CN103454721A - Optical fiber circuit board and manufacturing method thereof - Google Patents
Optical fiber circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN103454721A CN103454721A CN2012101762018A CN201210176201A CN103454721A CN 103454721 A CN103454721 A CN 103454721A CN 2012101762018 A CN2012101762018 A CN 2012101762018A CN 201210176201 A CN201210176201 A CN 201210176201A CN 103454721 A CN103454721 A CN 103454721A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate
- flexible substrate
- photoresistance
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention provides an optical fiber circuit board comprising a flexible base material and a flexible optical waveguide. The flexible optical waveguide is arranged on the flexible base material and used for transmitting optical signals. The invention further provides a manufacturing method of the optical fiber circuit board.
Description
Technical field
The present invention is about the manufacture method of a kind of optical circuit board and optical circuit board.
Background technology
Due to current interior of mobile phone core processor processing speed, with Fast Growth, and outside each spare part is also because the raising of core processor usefulness, also is inconjunction with to drive outside spare part specification and improve.As camera model, improved picture element, volume of transmitted data that also relatively must be larger; The LCD display module, promoted LCD and shown picture element, makes the more careful perfection of picture, volume of transmitted data that also must be larger.
How to solve the more more substantial volume of transmitted data than in the past, the general employing increases the data transmission channel number of traditional flexible circuit board connecting line, and then strengthens outside transmission quantity.In addition, because optical fiber is with optical signal transmission, optical signal transmission obtains major advantage, can not be subject to Electromagnetic Interference (EMI), and ray velocity is faster than electric speed, so use optical fiber fast doubly a lot of more than adopting copper cash to transmit on data transmission.
Summary of the invention
In view of this, be necessary to provide a kind of whole height is little and the loss light transmission is lower optical circuit board and the manufacture method of optical circuit board.
A kind of optical circuit board, comprise flexible substrate, following layer and copper layer on described flexible substrate comprises substrate and is positioned on described substrate, described copper layer is located on described substrate by described following layer, the etched rear setting of the described copper layer of part, described soft optical waveguide is used for transmitting optical signal.
A kind of manufacture method of optical circuit board comprises step: flexible substrate is provided and cuts flexible substrate, described flexible substrate comprises substrate and is arranged on the copper layer on institute's substrate; On flexible substrate perforate and on the inwall in described hole plated film; On flexible substrate after plated film completes, photographic layer is set; The exposure imaging photographic layer is to form the naked copper district; Copper floor in etching naked copper district is to form waveguide section; Remove the photographic layer of many Yus; Soft optical waveguide is set and sticks insulation course in waveguide section; Corresponding soft optical waveguide is offered optical window to appear soft optical waveguide.
Compared to prior art, the optical circuit board of the present embodiment utilizes the mode of optical waveguide transmission signal to adapt to the ability of high speed transmission of signals; In addition, soft optical waveguide with can to reach volume together with flexible substrate is manufactured less, reduce the separately contraposition problem when cost of assembling and assembling and then reduce loss of photoelectricity.
The accompanying drawing explanation
Fig. 1 to Figure 11 is the schematic diagram of embodiment of the present invention fiber optic circuit board fabrication method.
The main element symbol description
| Flexible substrate | 10 |
| |
11 |
| |
12 |
| The |
13 |
| Through |
14 |
| The |
15 |
| |
16 |
| The |
17 |
| The electrode opening |
18 |
| Waveguide |
19 |
| Electrode |
20 |
| Soft |
21 |
| |
22 |
| The |
23 |
| Optical window | 24 |
| |
30 |
| |
31 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, provide flexible substrate and shear flexible substrate to be applicable to the optical circuit board of needs size.
Flexible substrate 10 is doubling plate, and it comprises substrate 11 and is arranged on 11 two lip-deep solids 12 of substrate and copper layer 13.Solid 12 is used for copper layer 13 is incorporated on substrate 11 between substrate 11 and copper layer 13.
