CN103449025A - Tray fixing clamp for semiconductor component - Google Patents
Tray fixing clamp for semiconductor component Download PDFInfo
- Publication number
- CN103449025A CN103449025A CN2013104093123A CN201310409312A CN103449025A CN 103449025 A CN103449025 A CN 103449025A CN 2013104093123 A CN2013104093123 A CN 2013104093123A CN 201310409312 A CN201310409312 A CN 201310409312A CN 103449025 A CN103449025 A CN 103449025A
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- China
- Prior art keywords
- pallet
- fixing clamp
- tray fixing
- tray
- reed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a tray fixing clamp for a semiconductor component. The tray fixing clamp comprises a flat plate chassis, two sides of the flat plate chassis are provided with C-shaped depression bars for clamping a tray, the inner side of the top of each C-shaped depression bar is provided with a reed, and a groove is formed on the connecting part of the flat plate chassis and each C-shaped depression bar. The tray fixing clamp can be used for preventing trays from bending during multilayer stacking of the trays, so as not to damage or scatter components.
Description
Technical field
The present invention relates to a kind of tray clamps, particularly relate to a kind of pallet geometrical clamp of semiconductor element.
Background technology
Semiconductor element is placed on transhipment and storage in vinyl disc usually, this vinyl disc has a capping, this capping middle section height will be higher than peripheral sidewalls, therefore the pallet of whole semiconductor element is also that central authorities are highly high, and the lower slightly square box of surrounding, this is the semiconductor component package form generally adopted in the industry.For good actv. transportation, need to grip this packaged form.
The box cover that existing pallet geometrical clamp adopts both sides that clamp bar is set is usually fixed, some reeds are arranged in bottom at the box cover, reed produces elastic force to the pallet of placing wherein, make vinyl disc and capping keep fixing, this pallet geometrical clamp is after pallet is placed, there is a fixed gap in pallet apart from the geometrical clamp bottom, and the central authorities of pallet can exceed geometrical clamp, when multiple layer tray is stacking, upper tray easily makes lower tray be bent downwardly distortion to the pressure of lower tray, and then likely damage semiconductor element, or cause being scattered of semiconductor element.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the purpose of this invention is to provide the pallet geometrical clamp of semiconductor element, while avoiding multiple-level stack, the flexural deformation of quartz conductor pallet.
Technical scheme of the present invention is such: a kind of pallet geometrical clamp of semiconductor element, it is characterized in that, comprise dull and stereotyped chassis, the both sides on described dull and stereotyped chassis are provided with the C type press strip for holding tray, the inside top of described C type press strip is provided with reed, and described dull and stereotyped chassis and C type press strip link place are provided with groove.
Preferably, be provided with reed in described groove.
The advantage of technical scheme provided by the present invention is, the quartz conductor pallet is after inserting this pallet geometrical clamp, and the reed in C type press strip produces downforce to the edge of quartz conductor pallet, and the bottom of pallet fully contacts with dull and stereotyped chassis.Like this when the Stacket semiconductor pallet, even when the pallet on top produces downforce to the pallet of bottom, pallet is can be in pallet not crooked and cause the damage of element or be scattered yet.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The specific embodiment
Below in conjunction with embodiment, the invention will be further described, but not as a limitation of the invention.
Refer to Fig. 1, the pallet geometrical clamp of semiconductor element, comprise dull and stereotyped chassis 1, the both sides on dull and stereotyped chassis 1 are provided with the C type press strip 2 for holding tray, the inside top of C type press strip 2 is provided with reed 3, and dull and stereotyped chassis 1 is provided with groove 4 with C type press strip 2 junctions, for holding tray edge better, also be provided with reed 5 in groove 4, the upper and lower common holding tray of reed.The quartz conductor pallet is after inserting this pallet geometrical clamp, and the reed in C type press strip produces downforce to the edge of quartz conductor pallet, and the bottom of pallet fully contacts with dull and stereotyped chassis.
Claims (2)
1. the pallet geometrical clamp of a semiconductor element, it is characterized in that, comprise dull and stereotyped chassis (1), the both sides on described dull and stereotyped chassis (1) are provided with the C type press strip (2) for holding tray, the inside top of described C type press strip (2) is provided with reed (3), and described dull and stereotyped chassis (1) is provided with groove (4) with C type press strip (2) junction.
2. the pallet geometrical clamp of semiconductor element according to claim 1, is characterized in that: be provided with reed (5) in described groove (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013104093123A CN103449025A (en) | 2013-09-10 | 2013-09-10 | Tray fixing clamp for semiconductor component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013104093123A CN103449025A (en) | 2013-09-10 | 2013-09-10 | Tray fixing clamp for semiconductor component |
Publications (1)
Publication Number | Publication Date |
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CN103449025A true CN103449025A (en) | 2013-12-18 |
Family
ID=49731950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013104093123A Pending CN103449025A (en) | 2013-09-10 | 2013-09-10 | Tray fixing clamp for semiconductor component |
Country Status (1)
Country | Link |
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CN (1) | CN103449025A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54154270A (en) * | 1978-05-26 | 1979-12-05 | Hitachi Ltd | Parts storing tool |
US20050011056A1 (en) * | 2003-07-14 | 2005-01-20 | Pylant James D. | Bare die tray clip |
CN1915760A (en) * | 2005-08-15 | 2007-02-21 | 奇景光电股份有限公司 | Chip tray |
CN101995764A (en) * | 2009-08-06 | 2011-03-30 | 信越化学工业株式会社 | Dustproof thin film assembly accepting container |
CN102712414A (en) * | 2010-01-13 | 2012-10-03 | 旭硝子株式会社 | Storage container for plate-like body, storage body, device for loading plate-like body thereon, and conveyance vehicle |
CN102985341A (en) * | 2010-05-06 | 2013-03-20 | 神农电气产业株式会社 | Tray for semiconductor integrated circuits |
-
2013
- 2013-09-10 CN CN2013104093123A patent/CN103449025A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54154270A (en) * | 1978-05-26 | 1979-12-05 | Hitachi Ltd | Parts storing tool |
US20050011056A1 (en) * | 2003-07-14 | 2005-01-20 | Pylant James D. | Bare die tray clip |
CN1915760A (en) * | 2005-08-15 | 2007-02-21 | 奇景光电股份有限公司 | Chip tray |
CN101995764A (en) * | 2009-08-06 | 2011-03-30 | 信越化学工业株式会社 | Dustproof thin film assembly accepting container |
CN102712414A (en) * | 2010-01-13 | 2012-10-03 | 旭硝子株式会社 | Storage container for plate-like body, storage body, device for loading plate-like body thereon, and conveyance vehicle |
CN102985341A (en) * | 2010-05-06 | 2013-03-20 | 神农电气产业株式会社 | Tray for semiconductor integrated circuits |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131218 |