CN103436097A - Mixed solder resist printing ink for preventing side etching of PCB (Printed Circuit Board) - Google Patents

Mixed solder resist printing ink for preventing side etching of PCB (Printed Circuit Board) Download PDF

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Publication number
CN103436097A
CN103436097A CN2013104125904A CN201310412590A CN103436097A CN 103436097 A CN103436097 A CN 103436097A CN 2013104125904 A CN2013104125904 A CN 2013104125904A CN 201310412590 A CN201310412590 A CN 201310412590A CN 103436097 A CN103436097 A CN 103436097A
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China
Prior art keywords
printing ink
ink
green
pcb
black
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CN2013104125904A
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CN103436097B (en
Inventor
严来良
文泽生
李长生
何盛平
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Shenzhen Sun & Lynn Circuits Co Ltd
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Shenzhen Sun & Lynn Circuits Co Ltd
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Abstract

The invention provides mixed solder resist printing ink for preventing side etching of a PCB (Printed Circuit Board). The mixed solder resist ink is prepared by manufacturing black printing ink and green printing ink and stirring the black printing ink and green printing ink for 15 minutes through a stirrer according to a mass ratio of 3:10 under the condition that the humidity is 50-60% and the temperature is 17-23 DEG C, and mixing. According to the mixed solder resist printing ink prepared by the invention, the green printing ink with good low optical resistance is used to improve high optical resistance of black printing ink, so that the problem on metallic cementation due to oversized developing side etching caused by optical resistance of the black printing ink is thoroughly solved, thereby guaranteeing the quality of black printing ink printed PCB.