The material of substrate 11 can be selected from polyimide (Polyimide, PI), Teflon (Teflon), poly-thiamines (Polyamide), polymethylmethacrylate (Polymethylmethacrylate), polycarbonate (Polycarbonate), polyethylene terephthalate (Polyethylene Terephtalate, PET), polyimide-tygon-terephthaldehyde's ester copolymer (Polyamide Polyethylene-Terephthalate copolymer) or above-mentioned two or more composition.
Certainly, flexible substrate 10 can be also lamina, on a surface of substrate 11, utilizes solid 12 that copper layer 13 is set.
The doubling plate of below take is introduced the manufacture process of optical circuit board as example.
Refer to Fig. 2, bore a hole on flexible substrate.
Utilize mechanical system to form through hole 14 on flexible substrate 10 so that be arranged on copper layer 13 conducting on 11 two surfaces of substrate.
In other structure, blind hole can certainly be set to be communicated with 11 two lip-deep copper layers 13 of substrate.
As shown in Figure 3, plated film on the inwall in hole.
On the inwall of through hole 14, plated film is to form the first rete 15.The material of the first rete 15 is conductive material, for example copper.
Certainly, can adopt the modes such as sputter or evaporation to form the first rete 15.
As shown in Figure 4, stick photosensitive material on the flexible substrate after plated film completes.
Flexible substrate 10 after the cleaning plated film, then the mode with hot pressing arranges photographic layer 16 on copper layer 13.
It is that photoresistance or epoxy acrylate are that photoresistance, polyester acrylate are that the upgrading acryl resins such as photoresistance, polycarbamate acrylic ester photoresistance are that photoresistance, pi are that photoresistance, siloxane-based photoresistance or fluorine are photoresistance that the material of photographic layer 16 can be selected from acryl resin.
Certainly, in alternate manner, also can utilize any one method in rotary coating (Spin Coat), crack coating (Slit Coat), crack rotary coating (Slit and Spin Coat) or dry film rubbing method (Dry Film Lamination) that photosensitive material is coated on copper layer 13 to form photographic layer 16.
Refer to Fig. 5, the exposure photographic layer.
30 pairs of photographic layers 16 of light shield that utilization has drafting department 31 are exposed, and light shines on photographic layer 16 through drafting department 31, thereby the zone of corresponding pattern section 31 on photographic layer 16 is changed.
The distribution of drafting department 31 and structures shape distribution and the structure of the photographic layer 16 that changes.
As shown in Figure 6, the development photographic layer is to obtain the naked copper district.
Flexible substrate 10 after exposure is placed in to developer solution, etches away with the photographic layer 16 by corresponding pattern section 31, thereby exposed copper floor 13 is to produce naked copper district 17 and electrode opening district 18.
Refer to Fig. 7, etch away the unnecessary copper floor in naked copper district.
Flexible substrate 10 after developing is put into to the etching solution of etch copper, waveguide section 19 and electrode district 20 are removed and then formed in copper floor 13 etching in naked copper district 17 and electrode opening district 18.
As shown in Figure 8, remove the photographic layer of many Yus.
Flexible substrate 10 is put into to the solution of etching photosensitive material, the photographic layer of many Yus 16 is removed.
Refer to Fig. 9, in waveguide section, place soft optical waveguide and stick insulation course.
Place on soft optical waveguide 21 two surfaces at flexible substrate 10 and stick insulation course 22 in waveguide section 19, then utilize the mode of heating pressurization to make insulation course 22 tightr with flexible substrate 10 laminatings.
Preferably, on soft optical waveguide 21, be coated with solid, make soft optical waveguide 21 tightr with the combination of flexible substrate 10.
The material of insulation course 22 is peelable type printing ink, specifically can be comprised of thermoplastic polyurethane (TPU), dipropylene glycol monomethyl ether (Dipropylene Glycol Monomethyl Ether), butyl cellosolve (Butyl cellosolve), titania (TiO2) and mould release.
As shown in figure 10, at electrode district place plated film.
