: the integrated circuit that oscillator is used is placed on the conductive adhesion thing of PCB pedestal, and guarantees that integrated circuit has preferably and contacts with the conductive adhesion thing;
B3, curing conductive binding: the semi-finished product of having placed integrated circuit are put into to baking oven curing conductive binding;
B4, binding metal wire: use the metal pressure-welding technology with metal wire, the corresponding endpoint of the electronic circuit on the exit on integrated circuit and PCB pedestal or metlbond thing dish to be coupled together;
B5, distribution protection binding: a certain amount of protection binding is assigned to and all covers integrated circuit and metal binding alignment.
8. full ceramic device resonator as claimed in claim 6, as the manufacture method of the oscillator of enclosing cover, is characterized in that further comprising in step C:
C1, distribution conductive adhesion thing: a certain amount of conductive adhesion thing is assigned on the metlbond thing dish in PCB pedestal front, so that bonding pedestal has the full ceramic device surface mounting quartz crystal resonator of recess;
C2, distribution connect binding: a certain amount of connection binding is assigned on the edge in PCB pedestal front, connecting binding is non-conductive adhesion thing, in order to make PCB pedestal and pedestal have the full ceramic device surface mounting quartz crystal resonator of recess to bond together; The distribution of non-conductive binding can be the point-like of separating, and can be also continuous strip, but can not be assigned on the metlbond thing dish in PCB pedestal front;
C3, place resonator: have the full ceramic device surface mounting quartz crystal resonator of recess to be placed on the conductive adhesion thing and non-conductive binding in PCB pedestal front pedestal, and guarantee that resonator and conductive adhesion thing and non-conductive binding have preferably and contact;
C4, solidify protection binding, conductive adhesion thing and be connected binding: the product that will be placed with resonator puts into that baking oven is curing to be protected binding, conductive adhesion thing and be connected binding.
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| CN2013103440244A CN103457568A (en) | 2013-08-08 | 2013-08-08 | Oscillator with full-ceramic-packaged resonator as outer cover and manufacturing method of oscillator |
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| CN2013103440244A CN103457568A (en) | 2013-08-08 | 2013-08-08 | Oscillator with full-ceramic-packaged resonator as outer cover and manufacturing method of oscillator |
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Cited By (3)
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| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
| CN107769746A (en) * | 2017-02-08 | 2018-03-06 | 应达利电子股份有限公司 | Quartz crystal oscillator pasted on surface and its manufacture method |
| CN108900174A (en) * | 2018-08-23 | 2018-11-27 | 应达利电子股份有限公司 | A kind of quartz oscillator and the method for manufacturing the quartz oscillator |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107769746A (en) * | 2017-02-08 | 2018-03-06 | 应达利电子股份有限公司 | Quartz crystal oscillator pasted on surface and its manufacture method |
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