Description

A kind of mixing welding resistance printing ink that prevents the PCB lateral erosion
Technical field
The present invention relates to welding resistance printing ink, what be specifically related to is a kind of mixing welding resistance printing ink of the PCB of preventing lateral erosion.
Background technology
Welding resistance is the very important procedure of PCB making processes, its Main Function is that the mode by silk-screen covers on etched line pattern by welding resistance printing ink, to not need the position of carrying out the element welding all to hide, with prevent in the element welding process because of on tin cause electric intercommunication to form the problem of short circuit.
The color of welding resistance printing ink has multiple, wherein green ink is for commonly used, its performance is best, resistance backscatter extinction logarithmic ratio minimum, other variegated printing ink as: the performances such as black ink, red ink, white ink are poor than green ink, especially the resistance backscatter extinction logarithmic ratio maximum of black ink, when welding resistance is made, quality problem is also outstanding.But just must use these variegated printing ink some specific use under zone or client's particular cases.
Due to the exclusive light-blocking property of black ink, when exposing making, light source can't penetrate printing ink fully, easily causing bottom printing ink can't complete exposure makes, during development, the unexposed black ink of circuit or PAD edge can fall under the flushing of salt of wormwood liquid medicine in strip off, form space, there is the excessive problem of side etching quantity in it, when carrying out surface treatment, subsequent handling can enter liquid medicine, the circuit edge will form coating, thereby cause the plating problem, more easily form the situation of short circuit for spacing between less figure, cause most probably serious quality problem.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of mixing welding resistance printing ink of the PCB of preventing lateral erosion, to solve when using black ink to carry out the welding resistance making, exist side etching quantity excessive, cause the problem of plating.
The objective of the invention is to be achieved through the following technical solutions.
A kind of mixing welding resistance printing ink that prevents the PCB lateral erosion, comprise green ink and black ink that mass ratio is 3:10, in humidity 50%~60%, in the situation that temperature is 17~23 ℃, by stirrer, stirs and is mixed in 15 minutes, wherein:
Described black ink comprises that mass percent is: 48% o-cresol formaldehyde epoxy modified acrylic resin, 1% isopropyl thioxanthone, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM), 3.3% durene and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone;
Described green ink comprises that mass percent is: 43.9% o-cresol formaldehyde epoxy modified acrylic resin, 30% barium sulfate, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM) and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-the 1-butanone.
Preferably, described black ink is according to following mass percent: 48% o-cresol formaldehyde epoxy modified acrylic resin, 1% isopropyl thioxanthone, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM), 3.3% durene and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50%~60%, the situation that temperature is 17~23 ℃, stir and fully be uniformly mixed and make in 15 minutes by stirrer.
Preferably, described green ink is according to following mass percent: 43.9% o-cresol formaldehyde epoxy modified acrylic resin, 30% barium sulfate, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM) and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-the 1-butanone, in humidity 50%~60%, the situation that temperature is 17~23 ℃, stir and fully be uniformly mixed and make in 15 minutes by stirrer.
Preferably, add the green ink that mass fraction is 3 in the black ink that is 10 to mass fraction, stir 15 minutes by stirrer, the two is fully mixed.
The present invention compared with prior art, beneficial effect is: the mixing welding resistance printing ink that prevents the PCB lateral erosion provided by the invention, by making black ink and green ink, and make the green ink that makes and black ink according to mass ratio 3:10, in humidity 50%~60%, in the situation that temperature is 17~23 ℃, by stirrer, stir mixing in 15 minutes.The mixing welding resistance printing ink that the present invention makes has used low-resistance photosensitiveness that green ink is good to improve the high resistant photosensitiveness of dirty oil, thoroughly solved because the lateral erosion that causes developing of black ink resistance light is excessive, appearance ooze golden problem, guaranteed to print the quality of dirty oil PCB.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The present invention is to provide a kind of mixing welding resistance printing ink of the PCB of preventing lateral erosion, this mixing welding resistance printing ink mainly includes black ink and green ink, in the situation that needs are used black ink to carry out the welding resistance making, can utilize mixing welding resistance printing ink of the present invention to carry out the welding resistance making, it is because the green ink adopted has good low-resistance photosensitiveness, therefore can improve the high resistant photosensitiveness of black ink, thereby avoided when carrying out the welding resistance making, because of the lateral erosion that causes developing of black ink resistance optical issue excessive, occur oozing golden problem, effectively guaranteed the quality of PCB.
Wherein to mix welding resistance printing ink be that the ratio mixing manufacture according to mass ratio 3:10 forms by green ink and black ink in the present invention.Be specially: in humidity 50%~60%, in the situation that temperature is 17~23 ℃, add the green ink that mass fraction is 3 in the black ink that is 10 to mass fraction, stir 15 minutes by stirrer, the two is fully mixed, form and mix welding resistance printing ink.
It should be noted that, embodiment of the present invention Green printing ink to manufacture mode is as follows: in humidity 50%~60%, the situation that temperature is 17~23 ℃, by mass percent, be: 43.9% o-cresol formaldehyde epoxy modified acrylic resin, 30% barium sulfate, 1% PHTHALOCYANINE GREEN 7, 9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM) and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-the 1-butanone evenly mixes, by stirrer, stir 15 minutes, fully be uniformly mixed and make.
In the embodiment of the present invention, the black ink production method is as follows: in humidity 50%~60%, the situation that temperature is 17~23 ℃, by mass percent, be: 48% o-cresol formaldehyde epoxy modified acrylic resin, 1% isopropyl thioxanthone, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM), 3.3% durene and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50%~60%, the situation that temperature is 17~23 ℃, stir and fully be uniformly mixed and make in 15 minutes by stirrer.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.

Claims (4)