If insulation course 22 coated electrode districts 20, can first remove the insulation course 22 on electrode district 20, now need to retain insulation course 22 on soft optical waveguide 21 and damage soft optical waveguide 21 when preventing plated film.The material that then can utilize sputter or evaporation mode plated film on electrode district 20 to form the second rete 23, the second retes 23 can be nickel, gold, tin or lead etc.
Refer to Figure 11, offer optical window.
Remove the insulation course 22 of the light inlet of soft optical waveguide 21 and bright dipping place to form optical window 24, make light to enter in soft optical waveguide 21 by optical window 24, so far optical circuit board has been manufactured.
The optical circuit board of the present embodiment utilizes the mode of optical waveguide transmission signal to adapt to the ability of high speed transmission of signals; In addition, soft optical waveguide with can to reach volume together with flexible substrate is manufactured less, reduce the separately cost of assembling of photoelectricity.
Be understandable that, those skilled in the art also can do other variation etc. and be used in design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (8)
1. an optical circuit board, comprise flexible substrate, following layer and copper layer on described flexible substrate comprises substrate and is positioned on described substrate, described copper layer is located on described substrate by described following layer, after the described copper layer of part is etched, soft optical waveguide is set, described soft optical waveguide is used for transmitting optical signal.
2. optical circuit board as claimed in claim 1, is characterized in that, described substrate comprises relative first surface and second surface, and described copper layer is arranged on described first surface and second surface, and described soft optical waveguide is positioned at described first surface.
3. optical circuit board as claimed in claim 2, it is characterized in that, the material of described substrate is selected from polyimide, Teflon, poly-thiamines, polymethylmethacrylate, polycarbonate, polyethylene terephthalate or polyimide-tygon-terephthaldehyde's ester copolymer.
4. the manufacture method of an optical circuit board comprises step:
Flexible substrate is provided and cuts flexible substrate, described flexible substrate comprises substrate and is arranged on the copper layer on institute's substrate;
On flexible substrate perforate and on the inwall in described hole plated film;
On flexible substrate after plated film completes, photographic layer is set;
The exposure imaging photographic layer is to form the naked copper district;
Copper floor in etching naked copper district is to form waveguide section;
Remove the photographic layer of many Yus;
Soft optical waveguide is set and sticks insulation course in waveguide section;
Corresponding soft optical waveguide is offered optical window to appear soft optical waveguide.
5. the manufacture method of optical circuit board as claimed in claim 4, it is characterized in that, the material of described substrate is selected from polyimide, Teflon, poly-thiamines, polymethylmethacrylate, polycarbonate, polyethylene terephthalate or polyimide-tygon-terephthaldehyde's ester copolymer.
6. the manufacture method of optical circuit board as claimed in claim 4, it is characterized in that, it is that photoresistance or epoxy acrylate are that photoresistance, polyester acrylate are that the upgrading acryl resins such as photoresistance, polycarbamate acrylic ester photoresistance are that photoresistance, pi are that photoresistance, siloxane-based photoresistance or fluorine are photoresistance that the material of described photographic layer is selected from acryl resin.
7. the manufacture method of optical circuit board as claimed in claim 6, is characterized in that, described photographic layer is arranged on described flexible substrate by rotary coating, crack coating, crack rotary coating, dry film rubbing method or hot-press method.
