CN103456672B - Open pin support plate - Google Patents
Open pin support plate Download PDFInfo
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- CN103456672B CN103456672B CN201310398225.2A CN201310398225A CN103456672B CN 103456672 B CN103456672 B CN 103456672B CN 201310398225 A CN201310398225 A CN 201310398225A CN 103456672 B CN103456672 B CN 103456672B
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Abstract
Open pin support plate, mainly solves the technical problem that existing pin support plate can not be suitable for two or more size wafer.This support plate main body is triangular in shape and a limit is Open architecture.The edge of above-mentioned support plate main body is processed with datum line, and the plane place of support plate main body is processed with general surface, is shaped with polished surface respectively with general surperficial adjacent.Three angles of above-mentioned support plate main body are shaped with ejector pin position respectively.The drift angle of support plate main body is shaped with through hole, is connected with elevating mechanism moving component, the drift angle of support plate main body is also shaped with pin-and-hole, pin-and-hole is used for guaranteeing to connect precision.Above-mentioned support plate main body adopts ceramic material, takes full advantage of ceramics strength high, the advantages such as high temperature deformation is little.The wafer jacking position of plurality of specifications can be integrated on a support plate by the present invention, and its feature is also that same support can be used for the jacking pin of multiple wafer size, saves the maintenance cost of equipment transition, can be widely used in semiconductor coated film technical field.
Description
Technical field
The present invention relates to a kind of open pin support plate, be mainly used in semiconductor coated film equipment, belong to semiconductive thin film deposition applications and preparing technical field.
Background technology
In existing semiconductor coated film equipment, especially 12 inch semiconductor filming equipments, pin support plate, in whole technical process, is realized the unified lifting of the pin on diverse location, thus realizes the lifting of wafer in piece delivery process by the lifting of self.Pin is generally circumferentially equally distributed, and quantity is not generally three or more not etc.For ensureing wafer without the phenomenon such as skew, slide plate in whole technical process, the height needing the pin on guarantee diverse location is consistent, and namely no matter under any state, the lifting of pin is the same with the speed of decline.This just improves the requirement of pin support plate.Need pin support plate under any state, the lifting being positioned at the face residing for pin of diverse location is consistent, and ensures that these faces are in the same plane all the time.Consider that sealing and the installing space of cavity are limited, pin support plate is generally only provided with a lifting fulcrum.This improves the requirement of strength of pin support plate again, does not allow it to have larger distortion to exist at high operating temperatures.To ensure that the height sold does not have large difference everywhere, thus guarantee that the transmission of wafer is smooth and easy.Meanwhile, pin support plate himself can not be too heavy, avoids because Action of Gravity Field causes distortion.
According to the needs of semiconductor industry, some equipment need possess the ability of producing different size wafer simultaneously.For different diameter wafers, also there is difference the position of jacking pin.Existing way changes heating plate to adapt to corresponding wafer size in the industry; Change the support plate of jacking pin, to adapt to different wafer jacking positions simultaneously.And change ejector pin support plate and bring a series of activities amount such as leveling of installing, add maintenance cost.
Summary of the invention
The present invention, for the purpose of solving the problem, mainly solves the deficiency that existing pin support plate can not be suitable for two or more size wafer, and provides a kind of structure relatively simple, and intensity is high, can meet the open pin support plate of multiple wafer size simultaneously.
For achieving the above object, the present invention adopts following technical proposals: open pin support plate, and support plate main body is triangular in shape and a limit is Open architecture.The edge of above-mentioned support plate main body is processed with datum line (2); The plane place of support plate main body is processed with general surface (3), is shaped with polished surface A(5-1 respectively with general surface (3) adjacent), polished surface B(5-2) and polished surface C(5-3).Three angles of above-mentioned support plate main body are shaped with ejector pin position A(4 respectively), ejector pin position B(6), ejector pin position C(7), ejector pin position D(8), ejector pin position E(9) and ejector pin position F(11).The drift angle of above-mentioned support plate main body is shaped with through hole (1), is connected with elevating mechanism moving component, the drift angle of support plate main body is also shaped with pin-and-hole (10), pin-and-hole (10) connects precision for guaranteeing.
Above-mentioned support plate main body adopts ceramic material, takes full advantage of ceramics strength high, the advantages such as high temperature deformation is little.
Beneficial effect of the present invention and feature are:
The wafer jacking position of plurality of specifications is integrated on a support plate, effectively utilizes polished surface, reduce costs, remove excess stock, weight reduction, reduce everywhere due in uneven thickness and produce thermal stress.Feature of the present invention is also that same support can be used for the jacking pin of multiple wafer size, saves the maintenance cost of equipment transition.Simple and reasonable, better avoid the pin caused because of the distortion of support plate and highly differ, thus cause the appearance of wafer tilt or slide plate phenomenon.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the schematic diagram of specific embodiments of the invention.