1. a mixing welding resistance printing ink that prevents the PCB lateral erosion, is characterized in that, comprises green ink and black ink that mass ratio is 3:10, in humidity 50%~60%, in the situation that temperature is 17~23 ℃, by stirrer, stir and be mixed in 15 minutes, wherein:
Described black ink comprises that mass percent is: 48% o-cresol formaldehyde epoxy modified acrylic resin, 1% isopropyl thioxanthone, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM), 3.3% durene and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone;
Described green ink comprises that mass percent is: 43.9% o-cresol formaldehyde epoxy modified acrylic resin, 30% barium sulfate, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM) and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-the 1-butanone.
2. the mixing welding resistance printing ink that prevents the PCB lateral erosion according to claim 1, it is characterized in that, described black ink is according to following mass percent: 48% o-cresol formaldehyde epoxy modified acrylic resin, 1% isopropyl thioxanthone, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM), 3.3% durene and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50%~60%, the situation that temperature is 17~23 ℃, stir and fully be uniformly mixed and make in 15 minutes by stirrer.
3. the mixing welding resistance printing ink that prevents the PCB lateral erosion according to claim 1, it is characterized in that, described green ink is according to following mass percent: 43.9% o-cresol formaldehyde epoxy modified acrylic resin, 30% barium sulfate, 1% PHTHALOCYANINE GREEN 7, 9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, 1.8% trimeric cyanamide, 2% dipropylene glycol monomethyl ether (DPM) and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-the 1-butanone, in humidity 50%~60%, the situation that temperature is 17~23 ℃, stir and fully be uniformly mixed and make in 15 minutes by stirrer.
4. according to the described mixing welding resistance printing ink that prevents the PCB lateral erosion of claim 1~3 any one, it is characterized in that, add the green ink that mass fraction is 3 in the black ink that is 10 to mass fraction, stir 15 minutes by stirrer, the two is fully mixed.
CN201310412590.4A 2013-09-06 2013-09-06 A kind of mixing solder mask preventing PCB lateral erosion Active CN103436097B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107128091A (en) * 2017-05-26 2017-09-05 东莞翔国光电科技有限公司 One kind improves wet film dirty oil plate and falls oily technique
CN109575675A (en) * 2018-12-07 2019-04-05 常熟东南相互电子有限公司 Anti-welding LDI ink special and preparation method thereof
CN110911067A (en) * 2019-11-08 2020-03-24 广东风华高新科技股份有限公司 Current sensing resistor and manufacturing method thereof
CN111800956A (en) * 2020-07-21 2020-10-20 博敏电子股份有限公司 Processing method of circuit board solder resist black oil
US11166387B2 (en) 2020-03-06 2021-11-02 Unimicron Technology Corp. Wiring board and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0663411A1 (en) * 1994-01-17 1995-07-19 Nippon Kayaku Kabushiki Kaisha Photo-imaging resist ink and cured product thereof
JPH0820742A (en) * 1994-07-05 1996-01-23 Nippon Kayaku Co Ltd Resist ink composition and its cured item
US5821031A (en) * 1994-10-05 1998-10-13 Goo Chemical Co., Ltd. Photosensitive solder resist ink, printed circuit board and production thereof
CN1784432A (en) * 2003-05-09 2006-06-07 太阳油墨制造株式会社 Photocuring/thermosetting inkjet composition and printed wiring board using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0663411A1 (en) * 1994-01-17 1995-07-19 Nippon Kayaku Kabushiki Kaisha Photo-imaging resist ink and cured product thereof
JPH0820742A (en) * 1994-07-05 1996-01-23 Nippon Kayaku Co Ltd Resist ink composition and its cured item
US5821031A (en) * 1994-10-05 1998-10-13 Goo Chemical Co., Ltd. Photosensitive solder resist ink, printed circuit board and production thereof
CN1784432A (en) * 2003-05-09 2006-06-07 太阳油墨制造株式会社 Photocuring/thermosetting inkjet composition and printed wiring board using same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107128091A (en) * 2017-05-26 2017-09-05 东莞翔国光电科技有限公司 One kind improves wet film dirty oil plate and falls oily technique
CN109575675A (en) * 2018-12-07 2019-04-05 常熟东南相互电子有限公司 Anti-welding LDI ink special and preparation method thereof
CN110911067A (en) * 2019-11-08 2020-03-24 广东风华高新科技股份有限公司 Current sensing resistor and manufacturing method thereof
US11166387B2 (en) 2020-03-06 2021-11-02 Unimicron Technology Corp. Wiring board and manufacturing method thereof
CN111800956A (en) * 2020-07-21 2020-10-20 博敏电子股份有限公司 Processing method of circuit board solder resist black oil
CN111800956B (en) * 2020-07-21 2021-12-17 博敏电子股份有限公司 Processing method of circuit board solder resist black oil

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Inventor after: An Guoyi

Inventor after: Li Changsheng

Inventor after: Wen Chenglin

Inventor before: Yan Lailiang

Inventor before: Wen Zesheng

Inventor before: Li Changsheng

Inventor before: He Shengping

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Free format text: CORRECT: INVENTOR; FROM: YAN LAILIANG WEN ZESHENG LI CHANGSHENG HE SHENGPING TO: AN GUOYI LI CHANGSHENG WEN CHENGLIN

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