8. the manufacture method of optical circuit board as claimed in claim 4, is characterized in that, the material of described insulation course is comprised of thermoplastic polyurethane, dipropylene glycol monomethyl ether, butyl cellosolve, titania and mould release.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101762018A CN103454721A (en) | 2012-05-31 | 2012-05-31 | Optical fiber circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101762018A CN103454721A (en) | 2012-05-31 | 2012-05-31 | Optical fiber circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103454721A true CN103454721A (en) | 2013-12-18 |
Family
ID=49737282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101762018A Pending CN103454721A (en) | 2012-05-31 | 2012-05-31 | Optical fiber circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103454721A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1657988A (en) * | 2004-02-16 | 2005-08-24 | 日东电工株式会社 | Optical waveguide and production method thereof |
| CN101340775A (en) * | 2007-07-06 | 2009-01-07 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| US20090016671A1 (en) * | 2004-10-22 | 2009-01-15 | Ibiden Co., Ltd | Multilayer printed circuit board |
| CN101571610A (en) * | 2008-04-28 | 2009-11-04 | 日立电线株式会社 | Flexible optical waveguide and process for its production |
| CN100586259C (en) * | 2007-04-13 | 2010-01-27 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit board with differential break structure |
| KR20100066155A (en) * | 2008-12-09 | 2010-06-17 | 삼성전기주식회사 | Printed circuit board for optical waveguides and method of manufacturing the same |
| CN102223764A (en) * | 2010-04-16 | 2011-10-19 | 富葵精密组件(深圳)有限公司 | Manufacturing method of flexible circuit boards |
-
2012
- 2012-05-31 CN CN2012101762018A patent/CN103454721A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1657988A (en) * | 2004-02-16 | 2005-08-24 | 日东电工株式会社 | Optical waveguide and production method thereof |
| US20090016671A1 (en) * | 2004-10-22 | 2009-01-15 | Ibiden Co., Ltd | Multilayer printed circuit board |
| CN100586259C (en) * | 2007-04-13 | 2010-01-27 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit board with differential break structure |
| CN101340775A (en) * | 2007-07-06 | 2009-01-07 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN101571610A (en) * | 2008-04-28 | 2009-11-04 | 日立电线株式会社 | Flexible optical waveguide and process for its production |
| KR20100066155A (en) * | 2008-12-09 | 2010-06-17 | 삼성전기주식회사 | Printed circuit board for optical waveguides and method of manufacturing the same |
| CN102223764A (en) * | 2010-04-16 | 2011-10-19 | 富葵精密组件(深圳)有限公司 | Manufacturing method of flexible circuit boards |
Non-Patent Citations (1)
| Title |
|---|
| 陈福深等: "《集成光学器件导论》", 31 January 2010, 机械工业出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110692029B (en) | Shielding curved portions of a flexible display | |
| CN106154675B (en) | A kind of flexible electronic paper display device and its manufacturing method having ink layer | |
| US20190278132A1 (en) | Display device | |
| CN101424750A (en) | External light blocking film for display device, method of fabricating the same and filter having the same | |
| US8947399B2 (en) | Dual-substrate capacitive touch panel | |
| CN112002223A (en) | Display cover plate, preparation method thereof and display device | |
| CN109901742B (en) | Flexible touch module and preparation method thereof | |
| CN102346046B (en) | Optical sensor module | |
| CN106293172B (en) | Touch panel and manufacturing method thereof | |
| US8644655B2 (en) | Opto-electric hybrid board and manufacturing method therefor | |
| US8761551B2 (en) | Optical flexible printed circuit board with optical waveguides and method manufacturing the same | |
| KR20180045712A (en) | Method for manufacturing sensor for touch screen sensor, and sensor for touch screen panel | |
| CN103454721A (en) | Optical fiber circuit board and manufacturing method thereof | |
| JP2012155312A (en) | Manufacturing method for optical waveguide | |
| CN109061962B (en) | Display panel, manufacturing method thereof and display device | |
| JP2009094639A (en) | Optical filter for plasma display panel | |
| CN107306509A (en) | Touch panel | |
| JP2006154684A (en) | Electro-optic mixed circuit board | |
| CN111324243A (en) | Manufacturing method of touch screen, touch screen and intelligent terminal | |
| GB2526150A (en) | An optical printed circuit board and a method of mounting a component onto an optical printed circuit board | |
| TWI571786B (en) | Portable electronic apparatus | |
| CN111061009B (en) | Suspended optical waveguide and preparation method thereof | |
| JP2014021478A (en) | Display device | |
| US10847731B2 (en) | Organic light emitting diode device and manufacturing method thereof | |
| US10749573B2 (en) | Antenna configured to conform to a transparent surface, corresponding display device and electronic payment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131218 |