Embodiment
Embodiment
With reference to Fig. 1-2, open pin support plate, support plate main body is triangular in shape and a limit is Open architecture.The edge of above-mentioned support plate main body is processed with datum line 2; The plane place of support plate main body is processed with general surface 3, is shaped with polished surface A5-1, polished surface B5-2 and polished surface C5-3 respectively with general surperficial 3 adjacents.Three angles of above-mentioned support plate main body are shaped with respectively ejector pin position A4, ejector pin position B6, ejector pin position C7, ejector pin position D8, ejector pin position E9 and ejector pin position F11.The drift angle of above-mentioned support plate main body is shaped with through hole 1, is connected with elevating mechanism moving component, the drift angle of support plate main body is also shaped with pin-and-hole 10, pin-and-hole 10 connects precision for guaranteeing.
As shown in Figure 2, large wafer 12 is by ejector pin position A4, ejector pin position D8, the F11 jacking of ejector pin position; Little wafer 13 is by ejector pin position B6, ejector pin position C7, the E9 jacking of ejector pin position.As equipment have need to do different size wafer time, then jacking pin is installed on relevant position.
Described pin-and-hole 10 is 1, and through hole 1 is 3.
During installation, support plate main body realizes the location with elevating mechanism by pin-and-hole 10, is realized and being fastenedly connected of elevating mechanism by through hole 1.
During use, the present invention is installed on the moving component top of lifting body, datum line 2 is for measuring installation direction, and pin-and-hole 10 is for position assurance installation accuracy, and screw is fastening by through hole 1, and the installation of whole like this pin support plate just completes.
Claims (2)
1. an open pin support plate, is characterized in that: support plate main body is triangular in shape and a limit is Open architecture, and the edge of above-mentioned support plate main body is processed with datum line (2), the plane place of support plate main body is processed with a surface (3), polished surface A (5-1) is shaped with respectively with a surface (3) adjacent, polished surface B (5-2) and polished surface C (5-3), three angles of above-mentioned support plate main body are shaped with ejector pin position A (4) respectively, ejector pin position B (6), ejector pin position C (7), ejector pin position D (8), ejector pin position E (9) and ejector pin position F (11), the drift angle of above-mentioned support plate main body is shaped with through hole (1), be connected with elevating mechanism moving component, the drift angle of support plate main body is also shaped with pin-and-hole (10).
2. open pin support plate as claimed in claim 1, is characterized in that: described pin-and-hole (10) is 1, and through hole (1) is 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310398225.2A CN103456672B (en) | 2013-09-04 | 2013-09-04 | Open pin support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310398225.2A CN103456672B (en) | 2013-09-04 | 2013-09-04 | Open pin support plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103456672A CN103456672A (en) | 2013-12-18 |
| CN103456672B true CN103456672B (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310398225.2A Active CN103456672B (en) | 2013-09-04 | 2013-09-04 | Open pin support plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN103456672B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6190113B1 (en) * | 1997-04-30 | 2001-02-20 | Applied Materials, Inc. | Quartz pin lift for single wafer chemical vapor deposition/etch process chamber |
| CN102709222A (en) * | 2011-06-28 | 2012-10-03 | 清华大学 | Wafer clamping device utilizing stretching of cord spring |
| CN103236409A (en) * | 2013-04-07 | 2013-08-07 | 沈阳拓荆科技有限公司 | Sealed pin ceramic support plate |
| CN203481207U (en) * | 2013-09-04 | 2014-03-12 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4592849B2 (en) * | 1999-10-29 | 2010-12-08 | アプライド マテリアルズ インコーポレイテッド | Semiconductor manufacturing equipment |
-
2013
- 2013-09-04 CN CN201310398225.2A patent/CN103456672B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6190113B1 (en) * | 1997-04-30 | 2001-02-20 | Applied Materials, Inc. | Quartz pin lift for single wafer chemical vapor deposition/etch process chamber |
| CN102709222A (en) * | 2011-06-28 | 2012-10-03 | 清华大学 | Wafer clamping device utilizing stretching of cord spring |
| CN103236409A (en) * | 2013-04-07 | 2013-08-07 | 沈阳拓荆科技有限公司 | Sealed pin ceramic support plate |
| CN203481207U (en) * | 2013-09-04 | 2014-03-12 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103456672A (en) | 2013-12-18 |
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Address after: No.900 Shuijia, Hunnan District, Shenyang City, Liaoning Province Patentee after: Tuojing Technology Co.,Ltd. Address before: 110179 3rd floor, No.1-1 Xinyuan street, Hunnan New District, Shenyang City, Liaoning Province Patentee before: PIOTECH Co.,Ltd. |
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